Huawei Mediapad S7-PRO User manual

S7-PRO Maintenance Manual (Basic Version V2.1)
INTERNAL
2012-07-20
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Page 1 of 97
Mediapad Maintenance Manual (Basic Version V2.1)
Huawei Technologies Co., Ltd.
All Rights Reserved

S7-PRO Maintenance Manual (Basic Version V2.1)
INTERNAL
2012-07-20
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Page 2 of 97
Contents
1 Product Introduction ....................................................................................................................4
1.1 Appearance.......................................................................................................................................................4
1.2 S7 PRO Models................................................................................................................................................4
1.3 Product Specifications......................................................................................................................................4
2 Maintenance Instructions............................................................................................................6
2.1 Application Scope ............................................................................................................................................6
2.2 Maintenance Precautions..................................................................................................................................6
2.3 Maintenance Information .................................................................................................................................6
3 Exploded View Drawing .............................................................................................................7
4 Components on the Main Board ................................................................................................8
4.1 Diagram of Components on the Mediapad Main Board...................................................................................8
4.2 BOM List .........................................................................................................................................................9
5 Software Upgrade .......................................................................................................................14
5.1 Preparation .....................................................................................................................................................14
5.2 Upgrade Using the Micro SD Card ................................................................................................................14
5.2.1 Upgrade Process....................................................................................................................................14
5.2.2 Troubleshooting ....................................................................................................................................15
5.3 Upgrade Using the USB.................................................................................................................................16
5.3.1 Entering the USB Upgrade Mode .........................................................................................................16
5.3.2 Installing the USB Device Driver .........................................................................................................16
5.3.3 Programming Using the QPST Software ..............................................................................................19
5.3.4 Troubleshooting ....................................................................................................................................24
5.4 Viewing the Software Version........................................................................................................................26
6 Maintenance Tools......................................................................................................................26
7 Disassembly Procedures............................................................................................................28
8 Assembly Procedures .................................................................................................................33
9 Troubleshooting for Common Failures ..................................................................................37
9.1 Principle .........................................................................................................................................................37
9.2 Power-on Failure............................................................................................................................................40
9.2.1 Power-on Failure —High Current........................................................................................................47

S7-PRO Maintenance Manual (Basic Version V2.1)
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9.2.2 Power-on Failure —Low Current ........................................................................................................50
9.3 Charge Failure................................................................................................................................................51
9.4 Failure to Identify SIM Card..........................................................................................................................52
9.5 Failure to Identify SD Card............................................................................................................................54
9.6 Display Failure...............................................................................................................................................58
9.7 Touchscreen Failure .......................................................................................................................................60
9.8 Audio Failure..................................................................................................................................................61
9.8.1 Speaker Failure .....................................................................................................................................61
9.8.2 Headset Failure .....................................................................................................................................63
9.9 Camera Failure...............................................................................................................................................63
9.10 Vibration Failure ..........................................................................................................................................64
9.11 RF Failure.....................................................................................................................................................65
9.12 Maintenance Procedures for Transmit Failure..............................................................................................69
9.12.1 WCMDA2100 Transmit Calibration Failure.......................................................................................69
9.12.2 WCMDA1900 Transmit Calibration Failure.......................................................................................70
9.12.3 AWS Transmit Calibration Failure......................................................................................................71
9.12.4 WCMDA850 Transmit Calibration Failure.........................................................................................72
9.12.5 WCMDA900 Transmit Calibration Failure.........................................................................................73
9.12.6 GSM HB Transmit Calibration Failure...............................................................................................74
9.12.7 GSM LB Transmit Calibration Failure................................................................................................75
9.13 Maintenance Procedures for Receiving Failure............................................................................................76
9.13.1 Maintenance Procedures for WCDMA Receiving Failure..................................................................76
9.13.2 Maintenance Procedures for GSM Receive Failure............................................................................77
9.14 GPS Failure..................................................................................................................................................78
9.15 Wi-Fi/BT Failure..........................................................................................................................................80
10 Diagram of Soldered Connections on PCB and BGA Chip..............................................82
11 Function Test..............................................................................................................................82
11.1 MMI Test......................................................................................................................................................82
11.2 Voice Call Test..............................................................................................................................................96

S7-PRO Maintenance Manual (Basic Version V2.1)
INTERNAL
2012-07-20
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Copyright © Huawei Technologies Co., Ltd.
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1 Product Introduction
1.1 Appearance
1.2 S7 PRO Models
The following table lists the S7-PRO models and related descriptions.
The MediaPad has several models. The following table lists the differences between these
models.
Model
Specification
Standard and Frequency Band
S7-301u
UMTS 900
UMTS 900 MHz/2100 MHz
S7-302u
UMTS 850
UMTS 850 MHz/1900 MHz/2100 MHz
S7-303u
UMTS AWS
UMTS 1900 MHz/2100 MHz/AWS
1.3 Product Specifications
Item
Description
Dimensions (H
x W x D)
190 mm x 124 mm x 10.5 mm
Weight
About 390 g

S7-PRO Maintenance Manual (Basic Version V2.1)
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Item
Description
Power supply
Input: 100–240 V AC, 50 Hz/60 Hz
Output: 5 V DC, 2.0 A
Antenna
Built-in antenna
Technical
standards
3GPP FDD Release 6
WCDMA 900/2100 MHz & HSDPA 14.4 Mbit/s & GSM/GPRS/EDGE
850/900/1800/1900 MHz
S7-PRO-301u
frequency band
850 MHz (CLR): 824 MHz-849 MHz/869 MHz-894 MHz
(uplink/downlink)
900 MHz (GSM): 880 MHz-915 MHz/925 MHz-960 MHz
(uplink/downlink)
1900 MHz (PCS): 1850–1910 MHz/1930–1990 MHz (uplink/downlink)
2100 MHz (IMT): 1920–1980 MHz/2110–2170 MHz (uplink/downlink)
AWS: 1710–1755 MHz/2110–2155 MHz (uplink/downlink)
Battery
Li-ion battery
3.7 V, 4100 mAh
Video playback time: about 6 hours
Standby time: about 369 hours
Interface
3.5 mm TRRS stereo headset interface
MicroSD card slot: compatible with an SDHC card of a maximum
capacity of 32 GB
USB port: Micro USB 2.0
HDMI: HDMI 1.3b type D
SIM card slot
Display screen
Type: IPS LCD, Glare
Size: 7 inches
Resolution: WXGA (1280x800 pixels), 217 ppi
Visual angles: upward 89°/downward 89°/leftward 89°/rightward 89°
Colors: 16,000,000 colors
Contrast: 800:1
Brightness: 400 cd/m2(maximum)
Touchscreen
7-inch captive touchscreen
Camera
Front camera: 1.3 megapixels, rear camera: 5 megapixels, autofocus

S7-PRO Maintenance Manual (Basic Version V2.1)
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Item
Description
GPS
Qualcomm GPS
Bluetooth (BT)
Standard: 2.1 + EDR
Configuration: A2DP, HFP, HSP, and PBAP
Wi-Fi
Standards: IEEE 802.11b/g/n, WEP, WPA, and WPA2
Working frequency band: 2.4 GHz
Working
environment
Working temperature: –10°C to +45°C (14°F to 113°F)
Storage temperature: –40°C to +70°C (–40°F to 158°F)
Humidity: 5% to 95% RH (non-condensing)
2 Maintenance Instructions
2.1 Application Scope
This document provides instructions for the maintenance of Huawei products by technical
personnel at service sites authorized by Huawei. This manual is Huawei proprietary and is
only permitted to be used by authorized service sites or companies.Although every effort has
been made to ensure the accuracy, mistakes may still be found. If you find any error or have
any suggestions, contact our customer service personnel.
2.2 Maintenance Precautions
Only qualified technicians are allowed to perform maintenance and calibration.
Always wear ESD wrist straps during operation and conduct the maintenance in an ESD
room.
Ensure that all components, screws, and insulators are properly installed after
maintenance and calibration. Ensure that all cables are properly connected.
Ensure that the soldering complies with environmental requirements and is lead-free.
Electrostatic discharging is the major cause for the damage of sensitive electronic
components. Each service site should attach great importance to the electrostatic
discharging and strictly observe the antistatic measures described in this manual.
2.3 Maintenance Information
To obtain related product and maintenance information, visit
http://www.huaweidevice.com/cn/technicaIndex.do

S7-PRO Maintenance Manual (Basic Version V2.1)
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3 Exploded View Drawing
1
13
2 3 456
14 15 16
789 10 11 12
17 18 19 20 21 22 23
The exploded view shows the phone structure only and cannot be regarded as a reference for
applying for spare parts.
No.
Description
Quantity
1
Rear camera lens
1
2
Cover B assembly
1
3
POGO PIN
1
4
Diversity antenna support
1
5
Speaker
1
6
Rear camera
1
7
Headset connector
1
8
Speaker FPC
1
9
Main board
1
10
LCD
1
11
Cover A assembly
1
12
TP
1

S7-PRO Maintenance Manual (Basic Version V2.1)
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No.
Description
Quantity
13
Left decorative cover
1
14
Right decorative cover
1
15
Side buttons
1
16
Battery
1
17
Wi-Fi antenna support
1
18
MIC-FPC
1
19
MIC
1
20
SUB FPC
1
21
Front camera
1
22
DC-JACK
1
23
SUB-PCB-FPC
1
4 Components on the Main Board
4.1 Diagram of Components on the Mediapad Main Board
J48 battery socket
Failure symptom:
power-on failure
with no DC
inserted
U7 power supply
control IC
(PM8058)
Failure symptom:
power-on failure
and other failures
U12 NAND Flash-
EMMC-WLAN
Failure symptom:
WLAN failure
U34 CPU
(MSM8260)
Failure symptom:
power-on failure,
RF failure, and
other failures
J10 touchscreen
connector
Failure symptom:
nothing happens
when you touch the
screen
U48 charger IC
Failure symptom:
battery charging
fails
J24 SIM card
socket
Failure symptom:
SIM registration
fails
U36 touchscreen
and speaker driver
IC
Failure symptom:
touchscreen and
speaker failure
U1 LCD
management IC
Failure symptom:
display failure
U2 power
management IC
(PM8901)
Failure symptom:
power-on failure
and other failures
U20/22/24/25 RF
power module
Failure symptom:
abnormal RF
transmitter power
U47 RF power
module
Failure symptom:
RF failure
U23 RF modem
Failure symptom:
RF failure
J21 speaker FPC
connector
Failure symptom:
no voice
U33 RF signaling
regulating sensor
Failure symptom:
RF failure
J2 rear camera
connector
Failure symptom:
rear camera failure
U40 LCD
management IC
Failure symptom:
display failure
J31 Headset
connector
Failure symptom:
no voice
J12 connector for
power-on and voice
buttons
Failure symptom:
failure to power on
and adjust the voice
U6 6D sensor with
accelerometer and
compass
Failure symptom:
accelerometer and
compass failure
LCD-FPC
connector
Failure symptom:
display failure
U17 voltage-level
transformer IC
Failure symptom:
display failure
U7 power supply
control IC
(PM8058)
Failure symptom:
power-on failure
and other failures
U12 NAND Flash-
EMMC-WLAN
Failure symptom:
WLAN failure
U34 CPU
(MSM8260)
Failure symptom:
power-on failure,
RF failure, and
other failures
J10 touchscreen
connector
Failure symptom:
nothing happens
when you touch the
screen
U48 charger IC
Failure symptom:
battery charging
fails
J24 SIM card
socket
Failure symptom:
SIM registration
fails
U36 touchscreen
and speaker driver
IC
Failure symptom:
touchscreen and
speaker failure
U1 LCD
management IC
Failure symptom:
display failure
U2 power
management IC
(PM8901)
Failure symptom:
power-on failure
and other failures
U20/22/24/25 RF
power module
Failure symptom:
abnormal RF
transmitter power
U47 RF power
module
Failure symptom:
RF failure
U23 RF modem
Failure symptom:
RF failure
J21 speaker FPC
connector
Failure symptom:
no sound
U33 RF signal
regulating sensor
Failure symptom:
RF failure
J2 rear camera
connector
Failure symptom:
rear camera failure
U40 LCD
management IC
Failure symptom:
display failure
J31 Headset
connector
Failure symptom:
no sound
J12 connector for
power-on and
sound
Failure symptom:
failure to power on
and adjust the
sound
U6 6D sensor with
accelerometer and
compass
Failure symptom:
accelerometer and
compass failure
LCD-FPC
connector
Failure symptom:
display failure
U17 level shifter IC
Failure symptom:
display failure

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U4 voltage-level translator
for RF power amplifier
control signal
Failure symptom: RF
failure
U13 RF switch
Failure symptom: RF
failure
U3 RF low noise amplifier
Failure symptom: RF
failure
U19 voltage-level
transformer IC for
touchscreen signal
Failure symptom:
touchscreen failure
J8 auxiliary board FPC
connector for USB/HDMI/
SD card
Failure symptom: USB/
HDMI/SD card failure
U10 voltage-level
transformer IC
Failure symptom:
coulometer failure
U1001 current limiting IC
Failure symptom: USB-
HOST faults
U37 coulometer
Failure symptom:
coulometer failure
U16 voltage-level
transformer IC for
touchscreen signal
Failure symptom:
touchscreen failure
U15 speaker power
amplifier
Failure symptom: no sound
U14 speaker power
amplifier
Failure symptom: no sound
U11 BT/Wi-Fi driver IC
Failure symptom: BT/Wi-Fi
failure
. U18 coulometer I2C
voltage-level transformer IC
Failure symptom:
coulometer failure
U9 voltage-level
transformer IC for
touchscreen I2C signal
Failure symptom:
touchscreen failure
U35 touchscreen power
management IC
Failure symptom:
touchscreen failure
J6 front camera connector
Failure symptom: front
camera failure
4.2 BOM List
The following table is provided for reference only and is subject to change without notice.
The latest component list is available on corresponding Huawei system. If you have any
questions, contact the local technical personnel
BOM
Description
Location
15010248
Schottky diode-30 V-0.2 A-0.5 V
D1
15040238
Transient voltage suppression diode-6
V-14 V-10 W-12 A
D10, D1002, D1003, D1004,
D1005, D1006, D1007, D1100,
D13, D17,
D18, D19, D2, D23, D24, D25,
D26,
D27, D3, D5, D6, D9
15010235
Schottky diode-40 V-0.5 A-0.425 V
D12
14240309
IO connector-female-5pin-WTB
connector-SMT
J1
14240181
BTB connector-female-24-0.4 mm-1
mm-SMT
J2, J6

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BOM
Description
Location
14240004
RF connector-straight-female-SMT
J19, J3, J4
51621274
Main antenna SMT spring
J13, J14, J15, J20, J23, J27, J30,
J32, J5
14240210
BTB connector-female-40Pin-0.4
mm-0.9 mm
J8, J9
14240199
BTB connector-female-10pin-0.4
mm-0.9 mm
J10, J12, J21
51621023
Ground spring
J11, J25, J26, J28, J29, J33,
J34, J35, J36, J37, J38, J39, J40,
J41, J42, J43, J44, J45, J46, J48
14240301
Card connector-SIM card socket
J24
14240283
FPC connector-11-0.3 mm-0.1 mm-0.6
mm
J31
15060228
MOSFET-P-channel
Q1, Q17, Q2, Q9
15050014
NPN transistor
Q22, Q5
15060153
MOSFET-N-channel
Q1000, Q1001, Q1101, Q1102,
Q1103,
Q1104, Q1105, Q1206, Q19
39110582
Power Driver-Boost DCDC
U1
39200270
Power management IC-PM8901
U2
47090034
RF low noise
amplifier-869-894/1930-1990/2110-217
0 MHz
U3
36020366
CMOS-4BIT bidirectional voltage-level
translator with auto direction sensing
U17, U19, U4
38140016
Semiconductor sensor-6-axis sensor
with accelerometer and compass
U6
39200177
Dedicated power management chip of
Qualcomm MSM7x30 series (PM8058)
U7
40020131
DDR2 DRAM-8Gb LPDDR2-800
MHz-32 bit
U8
36020395
CMOS-4BIT bidirectional voltage-level
translator with auto direction
sensing-I2C bus
U10, U16, U18, U9
39200222
Chip with the combination of single
band 2.4GHz WLAN, Bluetooth 2.1, and
FM-BCM4329
U11

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BOM
Description
Location
47140045
RF switch-0.5–2.5 GHz
U13
39080077
Audio power amplifier
U14, U15
13080038
Duplexer-RX: 2110–2170 MHz/TX:
1920–1980 MHz
U20
13080060
Duplexer-TX: 824–849 MHz/RX:
869–894 MHz
U21
47100280
Power module-1920–1980 MHz
U22
39200249
WCMDA/GSM radio transceiver
(QTR8615)
U23
47100289
Power module-1850-1910 MHz
U24
47100360
RF power module-1710-1785 MHz
U25
13080072
Duplexer-RX: 2110–2155 MHz/TX:
1710–1755 MHz
U31
38140022
Semiconductor-capacitive sensor
U33
39200289
Digital base band processor-1.2
GHz-MSM8260
U34
39110548
LDO-3.3 V
U35
39110567
Switching regulators-2.0–5.5 V
U36
39070073
Power management IC-0.3–2.75
V-battery coulometer
U37
43140104
Connector controller-LCD Drive IC
U40
13080082
Duplexer-RX: 1930–1990 MHz/TX:
1850–1910 MHz
U41
47090042
RF low noise amplifier-0.5–3 GHz
U42
47140049
RF switch-0.5–3.0 GHz
U43
47140054
RF switch-600–2700 M
U46
47100307
RF power module-824–849 MHz,
880–915 MHz, 1710–1785 MHz,
1850–1910 MHz
U47
39070085
Battery management IC-4.1–16
V-DC-DC charging chip
U48
39070055
Battery management IC-2.5–6.5
V-average current limiting-percentage
(10%)-DRV
U1001
12020141
Crystal oscillator-19.2 MHz
X1

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BOM
Description
Location
12020171
Crystal oscillator-27 MHz
X2
12020125
Crystal oscillator-0.032768 MHz
X3
12020168
Crystal oscillator-37.4 MHz
X4
13010262
SAW filter-2140 MHz
Z1
13010177
SAW filter-1960 MHz
Z3
13010175
SAW filter-1732.5 MHz
Z4
13010265
SAW filter-1574.42 MHz/1605.89 MHz
Z5
07040064
Varistor-8 V-4 V-30
V-SMT-0405-ESD+EMI noise filter
Z10, Z9
13030052
Ceramics filter-2450 MHz
Z11
07040072
ESD_EMI Filter-14 V-30 pF-800–3000
MHz
Z12
13010131
Sound filter-1960 MHz
Z16
13010148
Sound filter-2140 MHz
Z17
13080106
Duplexer-1565–1607 MHz/2400–2500
MHz
Z18
13010264
SAW filter-1590.16 MHz
Z22
40060318
NAND flash-16 GB eMMC V4.4-52
MHz
U12
03021CNP
Interface
board-MediaPad-HIDS7PIA-with TF
slot, type D HDMI, and micro USB
connector
15040238
Transient voltage suppression diode-6
V-14 V-10 W-12 A
D21, D5, D9
15040264
Transient voltage suppression diode-5.5
V-15 V-1 A
D10, D7
15040293
Transient voltage suppression diode-6
V-15 V-15 W-1.5 A
D19, D20
14240243
Card connector-micro SD receptacle
J2
14240272
IO
connector-micro_B-female-5pin-bend-S
MT
J3
14240268
IO connector-micro HDMI-19-D type
J4
14240199
BTB connector-female-10pin-0.4
mm-0.9 mm
J6

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BOM
Description
Location
14240210
BTB connector-female-40Pin-0.4
mm-0.9 mm
J8
10040059
Common mode EMI filter-20 V DC/280
mA-0805
T1
07040064
Varistor-8 V-4 V-30
V-SMT-0405-ESD+EMI noise filter
Z1
03021CNQ
Speaker
board-MediaPad-HIDS7PSK-1x1
14240200
BTB connector-male-10Pin-0.4 mm-0.9
mm
J1
03021CNW
LED board-MediaPad-HIDS7PFR-1x1
14240200
BTB connector-male-10Pin-0.4 mm-0.9
mm
J3
03021CPB
Key board-S7-301u-HIDS7PKA-1x1
14240200
BTB connector-male-10Pin-0.4 mm-0.9
mm
J1
38140014
Semiconductor sensor-ambient light
sensor
U1
03021CPF
BTB board-MediaPad-HIDS7PFI
14240221
BTB connector-male-40Pin-0.4 mm-0.9
mm
J1, J5
03021DTK
BTB to ZIF FPC bridge
board-MediaPad-HIDS7PFL
14240221
BTB connector-male-40Pin-0.4 mm-0.9
mm
J1
32050018
Vibrator-column
22020058
Speaker
22050048
Microphone
23040205
LCD module-single display
23060061
Camera module group-CMOS-1.3 M-FF
23060062
Camera module group-CMOS-5 M-AF
14240276
IO connector-DC JACK
14240340
Headset connector
27160803
Main antenna-S7-303u-(sensor FPC)
SAA

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BOM
Description
Location
23070113
Touchscreen-S7 PRO CTP with AF
27160802
Main antenna
S7-303 u-1710–2170 MHz/824–894
MHz
27160804
GPS WIFI antenna
S7-30 3u-1565–1620 MHz/2400–2500
MHz
27160805
Diversity antenna-S7-303 u-1910–2170
MHz
5 Software Upgrade
5.1 Preparation
Item
Contents
Remarks
Preparation
Battery
At least two bars on the battery level
indicator
Micro SD card
More than 512 M
USB cable
BOM: 97065432
PC
Windows 2000, Windows XP
File
S7-30Xu V100R001C002B027T01
(not the final version)
This version is only for reference.
Download the latest version for
upgrade (the upgrade using USB).
Tool
eMMC Software Download
For upgrade using the USB
Upgrade
method
Using the Micro SD card
Using the USB
5.2 Upgrade Using the Micro SD Card
5.2.1 Upgrade Process
Step 1 Delete the information in the Micro SD card or format the SD card.
Step 2 Create a folder named dload in the root directory of the Micro SD card, and copy the upgrade
file to dload.

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Step 3 Ensure that the board is powered off, and that the battery is fully charged or connected to a
charger. Insert the Micro SD card into the board, and the upgrade will be performed
automatically after the board is powered on.
Upgrade
State
Upgrade of the Device
Upgrade of the Board
Upgrading.
The LED indicator blinks at the
frequency of 1 Hz.
Upgrade
succeeded.
The LED indicator stays on.
Upgrade
failed.
The LED indicator blinks at the
frequency of 4 Hz.
Step 4 When the upgrade is completed, remove the SD card and press and hold the POWER button
to restart the device.
5.2.2 Troubleshooting
During the update using the SD card, if the device presents a flash screen indicating the
upgrade failure, check for any mis-operation or incorrect upgrade version. You can remove
the SD card and try it again or change the SD card.
Method to check whether the SD card is damaged:
Because the size of the upgrade package of some version is large, try to open the compressed
upgrade package that is copied to the SD card to check for damage. Remove and plug the SD
card before you open the compressed upgrade package. If you open the compressed upgrade
package directly, the opened package may be a cache on the PC. Alternatively, you can check
the reliable storage capacity of the SD card with the MyDiskTest (an SD card check tool) to
ensure that the size of the upgrade package does not exceed the storage capacity of the SD
card. For more information, see the appendix of this chapter.

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5.3 Upgrade Using the USB
5.3.1 Entering the USB Upgrade Mode
When the system is powered on, quickly press the VOLUME_UP button and the
VOLUME_DOWN button. If it is the first time for your PC to connect the USB, the message
"Found New Hardware" will be displayed, which indicates that the system has entered the
USB upgrade mode successfully, as shown in the following figure.
5.3.2 Installing the USB Device Driver
If the driver has not been installed before, you must install the driver on the PC before the
update using the USB.
Step 1 When the MediaPad is connected, it enters into the Emergency Download mode, and a
window is displayed, showing the port Qualcomm HS-USB QDLoader 9008. If the port
driver has not been installed before, a message for installing the driver will be displayed.

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Step 2 Select Choose the install from a list or specific location (Advanced). Then click Next.

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Step 3 Click Browse in the window displayed to select the USB driver to be installed, as shown in
the following figure. Then click Next.

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Step 4 If the corresponding file is found, the window indicating successful installation will be
displayed, as shown in the following figure.
Step 5 The USB port (COM15) is shown in the Device Manager window.
5.3.3 Programming Using the QPST Software
If the QPST software has been installed, run the eMMC Software Download tool and do as
follows:
Step 1 Ensure that you select Program Boot Loaders and Program MMC device.

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Step 2 Set Flash Programmer file name to MPRG8660.hex, and set Boot Image to
8660_msimage.mbn.
Step 3 Click Browse. In the Select Port window, check whether the value of Phone is Q/QCP-XXX
(Download) (COM15), and whether the port is consistent with that shown in the Device
Manager window. Then click OK.
Step1
Step 2