JETWAY NAF95-Q87 User manual

USER'S MANUAL
Of
Intel Q87 Express Chipset
Based
M/B for LGA 1150 Quad Core Ready
Intel Core Processor
No. G03-NAF95-F
Rev: 1.0
Release date: July 25, 2013
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
ENVIRONMENTAL PROTECTION ANNOUCEMENT..............................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 SPECIFICATION.........................................................................................................1
1-2 LAYOUT DIAGRAM....................................................................................................2
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................5
2-2 CONNECTORS AND HEADERS................................................................................10
2-2-1 REAR I/O BACK PANEL CONNECTORS....................................................10
2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................11
2-2-3 HEADER PIN DEFINITION ...........................................................................13
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERNING SETUP...................................................................................................18
3-2 BIOS MENU SCREEN ................................................................................................18
3-3 FUNCTION KEYS .......................................................................................................19
3-4 GETTING HELP ..........................................................................................................19
3-5 MENU BARS...............................................................................................................20
3-6 MAIN MENU................................................................................................................20
3-7 ADVANCED MENU.....................................................................................................21
3-8 CHIPSET MENU..........................................................................................................28
3-9 BOOT MENU...............................................................................................................30
3-10 SECURITY MENU.......................................................................................................31
3-11 SAVE & EXIT MENU...................................................................................................32
TABLE OF CONTENT

iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition July 25, 2013
Item Checklist
5Motherboard
5User’s Manual
5DVD for motherboard utilities
5Cable(s)
5I/O Back panel shield

1
Chapter 1
Introduction of the Motherboard
1-1 Specification
Spec Description
Design zATX form factor; PCB size: 30.5 x24.5 cm
Chipset zIntel®Q87 Express Chipset
LGA1155
CPU Socket
zSupports Intel®Core™ i7, Core™ i5, Core™ i3 series, Pentium®
processor in LAG1150 Package
* for detailed CPU support information please visit our website
Memory Slot
zDDRIII RAM module slot x 4
zSupporting four DDRIII 1600/1333/1066MHz RAM Module
expandable to 32 GB (Maximum)
zSupport dual-channel function
Expansion Slots
z1 pcs* PCI-Express x16 slot (PE1)
z1 pcs* PCI-Express x4 slot (PE2)
z1 pcs* PCI-Express x1 slot (PE3)
z4 pcs *32-bit PCI slot
z1 pcs* Full-size Mini-PCIE slot (PE4)
z1 pcs* Full-size MSATA slot
Storage z6 * SATAIII 6Gb/s ports support RAID 0, 1, 5, 10 function
Dual LAN Chips
zIntegrated Intel®82574L and i217-LM Gigabit Ethernet LAN chip
that supports Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
HD Audio Chip zRealtek ALC662 6-channel Audio Codec integrated
zAudio driver and utility included
BIOS z64M Bit DIP Flash ROM
Multi I/O
Rear Panel I/O:
zSerial port connector x1
zDisplay port connector x1
zHDMI port connector x1
zDVI-D port connector x1
zVGA port connector x1
zUSB 3.0 port connector x2
zUSB 2.0 port connector x4
zRJ-45 LAN connector x2
zAudio connector x3 (Line-in, Line-out, MIC)
Internal I/O Connectors& Headers:
z1 *24-pin main power connector
z1 *8-pin 12V Power connector
zFront panel audio header x1
zCDIN header x1
zHDMI-SPDIF header x1
zPS/2 KB & MS header x1
zGPIO header x1
zCIR header x1
zTPM 1.2 header x1
zUSB 3.0 header x1 (support two expansion USB 3.0 ports)
zUSB 2.0 header x2 (support four expansion USB 2.0 ports)
zFront panel header x1
zPOWER LED1+Speaker header x1
zCOM port header x 9
zSM_BUS header x1
zLANLED header x2
zFan header x 3