IBASE Technology MI836F User manual

MI836F
Intel
®
Atom
®
SoC
(x6000 Series)
Mini-ITX Motherboard
User’s Manual
Version 1.0
(December 2022)

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User’s Manual
Copyright
© 2022 IBASE Technology, Inc. All rights reserved.
No part of this publication may be reproduced, copied, stored in a retrieval
system, translated into any language or transmitted in any form or by any
means, electronic, mechanical, photocopying, or otherwise, without the prior
written consent of IBASE Technology, Inc. (hereinafter referred to as
“IBASE”).
Disclaimer
IBASE reserves the right to make changes and improvements to the
products described in this document without prior notice. Every effort has
been made to ensure the information in the document is correct; however,
IBASE does not guarantee this document is error-free.
IBASE assumes no liability for incidental or consequential damages arising
from misapplication or inability to use the product or the information
contained herein, nor for any infringements of rights of third parties, which
may result from its use.
Trademarks
All the trademarks, registrations and brands mentioned herein are used for
identification purposes only and may be trademarks and/or registered
trademarks of their respective owners.

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Compliance
This is a class B product. In a domestic environment, this product may cause
radio interference in which case users may be required to take adequate
measures.
This product has been tested and found to comply with the limits for a Class
A device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with manufacturer’s
instructions, may cause harmful interference to radio communications.
WEEE
This product must not be disposed of as normal household
waste, in accordance with the EU directive of for waste
electrical and electronic equipment (WEEE - 2012/19/EU).
Instead, it should be disposed of by returning it to a
municipal recycling collection point. Check local
regulations for disposal of electronic products.
Green IBASE
This product is compliant with the current RoHS
restrictions and prohibits use of the following substances in
concentrations exceeding 0.1% by weight (1000 ppm)
except for cadmium, limited to 0.01% by weight (100 ppm).
• Lead (Pb)
• Mercury (Hg)
• Cadmium (Cd)
• Hexavalent chromium (Cr6+)
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ether (PBDE)

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Important Safety Information
Carefully read the precautions before using the board.
Environmental conditions:
•Use this product in environments with ambient temperatures between
0˚C and 60˚C.
•Do not leave this product in an environment where the storage
temperature may be below -20° C or above 80° C. To prevent from
damages, the product must be used in a controlled environment.
Care for your IBASE products:
•Before cleaning the PCB, unplug all cables and remove the battery.
•Clean the PCB with a circuit board cleaner or degreaser, or use cotton
swabs and alcohol.
•Vacuum the dust with a computer vacuum cleaner to prevent the fan
from being clogged.
WARNING
Attention during use:
•Do not spill water or any other liquids on this product.
•Do not place heavy objects on the top of this product.
Anti-static precautions
•Wear an anti-static wrist strap to avoid electrostatic discharge.
•Place the PCB on an anti-static kit or mat.
•Hold the edges of PCB when handling.
•Touch the edges of non-metallic components of the product instead of
the surface of the PCB.
•Ground yourself by touching a grounded conductor or a grounded bit of
metal frequently to discharge any static.
CAUTION
Danger of explosion if the internal lithium-ion battery is replaced by an
incorrect type. Replace only with the same or equivalent type recommended
by the manufacturer. Dispose of used batteries according to the
manufacturer’s instructions or recycle them at a local recycling facility or
battery collection point.

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Warranty Policy
•IBASE standard products:
24-month (2-year) warranty from the date of shipment. If the date of
shipment cannot be ascertained, the product serial numbers can be
used to determine the approximate shipping date.
•3
rd
-party parts:
12-month (1-year) warranty from delivery for the 3rd-party parts that are
not manufactured by IBASE, such as CPU, CPU cooler, memory,
storage devices, power adapter, panel and touchscreen.
＊PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,
IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL
BE TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL
BE BILLED FOR REPAIR AND SHIPPING CHARGES.
Technical Support & Services
1. Visit the IBASE website at www.ibase.com.tw to find the latest
information about the product.
2. If you need any further assistance from your distributor or sales
representative, prepare the following information of your product and
elaborate upon the problem.
•Product model name
•Product serial number
•Detailed description of the problem
•The error messages in text or in screenshots if there is any
•The arrangement of the peripherals
•Software in use (such as OS and application software, including the
version numbers)
3. If repair service is required, you can download the RMA form at
http://www.ibase.com.tw/english/Supports/RMAService/. Fill out the
form and contact your distributor or sales representative.

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Table of Contents
Chapter 1 General Information.................................................... 1
1.1 Introduction .........................................................................................2
1.2 Features..............................................................................................2
1.3 Packing List......................................................................................... 3
1.4 Optional Accessories........................................................................... 3
1.5 Specifications ......................................................................................4
1.6 Block Diagram ..................................................................................... 6
1.7 Product View .......................................................................................7
1.8 Dimensions ....................................................................................... 10
Chapter 2 Hardware Configuration........................................ 11
2.1 Installations ....................................................................................... 12
2.1.1 Installing the Memory ........................................................... 12
2.1.2 Setting the Jumpers ............................................................. 13
2.2 Jumper & Connector Locations.......................................................... 14
2.2.1 Clear CMOS Data (SW1) ..................................................... 15
2.2.2 Clear ME Register (SW1) .................................................... 16
2.2.3 EDP Panel Power Selection (JP1)....................................... 17
2.2.4 LVDS Panel Brightness Selection (JP2) .............................. 18
2.2.5 LVDS Panel Power Selection (JP3)..................................... 19
2.2.6 ATX & AT Power Mode Selection (JP4)............................... 20
2.3 Connectors Quick Reference............................................................. 21
2.3.1 COM1 & COM2 RS-232/422/485 Ports (CN8) ..................... 22
2.3.2 COM3 & COM4 RS-232 Ports (J22, J21) ............................ 23
2.3.3 eDP Connector (CN2) ......................................................... 24
2.3.4 DC Power Input Connector (CN3) ....................................... 25
2.3.5 LCD Backlight Connector (J1) ............................................. 25
2.3.6 SATA HDD Power Connector (J2)....................................... 26
2.3.7 DC Power Input Connector (J3)........................................... 26
2.3.8 LVDS Connector (J4-CHA, J7-CHB) ................................... 27
2.3.9 SUS_CLK-OUT (J10) .......................................................... 28
2.3.10 Audio SPDIF-OUT (J12)...................................................... 28
2.3.11 Front Panel Settings Connector (J15).................................. 29
2.3.12 Audio Amplifier Connector (J16).......................................... 30
2.3.13 Audio Connector (J17)......................................................... 31
2.3.14 Digital I/O Connector (J19) .................................................. 32

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2.3.15 USB 2.0 Connector (J20, J23) .............................................33
2.3.16 CPU PWM Fan Power Connector (CPU_FAN1) ...................33
Chapter 3 Drivers Installation .............................................35
3.1 Introduction........................................................................................36
3.2 Intel
®
Chipset Software Installation Utility ...........................................36
3.3 HD Graphics Driver Installation ..........................................................37
3.4 HD Audio Driver Installation ...............................................................40
3.5 Intel
®
Management Engine Drivers Installation...................................41
3.6 LAN Driver Installation .......................................................................42
Chapter 4 BIOS Setup..........................................................44
4.1 Introduction........................................................................................45
4.2 BIOS Setup........................................................................................45
4.3 Main Settings.....................................................................................46
4.4 Advanced Settings.............................................................................47
4.5 Chipset Settings.................................................................................58
4.6 Security Settings................................................................................61
4.7 Boot Settings .....................................................................................63
4.8 Save & Exit Settings ..........................................................................64
Appendix ........................................................................................65
A. I/O Port Address Map ........................................................................66
B. Interrupt Request Lines (IRQ) ............................................................68
C. Watchdog Timer Configuration...........................................................69
D. On-Board Connector Types ...............................................................73

1
Chapter 1
General Information
The information provided in this chapter includes:
•Features
•Packing List
•Specifications
•Block Diagram
•Product View
•Dimensions

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1.1 Introduction
MI836F is a Mini-ITX motherboard based on the Atom x6000E series
processors with either LVDS or eDP graphics interface support. Other
graphics display ports available are VGA and HDMI 2.0b. Two DDR4
SO-DIMM sockets support up to 32GB of 3200MHz memory. Two 2.5G LAN
are on board as well as 3x USB 3.1 and four USB 2.0 and M.2 Key E and
mPCIe sockets. The board runs on +12V~24V DC power and operating
temperature from -40C to 70C.
MI836F
1.2 Features
•2 x DDR4 SO-DIMM with 32MB maximum support.
•2x 2.5G LAN, 4x COM, 1x HDMI, 1x VGA
•1x eDP or 1x 24-bit dual channel LVDS
•3x USB 3.1, 2x SATA III
•PCIe (x1), M.2 E2230, M.2 M2280 (SATA only), mPCIe expansion slots
•Configurable watchdog timer and digital I/O
•Reserved firmware TPM (fTPM)

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1
1.3 Packing List
Your product package should include the items listed below.
•Motherboard
•I/O Shield
•SATA Cable (SATA-3F)
•Disk (including chipset drivers)
•This User’s Manual
1.4 Optional Accessories
IBASE provides the optional accessories listed below.
•Audio Cable (Audio-34)
•USB Cable (USB-29)
•USB Cable (USB2-4)
•COM Port Cable (PK1H)
•60W Power Adaptor

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1.5 Specifications
Product Name MI836F-6425E
MI836FE-6425E MI836F-6413E MI836FE-6211E
Intel Atom SoC X6425E X6425E X6413E X6211E
SoC Speed 2.0~3.0GHz 2.0~3.0GHz 1.5~3.0GHz 1.3~3.0GHz
LVDS or EDP LVDS eDP LVDS eDP
Memory 2 x DDR4 SO-DIMM 3200MHz, expandable up to 32GB
LAN 2x 2.5G LAN (Intel)
Network 1
st
LAN: Intel
®
I226IT 2.5GbE
2
nd
LAN: Intel
®
I226IT 2.5GbE
Audio Codec Built-in HD audio with Realtek ALC888S
Super I/O Fintek F81964D
Digital I/O 4-In / 4-Out
Watchdog
Timer Yes (256 segments, 0, 1, 2…255 sec / min)
BIOS AMI BIOS
TPM Reserved firmware TPM (fTPM)
EuP / ErP Compliant
Dimensions 170 x 170 mm (6.7” x 6.7”)
RoHS Yes
Operating
System
•Microsoft Windows 10 (64-bit)
•Linux Ubuntu (64-bit)
Certification CE, FCC Class A

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1
I/O Ports
Display
•1 x HDMI 2.0b (4096 x 2160 at 60 Hz)
•1 x VGA (1920 x 1200 at 60 Hz)
•1 x eDP or 24-bit dual channel LVDS (1920 x 1080 at 60 Hz)
LAN 2 x RJ45 GbE LAN
USB •3 x USB 3.1 (I/O coastline connectors)
•4 x USB 2.0 (via an onboard pin-header)
Serial
4 x COM ports:
• COM1 & COM2: RS-232/422/485 (I/O coastline connectors,
jumper-less selection)
•COM3 ~ COM4: RS-232 only (via onboard box-headers)
SATA 2 x SATA III
Audio Jack 1 x Line-In, 1 x Line-Out, 1 x Mic-In
Digital IO 4-In & 4-Out
Expansion
Slots
•1 x PCIe (x1)
•1 x M.2 Key M, type 2280, with SATA port
•1 x M.2 Key E, type 2230, with USB 2.0 / PCIe(x1)
•mPCIe
Environment
Temperature •Operating temperature: -40 ~ 70 °C
Relative
Humidity 0 ~ 90 %, non-condensing at 60 °C
All specifications are subject to change without prior notice.

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1.6 Block Diagram

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1.7 Product View
Top View

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Bottom View

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I/O View
No. Name No. Name
1 CN3 DC Power Input 5 CN7 LAN Port
2 CN4 VGA & HDMI Ports 6 CN8 COM1/COM2 Ports
3 CN5 USB 3.1 Port 7 CN9 Audio
(Line-out, Line-in, Mic)
4 CN6 LAN & 2x USB 3.1 Ports

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1.8 Dimensions

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Chapter 2
Hardware Configuration
This section provides information on jumper settings and
connectors on the board in order to set up a workable system.
The topics covered are:
•Memory installation
•Jumper and connector locations
•Jumper settings and information of connectors

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2.1 Installations
2.1.1 Installing the Memory
To install the modules, locate the memory slot on the board and perform the
following steps:
1. Align the key of the memory module with that on the memory slot and
insert the module slantwise.
2. Gently push the module in an upright position until the clips of the slot
close to hold the module in place when the module touches the bottom
of the slot.
To remove the module, press the clips outwards with both hands, and the
module will pop-up.