Infortrend EonStor S12S-R1032 User manual

i
Version 1.0 (June, 2007)
Installation and Hardware
Reference Manual
EonStor®S12S-R1032
S12S-G1032
SAS-to-SAS/SATA RAID Subsystem

Contact Information
Asia Pacific
(International Headquarters)
Infortrend Technology, Inc.
8F, No. 102 Chung-Shan Rd., Sec. 3
Chung-Ho City, Taipei Hsien, Taiwan
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://esupport.infortrend.com.tw
http://www.infortrend.com.tw
Americas
Infortrend Corporation
2200 Zanker Road, Unit D,
San Jose, CA. 95131
USA
Tel: [phone]
Fax: [phone]
[email protected]
http://esupport.infortrend.com
http://www.infortrend.com
China
Infortrend Technology, Limited
Room 1210, West Wing, Tower One, Junefield
Plaza, No. 6 Xuanwumen Street, Xuanwu
District, Beijing, China
Post code: 100052
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://esupport.infortrend.com.tw
http://www.infortrend.com.cn
Europe (EMEA)
Infortrend Europe Limited
1 Cherrywood, Stag Oak Lane
Chineham Business Park
Basingstoke, Hampshire
RG24 8WF, UK
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://esupport.infortrend-europe.com/
http://www.infortrend.com
Japan
Infortrend Japan, Inc.
6F, Okayasu Bldg.,
1-7-14 Shibaura Minato-ku,
Tokyo, 105-0023 Japan
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://esupport.infortrend.com.tw
http://www.infortrend.co.jp
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Copyright 2007
This Edition First Published 2007
All rights reserved. This publication may not be reproduced, trans-
mitted, transcribed, stored in a retrieval system, or translated into any
language or computer language, in any form or by any means, elec-
tronic, mechanical, magnetic, optical, chemical, manual or otherwise,
without the prior written consent of Infortrend Technology, Inc.
Disclaimer
Infortrend Technology makes no representations or warranties with
respect to the contents hereof and specifically disclaims any implied
warranties of merchantability or fitness for any particular purpose.
Furthermore, Infortrend Technology reserves the right to revise this
publication and to make changes from time to time in the content
hereof without obligation to notify any person of such revisions or
changes. Product specifications are also subject to change without
prior notice.
Trademarks
Infortrend, the Infortrend logo, RAIDWatch and EonStor are
registered trademarks of Infortrend Technology, Inc. Other names
prefixed with “IFT” and “ES” are trademarks of Infortrend Technology,
Inc.
PowerPC® is a trademark of International Business Machines
Corporation and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or
registered trademarks of their respective owners.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS
LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and service
personnel who have been instructed of and fully understand the possible
hazardous conditions and the consequences of accessing non-field-
serviceable units, e.g., system backplane.
FCC (applies in the U.S. and Canada)
FCC Class B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to Part 15 of the FCC Rules (47
CFR, Part 2, Part 15 and CISPR PUB. 22 Class B). These limits are
designed to provide reasonable protection against harmful
interference when the equipment is operated in a residential
installation. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with
this user’s guide, may cause harmful interference to radio
communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, you are encouraged
to try to correct the interference by one or more of the following
measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and
receiver.
Connect the equipment into an outlet on a circuit different
from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for
help.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
This device complies with Part 15 of FCC Rules. Operation is subject
to the following two conditions: 1) this device may not cause harmful
interference, and 2) this device must accept any interference
received, including interference that may cause undesired operation.
Warning!
A shielded power cord is required in order to meet FCC emission
limits and also to prevent interference with nearby radio and
television reception.
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly
approved by the party responsible for compliance could void your
authority to operate the equipment.
This device is in conformity with the EMC.
CB (Certified Worldwide)
This device meets the requirements of the CB standard for
electrical equipment with regard to establishing a satisfactory
level of safety for persons using the device and for the area
surrounding the apparatus. This standard covers only safety
aspects of the above apparatus; it does not cover other matters,
such as style or performance.
CCC For Power Supplies’ compatibility to China Compulsory
Certification.
ITE BSMI Class B, CNS 13438 (for Taiwan)
This device is in conformity with UL standards for safety.
Infortrend is committed to being properly prepared and taking all
the necessary steps that will result in our compliance with the
new European directive, RoHS (2002/95/EC), on or before the
specific dates set forth in those applicable laws and regulations.
Infortrend is applying its own internal efforts and expertise and is
working closely with customers and suppliers to achieve
compliance while maintaining an uninterrupted supply of quality
products. Infortrend is currently investigating, evaluating, and
qualifying our materials and components to ensure that products
sold on or after 1 July 2006, in such territory, are in compliance
with the above regulations.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Disposal of Old Electrical & Electronic Equipment (Applicable in
the European Union and other European countries with separate
collection systems)
This symbol on the product or on its packaging indicates that this
product shall not be treated as household waste. Instead it shall
be handed over to the applicable collection point for the recycling
of electrical and electronic equipment. By proper waste handling
of this product you ensure that it has no negative consequences
for the environment and human health, which could otherwise be
caused if this product is thrown into the garbage bin. The
recycling of materials will help to conserve natural resources.
For more details about recycling of this product, please contact
your local city office, your household waste disposal service or
the dealer from whom you purchased the product.
This product utilizes STA standards compliant interfaces.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Table of Contents
CONTACT INFORMATION ....................................................................................................III
COPYRIGHT 2007.................................................................................................................IV
This Edition First Published 2007....................................................................................................iv
Disclaimer ...................................................................................................................................iv
Trademarks ...................................................................................................................................iv
WARNINGS AND CERTIFICATIONS ...................................................................................V
SAFETY PRECAUTIONS ........................................................................................................XI
Precautions and Instructions.............................................................................................................xi
ESD Precautions............................................................................................................................. xii
ABOUT THIS MANUAL........................................................................................................XII
REVISION HISTORY ............................................................................................................XII
WHO SHOULD READ THIS MANUAL? ..................................................................................XII
RELATED DOCUMENTATION ............................................................................................ XIII
CONVENTIONS .................................................................................................................. XIII
CHAPTER 1 INTRODUCTION
1.1 PRODUCT OVERVIEW ............................................................................................1-1
1.1.1 Product Introduction ............................................................................................... 1-1
1.1.2 Model Variations .................................................................................................... 1-2
1.2 CHASSIS OVERVIEW ..............................................................................................1-2
1.2.1 Front Panel Overview............................................................................................. 1-2
1.2.2 Rear Panel Overview .............................................................................................. 1-3
1.2.3 Internal Backplane.................................................................................................. 1-4
1.2.4 Physical Dimensions............................................................................................... 1-4
1.3 MAJOR SUBSYSTEM COMPONENTS.......................................................................1-4
1.3.1 LCD keypad Panel.................................................................................................. 1-5
1.3.2 Drive Tray............................................................................................................... 1-6
1.3.3 MUX Kit................................................................................................................. 1-7
1.3.4 The RAID Controller Module................................................................................. 1-8
1.3.5 Special Firmware Implementations......................................................................... 1-9
Controller Module Interfaces ............................................................................................... 1-9
1.3.6 PSUs ..................................................................................................................... 1-12
1.3.7 Cooling Modules................................................................................................... 1-13
1.4 ENCLOSURE MONITORING ..................................................................................1-14
1.4.1 I2C bus.................................................................................................................. 1-14
1.4.2 Proprietary In-band Enclosure Service ................................................................. 1-14
1.4.3 LED Indicators...................................................................................................... 1-15
1.4.4 Audible Alarms..................................................................................................... 1-15
1.5 HOT-SWAPPABLE COMPONENTS.........................................................................1-15
1.5.1 Hot-swap Capability ............................................................................................. 1-16
1.5.2 Components.......................................................................................................... 1-16
CHAPTER 2 HARDWARE INSTALLATION
2.1 INTRODUCTION......................................................................................................2-1
2.2 INSTALLATION PREREQUISITES............................................................................2-1
2.3 SAFETY PRECAUTIONS ..........................................................................................2-3
2.3.1 Precautions and Instructions ................................................................................... 2-3
2.3.2 Static-free Installation............................................................................................. 2-5
2.3.3 Preparation.............................................................................................................. 2-5
2.4 GENERAL INSTALLATION PROCEDURE.................................................................2-6
2.4.1 Installation Procedure Flowchart ............................................................................ 2-7
2.5 UNPACKING THE SUBSYSTEM................................................................................2-7
2.5.1 Preinstalled Components ........................................................................................ 2-8
2.5.2 Modules to be Installed........................................................................................... 2-8
2.6 RACKMOUNTING....................................................................................................2-8
2.7 HARD DRIVE INSTALLATION.................................................................................2-9
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
2.7.1 Hard Drive Installation Prerequisites...................................................................... 2-9
2.7.2 Drive Installation .................................................................................................. 2-10
2.8 DRIVE TRAY INSTALLATION ...............................................................................2-11
2.9 OPTIONAL BATTERY MODULE INSTALLATION ..................................................2-13
2.9.1 BBU Warnings and Precautions ........................................................................... 2-13
2.9.2 Installation Procedure ........................................................................................... 2-14
CHAPTER 3 SUBSYSTEM CONNECTION
3.1 HOST CONNECTION PREREQUISITES ....................................................................3-1
The Host Link Cables.................................................................................................................... 3-1
3.2 TOPOLOGY AND CONFIGURATION CONSIDERATIONS..........................................3-3
Basic Configuration Rules ............................................................................................................ 3-3
3.3 SAMPLE TOPOLOGY ..............................................................................................3-5
SAS Expansion Configuration ...................................................................................................... 3-6
CHAPTER 4 SYSTEM OPERATION AND MONITORING
4.1 POWER ON.............................................................................................................4-1
4.1.1 Check List............................................................................................................... 4-1
4.1.2 Power On Procedure............................................................................................... 4-2
4.1.3 Power On Status Check .......................................................................................... 4-2
4.1.4 LCD Screen ............................................................................................................ 4-3
4.2 POWER OFF PROCEDURE ......................................................................................4-5
4.3 SYSTEM MONITORING OVERVIEW .......................................................................4-6
4.4 STATUS-INDICATING LEDS...................................................................................4-8
4.4.1 LED Overview........................................................................................................ 4-8
4.4.2 LCD Keypad Panel................................................................................................. 4-8
4.4.3 Drive Tray LEDs .................................................................................................... 4-9
4.4.4 Controller Module LEDs ...................................................................................... 4-10
4.4.4.1 Controller Status LEDs........................................................................................ 4-10
4.4.4.2 SAS Port LEDs.................................................................................................... 4-11
4.4.4.3 Restore Default LED ........................................................................................... 4-11
4.4.4.4 LAN Port LEDs................................................................................................... 4-11
4.4.5 BBU LED............................................................................................................. 4-12
4.4.6 PSU LEDs............................................................................................................. 4-12
4.4.7 Cooling Module LEDs.......................................................................................... 4-13
4.5 AUDIBLE ALARM .................................................................................................4-14
4.5.1 Failed Devices ...................................................................................................... 4-14
4.6 I2CMONITORING.................................................................................................4-15
CHAPTER 5 SYSTEM MAINTENANCE
5.1 OVERVIEW .............................................................................................................5-1
5.1.1 About Subsystem Maintenance............................................................................... 5-1
5.1.2 General Notes on Component Replacement ........................................................... 5-2
5.2 REPLACING A CONTROLLER MODULE .................................................................5-3
5.2.1 Considerations ........................................................................................................ 5-3
5.2.2 Removing the Controller Module ........................................................................... 5-4
5.2.3 Replacing the Controller Module............................................................................ 5-5
5.3 DIMMMODULE REPLACEMENT..........................................................................5-7
5.3.1 DIMM Module Considerations............................................................................... 5-7
5.3.2 DIMM Module Upgrade/Replacement Procedure .................................................. 5-8
5.4 REPLACING A FAULTY BBU..................................................................................5-9
5.5 REPLACING A FAULTY PSU ................................................................................5-12
5.5.1 PSU Overview...................................................................................................... 5-12
5.5.2 Replacing the PSU................................................................................................ 5-12
5.6 COOLING MODULE MAINTENANCE ....................................................................5-15
5.6.1 Notes on Cooling Module Maintenance................................................................ 5-15
5.6.2 Replacing a Cooling Module ................................................................................ 5-16
5.7 REPLACING A FAILED HARD DRIVE ...................................................................5-19
5.7.1 Hard Drive Maintenance Overview...................................................................... 5-19
5.7.2 Replacing a Hard Drive ........................................................................................ 5-19
APPENDIX A SPECIFICATIONS
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
A.1 TECHNICAL SPECIFICATIONS...............................................................................A-1
Environmental Specifications........................................................................................................A-1
Power Requirements .....................................................................................................................A-1
Vibration ................................................................................................................................A-2
Certifications ................................................................................................................................A-2
Warning Alarms............................................................................................................................A-2
A.2 FUNCTIONAL SPECIFICATIONS.............................................................................A-2
Configuration Specifications.........................................................................................................A-2
Architectural Specifications..........................................................................................................A-3
A.3 POWER SUPPLY SPECIFICATIONS.........................................................................A-3
A.4 COOLING MODULE SPECIFICATIONS...................................................................A-4
A.5 RAID MANAGEMENT........................................................................................... A-4
A.6 FAULT TOLERANCE MANAGEMENT..................................................................... A-5
APPENDIX B SPARE PARTS AND ACCESSORIES
B.1 SPARE PARTS ........................................................................................................ B-1
B.2 ACCESSORIES........................................................................................................ B-2
APPENDIX C PINOUTS
C.1 SASCONNECTOR PINOUTS ..................................................................................C-1
C.2 COM1 SERIAL PORT CABLE................................................................................C-2
C.3 IFT-9011 NULL MODEM ......................................................................................C-4
C.4 ETHERNET PORT PINOUTS ...................................................................................C-5
C.5 POWER CONNECTORS...........................................................................................C-5
SOFTWARE AND FIRMWARE UPDATES..............................................................................XIV
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Safety Precautions
Precautions and Instructions
Provide a soft, clean surface to place your subsystem on before
working on it. Servicing on a rough surface may damage the
exterior of the chassis.
The EonStor subsystem comes with numerous drive bays.
Leaving any of these drive bays empty will seriously affect the
efficiency of the airflow through the enclosure interior, and will
consequently lead to system overheating, which can cause
irreparable damage.
Prior to powering on the subsystem, ensure that the correct
power range is being used.
All modules must be properly installed before powering on the
subsystem. If a cooling module is missing, heat will quickly
accumulate within the chassis and the other components may
malfunction.
If a module fails, leave it in place until you have a replacement
unit and you are ready to replace it.
Handle subsystem modules using their retention screws, eject
levers, and the metal frames/face plates. Avoid touching PCB
boards and connector pins.
Airflow Consideration: The subsystem requires an airflow
clearance, especially at the front and rear.
Be sure that the rack cabinet into which the subsystem chassis
will be installed provides sufficient ventilation channels and
airflow circulation around the subsystem.
To comply with safety, emission, or thermal requirements, none
of the covers or replaceable modules should be removed. Make
sure that all enclosure modules and covers are securely in place
during operation.
Single-controller models come with a single controller module
and a dummy cage is placed over the lower controller bay. Since
the single-controller modules cannot be upgraded, this metal
sheet should NEVER be removed.
If it is necessary to transport the subsystem, repackage all disk
drives separately using the original packaging materials.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work
pad are recommended. Avoid dust and debris in your work area.
About This Manual
This manual:
Introduces the EonStor RAID subsystem series.
Describes all active components in the subsystem.
Provides recommendations and details about the hardware
installation processes.
Briefly describes how to monitor the subsystem.
Describes how to maintain the subsystem.
This manual does not:
Describe components that are not user-serviceable.
Describe the configuration options of firmware, using terminal
emulation programs, or the RAIDWatch GUI that came with
your subsystem.
Give a detailed description of the RAID controllers embedded
within the subsystem.
Revision History
Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.
xi

EonStor S12S-R/G1032 Installation and Hardware Reference Manual
Related Documentation
•SAS/SATA Series RAID Subsystem Operation Manual
(firmware)
•RAIDWatch User’s Manuals (Java-based or embedded
versions)
These two (2) documents are located in the CD included with your
subsystem package.
Conventions
Naming
From this point on and throughout the rest of this manual, the
EonStor series is referred to as simply the “subsystem” or the
“enclosure” and EonStor is frequently abbreviated as “ES.”
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts.
They can be read in any order. Each statement is preceded by a
round black dot “•.”
Numbered Lists: Numbered lists are used to describe sequential
steps you should follow in order.
Important information that users should be aware of is indicated with
the following icons:
NOTE:
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any
directions or instructions contained therein can help you avoid
making mistakes.
CAUTION!
Cautionary messages should also be heeded to help you reduce
the chance of losing data or damaging the system.
IMPORTANT!
Important messages help you avoid erroneous configurations and
hardware faults.
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EonStor S12S-R/G1032 Installation and Hardware Reference Manual
WARNING!
Warnings appear where overlooked details may cause damages
to the equipment or result in personal injury. Warnings should be
taken seriously.
Software and Firmware Updates
Please contact your system vendor or visit Infortrend’s VIP room
(http://viproom.infortrend.com) or (esupport.infortrend.com) websites
for the latest software or firmware updates.
Problems that occur during the updating process may cause
unrecoverable errors and system downtime. Always consult technical
personnel before proceeding with any firmware upgrade.
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This page is intentionally left blank.
xiv

Chapter 1
Introduction
1.1 Product Overview
1.1.1 Product Introduction
This hardware manual briefly introduces the EonStor SAS-to-SAS
(Serial Attached SCSI) RAID enclosure that houses either SAS or
Serial ATA (3Gbps SATA-II) disk drives. The enclosure comes with
the host-side connectivity via 4x wide SAS connectors and supports
twelve (12) hot-swappable SAS/SATA disk drives. The enclosure is
managed by redundant
or a single RAID
controller that provide
complete RAID
functionality and the
computing power to
facilitate data flow
between application
servers and disk drives and report enclosure operating statuses
through an I2C bus or the proprietary in-band enclosure service. The
enclosure, along with SAS JBODs, connects to application servers
and serves as a building block of a scalable configuration.
The RAID firmware supports communications with SAS initiators and
SAS or SATA disk drives. In terms of physical connection, the SAS
interface provides ease of cabling through SFF-8088, 4x wide, mini-
SAS interface connectors. Each SAS channel within is capable of a
1.5/3.0Gb/s data rate. Each RAID controller provides two (2) SAS
connectors for host and one (1) SAS connector for expansion each
with 4 PHYs. With a SAS-/SATA-compatible backplane, the
subsystem supports SAS or 3Gbps SATA-II disk drives, and is ideal
for adding large capacity to a storage pool.
Dual-redundant RAID controllers (S12S-R1032), power supplies and
cooling modules protect the subsystem from the down time caused
by single module failure. Power supply units (PSU) share load in a
dual-redundant configuration, and is able to sustain system operation
Figure 1-1: EonStor S12S Enclosure
Product Overview 1-1

EonStor S12S-R/G1032 Installation and Hardware Reference Manual
in the event of single power supply failure. The modular nature of the
subsystem and the easy accessibility to all major components
ensure that faults can be corrected online, within a few seconds.
NOTE:
On receiving and unpacking your subsystem, please check the
package contents against the included Unpacking List. If any
modules are missing, please contact your subsystem vendor
immediately.
1.1.2 Model Variations
The basics of S12S are listed in Table 1-1 below:
Model Controllers Controller
Configuration Host Ports Expansion
Ports
S12S-R1032 IFT-89S10RE12 x 2 Redundant 4 2
S12S-G1032 IFT-89S10GE12 x 1 Single (not
upgradable) 2 1
Table 1-1: EonStor S12S Model Variations
S12S-R1032: The redundant-controller configuration with two
fold of the computing power and the transparent failover/failback
capability.
S12S-G1032: This single-RAID-controller configuration can not
be upgraded into a dual-controller configuration.
1.2 Chassis Overview
The S12S RAID chassis is built with rugged steel in a standard 19”
2U profile. The chassis is divided into the front and rear sections.
Due to the wide varieties of rackmount options, rackmount rails are
provided as optional accessories. You can locate information about
all major components in the following sections.
NOTE:
Components accessed through the front panel are referred to as
“Front Panel Components” and those accessed through the rear
panel as “Rear Panel Components.”
1.2.1 Front Panel Overview
The front section of the subsystem features a 4 x 3 layout for
housing twelve (12) 3.5-inch drives. Two (2) forearm handles on the
1-2 Chassis Overview

Chapter 1: Introduction
sides of the chassis can help with retrieving the chassis. A
comprehensive LCD keypad panel provides access to all embedded
firmware functionality.
The front view of the S12S subsystem is shown below:
Figure 1-2: Enclosure Front View
Drive bays with drive tray canisters: The subsystem
comes with twelve (12) drive bays in the front section of the
chassis.
LCD keypad panel: The LCD panel is mounted on the left-
side forearm handle. The panel also comes with status
LEDs, function keys, and a mute button.
1.2.2 Rear Panel Overview
The enclosure rear views are shown below. The rear panel provides
access to key components. A description of each rear panel
component is given below:
Figure 1-3: S12S-R1032 Enclosure Rear View
Figure 1-4: S12S- G1032 Enclosure Rear View
RAID controller module: Two (2) or one (1) controller module is
installed in the enclosure. Each controller contains a main circuit
board, which processes I/O requests and RAID parity
computation for data protection and high performance for
application servers.
Chassis Overview 1-3

EonStor S12S-R/G1032 Installation and Hardware Reference Manual
PSUs: The hot-swappable PSUs supply power to the
subsystem. Power on/off is controlled by the individual power
switches on the power supply modules. Each power supply
module contains the system’s cooling module. The redundant
cooling modules ventilate the system with an airflow direction
from the front to the rear.
1.2.3 Internal Backplane
An integrated backplane board separates the front and rear sections
of the chassis. This PCB board provides logic level signals and low
voltage power paths. Thermal sensors and I2C serial paths are
implemented in order to receive temperature/voltage readings and
module presence signals. This board contains no user-serviceable
components.
1.2.4 Physical Dimensions
The S12S subsystem comes in an enhanced 2U chassis with the
following dimensions:
Measured with forearm handles: 482mm x 88mm x 516mm
(width x height x depth)
Measured without forearm handles: 446mm x 88mm x 498mm
(width x height x depth)
1.3 Major Subsystem Components
S12S houses many active components and most of them can be
accessed either through the front or the rear panel. The modular
design of these components facilitates their easy installation and
removal. Hot-swap mechanisms are incorporated to eliminate power
surges and signal glitches that might occur while removing or
installing these modules. Each component is further described
below:
1-4 Major Subsystem Components

Chapter 1: Introduction
1.3.1 LCD keypad Panel
LCD Panel
Figure 1-5: Opening the Front Handle
The LCD panel shown in Figure 1-5 consists of a 16 characters x 2
rows LCD screen with push buttons, a mute button, and LED status
indicators. The LCD front panel provides full access to all array
configurations and monitoring options. After powering up the
subsystem, the initial screen will show the subsystem model name. A
different name can be manually assigned to the subsystem or to
different RAID arrays. This enables easier identification in a topology
consisting of numerous arrays.
Figure 1-6: Front Panel Retention Latch
To access drive bays in the left- or right-hand side column, first
release the retention latches by pushing them outwards (see Figure
1-6), and then swing the forearm handles to the sides. To close the
handles, swing the forearm handles towards the center; gently press
the handles until a click sound is heard. The latches will lock the
handles in place.
Major Subsystem Components 1-5

EonStor S12S-R/G1032 Installation and Hardware Reference Manual
1.3.2 Drive Tray
Figure 1-7: Drive Tray Front View
PN: IFT-9279CDTray
The S12S enclosure comes with drive trays (see Figure 1-7)
designed to accommodate separately purchased standard 1-inch
pitch, 3.5-inch SAS/SATA disk drives. The drive bays are accessible
from the front side of the chassis. Two (2) LEDs on the tray bezel
indicate operating statuses. A rotary bezel lock prevents accidental
removal, while a convenient release button ensures fast and efficient
drive swapping. There are screw holes on the sides of the drive tray
for securing hard drives to the drive tray.
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way
(e.g., by dropping it or resting heavy objects on it). The drive tray
has been customized to fit into the drive bays in the subsystem. If
the drive bay superstructure is deformed or altered, the drive trays
may not fit properly into the drive bay.
The diagram below shows drive bays that are numbered from Slot 1
to Slot 12 (see Figure 1-8), from left to right, and then from top to
bottom. This numbering sequence is important when replacing a disk
drive. Replacing a wrong drive can fatally fail a logical RAID array.
Figure 1-8: S12S Drive Bay Numbering Sequence
1-6 Major Subsystem Components