Intel BLKDG965SSCK Configuration guide

August 2006
Order Number: D56010-001US
The Intel®Desktop Board DG965SS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965SS Specification Update.
Intel® Desktop Board
DG965SS
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DG965SS Technical Product
Specification.
August 2006
This product specification applies to only the standard Intel®Desktop Board DG965SS with
BIOS identifier MQ96510A.86A.
Changes to this specification will be published in the Intel Desktop Board DG965SS Specification
Update before being incorporated into a revision of this document.
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or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
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Intel®desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2006, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DG965SS. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG965SS and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DG965SS Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1 Memory Configurations ......................................................... 17
1.5 Intel®G965 Express Chipset ............................................................. 23
1.5.1 Intel G965 Graphics Subsystem.............................................. 23
1.5.2 USB ................................................................................... 26
1.5.3 Serial ATA Interfaces ............................................................ 26
1.5.4 Parallel IDE Interface ............................................................ 27
1.5.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 27
1.6 Legacy I/O Controller....................................................................... 28
1.6.1 Serial Port Interface.............................................................. 28
1.6.2 Parallel Port Interface ........................................................... 28
1.6.3 Diskette Drive Interface ........................................................ 28
1.6.4 PS/2 Keyboard and Mouse Interface........................................ 28
1.7 Audio Subsystem............................................................................. 29
1.7.1 Audio Subsystem Software .................................................... 29
1.7.2 Audio Connectors and Headers ............................................... 30
1.8 LAN Subsystem............................................................................... 31
1.8.1 Intel®82566DC Gigabit Ethernet Controller ............................. 31
1.8.2 LAN Subsystem Software....................................................... 32
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 32
1.9 Hardware Management Subsystem .................................................... 33
1.9.1 Hardware Monitoring and Fan Control...................................... 33
1.9.2 Fan Monitoring..................................................................... 33
1.9.3 Chassis Intrusion and Detection.............................................. 33
1.9.4 Thermal Monitoring .............................................................. 34
1.10 Power Management ......................................................................... 35
1.10.1 ACPI .................................................................................. 35
1.10.2 Hardware Support ................................................................ 37
2Technical Reference
2.1 Memory Map................................................................................... 41
2.1.1 Addressable Memory............................................................. 41
2.2 DMA Channels................................................................................. 43
2.3 Fixed I/O Map ................................................................................. 44
2.4 PCI Configuration Space Map ............................................................ 45
2.5 Interrupts ...................................................................................... 46

Intel Desktop Board DG965SS Technical Product Specification
vi
2.6 PCI Interrupt Routing Map ................................................................ 47
2.7 Connectors and Headers................................................................... 48
2.7.1 Back Panel Connectors .......................................................... 49
2.7.2 Component-side Connectors and Headers ................................ 50
2.8 Jumper Block .................................................................................. 59
2.9 Mechanical Considerations ................................................................ 60
2.9.1 Form Factor......................................................................... 60
2.9.2 I/O Shield ........................................................................... 61
2.10 Electrical Considerations................................................................... 62
2.10.1 DC Loading.......................................................................... 62
2.10.2 Fan Header Current Capability................................................ 62
2.10.3 Add-in Board Considerations .................................................. 63
2.10.4 Power Supply Considerations ................................................. 63
2.11 Thermal Considerations.................................................................... 64
2.12 Reliability ....................................................................................... 66
2.13 Environmental ................................................................................ 67
3Overview of BIOS Features
3.1 Introduction ................................................................................... 69
3.2 BIOS Flash Memory Organization....................................................... 70
3.3 Resource Configuration .................................................................... 70
3.3.1 PCI Autoconfiguration ........................................................... 70
3.3.2 PCI IDE Support................................................................... 71
3.4 System Management BIOS (SMBIOS)................................................. 71
3.5 Legacy USB Support ........................................................................ 72
3.6 BIOS Updates ................................................................................. 72
3.6.1 Language Support ................................................................ 73
3.6.2 Custom Splash Screen .......................................................... 73
3.7 BIOS Recovery................................................................................ 73
3.8 Boot Options................................................................................... 74
3.8.1 CD-ROM Boot ...................................................................... 74
3.8.2 Network Boot....................................................................... 74
3.8.3 Booting Without Attached Devices........................................... 74
3.8.4 Changing the Default Boot Device During POST ........................ 74
3.9 Adjusting Boot Speed....................................................................... 75
3.9.1 Peripheral Selection and Configuration..................................... 75
3.9.2 BIOS Boot Optimizations ....................................................... 75
3.10 BIOS Security Features .................................................................... 76
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................ 77
4.3 BIOS Error Messages ....................................................................... 77
4.4 Port 80h POST Codes ....................................................................... 78
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 83
5.1.1 Safety Regulations................................................................ 83

Contents
vii
5.1.2 European Union Declaration of Conformity Statement................ 84
5.1.3 Product Ecology Statements................................................... 86
5.1.4 EMC Regulations .................................................................. 90
5.1.5 Product Certification Markings (Board Level)............................. 91
5.2 Battery Disposal Information............................................................. 92
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel Configuration and DIMM Configuration........................ 18
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 20
7. Single Channel (Asymmetric) Mode Configuration with One DIMM.......... 21
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21
9. Flex Mode Configuration with Two DIMMs............................................ 22
10. Front/Back Panel Audio Connector Options .......................................... 30
11. LAN Connector LED Locations........................................................... 32
12. Thermal Sensors and Fan Headers ..................................................... 34
13. Location of the Standby Power Indicator LED....................................... 40
14. Detailed System Memory Address Map ............................................... 42
15. Back Panel Connectors ..................................................................... 49
16. Component-side Connectors and Headers ........................................... 50
17. Connection Diagram for Front Panel Header ........................................ 56
18. Connection Diagram for Front Panel USB Headers ................................ 58
19. Connection Diagram for IEEE 1394a Header ........................................ 58
20. Location of the Jumper Block............................................................. 59
21. Board Dimensions ........................................................................... 60
22. I/O Shield Dimensions...................................................................... 61
23. Localized High Temperature Zones..................................................... 65
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Memory Operating Frequencies ......................................................... 17
5. Audio Jack Retasking Support ........................................................... 29
6. LAN Connector LED States ................................................................ 32
7. Effects of Pressing the Power Switch .................................................. 35
8. Power States and Targeted System Power........................................... 36
9. Wake-up Devices and Events ............................................................ 37
10. System Memory Map ....................................................................... 43
11. DMA Channels................................................................................. 43
12. I/O Map ......................................................................................... 44
13. PCI Configuration Space Map ............................................................ 45

Intel Desktop Board DG965SS Technical Product Specification
viii
14. Interrupts ...................................................................................... 46
15. PCI Interrupt Routing Map ................................................................ 47
16. Component-side Connectors and Headers Shown in Figure 16................ 51
17. High Definition Audio Link Header ...................................................... 52
18. Serial ATA Connectors...................................................................... 52
19. Chassis Intrusion Header.................................................................. 52
20. Serial Port Header ........................................................................... 52
21. Front and Rear Chassis Fan Headers .................................................. 53
22. Processor Fan Header ...................................................................... 53
23. Front Panel Audio Header ................................................................. 53
24. Processor Core Power Connector........................................................ 55
25. Main Power Connector...................................................................... 55
26. Front Panel Header .......................................................................... 56
27. States for a One-Color Power LED...................................................... 57
28. States for a Two-Color Power LED...................................................... 57
29. Auxiliary Front Panel Power LED Header.............................................. 57
30. BIOS Setup Configuration Jumper Settings.......................................... 59
31. DC Loading Characteristics ............................................................... 62
32. Fan Header Current Capability........................................................... 62
33. Thermal Considerations for Components ............................................. 66
34. Desktop Board DG965SS Environmental Specifications.......................... 67
35. BIOS Setup Program Menu Bar.......................................................... 70
36. BIOS Setup Program Function Keys.................................................... 70
37. Acceptable Drives/Media Types for BIOS Recovery ............................... 73
38. Boot Device Menu Options ................................................................ 74
39. Supervisor and User Password Functions............................................. 76
40. Beep Codes .................................................................................... 77
41. BIOS Error Messages ....................................................................... 77
42. Port 80h POST Code Ranges.............................................................. 78
43. Port 80h POST Codes ....................................................................... 79
44. Typical Port 80h POST Sequence........................................................ 82
45. Safety Regulations........................................................................... 83
46. Lead-Free Board Markings ................................................................ 89
47. EMC Regulations ............................................................................. 90
48. Product Certification Markings ........................................................... 91

9
1Product Description
What This Chapter Contains
1.1 Overview...................................................................................................10
1.2 Online Support...........................................................................................15
1.3 Processor ..................................................................................................15
1.4 System Memory .........................................................................................16
1.5 Intel®G965 Express Chipset........................................................................23
1.6 Legacy I/O Controller ..................................................................................28
1.7 Audio Subsystem........................................................................................29
1.8 LAN Subsystem..........................................................................................31
1.9 Hardware Management Subsystem ...............................................................33
1.10 Power Management ....................................................................................35

Intel Desktop Board DG965SS Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG965SS.
Table 1. Feature Summary
Form Factor microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor Support for the following:
•Intel®Core™2 Duo processor in an LGA775 socket with a 1066 or
800 MHz system bus
•Intel®Pentium®D processor in an LGA775 socket with an 800 or
533 MHz system bus
•Intel®Pentium®4 processor in an LGA775 socket with an 800 or
533 MHz system bus
•Intel®Celeron®D processor in an LGA775 socket with a 533 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
•Support for up to 8 GB of system memory using DDR2 667 or DDR2 533 DIMMs
•Support for up to 4 GB of system memory using DDR2 800 DIMMs
Chipset Intel®G965 Express Chipset, consisting of:
•Intel®82G965 Graphics Memory Controller Hub (GMCH)
•Intel®82801HB I/O Controller Hub (ICH8)
Video Intel® GMA X3000 onboard graphics subsystem
Audio 6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec
Legacy I/O
Control
Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
•10 USB ports
•Two IEEE-1394a interfaces: one back panel connector and one front-panel
header
•One serial port
•One parallel port
•Four Serial ATA interfaces
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
•One diskette drive interface
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC Gigabit
Ethernet Controller
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly
Available PC
Technology
•Support for PCI Local Bus Specification Revision 2.3
•Support for PCI Express* Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued

Product Description
11
Table 1. Feature Summary (continued)
Expansion
Capabilities
•Two PCI Conventional* bus connectors
•One PCI Express x1 bus add-in card connector
•One PCI Express x16 bus add-in card connector
Hardware Monitor
Subsystem
•Intel®Quiet System Technology implemented through ICH8
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Three fan headers
•Three fan sense inputs used to monitor fan activity
For information about Refer to
Available configurations for the Desktop Board DG965SS Section 1.2, page 15

Intel Desktop Board DG965SS Technical Product Specification
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
XWVUTSQ
RPO
N
L
M
J
K
I
G
H
F
E
D
C
B
A
Y
Z
AA
BB
CC
DD
OM18462
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

Product Description
13
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A IEEE-1394a front panel header
B Front panel audio header
C PCI Conventional bus add-in card connector 1
D PCI Express x1 connector
E PCI Express x16 connector
F Back panel connectors
G Processor core power connector
H Rear chassis fan header
I LGA775 processor socket
J Intel 82G965 GMCH
K Processor fan header
L DIMM Channel A sockets
M Serial port header
N DIMM Channel B sockets
O Diskette drive connector
P Main Power connector
Q Battery
R Front chassis fan header
S Chassis intrusion header
T Intel 82801HB I/O Controller Hub (ICH8)
U BIOS Setup configuration jumper block
V Auxiliary front panel power LED header
W Front panel header
X Serial ATA connectors [4]
Y Front panel USB header
Z Speaker
AA Front panel USB header
BB Parallel ATE IDE connector
CC PCI Conventional bus add-in card connector 2
DD High Definition Audio header

Intel Desktop Board DG965SS Technical Product Specification
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Intel G965 Express Chipset
Intel 82801HB
I/O Controller Hub
(ICH8)
Intel 82G965
Graphics and
Memory
Controller Hub
(GMCH)
Serial
Peripheral
Interface (SPI)
Flash Device
System Bus
(1066/800/533
MHz)
LGA775
Processor
Socket
Parallel ATA
IDE
Connector
Diskette Drive
Connector
Legacy
I/O
Controller
PS/2 Keyboard
PS/2 Mouse
Parallel Port
OM18463
Audio
Codec
PCI Express
x16
Connector
PCI Bus
SMBus
High Definition Audio Link
USB
Dual-Channel
Memory Bus
SMBus
PCI Slot 1
PCI Slot 2
Serial ATA IDE
Connectors (4)
Serial ATA
IDE Interface
Channel A
DIMMs (2)
Channel B
DIMMs (2)
Back Panel/Front
Panel
USB Ports
DMI Interconnect
PCI Express x1 Slot 1
PCI Express x1 Interface LAN
Connector
Gigabit Ethernet
Controller
Line Out/Retasking Jack
Line Out
Line In/Retasking Jack
Mic In/Retasking Jack
Mic In
PCI
Bus
IEEE-1394a
Connector/Header IEEE-1394a Controller
Serial Port
Parallel ATA
IDE
Controller
High Definition
Audio Link
Header
PCI Express
x16 Interface
VGA
Port
Display
Interface
LPC
Bus
Figure 2. Block Diagram

Product Description
15
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel®Desktop Board DG965SS
under “Desktop Board Products” or
“Desktop Board Support”
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DG965SS
http://developer.intel.com/design/motherbd/ss/ss_available.htm
Processor data sheets http://www.intel.com/products/index.htm
ICH8 addressing http://developer.intel.com/design/chipsets/datashts
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/ss/ss_documentation.htm
1.3 Processor
The board is designed to support the following processors:
•Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
•Intel Pentium D processor in an LGA775 processor socket with an 800 or
533 MHz system bus
•Intel Pentium 4 processor in an LGA775 processor socket with an 800 or
533 MHz system bus
•Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/ss/ss_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can
damage the board, the processor, and the power supply.
#INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.2, page 55

Intel Desktop Board DG965SS Technical Product Specification
16
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
•1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs;
4 GB maximum total system memory using DDR2 800 DIMMs. Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
•Minimum total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs
•DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
 NOTE
A minimum of 512 MB of system memory is required to fully enable both the onboard
graphics and the manageability engine.
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Type
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
DDR2 533 256 Mbit 128 MB 512 MB 2 GB
DDR2 533 512 Mbit 256 MB 1 GB 4 GB
DDR2 533 1 Gbit 512 MB 2 GB 8 GB
DDR2 667 256 Mbit 128 MB 512 MB 2 GB
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 256 Mbit 128 MB 512 MB 2 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB

Product Description
17
 NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 800 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
533 MHz. Table 4 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 4. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
DDR2 533 533 MHz 533 MHz
DDR2 533 800 MHz 533 MHz
DDR2 533 1066 MHz 533 MHz
DDR2 667 533 MHz 533 MHz
DDR2 667 800 MHz 667 MHz
DDR2 667 1066 MHz 667 MHz
DDR2 800 533 MHz 533 MHz
DDR2 800 800 MHz 800 MHz
DDR2 800 1066 MHz 800 MHz
1.4.1 Memory Configurations
The Intel 82G965 GMCH supports the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.

Intel Desktop Board DG965SS Technical Product Specification
18
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels
are black.
Figure 3. Memory Channel Configuration and DIMM Configuration
#INTEGRATOR’S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
ICH8 Manageability Engine feature.

Product Description
19
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
OM18339
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
1 GB
1 GB
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM0 (blue) socket of Channel B.
OM18340
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
1 GB
1 GB
512 MB
512 MB
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs

Intel Desktop Board DG965SS Technical Product Specification
20
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the combined capacity of the
two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1
of both channels.
OM18341
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
1 GB
1 GB
512 MB
1 GB
512 MB
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs