Lanner ISD-V330 User manual

ISD-V330 User Manual
Preliminary Draft Release
Version: 1.0
Date of Release: 2022-10-04
Vehicle Computing

ISD-V330 User Manual
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This manual describes the overview of the various functionalities of this product, and the information you
need to get it ready for operation. It is intended for those who are:
-responsible for installing, administering and troubleshooting this system or Information Technology
professionals.
-assumed to be qualified in the servicing of computer equipment, such as professional system integrators,
or service personnel and technicians.
The latest version of this document can be found on Lanner’s official website, available either through the
product page or through the Lanner Download Center page with a login account and password.
The icons are used in the manual to serve as an indication of interest topics or important messages.
Icon
Usage
This mark indicates that there is something you should pay special
attention to while using the product.
This mark indicates that there is a caution or warning and it is
something that could damage your property or product.
To obtain additional documentation resources and software updates for your system, please visit the Lanner
Download Center. As certain categories of documents are only available to users who are logged in, please be
registered for a Lanner Account at http://www.lannerinc.com/ to access published documents and
downloadable resources.
In addition to contacting your distributor or sales representative, you could submit a request at our Lanner
Technical Support and fill in a support ticket to our technical support department.
Your feedback is valuable to us, as it will help us continue to provide you with more accurate and relevant
documentation. To provide any feedback, comments or to report an error, please email
[email protected]m. Thank you for your time.
This document is copyrighted © 2022 by Lanner Electronics Inc. All rights are reserved. The original
manufacturer reserves the right to make improvements to the products described in this manual at any time
without notice. No part of this manual may be reproduced, copied, translated or transmitted in any form or by
any means without the prior written permission of the original manufacturer. Information provided in this
manual is intended to be accurate and reliable. However, the original manufacturer assumes no responsibility
for its use, nor for any infringements upon the rights of third parties that may result from such use.
Note or Information
Warning or Important

ISD-V330 User Manual
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Taiwan Corporate Headquarters
Lanner Electronics Inc.
7F, No.173, Sec.2, Datong Rd.
Xizhi District, New Taipei City 22184,
Taiwan
立端科技股份有限公司
221 新北市汐止區
大同路二段 173 號7樓
T: +886-2-8692-6060
F: +886-2-8692-6101
China
Beijing L&S Lancom Platform Tech. Co., Ltd.
Guodong LOFT 9 Layer No. 9 Huinan Road,
Huilongguan Town, Changping District, Beijing
102208 China
T: +86 010-82795600
F: +86 010-62963250
E: service@ls-china.com.cn
USA
Lanner Electronics Inc.
47790 Westinghouse Drive
Fremont, CA 94539
T: +1-855-852-6637
F: +1-510-979-0689
E: sales_us@lannerinc.com
Canada
Lanner Electronics Canada Ltd
3160A Orlando Drive
Mississauga, ON
L4V 1R5 Canada
T: +1 877-813-2132
F: +1 905-362-2369
E: sales_ca@lannerinc.com
Europe
Lanner Europe B.V.
Wilhelmina van Pruisenweg 104
2595 AN The Hague
The Netherlands
T: +31 70 701 3256
E: sales_eu@lannerinc.com

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Intel® and Intel® Celeron® are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with
the instruction, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after installation.
Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and roll up your
sleeves.
Wear safety glasses if you are working under any conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential hazard to people or makes the equipment unsafe.
Disconnect all power by turning off the power and unplugging the power cord before installing or removing a chassis
or working near power supplies
Do not work alone if potentially hazardous conditions exist.
Never assume that power is disconnected from a circuit; always check the circuit.
Suivez ces consignes pour assurer la sécuritégénérale :
Laissez la zone du châssis propre et sans poussière pendant et après l’installation.
Note
1. An unshielded-type power cord is required in order to meet FCC emission limits and also to prevent interference
to the nearby radio and television reception. It is essential that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
1. Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
2. This device meets all the other requirements specified in Part 15E, Section 15.407 of the FCC Rules.

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Ne portez pas de vêtements amples ou de bijoux qui pourraient être pris dans le châssis. Attachez votre cravate ou
écharpe et remontez vos manches.
Portez des lunettes de sécurité pour protéger vos yeux.
N’effectuez aucune action qui pourrait créer un danger pour d’autres ou rendre l’équipement dangereux.
Coupez complètement l’alimentation en éteignant l’alimentation et en débranchant le cordon d’alimentation avant
d’installer ou de retirer un châssis ou de travailler à proximité de sources d’alimentation.
Ne travaillez pas seul si des conditions dangereuses sont présentes.
Ne considérez jamais que l’alimentation est coupée d’un circuit, vérifiez toujours le circuit. Cet appareil génère, utilise
et émet une énergie radiofréquence et, s’il n’est pas installé et utilisé conformément aux instructions des fournisseurs
de composants sans fil, il risque de provoquer des interférences dans les communications radio.
There is risk of explosion if the battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
Installation should be conducted only by a trained electrician or only by an electrically trained person who knows all
installation procedures and device specifications which are to be applied.
Do not carry the handle of power supplies when moving to another place.
Please conform to your local laws and regulations regarding safe disposal of lithium battery.
Disposal of a battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Leaving a battery in an extremely high temperature environment can result in an explosion or the leakage of flammable
liquid or gas.
A battery subjected to extremely low air pressure may result in an explosion or the leakage of flammable liquid or gas.
Risque d’explosion si la pile est remplacée par une autre d’un mauvais type.
Jetez les piles usagées conformément aux instructions.
L’installation doit être effectuée par un électricien formé ou une personne formée à l’électricité connaissant toutes les
spécifications d’installation et d’appareil du produit.
Ne transportez pas l’unité en la tenant par le câble d’alimentation lorsque vous déplacez l’appareil.
Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment to acceptable
operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your
system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the flow of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when electronic
components are improperly handled and can result in complete or intermittent failures. Be sure to follow ESD-
prevention procedures when removing and replacing components to avoid these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available, ground
yourself by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap, which should be between 1 and 10 megohms (Mohms).
L’équipement électrique génère de la chaleur. La température ambiante peut ne pas être adéquate pour refroidir
l’équipement à une température de fonctionnement acceptable sans circulation adaptée. Vérifiez que votre site
propose une circulation d’air adéquate.
Vérifiez que le couvercle du châssis est bien fixé. La conception du châssis permet à l’air de refroidissement de bien
circuler. Un châssis ouvert laisse l’air s’échapper, ce qui peut interrompre et rediriger le flux d’air frais destiné aux
composants internes.
Les décharges électrostatiques (ESD) peuvent endommager l’équipement et gêner les circuits électriques. Des dégâts
d’ESD surviennent lorsque des composants électroniques sont mal manipulés et peuvent causer des pannes totales ou
intermittentes. Suivez les procédures de prévention d’ESD lors du retrait et du remplacement de composants.
Portez un bracelet anti-ESD et veillez à ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est disponible, reliez

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votre corps à la terre en touchant la partie métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet antistatique, qui doit être comprise entre 1 et 10 mégohms
(Mohms).
Mounting Installation Precautions
The following should be put into consideration for rack-mount or similar mounting installations:
Do not install and/or operate this unit in any place that flammable objects are stored or used in.
The installation of this product must be performed by trained specialists; otherwise, a non-specialist might create the
risk of the system’s falling to the ground or other damages.
Lanner Electronics Inc. shall not be held liable for any losses resulting from insufficient strength for supporting the
system or use of inappropriate installation components.
Elevated Operating Ambient - If installed in a closed or multi-unit rack assembly, the operating ambient temperature of
the rack environment may be greater than room ambient. Therefore, consideration should be given to installing the
equipment in an environment compatible with the maximum ambient temperature (Tma) specified by the
manufacturer.
Reduced Air Flow - Installation of the equipment in a rack should be such that the amount of airflow required for safe
operation of the equipment is not compromised.
Mechanical Loading - Mounting of the equipment in the rack should be such that a hazardous condition is not
achieved due to uneven mechanical loading.
Circuit Overloading - Consideration should be given to the connection of the equipment to the supply circuit and the
effect that overloading of the circuits might have on overcurrent protection and supply wiring. Appropriate
consideration of equipment nameplate ratings should be used when addressing this concern.
Reliable Grounding - Reliable grounding of rack mounted equipment should be maintained. Particular attention should
be given to supply connections other than direct connections to the branch circuit (e.g. use of power strips).
Installation & Operation:
This equipment must be grounded. The power cord for product should be connected to a socket-outlet with earthing
connection.
Cet équipement doit être mis à la terre. La fiche d'alimentation doit être connectée à une prise de terre correctement
câblée
Suitable for installation in Information Technology Rooms in accordance with Article 645 of the National Electrical Code
and NFPA 75.
Peut être installé dans des salles de matériel de traitement de l'information conformément à l'article 645 du National
Electrical Code et àla NFPA 75.
The machine can only be used in a restricted access location and must be installed by a skilled person.
Les matériels sont destinés à être installés dans des EMPLACEMENTS À ACCÈS RESTREINT.
Warning
Class I Equipment. This equipment must be earthed. The power plug must be connected to a properly wired earth ground
socket outlet. An improperly wired socket outlet could place hazardous voltages on accessible metal parts.
Product shall be used with Class 1 laser device modules.
Avertissement
Équipement de classe I. Ce matériel doit être relié à la terre. La fiche d’alimentation doit être raccordée à une prise de
terre correctement câblée. Une prise de courant mal câblée pourrait induire des tensions dangereuses sur des parties
métalliques accessibles.
Le produit doit être utilisé avec des modules de dispositifs laser de classe 1.

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Before turning on the device, ground the grounding cable of the equipment. Proper grounding (grounding) is very
important to protect the equipment against the harmful effects of external noise and to reduce the risk of electrocution in
the event of a lightning strike. To uninstall the equipment, disconnect the ground wire after turning off the power. A
ground wire (green-and-yellow) is required and the part connecting the conductor must be greater than 4 mm2 or 10
AWG.
Avant d’allumer l’appareil, reliez le câble de mise à la terre de l’équipement à la terre.
Une bonne mise à la terre (connexion à la terre) est très importante pour protéger l’équipement contre les effets néfastes
du bruit externe et réduire les risques d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble de mise à la terre après avoir éteint l’appareil.
Un câble de mise àla terre est requis et la zone reliant les sections du conducteur doit faire plus de 4 mm2 ou 10 AWG.
Connect the grounding cable to the ground.
The protection device for the DC power source must provide 30 A current.
This protection device must be connected to the power source before DC power.
Branchez le câble de mise à la terre à la terre.
L’appareil de protection pour la source d’alimentation CC doit fournir 30 A de courant.
Cet appareil de protection doit être branché à la source d’alimentation avant
l’alimentation CC.

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Package Content...............................................................................................................................10
Ordering Information.......................................................................................................................10
Optional Accessories........................................................................................................................10
System Specifications.......................................................................................................................11
Front Panel .......................................................................................................................................12
Rear Panel ........................................................................................................................................13
Block Diagram...................................................................................................................................14
Internal Jumpers & Connectors .......................................................................................................15
Opening the Chassis .........................................................................................................................20
Installing the LTE Module (Optional) ...............................................................................................22
Installing the Wi-Fi Module (Optional).............................................................................................25
Installing the PGN Module (Optional)..............................................................................................27
Wall Mounting..................................................................................................................................30
BIOS Setup........................................................................................................................................32
Entering BIOS Setup .........................................................................................................................32
Main Page.........................................................................................................................................33
Advanced Page.................................................................................................................................34
Chipset..............................................................................................................................................55
Security.............................................................................................................................................63

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Boot Menu........................................................................................................................................66
Save and Exit Menu..........................................................................................................................67
Warranty Policy................................................................................................................................71

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The ISD-V330 is a fanless rugged Multi-WAN in-vehicle SD-WAN featuring IoT-enhanced CPU, with rich I/O
functionality and environmental endurance, making it highly applicable in smart bus evolution. ISD-V330
features the new generation 10 nm process SoC (System-on-Chip) Intel Atom x6000E processor (codenamed
Elkhart Lake).
ISD-V330 boasts an abundance of I/O peripheral connectivity including 1x CAN bus and 2x serial COM ports, 2x
video output by HDMI, USB and MIO ports, 2x RJ-45 GbE LAN ports and SATA/mSATA storage options. To
achieve multi-WAN aggregate wireless network connectivity, ISD-V330 offers 3x PGN removable caddy with
dual SIM slot supporting 4G-LTE/5G cellular communications. ISD-V330 is compliant with E13 standard and
passes MIL-STD-810G shock and vibration resistance certifications to ensure proper operations when traveling
on non-flat surfaces.
Your package contains the following items:
1x ISD-V330 Vehicle Computer
SKU No.
Description
ISD-V330A
Fanless In-vehicle SD-WAN with multi-modems for fleet networks with Intel® AtomTM
x6000E Processor
Model No.
Description
PGN-300
4G LTE Radio Modem with LTE Cat-6 embedded module, certified with PTCRB, AT&T,
Verizon
PGN-600
4G LTE-Advanced Pro Radio Modem with LTE Cat-12 embedded module, certified with
PTCRB, AT&T

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Processor System
CPU
Intel® Elkhart Lake Atom® x6425RE Processor
Frequency
1.9 GHz
Core Number
Quad-core
Chipset
SoC
Fanless
Yes
Memory
Technology
1x DDR4 3200MT/s with SODIMM
Max. Capacity
Up to 32GB
Socket
1x 260-pin SODIMM
Graphic
Graphic Processor
Intel® UHD Graphics
Miscellaneous
Hardware Monitoring
Yes
Internal RTC with Li Battery
Yes
TPM
Yes, onboard
Ethernet
Controller
Intel® i210IT
Interface
2x RJ45 Ports
Storage
Installation
Onboard eMMC, up to 64GB
I/O
Display Port
2x HDMI with screw lock
LED Indicator
GPS; LTE; Power, refer to Appendix A
LAN Port
2x GbE RJ45 LAN Ports
CAN Bus Port
1x RS-232 CAN 2.0 (optional for J1939/1708) Bus Port
COM Port
2x RS-232/422/485 COM Ports
USB Port
3x USB 2.0, Type A Ports,
1x USB 3.0 Type A Port
GPS/G-sensor
u-blox NEO-M8N/ADXL 345
Digital I/O
4x digital input with isolation, 5-30V/100mA,
4x digital output with isolation, 30V/2A dry relay config either
N.C. or N.O.,
1x IGN_DI to MCU
Antenna
6x SMA antenna hole (GPS/GLONASSx1)
Expansion Interface
PCIe
1x M.2 3042 B-Key Socket for LTE, with dual Nano-SIM slot
1x M.2 2230 E-Key Socket for Wi-Fi Module
Cooling
Processor
Passive CPU heatsink
System
Fanless design with corrugated aluminum
Power
Connector
3-pin terminal block (+,-,ignition)
Input
Supports DC 9~36V level, ignition delay on/off control
Environment
Operating Temperature
-40~70°C / -40~158°F
Storage Temperature
-40~85°C / -40~185°F
Relative Humidity
5%~95% @ 40°C / 104°F (Storage Level)
Mechanical
Dimension (WxHxD)
274 x 73 x 185mm (10.78” x 2.87” x 7.28”)
Weight
5.2 kg
Mounting
Wall mount
Driver Support
Microsoft Windows
Windows 10 IoT Enterprise
Certification
EMC
CE/FCC Class A, RoHS
Safety
E13 include ISO 7637-2, SAE J1455&J1113-11
Compliance
Vibration & Shock
MIL-STD-810G, Method 514.6

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No.
Description
F1
GbE Ports
2x RJ45 LAN Ports
F2
Module Slot
2x Removable PGN Module Slot supporting Dual SIM and 2x Antenna
ports with dust cover
F3
SIM Slot
2x Nano-SIM cards with cover
F4
Antenna Holes
2x SMA-type Antenna Holes for LTE Module (Optional)
F5
USB Port
1x USB 3.0 Type A, 3x USB 2.0 Type A Ports
F6
CAN Bus Port
1x RS232 CAN 2.0 (option for J1939/J1708)
F7
LED Indicator
GPS; LTE; Power; Storage refer to Appendix A
F6
F7
F1
F5
F2
F3
F2
F4

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No.
Description
R1
Multi-IO Port
4x DI @5-30V/100mA, 4x DO @30V/2A dry relay N.C./N.O., 1x IGN DI to MCU
R2
Module Slot
1x Removable PGN Module Slot supporting Dual SIM and 2x Antenna ports
with dust cover
R3
HDMI Port
2x HDMI ports with cable lock
R4
GPS Antenna
1x GPS+GLONASS Antenna hole with dust cover
R5
COM Port
2x DB9 Male Connector for RS232/422/485
R6
Antenna Hole
2x SMA-type Antenna holes for Wi-Fi Module (optional)
R7
DC Input
1x 3-pin terminal block for DC 9~54V external power source, GND and Ignition
R8
Ground Pin
1x Protective Grounding Hole
R3
R4
R5
R1
R2
R6
R7
R8

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The block diagram indicates how data flows among components on the motherboard. Please refer to the
following figure for the motherboard’s layout design.

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Refer to the following as reference for the pin assignments and internal connectors. The pin headers on the
motherboard are often associated with important functions. With the shunt (Jumper) pushed down on the
designated pins (the pin numbers are printed on the circuit board, surrounding the pin header), certain feature
can be enabled or disabled. While changing the jumpers, make sure your system is turned off.
PRJK1 (+9V~36V)
Pin No.
Description
1
IGNITION
2
GND_IGNI
3
DC_VIN
SW3
Function Detec
All OFF: Normal Operate
SW1 ON: Detect by Power Good
SW2 ON: Enable Low Power Detect
SW3 ON: Disable Watchdog
SW4 ON: For Program MCU
Pin No.
Description
1
ON (Default)
2
OFF
3
OFF
4
OFF
J9
Pin No.
Description
1-2 (Default)
PSE_UART4_TX_L/
PSE_UART4_RX_L
2-3
NXP_RXD/ NXP_TXD
CON5
Pin No.
Description
1
IGN3V3_SB
2
NXP_RXD
3
GND
4
NXP_TXD

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JCOMS1
Pin No.
Description
1
RTC_RST#
2
GND
3
SRTC_RST#
J1 (Debug Port for ARM)
Pin No.
Description
Pin No.
Description
1
V_ARM_JTAG
2
PSE_SWDIO
3
GND
4
PSE_SWCLK
5
GND
6
PSE_TRACESWO
7
NC
8
TP_TDI_PIN8
9
GND
10
PSE_JTAG_NRESET
11
NC
12
PSE_TRACECLK
13
NC
14
PSE_TRACEDATA0
15
GND
16
PSE_TRACEDATA1
17
GND
18
PSE_TRACEDATA2
19
GND
20
PSE_TRACEDATA3
JCOM1
Pin No.
Description
1
V3P3_A
2
PSE_I2C5_SDA
3
PSE_I2C5_SCL
4
GND
J8
Pin No.
Description
1
SMB_DATA_VR
2
SMB_CLK_VR
3
GND
JSPI1
Pin No.
Description
1
SPI0_IO3_HOLD#
2
NC
3
SPI0_CS0_R#

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COM1
Pin No.
Description
1
COM_DCD1_#_L
2
COM_RXD1_L
3
COM_TXD1_L
4
COM_DTR1_#_L
5
GND
6
COM_DSR1_#_L
7
COM_RTS1_#_L
8
COM_CTS1_#_L
9
COM_RI1#
COM2
Pin No.
Description
1
COM_DCD2_#_L
2
COM_RXD2_L
3
COM_TXD2_L
4
COM_DTR2_#_L
5
GND
6
COM_DSR2_#_L
7
COM_RTS2_#_L
8
COM_CTS2_#_L
9
COM_RI2#
CON2
Pin No.
Description
1
V3P3S_PGN1
2
V3P3S_PGN1
3
V5_S
4
V3P3A_1P8A_SPI
5
SPI0_IO1_MISO_R
6
NC
7
NC
8
SPI0_CLK_R
9
GND
10
SPI0_IO0_MOSI_R

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4
PGN1_SIM_SW
5
PGN1_RST#
6
GND
7
USB2_N4
8
USB2_P4
CON3
Pin No.
Description
1
V3P3S_PGN1
2
V3P3S_PGN1
3
V5_S
4
PGN1_SIM_SW
5
PGN1_RST#
6
GND
7
USB2_N4
8
USB2_P4
CON4
Pin No.
Description
1
V3P3S_PGN3
2
V3P3S_PGN3
3
V5_S
4
PGN3_SIM_SW
5
PGN3_RST#
6
GND
7
USB2_N6
8
USB2_P6
CN3
Pin No.
Description
Pin No.
Description
1
NC
2
NC
3
IGN_DI_ISO
4
IGN_ISOGND
5
DO4_N
6
DO4_P
7
DO3_N
8
DO3_P
9
DO2_N
10
DO2_P
11
DO1_N
12
DO1_P
13
EXT_DI4
14
GND_DI4

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15
EXT_DI3
16
GND_DI3
17
EXT_DI2
18
GND_DI2
19
EXT_DI1
20
GND_DI1
SATA_PWR1
Pin No.
Description
1
V12_S
2
GND
3
GND
4
V5_S
CN2
Pin No.
Description
Pin No.
Description
1
BAT_12V_24V
2
K_LINE
3
DO
4
NC
5
GND
6
GND
7
NC
8
J1850+/J1708+
9
CAN_M_TX
10
J1850-/J1708-
11
CAN_M_RX
12
CAN_H/J1939+
13
V5_S
14
CAN_L/J1939-
COM2
Pin No.
Description
1
J1850-/J1708-_C
2
COM3_RXD
3
DSUB3_C
4
NC
5
DSUB5_C
6
J1850-/J1708-
7
J1850+/J1708+
8
J1850+/J1708+
9
BAT_12V_24V

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20
To reduce the risk of personal injury, electric shock, or damage to the unit, please remove all power connections
to completely shut down the device and wear ESD protection gloves when conducting the steps in this chapter.
1. Turn the system over so the bottom is
facing up. Then, remove the 13 screws
on the sides, front, and rear panels.
2. Lift up the bottom chassis
Right/Left Side
x4 screws
Front/Rear Panels x6 screws
Bottom Side x3 screws
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