JVC KD-G815 User manual

SERVICEMANUAL
COPYRIGHT© 2005 Victor Company of Japan,Limited No.MA170
2005/3
CD RECEIVER
MA17020053
KD-G815
TABLEOFCONTENTS
1PRECAUTIONS.. . . . . . .. . .. . . . .. . . . . . . . . .. . .. .. . . . .. . .. . . . .. .. . . . . . . .. . .. .. .. . .. . .. .. . 1-3
2SPECIFICSERVICEINSTRUCTIONS.. . . . .. .. . . . . . . .. . . . .. . .. . . . .. . . . .. . .. .. . . . . . . .. .. . . . . 1-6
3DISASSEMBLY. . . . .. . . . .. . .. .. . . . . . . .. . . . .. . . . .. . . . .. . .. . . . .. . . . .. . . . .. . .. .. . .. . .. .. . 1-7
4ADJUSTMENT. .. . .. . . . .. .. . . . . . . .. . . . .. .. . .. . .. .. . . . .. . . . . . . .. .. . . . .. . .. . . .. . .. .. . . . 1-28
5TROUBLESHOOTING. . .. . .. . . . .. .. . . . . . . .. . . . .. . . . .. . .. . . . . . .. . . . . . . .. . . . . . . .. .. . .. . .1-29
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1-2(No.MA170)
SPECIFICATION
Designandspecifications aresubject tochangewithout notice.
AUDIOAMPLIFIERSECTION
MaximumPower OutputFront50Wperchannel
Rear50Wperchannel
ContinuousPower Output(RMS)Front19 Wperchannelinto4 ,40Hzto20000Hzatnomore
than0.8%total harmonicdistortion.
Rear19Wperchannelinto4 ,40Hzto20000Hzatnomore
than0.8%total harmonicdistortion.
LoadImpedance4 (4 to8 allowance)
Equalizer Control RangeLow±12dB(60Hz, 80Hz, 100Hz, 120Hz)
Mid±12dB
High±12dB(8kHz,10 kHz, 12kHz, 15kHz)
FrequencyResponse40Hzto20000Hz
Signal-to-NoiseRatio70 dB
Line-Out Level/Impedance5.0V/20k load(full scale)
Output Impedance1k
Subwoofer-Out Level/Impedance2.0V/20k load(full scale)
Other terminalsCDchanger, SUBWOOFER
TUNER SECTION
FrequencyRangeFM87.5MHzto108.0MHz
AM531kHzto1602 kHz
FMTunerUsableSensitivity11.3dBf (1.0 kV/75 )
50dBQuietingSensitivity16.3dBf(1.8 kV/75 )
AlternateChannel Selectivity(400kHz)65dB
Frequency Response40Hzto15 000Hz
Stereo Separation35dB
CaptureRatio1.5dB
AMTunerSensitivity20 kV
Selectivity35dB
CDPLAYERSECTION
TypeCompact discplayer
Signal DetectionSystemNon-contact opticalpickup(semiconductorlaser)
Number of Channels2channels(stereo)
FrequencyResponse5Hzto20000 Hz
DynamicRange96dB
Signal-to-NoiseRatio98 dB
WowandFlutterLessthanmeasurablelimit
MP3DecodingFormatMPEG1/2AudioLayer3
Max.Bit Rate: 320kbps
WMA(WindowsMediaAudio)DecodingFormatMax. Bit Rate: 192kbps
GENERAL
Power RequirementOperatingVoltageDC14.4V(11Vto16Vallowance)
GroundingSystemNegative ground
AllowableOperatingTemperature0pCto+40pC
Dimensions(W IH ID)InstallationSize (approx.)182mm I52mm I159 mm
Panel Size (approx.)188 mm I58mm I12mm
Mass(approx.)1.5kg (excluding accessories)

(No.MA170)1-3
SECTION1
PRECAUTIONS
1.1SafetyPrecautions
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1-4(No.MA170)
1.2Preventingstaticelectricity
Electrostaticdischarge(ESD),whichoccurswhenstaticelectricitystoredinthebody,fabric, etc.isdischarged, can destroythe laser
diodeinthetraverseunit (opticalpickup). Takecaretoprevent thiswhen performing repairs.
1.2.1Groundingtopreventdamageby staticelectricity
Staticelectricityinthe workareacandestroytheoptical pickup (laser diode)indevicessuchasCDplayers.
Becarefultouseproper grounding inthe areawhererepairsarebeingperformed.
(1)Ground theworkbench
Ground theworkbenchbylayingconductivematerial(suchasaconductivesheet) oran iron plateoverit beforeplacingthe
traverseunit (opticalpickup)on it.
(2)Ground yourself
Use an anti-staticwriststraptoreleaseany staticelectricitybuiltup inyourbody.
(3)Handlingtheopticalpickup
Inordertomaintainqualityduring transport andbeforeinstallation,bothsidesofthelaserdiodeonthereplacementoptical
pickupareshorted. After replacement,returntheshortedpartstotheir original condition.
(Refer tothetext.)
Donotuseatestertochecktheconditionof thelaserdiodeintheopticalpickup. The tester'sinternalpower sourcecan easily
destroythelaserdiode.
1.3Handlingthetraverseunit (optical pickup)
(1)Donot subjectthetraverseunit (opticalpickup) tostrongshocks, asitisasensitive, complexunit.
(2)Cutoff theshortedpart of theflexiblecableusingnippers, etc.afterreplacingtheopticalpickup.Forspecificdetails,refertothe
replacementprocedureinthetext.Removetheanti-staticpinwhenreplacingthe traverseunit. Becareful nottotaketoolong a
timewhen attachingit totheconnector.
(3)Handletheflexiblecablecarefullyasitmaybreakwhen subjected tostrong force.
(4)It isnot possibletoadjust the semi-fixedresistorthat adjuststhelaserpower. Donotturnit.
1.4Attentionwhentraverseunit isdecomposed
*Pleasereferto"Disassemblymethod"inthetext fortheCDpickupunit.
Applysoldertotheshortlandbeforetheflexiblewireisdisconnectedfromthe connector ontheCDpickupunit.
(If theflexiblewireisdisconnectedwithout applyingsolder, the CDpickupmaybedestroyedbystaticelectricity.)
Intheassembly, besuretoremove solderfromtheshort landafter connecting the flexiblewire.
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(No.MA170)1-5
1.5Importantforlaserproducts
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1-6(No.MA170)
SECTION2
SPECIFICSERVICEINSTRUCTIONS
Thisservicemanual doesnotdescribeSPECIFICSERVICEINSTRUCTIONS.

(No.MA170)1-7
SECTION3
DISASSEMBLY
3.1Mainbodysection
3.1.1Removingthefront panel assembly
(SeeFig.1)
(1)Push the detach buttoninthelowerrightpartofthefront
panel assembly.
(2)Take outthefrontpanelassembly.
Fig.1
3.1.2Removingtheheatsink
(SeeFig.2)
(1)Fromthe left sideofthemainbody,removethetwoscrews
Aand three screws Battaching theheat sink.
(2)Take outtheheatsink.
Fig.2
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1-8(No.MA170)
3.1.3Removingthetopchassisassembly
(SeeFigs.3to6)
Prior toperformingthe followingprocedures, removetheheat
sink.
Reference:
Removethefrontpanelassemblyasrequired.(Refer to"3.1.1
Removingthefrontpanelassembly")
(1)Fromthebottomsideofthemainbody,removethetwo
screws Cattachingthetop chassisassemblytothebottom
chassisassembly. (SeeFig.3)
(2)Fromthebothand rearsidesofthemainbody, remove the
fourscrews Dattachingthe topchassisassemblytothe
bottomchassisassembly. (SeeFigs.4to6)
(3)Liftthetopchassisassemblyinthedirectionofthearrow,
anddisconnecttheconnector CN501 onthemechanism
controlboardfromtheconnector CN101 onthemain
board. (SeeFigs.5and6)
(4)Takeoutthetopchassisassemblyfromthebottomchassis
assembly.
Fig.3
Fig.4
Fig.5
Fig.6
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(No.MA170)1-9
3.1.4Removingthefront chassis
(SeeFigs.7and 8)
Priortoperformingthefollowing procedure,removethefront
panelassembly,heat sinkandtopchassisassembly.
(1)Fromthebothsidesofthetopchassisassembly,remove
thetwoscrews Eattachingthefrontchassis.(See Figs.7
and8)
(2)Take outthefrontchassis.
Fig.7
Fig.8
3.1.5Removingthemechanismcontrol board
(SeeFig.9)
Prior toperformingthefollowing procedures, removethefront
panelassembly,heat sink andtopchassisassembly.
Reference:
Removethefrontchassisasrequired.(Referto"3.1.4Remov-
ingthe front chassis")
(1)Disconnectthecardwirefromtheconnector CN601 onthe
mechanismcontrolboard.
(2)Removethefivescrews Fattachingthe mechanismcontrol
board.
(3)Release the claw a,andtake outthemechanismcontrol
board.
Reference:
Afterattachingthe mechanismcontrolboard,attachittothe
claw aandpasstheslot bof it intothebossofthe CDmech-
anismassembly.
Fig.9
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1-10(No.MA170)
3.1.6RemovingtheCDmechanismassembly
(SeeFig.10)
Prior toperformingthefollowingprocedures, remove thefront
panel assembly, heat sink andtopchassisassembly.
Reference:
Removethefrontchassisandmechanismcontrol boardasre-
quired.(Referto"3.1.4Removingthefrontchassis"and"3.1.5
Removingthemechanismcontrol board")
(1)Fromtheinside ofthetopchassisassembly,removethe
threescrews GattachingtheCDmechanismassembly.
(2)Takeout theCDmechanismassemblyfromthetopchas-
sis.
Fig.10
3.1.7Removingthemainboard
(SeeFigs.11 and12)
Prior toperformingthefollowingprocedures, remove thefront
panel assembly, heat sink andtopchassisassembly.
(1)Fromtherearsideofthe bottomchassisassembly,remove
thetwoscrews Hattachingtherearbrackettothebottom
chassisassembly. (SeeFig.11)
(2)Fromthetopsideof thebottomchassisassembly,remove
thetwoscrews Jattachingthe mainboardtothebottom
chassisassembly. (SeeFig.12)
(3)Releasethestopperoftheconnector CN702 on themain
boardinanupwarddirection,disconnectthecardwirefrom
theconnector CN702. (SeeFig.12)
(4)Disconnectthewirefromthe connectorofthefrontdoor
mechanismassembly. (SeeFig.12)
(5)Disconnectthewirefromtheconnector CN951 onthemain
board. (SeeFig.12)
Reference:
Afterconnecting thewires,fixthewireswiththewire
clamp.
(6)Take outthe mainboardfromthebottomchassisassem-
bly.
Fig.11
Fig.12
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