IBASE Technology MI811F Series User manual

MI811F Series
Intel
®
Pentium
®
& Celeron
®
SoC
Mini-ITX Motherboard
User’s Manual
Version 1.4
(July 2020)

ii MI811F Series User’s Manual
Copyright
© 2020 IBASE Technology, Inc. All rights reserved.
No part of this publication may be reproduced, copied, stored in a retrieval
system, translated into any language or transmitted in any form or by any
means, electronic, mechanical, photocopying, or otherwise, without the prior
written consent of IBASE Technology, Inc. (hereinafter referred to as
“IBASE”).
Disclaimer
IBASE reserves the right to make changes and improvements to the
products described in this document without prior notice. Every effort has
been made to ensure the information in the document is correct; however,
IBASE does not guarantee this document is error-free.
IBASE assumes no liability for incidental or consequential damages arising
from misapplication or inability to use the product or the information
contained herein, nor for any infringements of rights of third parties, which
may result from its use.
Trademarks
All the trademarks, registrations and brands mentioned herein are used for
identification purposes only and may be trademarks and/or registered
trademarks of their respective owners.

MI811F Series User’s Manual
iii
Compliance
This product has passed CE tests for environmental specifications and
limits. This product is in accordance with the directives of the European
Union (EU). In a domestic environment, this product may cause radio
interference in which case users may be required to take adequate
measures.
This product has been tested and found to comply with the limits for a Class
B device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with manufacturer’s
instructions, may cause harmful interference to radio communications.
WEEE
This product must not be disposed of as normal household
waste, in accordance with the EU directive of for waste
electrical and electronic equipment (WEEE - 2012/19/EU).
Instead, it should be disposed of by returning it to a
municipal recycling collection point. Check local
regulations for disposal of electronic products.
Green IBASE
This product is compliant with the current RoHS
restrictions and prohibits use of the following substances
in concentrations exceeding 0.1% by weight (1000 ppm)
except for cadmium, limited to 0.01% by weight (100 ppm).
• Lead (Pb)
• Mercury (Hg)
• Cadmium (Cd)
• Hexavalent chromium (Cr6+)
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ether (PBDE)

iv MI811F Series User’s Manual
Important Safety Information
Carefully read the precautions before using the board.
Environmental conditions:
•Use this product in environments with ambient temperatures between
0˚C and 60˚C.
•Do not leave this product in an environment where the storage
temperature may be below -20° C or above 80° C. To prevent from
damages, the product must be used in a controlled environment.
Care for your IBASE products:
•Before cleaning the PCB, unplug all cables and remove the battery.
•Clean the PCB with a circuit board cleaner or degreaser, or use cotton
swabs and alcohol.
•Vacuum the dust with a computer vacuum cleaner to prevent the fan
from being clogged.
WARNING
Attention during use:
•Do not use this product near water.
•Do not spill water or any other liquids on this product.
•Do not place heavy objects on the top of this product.
Anti-static precautions
•Wear an anti-static wrist strap to avoid electrostatic discharge.
•Place the PCB on an anti-static kit or mat.
•Hold the edges of PCB when handling.
•Touch the edges of non-metallic components of the product instead of
the surface of the PCB.
•Ground yourself by touching a grounded conductor or a grounded bit of
metal frequently to discharge any static.
CAUTION
Danger of explosion if the internal lithium-ion battery is replaced by an
incorrect type. Replace only with the same or equivalent type recommended
by the manufacturer. Dispose of used batteries according to the
manufacturer’s instructions or recycle them at a local recycling facility or
battery collection point.

MI811F Series User’s Manual
v
Warranty Policy
•IBASE standard products:
24-month (2-year) warranty from the date of shipment. If the date of
shipment cannot be ascertained, the product serial numbers can be
used to determine the approximate shipping date.
•3
rd
-party parts:
12-month (1-year) warranty from delivery for the 3rd-party parts that are
not manufactured by IBASE, such as CPU, CPU cooler, memory,
storage devices, power adapter, panel and touchscreen.
＊ PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,
IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL BE
TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL BE
BILLED FOR REPAIR AND SHIPPING CHARGES.
Technical Support & Services
1. Visit the IBASE website at www.ibase.com.tw to find the latest
information about the product.
2. If you need any further assistance from your distributor or sales
representative, prepare the following information of your product and
elaborate upon the problem.
•Product model name
•Product serial number
•Detailed description of the problem
•The error messages in text or in screenshots if there is any
•The arrangement of the peripherals
•Software in use (such as OS and application software, including the
version numbers)
3. If repair service is required, you can download the RMA form at
http://www.ibase.com.tw/english/Supports/RMAService/. Fill out the
form and contact your distributor or sales representative.

vi MI811F Series User’s Manual
Table of Contents
Compliance ..................................................................................... iii
Important Safety Information ........................................................ iv
Warranty Policy ............................................................................... v
Technical Support & Services ....................................................... v
Chapter 1 General Information ............................................. 1
1.1 Introduction .........................................................................................2
1.2 Features..............................................................................................2
1.3 Packing List.........................................................................................3
1.4 Optional Accessories........................................................................... 3
1.5 Specifications ...................................................................................... 4
1.6 Block Diagram..................................................................................... 7
1.7 Overview .............................................................................................8
1.8 Dimensions ....................................................................................... 10
Chapter 2 Hardware Configuration........................................ 11
2.1 Essential Installations Before You Begin ........................................... 12
2.1.1 Installing the Memory ........................................................... 12
2.2 Setting the Jumpers .......................................................................... 13
2.3 Jumper & Connector Locations ......................................................... 14
2.4 Jumpers Quick Reference ................................................................. 16
2.4.1 LVDS Panel Power Selection (JP1)..................................... 16
2.4.2 Panel Output Selection (JP3) .............................................. 17
2.4.3 Panel Backlight Control Selection (JP4) .............................. 18
2.4.4 ME Register Clearance (JP6).............................................. 19
2.4.5 CMOS Data Clearance (JP7) .............................................. 20
2.4.6 eDP Backlight Power Selection (JP9).................................. 21
2.4.7 eDP Panel Power Selection (JP10) ..................................... 22
2.5 Connectors Quick Reference............................................................. 23
2.5.1 eDP Connector (CN1) ......................................................... 24
2.5.2 COM1 RS-232/422/485 Port & COM2 RS-232 Port (CN2) .. 25
2.5.3 Dual USB 2.0 Port (CN3) .................................................... 26
2.5.4 Dual USB 3.0 Port & LAN Port (CN4, CN5)......................... 26
2.5.5 HDMI Port (CN6, CN7)........................................................ 27

MI811F Series User’s Manual
vii
2.5.6 Audio Jack (CN10) ..............................................................27
2.5.7 DVI-D Connector (J11) ........................................................28
2.5.8 SATA III Port (CN8, CN9)....................................................29
2.5.9 Mini-PCIe Slot for mSATA (J8) ............................................29
2.5.10 Mini-PCIe Slot (J7) ..............................................................30
2.5.11 Panel Inverter Connector (J2)..............................................30
2.5.12 LVDS Connector (J3, J4).....................................................31
2.5.13 DC Power Input Connector (J6) ...........................................32
2.5.14 ATX Power Connector (J5) ..................................................33
2.5.15 Dual USB Port (J9, J23) ......................................................34
2.5.16 SATA Power Connector (J14, J15) ......................................34
2.5.17 Front Panel Setting Connector (J12)....................................35
2.5.18 DDR3L SO-DIMM Slot (J10, J13) ........................................36
2.5.19 Amplifier Connector (J16) ....................................................36
2.5.20 Audio Connector (J17).........................................................37
2.5.21 COM3 & COM4 RS-232 Port (J18, J19) ..............................38
2.5.22 Fan Connector (CPU_FAN1, SYS_FAN1) ...........................38
2.5.23 Digital I/O Connector (J21) ..................................................39
Chapter 3 Drivers Installation ............................................. 41
3.1 Introduction........................................................................................42
3.2 Intel
®
Chipset Software Installation Utility ..........................................42
3.3 VGA Driver Installation.......................................................................44
3.4 HD Audio Driver Installation ...............................................................46
3.5 Intel
®
Trusted Execution Engine Drivers Installation ..........................47
3.6 Intel
®
Serial IO Drivers Installation .....................................................49
3.7 LAN Drivers Installation .....................................................................51

viii MI811F Series User’s Manual
Chapter 4 BIOS Setup.......................................................... 53
4.1 Introduction ....................................................................................... 54
4.2 BIOS Setup ....................................................................................... 54
4.3 Main Settings .................................................................................... 55
4.4 Advanced Settings ............................................................................ 56
4.4.1 ACPI Computing .................................................................. 57
4.4.2 LVDS (eDP/DP) Configuration ............................................. 58
4.4.3 iSmart Controller .................................................................. 59
4.4.4 Fintek Super IO Configuration .............................................. 60
4.4.5 Fintek Super IO Hardware Monitor ....................................... 62
4.4.6 CPU Configuration ............................................................... 63
4.4.7 AMI Graphic Output Protocol Policy ..................................... 64
4.4.8 Network Stack Configuration................................................ 65
4.4.9 CSM Configuration ............................................................... 66
4.4.10 USB Configuration ............................................................... 67
4.5 Chipset Settings ................................................................................ 68
4.5.1 South Cluster Configuration ................................................. 68
4.6 Security Settings ............................................................................... 73
4.7 Boot Settings..................................................................................... 76
4.8 Save & Exit Settings .......................................................................... 77
Appendix ........................................................................................ 79
A. I/O Port Address Map........................................................................ 80
B. Interrupt Request Lines (IRQ)............................................................ 83
C. Watchdog Timer Configuration.......................................................... 85

1
Chapter 1
General Information
The information provided in this chapter includes:
•Features
•Packing List
•Optional Accessories
•Specifications
•Block Diagram
•Board Overview
•Board Dimensions

2 MI811F Series User’
s Manual
1.1 Introduction
MI811F is a Mini-ITX motherboard based on the platform of Intel® Pentium®
N4200 or Celeron® N3350. This board features HDMI at I/O coastline,
on-board headers for eDP and 24-bit dual channel LVDS interfaces for video
display. You can use either the eDP or LVDS interface. It operates at the
ambient temperature ranging from 0°C to 60°C.
Photo of MI811F
1.2 Features
•Mini-ITX with Intel®Pentium®QC N4200 / Celeron®DC N3350 SoC
•2 x DDR3L-1866 SO-DIMM socket, expandable up to 8GB
•1 x HDMI, 1 x DVI-D (or 2nd HDMI), and eDP / 24-bit dual channel LVDS
•2 x GbE LAN, 4 x USB 3.0, 6 x USB 2.0, 4 x COM, 2 x SATA III,
1 x PCIe (1x), 2 x Mini-PCIe slot
•Configurable watchdog timer and digital I/O

General Information
MI811F Series User’s Manual 3
1
1.3 Packing List
Your MI811F package should include the items listed below. If any of the
items below is missing, contact the distributor or dealer from whom you
purchased the product.
•MI811F x 1
•IO Shield x 1
•SATA cable x 1
(SATA-5 for ATX power connector;
SATA-53 for DC-In power connector)
•COM cable (PK3K) x 1
•Disk x 1
(including chipset drivers and flash memory utility)
•This User’s Manual x 1
1.4 Optional Accessories
IBASE provides optional accessories as follows:
•Audio cable (Audio-18)
•USB 2.0 cable (USB29)

4 MI811F Series User’
s Manual
1.5 Specifications
Product
Name
MI811F-420 MI811F-420D MI811F-335 MI811F-335D
Form Factor Mini-ITX Motherboard
System
Operating
System
•Windows 10 Enterprise (64-bit)
•Windows 10 IoT Core (64-bit)
•Linux Ubuntu
CPU Type Intel®Pentium®QC N4200 Intel®Celeron®DC N3350
CPU Speed 1.1 ~ 2.5 GHz 1.1 ~ 2.4 GHz
Cache 2 MB
Chipset Integrated
Memory 2 x DDR3L-1866 SO-DIMM, expandable up to 8 GB (Non-ECC)
Storage mSATA SSD
Graphics Intel®Pentium®SoC integrated Gen. 9
Network 2 x Intel®I211AT PCIe Gigabit Ethernet
Super I/O Fintek F81964D-I
Audio Codec
& Controller
Intel®SoC built-in HD audio controller
Realtek ALC283 codec with 2.1 channels and amplifier
Power
Requirement
ATX Power DC-In
12 ~ 24V
ATX Power DC-In
12 ~ 24V
Watchdog
Timer Yes (256 segments, 0, 1, 2…255 sec / min)
BIOS AMI BIOS
iSmart 3.5
H/W Monitor Yes
Smart
Control EuP/ErP wide temperature

General Information
MI811F Series User’s Manual
5
1
Dimensions 170 x 170 mm (6.7” x 6.7”)
RoHS Yes
Certification CE, FCC Class B, LVD
I/O Ports
Display
•1 x HDMI (1.4b, CN7 connector), 3840 x 2160 at
30 Hz
1 x HDMI (1.4b, CN6 connector) or DVI-D, 3840 x 2160 at
30 Hz
•1 x eDP / 24-bit dual channel LVDS
eDP: 4096 x 2160 at 60 Hz
LVDS: 1920 x 1200 at 60 Hz
*If both the HDMI connector (CN6) and DVI-D connector (J11)
ports are connected, HDMI will be given the precedence over
DVI-D.
*eDP and LVDS do not work at the same time.
LAN 2 x RJ45 GbE LAN
USB
•4 x USB 3.0: I/O coastline connectors
•6 x USB 2.0:
2 ports at the I/O coastline
4 ports via on-board pin headers
Serial
4 x COM ports:
•COM1: RS-232/422/485 (I/O coastline connector,
jumperless selection)
•COM2: RS-232 only (I/O coastline connector)
•COM3 & COM4: RS-232 only (via on-board
box-headers)
SATA 2 x SATA III
(one is shared with the mini-PCIe slot (full-size) for mSATA)
Audio
•Line-In
•Line-Out
•Microphone-Input
Digital IO 4-In & 4-Out

6 MI811F Series User’
s Manual
Expansion
Slots
•1 x Mini PCIe slot (full-size) for mSATA
•1 x Mini PCIe slot (half-size) with USB
•1 x PCIe (x1) slot
Environment
Temperature
•Operation: 0 ~ 60 °C (32 ~ 140 °F)
•Storage: -20 ~ 80 °C (-4 ~ 176 °F)
Relative
Humidity 0 ~ 90 %, non-condensing at 60 °C
All specifications are subject to change without prior notice.

General Information
MI811F Series User’s Manual
7
1
1.6 Block Diagram

8 MI811F Series User’
s Manual
1.7 Overview
Top View
Photo of MI811F (ATX power)
＊The photos above are for reference only. Some minor components may
differ.

General Information
MI811F Series User’s Manual 9
1
I/O View
No. Name No. Name
1 COM1 RS-232/422/485 Port 6
HDMI Port
(given the precedence over
the DVI-D connector, J11)
2 COM2 RS-232 Port 7 HDMI Port
3 USB 2.0 Port 8 Line-In
4 LAN Port (GbE) 9 Line-Out
5 USB 3.0 Port 10 Microphone-Input

10 MI811F Series User’
s Manual
1.8 Dimensions
170
165.1
33.02
35.52
31.05
28.38
10.16
0
0
6.35 17.99 44.65 64.21 86.45 107.98 128.8 170 146.12 163.83 0

11
Chapter 2
Hardware Configuration
This section provides information on jumper settings and
connectors on the MI811F in order to set up a workable system.
On top of that, you will also need to install crucial pieces such as
the CPU and the memory before using the product. The topics
covered are:
•Essential installations before you begin
•Jumper and connector locations
•Jumper settings and information of connectors

12 MI811F Series
User’s Manual
2.1 Essential Installations Before You Begin
Follow the instructions below to install the memory modules.
2.1.1 Installing the Memory
To install the modules, locate the memory slot on the board and perform the
following steps:
.
1. Align the key of the memory module with that on the memory slot and
insert the module slantwise.
2. Gently push the module in an upright position until the clips of the slot
close to hold the module in place when the module touches the bottom
of the slot.
To remove the module, press the clips outwards with both hands, and the
module will pop-up.