Intel G03-NF9W-F User manual

Technical Manual
Of
Intel Bay Trail Series CPU
Based Mini-ITX M/B
NO.G03-NF9W-F
Revision: 1.0
Release date: April 7, 2015
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv
USER’S NOTICE .......................................................................................................................v
MANUAL REVISION INFORMATION .......................................................................................v
ITEM CHECKLIST .....................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................18
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................25
3-2 BIOS MENU SCREEN ................................................................................................26
3-3 FUNCTION KEYS .......................................................................................................26
3-4 GETTING HELP ..........................................................................................................27
3-5 MEMU BARS...............................................................................................................27
3-6 MAIN MENU ................................................................................................................28
3-7 ADVANCED MENU.....................................................................................................29
3-8 CHIPSET MENU..........................................................................................................39
3-9 SECURITY MENU .......................................................................................................42
3-10 BOOT MENU...............................................................................................................43
3-11 SAVE & EXIT MENU...................................................................................................44
TABLE OF CONTENT

iv
Environmental Safety Instruction
 Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
 Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
 The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
 Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition April 7, 2015
Item Checklist
 Motherboard
 User’s Manual
 CD for motherboard utilities
 Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
 Onboard Intel® Bay Trail Series Processor, with low power consumption never
denies high performance
 Support 1* DDR3L 1066/1333 MHz SO-DIMM, up to 8GB
 Support full-size Mini-PCIE connector
 Support 2 * SATAII device & 2 * SATAIII device
 Support USB 3.0 data transport demand
 Support LVDS &DVI-I dual display output
 Support CPU Over-Temperature protection
 Support CPU Over-Current/Under Voltage protection
 Support DRAM Over-Current/Under Voltage protection
 Amplifier implement to support 3W Speaker
 Support CPU Smart FAN
 Compliance with ErP standard
 Support Watchdog function

2
1-2 Specification
Spec Description
Design  6 layers; PCB size: 17x 17 cm
Embedded CPU  Integrated with Intel® Bay Trail-D/M/I series CPU
Memory Slot  1 * DDR3L SODIMM Slot for un-buffered DDR
3L 1066/1333 MHz
SDRAM, expandable to 8GB in total
Expansion Slot  1* Full-size Mini-PCIE slot
 1* PCIE x1 slot
LAN Chip
 Integrated with Realtek RTL8111G PCI-E Gigabit LAN chip
 Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Storage  2* SATAII port (SATA1/2)
 2* SATAIII port (SATA3/4)
BIOS  AMI 64MB Flash ROM
Rear I/O
 1* 12V system DC Jack power-in connector
 1* USB 3.0 port
 3* USB 2.0 port
 1* DVI-I port
 1* COM1 serial port(COM1 supports RS422/485 function)
 1* RJ-45 LAN port
 Audio Line Out port x1
Internal I/O
 1* 2-Pin DC 12V system power-in connector
 1* 2-Pin DC 12V power-out connector
 2* SATA Power-out connector
 1* CPUFAN header
 2* SYSFAN header
 1* Front panel audio header
 1* SPDIF Out header

3
 1* SPEAK_CON header
 1* 4-pin USB 2.0 header (Expansible to 1* USB 2.0 port)
 2* 9-pin USB 2.0 header (Expansible to 4* USB 2.0 ports)
 1* Front panel header
 1* Power LED & speaker header
 1* Serial port header
 1* GPIO_CON header
 1* SMBUS header
 1* LAN LED activity header
 1* LVDS header
 1* LVDS inverter header
1-3 Layout Diagram
Rear IO Panel Diagram:
Warning!
The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V
(ATX2P) power connector. User can only connect one type of compatible power supply to one
of them to power the system.
Line-
Out Port
USB 2.0 Ports
RJ-45 LAN Port
USB 3.0 Port
USB 2.0 Port
DVI-
I Port
COM1 Port
DC 12V
Power-in
Connector

4
Motherboard Internal Diagram
Note: The memory module should be DDR3L 1.35V SODIMM and not exceeding 8GB total capacity.
Internal 12V DC-in
Power connector
Intel CPU
PCI Express x1 Slot
Front Panel
Audio Header
Front Panel Header
LVDS Inverter
Serial Port Header
(COM2)
GPIO Header
SATA Hard Disk
Power-Out Connector
Speaker
Connector
USB 2.0 Headers
LVDS Header
SATAII Ports (SATA1/2)
SYSFAN1 Header
LAN_LED1 Header
*DDR3L SODIMM Slot
(SODIMM1)
SMBUS Header
Power LED Header &
Speaker Header
Full-size
Mini-PCIE
Slot (MPE1)
USB 3.0 Port
Over USB 2.0 Port
DVI-I Port
COM1
USB 2.0 Ports
RJ-45 LAN Port
Line-Out Port
USB 2.0 Header
SATAIII Ports (SATA3/4)
CPUFAN Header
SYSFAN2 Header
SPDIF Out Header
MON_PWR
Connector
DC12V
Power-in Connector

5
Jumper Position:
JP1
JPCOM1
JPLED
JPCOM2
JPLCD

6
Jumper
Jumper Name Description
JP1 Pin 1-2: Clear ME Function Setting
Pin 3-4: Clear CMOS RAM Function Setting
Pin 5-6: ATX Mode & AT Mode Select
Pin 7-8: ME Security Measure Function Select
Pin 9-10: Case Open Message Display Function
10-Pin Block
JPLED INVERTER Back Light 5V/12V Select 3-Pin Block
JPLCD LVDS PVCC 5V/3.3V /12V Select 4-Pin Block
JPCOM1 COM1 Port Pin9 Function Select 4-Pin Block
JPCOM2 COM2 Header Pin9 Function Select 4-Pin Block
Connectors
Connector Name
DCIN DC 12V System Power–in Connector
ATX2P Internal DC 12V System Power–in Connector
MON_PWR DC 12V Power–out Connector
SATA1/2 SATAII Port Connector X2
SATA3/4 SATAIII Port Connector X2
SATAPW1/2 SATA Power out Connector X2
CPUFAN CPUFAN Connector
SYSFAN1/SYSFAN2
SYSFAN Connector X2
USB1(Top) /USB2 USB 2.0 Port Connector X3
USB1(Bottom) USB 3.0 Port Connector
DVI-CRT1 DVI-I Port Connector
COM1 Serial Port Connector
LAN RJ-45 LAN Port Connector

7
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
SPDIF SPDIF Out Header 2-pin Block
SPEAK_CON Speaker Header 4-pin Block
FP_USB1/2 USB 2.0 Header 9-pin Block
FP_USB3 USB 2.0 Header 4-pin Block
JW_FP1
Front Panel Header(PWR LED/
HDD LED/Power Button /Reset)
9-pin Block
SPK-LED1 Power LED & Speaker Header 7-pin Block
COM2 Serial Port Header X1 9-pin Block
GPIO_CON1 GPIO Header 10-pin Block
SMBUS1 SMBUS Header 5-pin Block
LAN_LED1 LAN Activity LED Header 2-pin Block
LVDS LVDS Header 30-pin Block
INVERTER LVDS Inverter 8-pin Block

8
Chapter 2
Hardware Installation
2-1 Jumper Setting
Pin 1 & 2 of JP1 (10-pin): Clear ME Function Setting
Pin 1-2 of JP1
→ Clear ME
1-2 Closed: Clear ME.
1-2 Open: Normal(Default);
;
2
Pin 1
Pin 1
2
Pin 3 & 4 of JP1 (10-pin): Clear CMOS Setting
Pin 3-4 of JP1
→ Clear CMOS
3-4 Closed: Clear CMOS(One Touch).
3-4 Open: Normal(Default);
;
2
Pin 1
3
4
Pin 1
2
3
4

9
Pin 5 & 6 of JP1 (10-pin): AT Mode Select
Pin 5-6 of JP1
→ AT Mode Select
5-6 Closed: AT Mode Selected.
5-6 Open: ATX Mode Selected(Default);
;
2
Pin 1
3
4
Pin 1
2
3
4
5
6
5
6
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.
Pin 7 & 8 of JP1 (10-pin): ME Security Measure Function Select
Pin 7-8 of JP1
→ ME Security Function Select
2
Pin 1
7-8 Closed: Disable Security Measures
in the Flash Descriptor(Override).
4
6
8
3
5
7
7-8 Open: Enable Security Measures in
the Flash Descriptor(Default);
Pin 1
3
5
7
2
4
6
8

10
Pin 9 & 10 of JP1 (10-pin):): Case Open Message Display Function Select
Pin 9-10 of JP1
→ Case Open
9-10 Closed: Case Open Function
Selected(One Touch).
9-10 Open: Normal(Default);
;
2
Pin 1
3
4
Pin 1
2
3
4
5
6
5
6
7
8
7
8
9
10
9
Pin 9-10 Close: When Case open function pin short to GND, the Case open function
was detected. When Used, needs to enter BIOS and enable ‘Case Open Detect’
function. In this case if your case is removed, next time when you restart your computer,
a message will be displayed on screen to inform you of this.

11
JPLED (3-pin): INVERTER Back Light VCC 5V/12V Select
2-3 Close: INVERTER Back Light 12V Selected.
JPLED → INVERTER Back Light VCC
1-2 Close: INVERTER Back Light 5V Selected(Default);
1
3
1
3
JPLCD (4-pin): LCD PVCC VCC3.3V/5V/12V Select
JPLCD
→ LCD PVCC
6
4
2
3
1
5
1
2
4
6
3
5
2
4
6
1
3
5
2-4 Closed:
VCC=3.3V
(Default);
3-4 Closed:
VCC= 5V;
4-6 Closed:
VCC= 12V.

12
JPCOM1 (4-pin): COM1 Port Pin9 Function Select
JPCOM1
→ COM1 Port Pin-9
6
4
2
3
1
5
1
2
4
6
3
5
2
4
6
1
3
5
2-4 Closed:
RI=RS232(Default);
3-4 Closed:
RI= 5V;
4-6 Closed:
RI= 12V.
JPCOM2 (4-pin): COM2 Header Pin9 Function Select
JPCOM2
→ COM2 Header Pin-9
6
4
2
3
1
5
1
2
4
6
3
5
2
4
6
1
3
5
2-4 Closed:
RI=RS232(Default);
3-4 Closed:
RI= 5V;
4-6 Closed:
RI= 12V.

13
2-2 Connectors and Headers
2-2-1 Connectors
(1) Rear I/O Connectors
(2) COM1 (9-pin Block): RS232/422/485 Port
COM1 port can function as RS232/422/485 port. In normal settings COM1 functions
as RS232 port. With compatible COM cable COM1 can function as RS422 or RS 485
port.
User also needs to go to BIOS to set ‘Transmission Mode Select’ for COM1 (refer to
Page 30) at first, before using specialized cable to connect different pins of this port.
For RS422 Mode
RS422 TX(B)
RS422 TX(A)
RS422 RX(A)
RS422 RX(B)
For RS485 Mode
RS485 D-(B)
RS485 D+(A)
Line-
Out Port
USB 2.0 Ports
RJ-45 LAN Port
USB 3.0 Port
USB 2.0 Port
DVI-
I Port
COM1 Port
DC 12V
Power-in
Connector

14
(3) ATX2P (2-pin Block): DC 12V Power-in Connector
Pin1
Pin.
Definition
1 GND
2 +12V DC_IN
(4) MON_PWR(2-pin Block): DC 12V Power-out Connector
Pin1
Pin.
Definition
1 GND
2 +12V

15
(5) SATA1/SATA2(7-pin Block): SATAII Port connector
These are high-speed SATAII ports that support 3GB/s transfer rate.
Pin No. Definition
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND
(6) SATA3/SATA4(7-pin Block): SATAIII Port connector
These are high-speed SATAIII ports that support 6GB/s transfer rate.
Pin No. Definition
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND