IWILL DK8-HTX Manual

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IW WI IL LL L®
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D DK K8 8- -H HT TX X
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Ha ar rd dw wa ar re e I In ns st ta al ll la at ti io on n G Gu ui id de e
FB27810500

Preface
Operation is subjected to the following two conditions
1. This device may not cause harmful interference
2. This device must accept any interference received, including interference that may cause undesired
operation.
IWILL®Corp. makes no warranty of any kind with regard to this material, including, but not limited to, the implied
warranties of merchantability and fitness for a particular purpose.
IWILL®Corp. shall not be liable for errors contained herein or for incidental or consequential damages in connection
with the furnishing, performance, or use of this material.
IWILL®Corp. assumes no responsibility for the use or reliability of its software on equipment that is not furnished by
IWILL®Corp.
This document contains proprietary information that is protected by copyright. All rights are reserved. No part of this
publication may be reproduced, transcribed, stored in a retrieval system, translated into any language or computer
language, or transmitted in any form whatsoever without the prior written consent of IWILL®Corp.
Copyright©2005 by IWILL®Corp. All rights reserved.
Other products and companies referred to herein the trademarks or registered trademarks of their respective
companies or mark holders.
Important
All product specifications are subject to change without prior notice. The actual specifications will be
according to the actual product.
2

FCC Compliance Statement
This equipment has been tested and found to comply with limits for a Class B digital device,
pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference in residential installations. This equipment generates,
uses, and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause interference to radio or television equipment reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
1. Reorient or relocate the receiving antenna
2. Move the equipment away from the receiver
3. Plug the equipment into an outlet on a circuit different from that to which the receiver is connected
4. Consult the dealer or an experienced radio/television technician for additional suggestions
You are cautioned that any change or modifications to the equipment not expressly approve by the party responsible
for compliance could void your authority to operate such equipment.
This device complies with Part 15 of the FCC Rules.
CE Compliance Statement
Notice for Europe (CE Mark) This product is in conformity with the Council Directive
89/336/EEC, 92/31/EEC (EMC).
3

Table of Content
CHAPTER 1 GETTING STARTED....................................................................................................6
1-1 OPERATING ENVIRONMENTAL REQUIREMENTS...............................................................................7
1-2 SAFE NOTICE...................................................................................................................................8
CHAPTER 2 MAINBOARD OVERVIEW........................................................................................10
2-1 DK8-HTX LAYOUT.......................................................................................................................11
2-2 REAR PANEL I/O PORTS ................................................................................................................12
2-3 INTERNAL IO CONNECTORS...........................................................................................................14
2-3.1 BMC Card connector (Disable by factory default)................................................................14
2-3.2 Serial ATA Connector............................................................................................................15
2-3.3 IDE and Floppy Connectors..................................................................................................16
2-3.4 Floppy Disk Drive Connector................................................................................................17
2-3.5 USB 1.0 Ports and Header – CN45, CN47............................................................................18
2-3.6 COM2 Header........................................................................................................................18
CHAPTER 3 HARDWARE INSTALLATION.................................................................................19
3-1 MAINBOARD INSTALLATION..........................................................................................................20
3-1.1 Screw holes ............................................................................................................................21
3-2 JUMPER SETTING FOR MAINBOARD ...............................................................................................22
3-2.1 PCI-X switch Jumper.............................................................................................................23
3-2.2 Clear CMOS Header..............................................................................................................24
3-2.3 LPC BUS Jumper...................................................................................................................25
3-2.4 VGA Jumper...........................................................................................................................26
3-2.5 Front Panel Switch Header....................................................................................................27
3-2.6 Case intruder header .............................................................................................................28
3-3 HEATSINK AND CPU INSTALLATION .............................................................................................29
3-4 INSTALL MEMORY.........................................................................................................................34
3-4.1 Memory Installation Procedures............................................................................................35
3-5 EPS POWER SUPPLY......................................................................................................................37
3-6 CPU/ SYSTEM FAN CONNECTORS .................................................................................................38
3-7 INSTALL EXPANSION CARDS .........................................................................................................39
3-7.1 Expansion Card Installation Procedure ................................................................................39
3-7.2 Assigning IRQs for PCI Expansion Cards.............................................................................39
3-7.3 HTX Pro Adapter Card..........................................................................................................40
3-8 POWERING ON YOUR SYSTEM ........................................................................................................41
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CHAPTER 4 BIOS SETUP.................................................................................................................42
4-1 STARTING BIOS SETUP .................................................................................................................43
4-2 UPDATING BIOS SETUP.................................................................................................................44
4-3 USING SETUP.................................................................................................................................46
4-4 MAIN MENU ..................................................................................................................................48
4-5 ADVANCED MENU.........................................................................................................................48
4-5.1 IDE Configuration Submenu..................................................................................................49
4-5.2 Floppy Configuration Submenu.............................................................................................50
4-5.3 Super I/O Configuration Submenu.........................................................................................50
4-5.4 Hardware Health Configuration Submenu ............................................................................51
4-5.5 ACPI Setting Submenu...........................................................................................................51
4-5.6 Hyper Transport Configuration Submenu..............................................................................52
4-5.7 Remote Access Configuration Submenu.................................................................................52
4-5.8 USB Configuration Submenu.................................................................................................53
4-5.9 Onboard Device configuration ..............................................................................................53
4-6 PCI PNPMENU..............................................................................................................................54
4-7 BOOT MENU ..................................................................................................................................55
4-7.1 Boot Settings Configuration Submenu ...................................................................................58
4-8 SECURITY MENU ...........................................................................................................................59
4-9 CHIPSET SETTINGS MENU..............................................................................................................61
4-9.1 NorthBridge Chipset Configuration Submenu.......................................................................61
4-9.1-1 Memory Configuration Submenu....................................................................................................62
4-9.1-2 MCT Timing Mode Submenu .........................................................................................................63
4-9.1-2 ECC Configuration Submenu..........................................................................................................64
4-9.1-3 IOMMU Mode Submenu.................................................................................................................65
4-9.2 South Bridge Chipset Configuration Submenu ......................................................................66
4-9.3 PCI-X Chipset Configuration Submenu.................................................................................66
4-10 POWER MENU..............................................................................................................................67
4-11 EXIT MENU..................................................................................................................................68
CHAPTER 5 TECHNOLOGY SUPPORT........................................................................................70
MAINBOARD SPECIFICATION......................................................................................................71
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Chapter 1 Getting Started
Thank you for choosing the DK8-HTX high performance Server motherboard. The
DK8-HTX is a dual AMD® Opteron micro-Socket 940 motherboard (M/B) based on the
SSI form factor and is configured with the AMD® HyperTransport I/O Hub 8111 and PCIX
Tunnel 8131 chipsets. The board features a Hyper Transport speed of 1600 MT (Mega
Transfer per second).
For memory support, the DK8-HTX provides eight sockets (four + four configuration)
accommodating up to 16 GB of memory using registered PC3200/2700/2100 ECC DDR
memory modules.
Flexibility and expandability are provided by one 64-bit/133MHz PCI-X slot, two PCI
64-bit/100MHz PCI slots, and two 32-bit/66MHz PCI slots. This array of PCI slots enables
numerous add-on cards and provides Peer PCI transaction support to increase system
performance.
DK8-HTX integrates a special HTX-Pro technology. Via its HTX-PRO expansion slot, the
particular adapter card could directly attaches to AMD Opteronthrough Hyper
Transport.
Other optional features such as onboard Silicon Image Serial ATA RAID interfaces, dual
INTEL® Gigabit Ethernet controllers, and onboard ATI® RageXL video controller with
8MB memory provide high system capabilities that meet a wide range of demanding
server applications.
Getting Started
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1-1 Operating Environmental Requirements
To ensure the reliability and performance of DK8-HTX Server System, please maintain the operating environment
described below:
1. The ambient operating temperature is 0°C to 40°C
2. The relative humidity of operation is 10% to 85% non-condensing.
Leave your system in the shipping crate at its final destination for 24 hours in the environment where you will set it
up. This is to prevent thermal shock and condensation. To minimize the chance of system failure, use the server
board within the optimal temperature and humidity ranges as follow:
1. The optimize ambient temperature of operating is required as 21°C to 23°C
2. The optimize relative humidity of operating is 45% to 50% non-condensing.
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1-2 Safe Notice
IWILL assumes the reader of this document is an experienced systems integrator. Please read
our instruction while you are installing the system.
General Safety Precautions
Keep the area around the Server clean and free of clutter.
Servers weigh a lot. When lifting the system, two people should lift slowly from opposite ends with their feet
spread out to distribute the weight. Always keep your back straight and lift with your legs.
Place the chassis top cover and any system components that have been removed away from the system or
on a table so that they won’t accidentally be stepped on.
While working on the system, do not wear loose items such as neckties and unbuttoned shirtsleeves. They
can come into contact with electrical circuits or get pulled into a cooling fan.
Remove any jewelry or metal objects from your body, which are excellent metal conductors and can create
short circuits and harm you if they come into contact with printed circuit boards or areas where power is
present.
ESD Precautions
Electrostatic discharge (ESD) is generated by two objects with different electrical charges coming into contact with
each other. An electrical discharge is created to neutralize this difference, which can damage electronic components
and printed circuit boards. The following measures are generally sufficient to neutralize this difference before
contact is made to protect your equipment from ESD:
Use a grounded wrist strap designed to prevent static discharge.
Keep all components and printed circuit boards (PCBs) in their antistatic bags until ready for use.
Touch a grounded metal object before removing the board from the antistatic bag.
Do not let components or PCBs come into contact with your clothing, which may retain a charge even if you
are wearing a wrist strap.
Handle a board by its edges only; do not touch its components, peripheral chips, memory modules or
contacts.
When handling chips or modules, avoid touching their pins.
Put the motherboard and peripherals back into their antistatic bags when not in use.
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For grounding purposes, make sure your computer chassis provides excellent conductivity between the
power supply, the case, the mounting fasteners and the motherboard.
After accessing the inside of the system, close the system back up and secure it to the rack unit with the
retention screws after ensuring that all connections have been made.
Operating Precautions
Check package contents
Missing or damaging accessories
Please contact your vendor immediately
Motherboard damage
Please contact your vendor immediately
Prepare minimum system components
At least one AMD OpteronTM Processor
At least one registered DDR memory module
At least one SATA or IDE HDD
EPS12V Power Supply
9

Chapter 2 Mainboard Overview
This chapter covers the below key points:
1. Mainboard layout
2. Rear IO layout
3. Internal IO connectors
zIDE connector
zFloppy connector
zSATA connector
zUSB header
zCOM port
Mainboard Overview
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