Intel DH67CF User manual

Intel® Desktop Board
DH67CF
Technical Product Specification
April 2012
Order Number: G15488-002
The Intel Desktop Board DH67CF may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH67CF Specification Update.

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DH67CF Technical Product
Specification
January 2011
-002 Updated the Board Identification Information section April 2012
This product specification applies to only the standard Intel®Desktop Board with BIOS identifier
BLH6710H.86A.
Changes to this specification will be published in the Intel Desktop Board DH67CF Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, Core i7, and Core i5 are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2011, 2012, Intel Corporation. All rights reserved.

iii
Board Identification Information
Basic Desktop Board DH67CF Identification Information
AA Revision BIOS Revision Notes
G10215-201 BLH6710.86A.0078 1,2
G10215-202 BLH6710.86A.0078 1,2
G10215-207 BLH6710.86A.0146 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel®82H67 PCH Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82H67 Platform Controller
Hub (PCH)
B2 SLH82
82H67 Platform Controller
Hub (PCH)
B3 SLJ49
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

Intel Desktop Board DH67CF Technical Product Specification
iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel®Desktop
Board DH67CF.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH67CF and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DH67CF
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH67CF Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Board Identification Information .................................................................iii
Errata.....................................................................................................iii
Preface
Intended Audience ................................................................................... v
What This Document Contains.................................................................... v
Typographical Conventions ........................................................................ v
1Product Description
1.1Overview........................................................................................ 11
1.1.1Feature Summary ................................................................ 11
1.1.2Board Layout ....................................................................... 13
1.1.3Block Diagram ..................................................................... 15
1.2Legacy Considerations...................................................................... 16
1.3Online Support................................................................................ 16
1.4Processor ....................................................................................... 17
1.4.1PCI Express x16 Graphics
...................................................... 17
1.5System Memory .............................................................................. 18
1.5.1Memory Configurations ......................................................... 19
1.6Intel®H67 Express Chipset ............................................................... 21
1.7Graphics Subsystem ........................................................................ 21
1.7.1Integrated Graphics.............................................................. 21
1.7.2USB ................................................................................... 24
1.8SATA Interfaces .............................................................................. 25
1.9Real-Time Clock Subsystem .............................................................. 26
1.10Legacy I/O Controller....................................................................... 26
1.10.1Consumer Infrared (CIR)....................................................... 26
1.11Audio Subsystem............................................................................. 27
1.11.1Audio Subsystem Software .................................................... 27
1.11.2Audio Subsystem Components ............................................... 27
1.12LAN Subsystem............................................................................... 29
1.12.1Intel®82579V Gigabit Ethernet Controller................................ 29
1.12.2LAN Subsystem Software....................................................... 30
1.12.3RJ-45 LAN Connector with Integrated LEDs .............................. 30
1.13Hardware Management Subsystem .................................................... 31
1.13.1Hardware Monitoring............................................................. 31
1.13.2Fan Monitoring
..................................................................... 31
1.13.3Chassis Intrusion and Detection.............................................. 31
1.13.4Thermal Monitoring .............................................................. 32

Intel Desktop Board DH67CF Technical Product Specification
viii
1.14Power Management ......................................................................... 33
1.14.1ACPI................................................................................... 33
1.14.2Hardware Support ................................................................ 35
2Technical Reference
2.1Memory Resources .......................................................................... 41
2.1.1Addressable Memory............................................................. 41
2.1.2Memory Map........................................................................ 43
2.2Connectors and Headers................................................................... 43
2.2.1Back Panel Connectors
.......................................................... 44
2.2.2Component-side Connectors and Headers ................................ 45
2.3Jumper Block
.................................................................................. 53
2.4Mechanical Considerations ................................................................ 55
2.4.1Form Factor......................................................................... 55
2.5Electrical Considerations
................................................................... 56
2.5.1Power Supply Considerations ................................................. 56
2.5.2Fan Header Current Capability................................................ 57
2.5.3Add-in Board Considerations .................................................. 57
2.6Thermal Considerations
.................................................................... 57
2.7Reliability ....................................................................................... 60
2.8Environmental ................................................................................ 60
3Overview of BIOS Features
3.1Introduction ................................................................................... 61
3.2BIOS Flash Memory Organization
....................................................... 62
3.3System Management BIOS (SMBIOS)................................................. 63
3.4Legacy USB Support ........................................................................ 63
3.5BIOS Updates ................................................................................. 64
3.5.1Language Support ................................................................ 64
3.5.2Custom Splash Screen .......................................................... 65
3.6BIOS Recovery................................................................................ 65
3.7Boot Options................................................................................... 66
3.7.1Optical Drive Boot ................................................................ 66
3.7.2Network Boot....................................................................... 66
3.7.3Booting Without Attached Devices........................................... 66
3.7.4Changing the Default Boot Device During POST ........................ 66
3.8Adjusting Boot Speed....................................................................... 67
3.8.1Peripheral Selection and Configuration..................................... 67
3.8.2BIOS Boot Optimizations ....................................................... 67
3.9BIOS Security Features .................................................................... 68
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 69
4.2BIOS Beep Codes ............................................................................ 69
4.3Front-panel Power LED Blink Codes
.................................................... 70
4.4BIOS Error Messages ....................................................................... 70
4.5Port 80h POST Codes ....................................................................... 71

Contents
ix
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance..................................................................... 77
5.1.1Safety Standards.................................................................. 77
5.1.2European Union Declaration of Conformity Statement
................ 78
5.1.3Product Ecology Statements................................................... 79
5.1.4EMC Regulations .................................................................. 81
5.1.5ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84
5.1.6Regulatory Compliance Marks (Board Level)
............................. 85
5.2Battery Disposal Information............................................................. 86
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 28
5. LAN Connector LED Locations............................................................ 30
6. Thermal Sensors and Fan Headers ..................................................... 32
7. Location of the Standby Power LED .................................................... 39
8. Detailed System Memory Address Map ............................................... 42
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header ........................................ 50
12. Connection Diagram for Front Panel USB 2.0 Headers........................... 52
13. Location of the Jumper Block............................................................. 53
14. Board Dimensions ........................................................................... 55
15. Localized High Temperature Zones..................................................... 58
Tables
1. Feature Summary............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. HDMI Port Status Conditions ............................................................. 22
5. DVI Port Status Conditions................................................................ 22
6. Audio Jack Support.......................................................................... 27
7. LAN Connector LED States ................................................................ 30
8. Effects of Pressing the Power Switch .................................................. 33
9. Power States and Targeted System Power........................................... 34
10. Wake-up Devices and Events ............................................................ 35
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 10................ 46
13. Front Panel Audio Header for Intel HD Audio........................................ 47
14. Front Panel Audio Header for AC ’97 Audio .......................................... 47
15. Front Panel USB 2.0 Headers ............................................................ 47
16. SATA Connectors............................................................................. 47
17. S/PDIF Header ................................................................................ 48

Intel Desktop Board DH67CF Technical Product Specification
x
18. Chassis Intrusion Header.................................................................. 48
19. Processor and System (4-Pin) Fan Headers ........................................ 48
20. Back Panel CIR Emitter (Output) Header............................................. 48
21. Front Panel CIR Receiver (Input) Header............................................. 48
22. Processor Core Power Connector........................................................ 49
23. Main Power Connector...................................................................... 49
24. Front Panel Header .......................................................................... 50
25. States for a One-Color Power LED...................................................... 51
26. States for a Two-Color Power LED...................................................... 51
27. Alternate Front Panel Power/Sleep LED Header .................................... 51
28. BIOS Setup Configuration Jumper Settings.......................................... 54
29. Recommended Power Supply Current Values ....................................... 56
30. Fan Header Current Capability........................................................... 57
31. Thermal Considerations for Components ............................................. 59
32. Tcontrol Values for Components ........................................................ 59
33. Environmental Specifications............................................................. 60
34. BIOS Setup Program Menu Bar.......................................................... 62
35. BIOS Setup Program Function Keys.................................................... 62
36. AcceptableDrives/Media Types for BIOS Recovery ................................ 65
37. Boot Device Menu Options ................................................................ 66
38. Supervisor and User Password Functions............................................. 68
39. BIOS Beep Codes ............................................................................ 69
40. Front-panel Power LED Blink Codes.................................................... 70
41. BIOS Error Messages ....................................................................... 70
42. Port 80h POST Code Ranges.............................................................. 71
43. Port 80h POST Codes ....................................................................... 72
44. Typical Port 80h POST Sequence........................................................ 76
45. Safety Standards............................................................................. 77
46. EMC Regulations ............................................................................. 81
47. Regulatory Compliance Marks............................................................ 85

11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor •Intel®Core™ i7, Intel®Core™ i5, and Intel Core™ i3 processors with up to
65W TDP in an LGA1155 socket
―One PCI Express* 2.0 x16 graphics interface
―Integrated memory controller with dual channel DDR3 memory support
―Integrated graphics processing (processors with Intel®Graphics
Technology)
Memory •Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
•Support for 1.35 V low voltage JEDEC memory
Chipset Intel®H67 Express Chipset consisting of the Intel®H67 Express Platform
Controller Hub (PCH)
Graphics •Integrated graphics support for processors with Intel Graphics Technology:
―High Definition Multimedia Interface* (HDMI*)
―DVI-I
―DisplayPort*
•Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio •10-channel (8+2) Intel High Definition audio via the Realtek* ALC892 audio
codec
•8-channel (7.1) Intel High Definition Audio via the HDMI interface and the
DisplayPort interface
continued

Intel Desktop Board DH67CF Technical Product Specification
12
Table 1. Feature Summary (continued)
Peripheral
Interfaces
•Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
•Ten USB 2.0 ports:
―Four ports are implemented with stacked back panel connectors (black)
―Six front panel ports implemented through three internal headers
•Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with Intel®
Rapid Storage Technology RAID support (blue)
•Three Serial ATA (SATA) 3.0 Gb/s interfaces through Intel H67 Express Chipset
with Intel Rapid Storage Technology RAID support:
―One internal SATA ports (black)
―One internal eSATA port (red)
―One back panel eSATA port (red)
Expansion
Capabilities
•One PCI Express 2.0 x16 add-in card connector
BIOS •Intel®BIOS resident in the Serial Peripheral Interface (SPI) Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and System Management BIOS (SMBIOS)
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express* Revision 2.0
•Suspend to RAM support
•Wake on PCI Express, LAN, front panel, Consumer Infrared (CIR), and USB
ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel®82579V Gigabit
Ethernet Controller
Legacy I/O Control Nuvoton W83677HG-i I/O controller for CIR, and hardware management support
Hardware Monitor
Subsystem
•Hardware monitoring through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Two fan headers
•Two fan sense inputs used to monitor fan activity
•Fan speed control

Product Description
13
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH67CF.
Figure 1. Major Board Components

Intel Desktop Board DH67CF Technical Product Specification
14
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Back panel connectors
B Processor core power connector (2 x 2)
C Front panel USB 2.0 header
D BIOS Setup configuration jumper block
E SATA connectors
F Intel H67 Express Chipset
G Front panel USB 2.0 header
H Front panel USB 2.0 header
I Main power connector (2 x 12)
J Front panel header
K DIMM 1 (Channel A DIMM 1)
L DIMM 2 (Channel B DIMM 1)
M Alternate front panel power LED header
N Piezoelectric speaker
O Standby power LED
P Processor fan header
Q Consumer IR receiver (input) header
R S/PDIF out header
S LGA1155 processor socket
T Consumer IR emitter (output) header
U Low Pin Count (LPC) Debug header
V PCI Express x16 bus add-in card connector
W Chassis intrusion header
X System fan header
Y Front panel audio header
Z Battery

Product Description
15
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram

Intel Desktop Board DH67CF Technical Product Specification
16
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No parallel port connector
•No floppy drive connector
•No serial port connector or header
•No PS/2 connectors
•No PATA connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH67CF http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH67CF
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit

Product Description
17
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3
processors in an LGA1155 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 65 W Thermal Design Power (TDP). The
processors listed above are only supported when falling within the wattage
requirements of Intel Desktop Board DH67CF. See the Intel web site listed below for
the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
1.4.1 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket
support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:
•Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 8 GB/s in each direction, simultaneously, for an aggregate of 16 GB/s
when operating in x16 GEN2 mode.
•Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 4 GB/s in each direction, simultaneously, for an aggregate of 8 GB/s
when operating in x16 GEN1 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com

Intel Desktop Board DH67CF Technical Product Specification
18
1.5 System Memory
The board has two DIMM sockets and supports the following memory features:
•1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
•Support for 1.35V Low Voltage DDR3 (new JEDEC specification)
•Two independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
•Minimum recommended total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
512 MB SS 1 Gbit 1 Gb x16/empty 4
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm

Product Description
19
1.5.1 Memory Configurations
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in the LGA1155 socket
support the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Intel Desktop Board DH67CF Technical Product Specification
20
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be
populated in the DIMM 1 (Channel A, DIMM 1) socket.