Intel 3210 Guide

Reference Number: 318465 Revision: 001
Intel®3210 and 3200 Chipset
Thermal/Mechanical Design Guide
November 2007

2Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving,
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel 3210 and 3200 Chipset, Dual Core Intel Xeon processor 3000 Sequence, and Intel Xeon processor 3200 Sequence may
contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1-800-548-4725, or by visiting http://www.intel.com
Intel, Xeon, Intel I/O Controller, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
Copyright © 2007, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 3
Contents
1Introduction..............................................................................................................7
1.1 Design Flow........................................................................................................8
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents ..........................................................................................9
2 Packaging Technology.............................................................................................11
2.1 Non-Critical to Function Solder Joints...................................................................13
2.2 Package Mechanical Requirements.......................................................................13
3 Thermal Specifications ............................................................................................15
3.1 Thermal Design Power (TDP) ..............................................................................15
3.2 Thermal Specification.........................................................................................15
4 Thermal Simulation ................................................................................................. 17
5 Thermal Metrology .................................................................................................. 19
5.1 MCH Case Measurement.....................................................................................19
5.1.1 Supporting Test Equipment...................................................................... 19
5.1.2 Thermal Calibration and Controls..............................................................20
5.1.3 IHS Groove ...........................................................................................20
5.1.4 Thermocouple Attach Procedure ...............................................................22
6 Reference Thermal Solution.....................................................................................35
6.1 Operating Environment ......................................................................................35
6.2 Heatsink Performance........................................................................................35
6.3 Mechanical Design Envelope ...............................................................................36
6.4 Thermal Solution Assembly.................................................................................36
6.4.1 Extruded Heatsink Profiles.......................................................................37
6.4.2 Retention Mechanism Responding in Shock and Vibration.............................38
6.4.3 Thermal Interface Material.......................................................................38
6.4.4 Reference Thermal Solution Assembly Process............................................39
6.5 Reliability Guidelines..........................................................................................40
A Thermal Solution Component Suppliers ...................................................................43
A.1 Heatsink Thermal Solution..................................................................................43
B Mechanical Drawings...............................................................................................45
Figures
1-1 Thermal Design Process .......................................................................................8
2-1 MCH Package Dimensions (Top View)................................................................... 11
2-2 MCH Package Height.......................................................................................... 11
2-3 MCH Package Dimensions (Bottom View)..............................................................12
2-4 Non-Critical to Function Solder Joints...................................................................13
2-5 Package Height................................................................................................. 14
5-1 Omega Thermocouple........................................................................................20
5-2 FCBGA7 Chipset Package Reference Groove Drawing..............................................21
5-3 IHS Groove on the FCBGA7 Chipset Package on the Live Board................................21
5-4 The Live Board on the Fixture Plate...................................................................... 22
5-5 Inspection of Insulation on Thermocouple............................................................. 23
5-6 Bending the Tip of the Thermocouple...................................................................23
5-7 Extending Slightly the Exposed Wire over the End of Groove................................... 24
5-8 Securing Thermocouple Wire with Kapton* Tape Prior to Attach...............................24

4Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
5-9 Detailed Thermocouple Bead Placement................................................................25
5-10 Tapes Installation ..............................................................................................25
5-11 Placing Thermocouple Bead into the Bottom of the Groove ......................................26
5-12 Second Tape Installation.....................................................................................26
5-13 Measuring Resistance between Thermocouple and IHS............................................27
5-14 Adding a Small Amount of Past Flux to the Bead for Soldering .................................27
5-15 Cutting Solder...................................................................................................28
5-16 Positioning Solder on IHS....................................................................................28
5-17 Solder Block Setup.............................................................................................29
5-18 Observing the Solder Melting...............................................................................30
5-19 Pushing Solder Back into the End of Groove ..........................................................30
5-20 Remove Excess Solder........................................................................................31
5-21 Thermocouple Placed into Groove ........................................................................32
5-22 Remove Excess Solder........................................................................................32
5-23 Fill Groove with Adhesive....................................................................................33
5-24 Finished Thermocouple Installation.......................................................................34
6-1 Reference Heatsink Measured Thermal Performance vs. Approach Velocity ................36
6-2 Design Concept for Reference Thermal Solution .....................................................37
6-3 Heatsink Extrusion Profiles..................................................................................37
6-4 Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1).......39
6-5 Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2) .............40
B-1 Intel®3210 and 3200 Chipset Package Drawing....................................................46
B-2 Intel®3210 and 3200 Chipset Motherboard Component
Top-Side Keep-Out Restrictions ...........................................................................47
B-3 Intel®3210 and 3200 Chipset Motherboard Component
Back-Side Keep-Out Restrictions..........................................................................48
B-4 Intel®3210 and 3200 Chipset Reference Thermal Solution Assembly.......................49
B-5 Intel®3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing..........50
B-6 Intel®3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip........51
B-7 Intel®3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut ................52
B-8 Intel®3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2)............53
B-9 Intel®3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2)............54
B-10 Intel®3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly ......55
B-11 Intel®3210 and 3200 Chipset Reference Thermal Solution - Backplate.....................56
B-12 Intel®3210 and 3200 Chipset Reference Thermal Solution - Insulator......................57
B-13 Intel®3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud..........58
Tables
3-1 Intel®3210 Chipset Thermal Specifications ..........................................................15
3-2 Intel®3200 Chipset Thermal Specifications ..........................................................15
5-1 Thermocouple Attach Support Equipment..............................................................19
6-1 Honeywell PCM45F* TIM Performance as a Function of Attach Pressure.....................38
6-2 Reference Thermal Solution Environmental Reliability Guidelines..............................41

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 5
Revision History
§
Document
Number Revision Number Description Date
318465 001 • Initial release of the document. November 2007

6Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 7
Introduction
1Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for
Intel® 3210 and 3200 Chipsets.
• Describe a reference thermal solution that meets the specification of
Intel®3210 and 3200 Chipsets.
Properly designed thermal solutions provide adequate cooling to maintain Intel®3210
and 3200 Chipsets die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining
Intel®3210 and 3200 Chipsets die temperature at or below the specified limits, a
system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for Intel®3210 and 3200
Chipsets components only. For thermal design information on other chipset
components, refer to the respective component datasheet. For the Intel® ICH9, refer to
the Intel®I/O Controller Hub9 (ICH9) Thermal Design Guidelines.
Note: Unless otherwise specified, the term “MCH” refers to the Intel®3210 and 3200
Chipsets.

Introduction
8Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
1.1 Design Flow
1.2 Definition of Terms
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic
substrate where a die is mounted using an underfill C4
(Controlled Collapse Chip Connection) attach style. The primary
electrical interface is an array of solder balls attached to the
substrate opposite the die. Note that the device arrives at the
customer with solder balls attached.
BLT Bond line thickness. Final settled thickness of the thermal
interface material after installation of heatsink.
MCH Memory controller hub. The chipset component contains the
processor interface, the memory interface, the PCI Express*
interface and the DMI interface.
ICH I/O controller hub. The chipset component contains the MCH
interface, the SATA interface, the USB interface, the IDE
interface, the LPC interface, and so forth.
IHS Integrated Heat Spreader. A thermally conductive lid integrated
into the package to improve heat transfer to a thermal solution
through heat spreading.
Tcase_max Maximum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
Tcase_min Minimum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
TDP Thermal design power. Thermal solutions should be designed to
dissipate this target power level. TDP is not the maximum power
that the chipset can dissipate.
TIM Thermal Interface Material. Thermally conductive material
installed between two surfaces to improve heat transfer and
reduce interface contact resistance.
TLA The local ambient air temperature at the component of interest.
The local ambient temperature should be measured just
Figure 1-1. Thermal Design Process
yThermal Model
yThermal Model User's Guide
Step 1: Thermal
Simulation
yThermal Reference
yMechanical Reference
Step 2: Heatsink Selection
yThermal Testing Software
ySoftware User's Guide
Step 3: Thermal Validation
001239

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 9
Introduction
upstream of airflow for a passive heatsink or at the fan inlet for
an active heatsink.
ΨCA Case-to-ambient thermal solution characterization parameter
(Psi). A measure of thermal solution performance using total
package power. Defined as (TC- TLA)/Total Package Power. Heat
source size should always be specified for Ψmeasurements.
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Note: Contact your Intel field sales representative for the latest revision and order number of this document.
§
Document Title Document Number / Location
Intel®I/O Controller Hub9 (ICH9) Thermal Design Guidelines Contact your Intel Field Sales
Representative
Intel®3210 and 3200 Chipset Datasheet www.developer.intel.com
Intel®3210 and 3200 Chipset Specification Update www.developer.intel.com
Dual-Core Intel®Xeon®Processor 3000 Series Datasheet www.developer.intel.com
Quad-Core Intel®Xeon®Processor 3200 Series Datasheet www.developer.intel.com
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales
Representative
Various system thermal design suggestions http://www.formfactors.org

Introduction
10 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 11
Packaging Technology
2Packaging Technology
The Intel®3210 and 3200 Chipset consists of two individual components: the Memory
Controller Hub (MCH) and the Intel®I/O Controller (Intel® ICH9). The Intel®3210 and
3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball
Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder
balls. A mechanical drawing of the package is shown in Figure 2-1. For information on
the Intel® ICH9 package, refer to the Intel®I/O Controller Hub9 (ICH9) Thermal
Design Guidelines.
Figure 2-1. MCH Package Dimensions (Top View)
Figure 2-2. MCH Package Height

Packaging Technology
12 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5 - 1994.
Figure 2-3. MCH Package Dimensions (Bottom View)

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 13
Packaging Technology
2.1 Non-Critical to Function Solder Joints
Intel has defined selected solder joints of the MCH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The MCH signals at
NCTF locations are typically redundant ground or no-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 2-4 identifies the NCTF solder joints of the MCH package.
2.2 Package Mechanical Requirements
The Intel®3210 and 3200 Chipset package has an Integrated Heat Spreader (IHS)
which is capable of sustaining a maximum static normal load of 15-lbf. This mechanical
maximum load limit should not be exceeded during heatsink assembly, shipping
conditions, or standard use conditions. Also, any mechanical system or component
testing should not exceed the maximum limit. The package substrate should not be
used as a mechanical reference or load-bearing surface for the thermal and mechanical
solution.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to
the package.
Figure 2-4. Non-Critical to Function Solder Joints

Packaging Technology
14 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
2. This is the maximum force that can be applied by a heatsink retention clip. The clip
must also provide the minimum specified load of 7.6 lbf on the package to ensure
TIM performance assuming even distribution of the load.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
To ensure that the package static load limit is not exceeded, the designer should
understand the post reflow package height shown in Figure 2-5. The following figure
shows the nominal post-reflow package height assumed for calculation of a heatsink
clip preload of the reference design. Please refer to the package drawing in Figure 2-1
to perform a detailed analysis.
§
Figure 2-5. Package Height

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 15
Thermal Specifications
3Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level that the thermal solutions should be designed to. TDP is not the maximum
power that the chipset can dissipate.
For TDP specifications, see Table 3-1 for Intel®3210 Chipset and Table 3-2 for Intel®
3200. FC-BGA packages have poor heat transfer capability into the board and have
minimal thermal capability without a thermal solution. Intel recommends that system
designers plan for a heatsink when using the Intel®3210 and 3200 Chipset.
3.2 Thermal Specification
To ensure proper operation and reliability of the Intel®3210 and 3200 Chipset, the
case temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in Table 3-1 and Table 3-2. System and/or component
level thermal solutions are required to maintain these temperature specifications. Refer
to Chapter 5 for guidelines on accurately measuring package die temperatures.
Notes:
1. The above specifications are based on post-si analysis.
2. The maximum idle power is the worst-case idle power with L1 ASPM state.
Notes:
1. The above specifications are based on post-silicon analysis.
2. The maximum idle power is the worst case idle power with L1 ASPM state.
§
Table 3-1. Intel®3210 Chipset Thermal Specifications
Parameter Value Notes
Tcase_max 96 °C
Tcase_min 5 °C
TDPdual channel 20.2 W DDR2-667
TDPdual channel 21.3 W DDR2-800
PIdle_max 11.3 W
Table 3-2. Intel®3200 Chipset Thermal Specifications
Parameter Value Notes
Tcase_max 97 °C
Tcase_min 5 °C
TDPdual channel 18.9 W DDR2-667
TDPdual channel 20.0 W DDR2-800
PIdle_max 11.3 W

Thermal Specifications
16 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 17
Thermal Simulation
4Thermal Simulation
Intel provides thermal simulation models of the Intel®3210 and 3200 Chipset and
associated user's guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics,
Inc. Contact your Intel field sales representative for the information of the thermal
models and user's guides.
§

Thermal Simulation
18 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 19
Thermal Metrology
5Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the MCH IHS temperatures. Section 5.1 provides guidelines on
how to accurately measure the MCH case temperature.
5.1 MCH Case Measurement
Intel®3210 and 3200 Chipset cooling performance is determined by measuring the
case temperature using a thermocouple. For case temperature measurements, the
attached method outlined in this section is recommended for mounting a
thermocouple.
Special case is required when measuring case temperature (Tc) to ensure an accurate
temperature measurement. Thermocouples are often used to measure Tc. When
measuring the temperature of a surface that is at a different temperature from the
surrounding local ambient air, errors may be introduced in the measurements. The
measurement errors can be caused by poor thermal contact between the thermocouple
junction and the surface of the integrated heat spreader, heat loss by radiation,
convection, by conduction through thermocouple leads, or by contact between the
thermocouple cement and the heatsink base. To minimize these measurement errors,
the approach outlined in the next section is recommended.
5.1.1 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended that you use
the equipment (or equivalent) given in Table 5-1.
Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance
measurement Fluke 79 Series
Thermal Meter Hand held thermocouple meter Multiple Vendors
Test Fixtures (see notes for ordering information)
Special Modified Tip Solder
Block Fixture 40 W 120 V~60 Hz modified soldering iron Weller SP40L solder tool
Miscellaneous Hardware (see notes for ordering information)
Solder Indium Corp. of America
Alloy 57BI/42SN/1AG 0.010 Diameter 52124
Flux Indium Corp. of America 5RMA
Loctite* 498 Adhesive Super glue w/ thermal characteristics 49850
Adhesive Accelerator Loctite 7452 for fast glue curing 18490
Kapton* Tape for holding thermocouple in place
Thermocouple Omega*, 36 gauge, T type
(see note 2 for ordering information) OSK2K1280/5SR TC-TT-T-36-72

Thermal Metrology
20 Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Notes:
1. The Special Modified Tip Solder Block Fixture is available from Test Equipment Depot 800-517-8431.
2. The Alloy 57BI/42SN/1AG 0.010 Diameter solder and the solder flux are available from Indium Corp. of
America 315-853-4900.
3. The Loctite* 498 Adhesive and Adhesive Accelerator are available from R.S. Hughes 916-737-7484.
4. This part number is a custom part with the specified insulation trimming and packaging requirements
necessary for quality thermocouple attachment, See Figure 16. Order from Omega Eng [phone].
5.1.2 Thermal Calibration and Controls
It is recommended that full and routine calibration of temperature measurement
equipment be performed before attempting to perform case temperature
measurements. Intel recommends checking the meter probe set against know
standard. This should be done at 0 °C (using ice bath or other stable temperature
source) and at an elevated temperature, around 80 °C (using an appropriate
temperature source).
Wire gauge and length should also be considered, as some less expensive
measurement systems are heavily impacted by impedance. There are numerous
resources available throughout the industry to assist with implementation of proper
controls for thermal measurements.
Note: 1. It is recommended to follow company-standard procedures and wear safety items
like glasses for cutting the IHS and gloves for chemical handling.
2. Please ask your Intel field sales representative if you need assistance to groove
and/or install a thermocouple according to the reference process.
5.1.3 IHS Groove
Cut a groove in the package IHS according to the drawing given in Figure 5-2.
Calibration and Control
Ice Point Cell Omega, stable 0°C temperature source
for calibration and offset TRCIII
Hot Point Celll Omega, temperature source to control
and understand meter slope gain CL950-A-110
Table 5-1. Thermocouple Attach Support Equipment (Sheet 2 of 2)
Item Description Part Number
Figure 5-1. Omega Thermocouple