Intel BOXDP35DPM User manual

May 2007
Order Number: D88103-001US
The Intel®Desktop Board DP35DP may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DP35DP Specification Update.
Intel® Desktop Board
DP35DP
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DP35DP Technical Product
Specification.
May 2007
This product specification applies to only the standard Intel®Desktop Board DP35DP with BIOS
identifier DPP3510J.86A.
Changes to this specification will be published in the Intel Desktop Board DP35DP Specification
Update before being incorporated into a revision of this document.
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or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel®desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copies of documents which have an ordering number and are referenced in this document, or other Intel
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Copyright © 2007, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DP35DP. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DP35DP and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST
codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DP35DP Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel®P35 Express Chipset ............................................................... 19
1.6.1 Intel®Viiv™ Processor Technology.......................................... 19
1.6.2 USB ................................................................................... 19
1.6.3 Serial ATA Interfaces ............................................................ 20
1.7 Parallel IDE Controller ...................................................................... 21
1.8 Real-Time Clock Subsystem .............................................................. 21
1.9 Legacy I/O Controller....................................................................... 22
1.9.1 Consumer Infrared (CIR)....................................................... 22
1.9.2 Serial Port ........................................................................... 22
1.10 Audio Subsystem............................................................................. 23
1.10.1 Audio Subsystem Software .................................................... 23
1.10.2 Audio Connectors and Headers ............................................... 24
1.11 LAN Subsystem............................................................................... 25
1.11.1 Intel®82566DC Gigabit Ethernet Controller.............................. 25
1.11.2 LAN Subsystem Software....................................................... 26
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 26
1.12 Hardware Management Subsystem .................................................... 27
1.12.1 Hardware Monitoring and Fan Control...................................... 27
1.12.2 Fan Monitoring..................................................................... 27
1.12.3 Chassis Intrusion and Detection.............................................. 27
1.12.4 Thermal Monitoring .............................................................. 28
1.13 Power Management ......................................................................... 29
1.13.1 ACPI .................................................................................. 29
1.13.2 Hardware Support ................................................................ 32
2Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel Connectors .......................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 42
2.3 Jumper Block .................................................................................. 51

Intel Desktop Board DP35DP Technical Product Specification
vi
2.4 Mechanical Considerations ................................................................ 52
2.4.1 Form Factor......................................................................... 52
2.5 Electrical Considerations................................................................... 53
2.5.1 Power Supply Considerations ................................................. 53
2.5.2 Fan Header Current Capability................................................ 53
2.5.3 Add-in Board Considerations .................................................. 54
2.6 Thermal Considerations.................................................................... 54
2.7 Reliability ....................................................................................... 56
2.8 Environmental ................................................................................ 56
3Overview of BIOS Features
3.1 Introduction ................................................................................... 57
3.2 BIOS Flash Memory Organization....................................................... 58
3.3 Resource Configuration .................................................................... 58
3.3.1 PCI* Autoconfiguration.......................................................... 58
3.3.2 PCI IDE Support................................................................... 59
3.4 System Management BIOS (SMBIOS)................................................. 59
3.5 Legacy USB Support ........................................................................ 60
3.6 BIOS Updates ................................................................................. 60
3.6.1 Language Support ................................................................ 61
3.6.2 Custom Splash Screen .......................................................... 61
3.7 BIOS Recovery................................................................................ 61
3.8 Boot Options................................................................................... 62
3.8.1 CD-ROM Boot ...................................................................... 62
3.8.2 Network Boot....................................................................... 62
3.8.3 Booting Without Attached Devices........................................... 62
3.8.4 Changing the Default Boot Device During POST ........................ 62
3.9 Adjusting Boot Speed....................................................................... 63
3.9.1 Peripheral Selection and Configuration..................................... 63
3.9.2 BIOS Boot Optimizations ....................................................... 63
3.10 BIOS Security Features .................................................................... 64
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 65
4.2 BIOS Beep Codes ............................................................................ 65
4.3 BIOS Error Messages ....................................................................... 65
4.4 Port 80h POST Codes ....................................................................... 66
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 71
5.1.1 Safety Standards.................................................................. 71
5.1.2 European Union Declaration of Conformity Statement................ 72
5.1.3 Product Ecology Statements................................................... 74
5.1.4 EMC Regulations .................................................................. 78
5.1.5 Product Certification Markings (Board Level)............................. 80
5.2 Battery Disposal Information............................................................. 81

Contents
vii
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration ........................................... 18
4. Back Panel Audio Connector Options .................................................. 24
5. LAN Connector LED Locations............................................................ 26
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Location of the Standby Power Indicator LED....................................... 35
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 48
12. Connection Diagram for Front Panel USB Headers ................................ 50
13. Connection Diagram for IEEE 1394a Header ........................................ 50
14. Location of the Jumper Block............................................................. 51
15. Board Dimensions ........................................................................... 52
16. Localized High Temperature Zones..................................................... 55
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Audio Jack Retasking Support ........................................................... 23
5. LAN Connector LED States ................................................................ 26
6. Effects of Pressing the Power Switch .................................................. 29
7. Power States and Targeted System Power........................................... 30
8. Wake-up Devices and Events ............................................................ 31
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 10................ 43
11. HD Audio Link Header ...................................................................... 44
12. Front Panel Audio Header ................................................................. 44
13. Serial ATA Connectors...................................................................... 44
14. Serial Port Header ........................................................................... 44
15. Chassis Intrusion Header.................................................................. 45
16. Front and Rear Chassis (3-Pin) Fan Headers ........................................ 45
17. Processor and Auxiliary Rear Chassis (4-Pin) Fan Headers ..................... 45
18. Auxiliary Front Panel Power/Sleep LED Header..................................... 46
19. Processor Core Power Connector........................................................ 47
20. Main Power Connector...................................................................... 47
21. Front Panel Header .......................................................................... 48
22. States for a One-Color Power LED...................................................... 49
23. States for a Two-Color Power LED...................................................... 49
24. BIOS Setup Configuration Jumper Settings.......................................... 51
25. Recommended Power Supply Current Values ....................................... 53
26. Fan Header Current Capability........................................................... 53
27. Thermal Considerations for Components ............................................. 55

Intel Desktop Board DP35DP Technical Product Specification
viii
28. Desktop Board DP35DP Environmental Specifications............................ 56
29. BIOS Setup Program Menu Bar.......................................................... 58
30. BIOS Setup Program Function Keys.................................................... 58
31. Acceptable Drives/Media Types for BIOS Recovery ............................... 61
32. Boot Device Menu Options ................................................................ 62
33. Supervisor and User Password Functions............................................. 64
34. Beep Codes .................................................................................... 65
35. BIOS Error Messages ....................................................................... 65
36. Port 80h POST Code Ranges.............................................................. 66
37. Port 80h POST Codes ....................................................................... 67
38. Typical Port 80h POST Sequence........................................................ 70
39. Safety Standards............................................................................. 71
40. Lead-Free Board Markings ................................................................ 77
41. EMC Regulations ............................................................................. 78
42. Product Certification Markings ........................................................... 80

9
1Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel®P35 Express Chipset ............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 21
1.8 Real-Time Clock Subsystem .............................................................. 21
1.9 Legacy I/O Controller....................................................................... 22
1.10 Audio Subsystem............................................................................. 23
1.11 LAN Subsystem............................................................................... 25
1.12 Hardware Management Subsystem .................................................... 27
1.13 Power Management ......................................................................... 29

Intel Desktop Board DP35DP Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DP35DP.
Table 1. Feature Summary
Form Factor ATX (11.60 inches by 9.60 inches [294.64 millimeters by 243.84 millimeters])
Processor Support for the following:
•Intel®Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
•Intel®Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
•Intel®Pentium®Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
•Intel®Celeron®processor in an LGA775 socket with an 800 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 800 or DDR2 667 MHz DIMMs
•Support for up to 8 GB of system memory using DDR2 800 or DDR2
667 DIMMs
Chipset Intel®P35 Express Chipset, consisting of:
•Intel®82P35 Memory Controller Hub (MCH)
•Intel®82801IR I/O Controller Hub (ICH9R).
Audio 8-channel (7.1) audio subsystem using the IDT* STAC9271D audio codec and
Dolby* Home Theater certification
Video Video support provided via PCI Express* graphics via add-in card.
Legacy I/O Control Legacy I/O controller for serial port and Consumer Infrared (CIR)
Peripheral
Interfaces
•12 USB 2.0 ports
•Two IEEE-1394a interfaces: one back panel connector and one front-panel
header
•Six Serial ATA IDE interfaces, including one red-colored external Serial ATA
(eSATA) IDE interface
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
•Back panel PS/2* ports for mouse and keyboard connection (optional)
•One serial port header (may require specialized chassis or cable for use)
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel®82566DC
Gigabit Ethernet Controller
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued

Product Description
11
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.3
•Support for PCI Express Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, USB ports, LAN, and CIR
Expansion
Capabilities
•One PCI Express x16 bus add-in card connector
•Three PCI Express x1 bus add-in card connectors
•Three PCI Conventional bus connectors
Hardware Monitor
Subsystem
•Intel®Quiet System Technology implemented through the Intel®Management
Engine in ICH9R
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Four fan headers
•Three fan sense inputs used to monitor fan activity

Intel Desktop Board DP35DP Technical Product Specification
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

Product Description
13
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A PCI Conventional bus add-in card connector
B Auxiliary rear chassis fan header
C PCI Express x1 connector
D PCI Express x1 connector
E High Definition Audio Link header
F PCI Conventional bus add-in card connector
G Front panel audio header
H PCI Conventional bus add-in card connector
I PCI Express x1 connector
J Speaker
K PCI Express x16 connector
L Back panel connectors
M Processor core power connector (2 X 2)
N Back panel CIR emitter (output) header
O Rear chassis fan connector
P LGA775 processor socket
Q Intel 82P35 MCH
R Processor fan header
S DIMM Channel A sockets
T Serial port header
U DIMM Channel B sockets
V Front panel CIR receiver (input) header
W Main Power connector (2 X 12)
X Chassis intrusion header
Y Battery
Z Front chassis fan header
AA Intel 82801IR I/O Controller Hub (ICH9R)
BB BIOS Setup configuration jumper block
CC Auxiliary front panel power LED header
DD Front panel header
EE Serial ATA connectors [5]
FF Parallel ATA IDE connector
GG Front panel USB headers [3]
HH External Serial ATA (eSATA) connector
II IEEE-1394a header

Intel Desktop Board DP35DP Technical Product Specification
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram

Product Description
15
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No parallel port
•The location of the floppy drive connector has moved
•No serial port on the back panel
•The serial port header is located between the memory sockets and may require a
specialized chassis or cabling solution to use
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel®Desktop Board DP35DP http://www.intel.com/products/motherboard/DP35DP/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DP35DP
http://www.intel.com/products/motherboard/DP35DP/index.htm
Supported processors http://www.intel.com/go/findcpu
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
1.4 Processor
The board is designed to support the following processors:
•Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus
•Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
•Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
•Intel Celeron processor in an LGA775 socket with an 800 MHz system bus
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 105 W. The processors listed above are only
supported when falling within the wattage requirements of the DP35DP board. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/go/findcpu
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
#INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.4, page 47

Intel Desktop Board DP35DP Technical Product Specification
16
1.5 System Memory
The board has four DIMM sockets and support the following memory features:
•1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•8 GB maximum total system memory using DDR2 800 or DDR2 667 DIMMs; refer
to Section 2.1.1 on page 37 for information on the total amount of addressable
memory.
•Minimum total system memory: 256 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR2 800 or DDR2 667 MHz SDRAM DIMMs
•DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
•DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3. Supported Memory Configurations
DIMM
Type
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
DDR2 800 1 Gbit 512 MB 2 GB 8 GB
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm

Product Description
17
1.5.1 Memory Configurations
The Intel 82P35 MCH supports the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Intel Desktop Board DP35DP Technical Product Specification
18
Figure 3 illustrates the memory channel and DIMM configuration.
 NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel and DIMM Configuration
#INTEGRATOR’S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
Intel Management Engine in ICH9R.

Product Description
19
1.6 Intel®P35 Express Chipset
The Intel P35 Express chipset consists of the following devices:
•Intel 82P35 Memory Controller Hub (MCH)
•Intel 82801IR I/O Controller Hub (ICH9R)
The MCH component provides interfaces to the CPU, memory, and PCI Express. The
ICH9R is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P35 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
The chipset supports the following features:
•USB
•Serial ATA
•Parallel IDE
1.6.1 Intel®Viiv™Processor Technology
This Intel desktop board supports Intel®Viiv™ processor technology. To be eligible for
the Intel Viiv processor technology brand, a system must meet certain hardware and
software requirements. To get the list of requirements for Intel Viiv processor
technology branding as well as all the features supported by Intel Viiv processor
technology, refer to
http://www.intel.com/products/viiv/index.htm
1.6.2 USB
The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI-
and EHCI-compatible drivers.
The ICH9R provides the USB controller for all ports. The port arrangement is as
follows:
•Six ports are implemented with stacked back panel connectors
•Six ports are routed to three separate front panel USB headers
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 41
The location of the front panel USB headers Figure 10, page 42

Intel Desktop Board DP35DP Technical Product Specification
20
1.6.3 Serial ATA Interfaces
The board provides five Serial ATA (SATA) connectors, which support one device per
connector. The board also provides one red-colored external Serial ATA (eSATA)
connector.
1.6.3.1 Serial ATA Support
The DP35DP Desktop Board’s Serial ATA controller offers six independent Serial ATA
ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device
can be installed on each port for a maximum of six Serial ATA devices. A point-to-
point interface is used for host to device connections, unlike Parallel ATA IDE which
supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista operating systems.
 NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA connectors Figure 10, page 42
1.6.3.2 Serial ATA RAID
The DP35DP Desktop Board supports the following RAID (Redundant Array of
Independent Drives) levels:
•RAID 0 - data striping
•RAID 1 - data mirroring
•RAID 0+1 (or RAID 10) - data striping and mirroring
•RAID 5 - distributed parity