JETWAY HA 18 User manual

USER'S MANUAL
Of
AMD 990X & AMD SB950
Based
M/B for AMD AM3+/AM3
Processor
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-HA18-F
Rev: 1.0
Release in: July, 2011

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
ENVIROMENTAL SAFETY INSTRUCTION .............................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECK LIST ..................................................................................................................iv
COOLING SOLUTIONS ............................................................................................................iv
CHAPTER 1 INTRODUCTION OF INTEL H67/Z68 CHIPSET MOTHERBOARDS
1-1 MOTHERBOARD SPECIFICATION...........................................................................1
1-2 SPECIAL FEATURES OF MOTHERBOARD.............................................................2
1-3 LAYOUT DIAGRAM....................................................................................................4
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS.......................................................................5
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................5
2-3 INSTALLING CPU.......................................................................................................7
2-3-1 ABOUT AMD MA3+ SOCKET......................................................................7
2-3-2 CPU INSTALLATION GUIDE........................................................................7
2-3-3 THERMAL SOLUTION ASSEMBLY.............................................................8
2-4 INSTALL MEMORY MODULE....................................................................................9
2-5 EXPANSION CARDS INSTALLATION ......................................................................10
2-5-1 EXPANSION SLOTS.....................................................................................10
2-5-2 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................10
2-5-3 INSTALLING CARD BRIDGE .......................................................................11
2-6 CONNECTORS AND HEADERS................................................................................12
2-6-1 I/O BACK PANEL CONNECTORS...............................................................12
2-6-2 INTERNAL CONNECTORS..........................................................................13
2-6-3 INTERNAL HEADERS..................................................................................14
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................18
3-2 BIOS MENU SCREEN ................................................................................................18
3-3 FUNCTION KEY..........................................................................................................19
3-4 GETTING HELP ..........................................................................................................19
3-5 MENU BAR..................................................................................................................19
3-6 MAIN MENU................................................................................................................19
3-7 ADVANCED MENU.....................................................................................................20
3-7-1 ACPI SETTINGS..........................................................................................21
3-7-2 S5 RTC WAKE SETTINGS..........................................................................22
3-7-3 SATA CONFIGURATION ............................................................................22
3-7-4 USB CONFIGURATION...............................................................................23
3-7-5 SUPER IO CONFIGURATION.....................................................................24
3-7-6 H/W MONITOR.............................................................................................25
3-7-7 SHUTDOWN TEMPERATURE CONFIGURATION ....................................25
3-8 CHIPSET MENU..........................................................................................................26
3-9 BOOT MENU..............................................................................................................27
3-10 SECURITY MENU......................................................................................................27
3-11 TURBO OC ................................................................................................................28
3-12 SAVE & EXIT MENU .................................................................................................30
3-13 HOW TO UPDATE BIOS...........................................................................................30
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
4-1 INSTALLATION INSTRUCTION.................................................................................31
APPENDIX...............................................................................................................................32
TABLE OF CONTENT

iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THESE
MOTHER-BOARDS TO MEET THE USER’S REQUIREMENTS. BUT IT WILL CHANGE, CORRECT
AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June, 2011
Item Checklist
5Motherboard
5User’s manual
5DVD for motherboard utilities
5SATA hard disk cable
5I/O Back Panel Shield
Cooling Solutions
-for AMD Processor Family
As processor technology pushes to faster speeds and higher performance with
increasing operation clock, thermal management becomes increasingly crucial while
building computer systems. Maintaining the proper computing environment without
thermal increasing is the key to reliable, stable, and 24 hours system operation. The
overall goal is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increasing surface
area and concentrated airflow from attached active cooling fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For
optimum heat transfer, AMD recommends the use of thermal grease and mounting
clips to attach the heatsink to the processor.
Please refer to AMD website for collection of heatsinks evaluated and recommended
for Socket AM3+ processors by AMD. In addition, this collection is not intended to be
a comprehensive listing of all heatsinks that support Socket AM3+ processors.

1
Chapter 1
Introduction of AMD 990X Chipset Motherboards
1-1 Motherboard Specification
Spec Description
Design zATX form factor; PCB size: 24.5x30.5cm
Chipset zAMD 990 X North Bridge Chipset
zAMD SB 950 South Bridge Chipset
CPU Socket
zAMD AM3+ Socket
zSupport AMD AM3+ FX processors and AMD AM3
Phenom™ II processor/Athlon™ II X processor (CPU
power consumption should be under 125W)
zSupport HT 3.0
* for detailed CPU support information please visit our website
Memory Slots
zDDRIII module Slots x 4
zSupport 4pcs DDRIII1066/1333/1600/1866 MHz memory
modules expandable to 16GB (DDRIII 1866 MHz is only
supported when using AM3+ processors)
zSupport Dual- channel function
Expansion Slots
z2 * PCI-Express 2.0 x16 slot by 8 lane
z2 * PCI-Express 2.0 x1 slot
z1 *32-bit PCI slot
z1 * Mini-PCIE slot
SATA3 Ports zSupports six SATAIII devices providing 6.0 Gb/sec data
transfer rate and support RAID 0,1,5,10,JBOD
Gigabit LAN Chip
zIntegrated Gigabit LAN chip
zSupports Fast Ethernet LAN function provide10Mb/100Mb/
1Gb /s data transfer rate
8-CH HD Audio z8-channel HD Audio Codec integrated zSupport 8-channel 3D surround & Positioning Audio
zAudio driver and utility included
BIOS z16MB Flash ROM
Multi I/O
zPS/2 keyboard & mouse port x1
zCoaxial SPDIF_OUT connector x1& Optical SPDIF_OUT
connector x1
zRJ-45 LAN connector x1
zUSB 2.0 port x 6 and USB 2.0 headers x 3
zUSB 3.0 port x 2
zAudio connector x1 (8-CH Audio)
zFront panel audio header x1
zCDIN header x1
zHDMI-SPDIF header x1
zSerial Port header x1
zFront panel header x1
zPower LED header x1
zSpeaker header x 1

2
1-2 Special Features of Motherboard
AMD 990X Chipset
With support for up to 2 AMD Radeon™ Premium Graphics boards
with AMD CrossFireX™ technology, the AMD 990X chipset is an
ideal fit for your FX processor and your ultimate PC.
Get Ready for New Generation of 32nm AMD AM3+ CPU
The AMD 990X motherboards are ready to support new generation
of 32nm AMD AM3+ multi-core processors, delivering the very best
platform for multitasking, multimedia and high performance gaming.
Multi-display support with 2 way CrossFireX
Flexible graphics capabilities - Up to 2 VGA cards are supported for
either 2 way CrossFireX™ (running at two x8 bandwidth), delivering
the ultimate in graphics performance for gaming enthusiasts who
demand the highest frame rates without compromising on
resolution.
USB3.0
Experience Fastest data transfers at 5Gb/s with USB3.0 the new
latest connectivity standard. Built connect easily with next
generation components and peripherals, USB3.0 transfers data 10x
faster and backward compatible with previous USB2.0 components.
SATA3.0
SATA3.0 6Gb/s provides a higher bandwidth to retrieve and transfer
HD media. With this super speed data transfer, SATA3.0 allows an
incredible data boost which is 2x faster than the SATA 3Gb/s.
3D Audio Technology
OP with two-stage Butterworth filter and quadruple noninverting
amplifier enhances bass effect under the 100MHz range to perfect
audio effect, brings you stunning shock experience in video game,
true-to-life simulated feeling when watching films and the greatest
touch as that in the concert.
E.R.P. Standards—Energy Using Product Standards
The full name of E.R.P. Standards is Energy Using Product
Standards, obviously technology utilized to low power
consumption. ERP is a technology with remarkable power saving
function.
Jetway G.P.I Technology
G.P.I is the acronym for the “Green Power Indicator” technology.
Jetway’s motherboard series with G.P.I technology have a specially
designed chip for real-time detecting CPU workload. The green
power indicator will automatically turn on when CPU workload is
heavy and turn off when CPU workload is light to indicate power
saving mold being activated.

3
Thunder Protection Technology
This motherboard series are integrated with double
thunder-protection walls, one from network port and the other from
LAN chip. Laboratory test statistics on IEC61000-4-5 (1.2-50us)
specialized thunderbolt surge tests have verified that motherboard
can endure up to 9KV thunderbolt surge and protect the system
from possible thunder damage.
OC-CON Solid Capacitors
OC-CON solid capacitors make it possible for motherboard to work
from 55 degrees Centigrade below zero to 125 degrees centigrade.
OC-CON capacitors possess superior physical characteristics to
prolong product life ten times than corresponding motherboard
without capacitors every time working temperature increases 20
degrees. Life of product of motherboard with solid capacitors
declines only 10% of those without solid capacitors as well under
same conditions.
DIY Clear
This CMOS Buttons (CMOS1) is to facilitate the clear COMS
process for power user overclocking function. The user can easily
clear or restore COMS settings by pressing down the button, without
taking trouble to remove the case and locate the jumper for clear
CMOS. (Remove or turn off the power supply before COMS clear）
Other Features
include: CPU Smart Fan—Noise Management System
It’s never been a good idea to gain the performance of your system
by sacrificing its acoustics. CPU Smart Fan Noise Management
System is the answer to control the noise level needed for
now-a-day’s high performance computing system. The system will
automatically increase the fan speed when CPU operating loading is
high, after the CPU is in normal operating condition, the system will
low down the fan speed for the silent operating environment. The
system can provide the much longer life cycle for both CPU and the
system fans for game use and business requirements.
Power on Button
You can easily start the computer by pressing down this button for a
few seconds, without troubling yourself to locate the front panel
jumpers to find the Power on jumper.
Reset Button
You can easily restart the computer by pressing down this button for
a few seconds, without troubling yourself to locate the front panel
jumpers to find the reset jumper.

4
1-3 Layout Diagram
CPU Socket
ATX Power Conn.
CPUFAN1 Header
CDIN Heade
r
Power LED
Header
HDMI-SPDIF Heade
r
Front Panel
Audio Header
USB 2.0
Headers Front Panel Heade
r
3D Audio Function
Jumper
Line-OUT
A
TX 12V Power Conn.
Line-IN
MIC-IN
RS-OUT
CS-OUT
DDR3 Socket x 4
(DIMM1~DIMM4)
SS-OUT
Coaxial
SPDIF
_
OUT
Reset Button
JBAT
Gigabit LAN Chip
8-CH HD
Audio Connecto
r
POWER＿CAP
USB 3.0 Ports
16MB Flash ROM
8-CH HD
A
udio Chip
PCI Express 2.0 x1
RJ-45 Ove
r
USB 2.0 Ports
G.P.I. LED
PS/2 Keyboard
Port
Optical
S/PDIF OUT
Coaxial
S/PDIF_OUT
Optical
S/PDIF_OUT
USB 3.0 Ports
USB 2.0 Ports
SYSFAN2 Header
Serial Port Heade
r
JP1
PCI Ex
p
ress 2.0 x16 b
y
8 Lan
e
PCI Slot
USB 2.0 Ports
SATA3
Connectors
RJ-45 LAN Port
PS/2 Mouse
Port
AMD 990X Chi
p
set
AMD
SB 950 Chi
p
set
USB 2.0 Ports
PS/2 KB over
MS
p
orts
Clear CMOS
Button
Speaker Header
PCI Ex
p
ress 2.0 x16 b
y
8 Lan
e
Min
i
-
PCI
E
Slot
SYSFAN1 Header

5
Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect hard disk and front panel /back panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) CMOS RAM Clear (3-pin): JBAT1
A battery must be used to retain the motherboard configuration in CMOS RAM
short 1-2 pins of JBAT to store the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power.
2. Remove ATX power cable from ATX power connector.
3. Locate JBAT and short pins 2-3 for a few seconds.
4. Return JBAT to its normal setting by shorting pins 1-2.
5. Connect ATX power cable back to ATX power connector.
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
CMOS RAM Clear Setting
2-3 Closed: Clear CMOS
JBATJBAT
1-2 Closed: Normal