Lanner ICS-I370 User manual
ICS-I370 User Manual
ICS-I370 User Manual
Preliminary Draft
Version: 1.3
Date of Release:2023-07-10
Industrial Communication Platforms
ICS-I370 User Manual
2
This manual describes the overview of the various functionalities of this product, and the information you
need to get it ready for operation. It is intended for those who are:
-responsible for installing, administering and troubleshooting this system or Information Technology
professionals.
-assumed to be qualified in the servicing of computer equipment, such as professional system
integrators, or service personnel and technicians.
The latest version of this document can be found on Lanner’s official website, available either through the
product page or through the Lanner Download Center page with a login account and password.
The icons are used in the manual to serve as an indication of interest topics or important messages.
Icon
Usage
This mark indicates that there is something you should pay special
attention to while using the product.
This mark indicates that there is a caution or warning and it is
something that could damage your property or product.
To obtain additional documentation resources and software updates for your system, please visit the
Lanner Download Center. As certain categories of documents are only available to users who are logged
in, please be registered for a Lanner Account at http://www.lannerinc.com/ to access published documents
and downloadable resources.
In addition to contacting your distributor or sales representative, you could submit a request at our Lanner
Technical Support and fill in a support ticket to our technical support department.
Your feedback is valuable to us, as it will help us continue to provide you with more accurate and relevant
documentation. To provide any feedback, comments or to report an error, please email
[email protected]m. Thank you for your time.
Note or Information
Warning or Important
ICS-I370 User Manual
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Taiwan Corporate Headquarters
Lanner Electronics Inc.
7F, No.173, Sec.2, Datong Rd.
Xizhi District, New Taipei City 22184,
Taiwan
立端科技股份有限公司
221 新北市汐止區
大同路二段 173 號7樓
T: +886-2-8692-6060
F: +886-2-8692-6101
China
Beijing L&S Lancom Platform Tech. Co., Ltd.
Guodong LOFT 9 Layer No. 9 Huinan Road,
Huilongguan Town, Changping District, Beijing
102208 China
T: +86 010-82795600
F: +86 010-62963250
E: service@ls-china.com.cn
USA
Lanner Electronics Inc.
47790 Westinghouse Drive
Fremont, CA 94539
T: +1-855-852-6637
F: +1-510-979-0689
E: sales_us@lannerinc.com
Canada
Lanner Electronics Canada Ltd
3160A Orlando Drive
Mississauga, ON
L4V 1R5 Canada
T: +1 877-813-2132
F: +1 905-362-2369
E: sales_ca@lannerinc.com
Europe
Lanner Europe B.V.
Wilhelmina van Pruisenweg 104
2595 AN The Hague
The Netherlands
T: +31 70 701 3256
E: sales_eu@lannerinc.com
ICS-I370 User Manual
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This document is copyrighted © 2023 by Lanner Electronics Inc. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at any time without notice. No part
of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior
written permission of the original manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, nor for any infringements upon the
rights of third parties that may result from such use.
Intel® and Intel® Atom® are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged
to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Note
1. An unshielded-type power cord is required to meet FCC emission limits and to prevent interference to the nearby
radio and television reception. It is essential that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
Important
1. Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
2. This device meets all the other requirements specified in Part 15E, Section 15.407 of the FCC Rules.
ICS-I370 User Manual
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Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after installation.
Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and roll up your
sleeves.
Wear safety glasses if you are working under any conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential hazard to people or makes the equipment unsafe.
Disconnect all power by turning off the power and unplugging the power cord before installing or removing a chassis
or working near power supplies
Do not work alone if potentially hazardous conditions exist.
Never assume that power is disconnected from a circuit; always check the circuit.
Suivez ces consignes pour assurer la sécuritégénérale :
Laissez la zone du châssis propre et sans poussière pendant et après l’installation.
Ne portez pas de vêtements amples ou de bijoux qui pourraient être pris dans le châssis. Attachez votre cravate ou
écharpe et remontez vos manches.
Portez des lunettes de sécurité pour protéger vos yeux.
N’effectuez aucune action qui pourrait créer un danger pour d’autres ou rendre l’équipement dangereux.
Coupez complètement l’alimentation en éteignant l’alimentation et en débranchant le cordon d’alimentation avant
d’installer ou de retirer un châssis ou de travailler à proximité de sources d’alimentation.
Ne travaillez pas seul si des conditions dangereuses sont présentes.
Ne considérez jamais que l’alimentation est coupée d’un circuit, vérifiez toujours le circuit. Cet appareil génère, utilise
et émet une énergie radiofréquence et, s’il n’est pas installé et utilisé conformément aux instructions des fournisseurs
de composants sans fil, il risque de provoquer des interférences dans les communications radio.
There is risk of Explosion if Battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
Installation only by a skilled person who knows all Installation and Device Specifications which are to be applied.
Do not carry the handle of power supplies when moving to another place.
Please conform to your local laws and regulations regarding safe disposal of lithium BATTERY.
Disposal of a battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Leaving a battery in an extremely high temperature surrounding environment can result in an explosion or the
leakage of flammable liquid or gas.
A battery subjected to extremely low air pressure that may result in an explosion or the leakage of flammable liquid
or gas.
Risque d’explosion si la pile est remplacée par une autre d’un mauvais type.
Jetez les piles usagées conformément aux instructions.
L’installation doit être effectuée par un électricien formé ou une personne formée à l’électricité connaissant toutes
les spécifications d’installation et d’appareil du produit.
Ne transportez pas l’unité en la tenant par le câble d’alimentation lorsque vous déplacez l’appareil.
Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment to acceptable
operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your
system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the flow of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when
electronic components are improperly handled and can result in complete or intermittent failures. Be sure to follow
ESD-prevention procedures when removing and replacing components to avoid these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available, ground
yourself by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap, which should be between 1 and 10 megohms (Mohms).
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L’équipement électrique génère de la chaleur. La température ambiante peut ne pas être adéquate pour refroidir
l’équipement à une température de fonctionnement acceptable sans circulation adaptée. Vérifiez que votre site
propose une circulation d’air adéquate.
Vérifiez que le couvercle du châssis est bien fixé. La conception du châssis permet à l’air de refroidissement de bien
circuler. Un châssis ouvert laisse l’air s’échapper, ce qui peut interrompre et rediriger le flux d’air frais destiné aux
composants internes.
Les décharges électrostatiques (ESD) peuvent endommager l’équipement et gêner les circuits électriques. Des dégâts
d’ESD surviennent lorsque des composants électroniques sont mal manipulés et peuvent causer des pannes totales
ou intermittentes. Suivez les procédures de prévention d’ESD lors du retrait et du remplacement de composants.
Portez un bracelet anti-ESD et veillez à ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est disponible,
reliez votre corps àla terre en touchant la partie métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet antistatique, qui doit être comprise entre 1 et 10 mégohms
(Mohms).
Mounting Installation Precaution
Do not install and/or operate this unit in any place that flammable objects are stored or used in.
If installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack environment may
be greater than room ambient. Therefore, consideration should be given to installing the equipment in an
environment compatible with the maximum ambient temperature (Tma) specified by the manufacturer.
Installation of the equipment (especially in a rack) should consider the ventilation of the system’s intake (for taking
chilled air) and exhaust (for emitting hot air) openings so that the amount of airflow required for safe operation of
the equipment is not compromised.
To avoid a hazardous load condition, be sure the mechanical loading is even when mounting.
Consideration should be given to the connection of the equipment to the supply circuit and the effect that
overloading of the circuits might have on over-current protection and supply wiring. Appropriate consideration of
equipment nameplate ratings should be used when addressing this concern.
Reliable earthing should be maintained. Particular attention should be given to supply connections other than direct
connections to the branch circuit (e.g., use of power strips).
Installation & Operation:
This equipment must be grounded. The power cord for product should be connected to a socket-outlet with earthing
connection.
Cet équipement doit être mis àla terre. La fiche d'alimentation doit être connectée àune prise de terre correctement
câblée
Suitable for installation in Information Technology Rooms in accordance with Article 645 of the National Electrical
Code and NFPA 75.
Peut être installédans des salles de matériel de traitement de l'information conformément àl'article 645 du National
Electrical Code et àla NFPA 75.
The machine can only be used in a restricted access location and must be installed by a skilled person.
Les matériels sont destinés àêtre installés dans des EMPLACEMENTS À ACCÈS RESTREINT.
Warning
Class I Equipment. This equipment must be earthed. The power plug must be connected to a properly wired earth
ground socket outlet. An improperly wired socket outlet could place hazardous voltages on accessible metal parts.
“Product shall be used with Class 1 laser device modules.”
Avertissement
Équipement de classe I. Ce matériel doit être relié à la terre. La fiche d’alimentation doit être raccordée à une prise de
terre correctement câblée. Une prise de courant mal câblée pourrait induire des tensions dangereuses sur des parties
métalliques accessibles.
“Le produit doit être utilisé avec des modules de dispositifs laser de classe 1.”
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Before turning on the device, ground the grounding cable of the equipment. Proper grounding (grounding) is very
important to protect the equipment against the harmful effects of external noise and to reduce the risk of electrocution
in the event of a lightning strike. To uninstall the equipment, disconnect the ground wire after turning off the power. A
ground wire is required and the part connecting the conductor must be greater than 4 mm2 or 10 AWG.
Avant d’allumer l’appareil, reliez le câble de mise à la terre de l’équipement à la terre.
Une bonne mise à la terre (connexion à la terre) est très importante pour protéger l’équipement contre les effets
néfastes du bruit externe et réduire les risques d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble de mise à la terre après avoir éteint l’appareil.
Un câble de mise à la terre est requis et la zone reliant les sections du conducteur doit faire plus de 4 mm2 ou 10
AWG.
Loosen the screw of the earthing point.
Connect the grounding cable to the ground.
The protection device for the power source must provide 30 A current.
This protection device must be connected to the power source before power.
The cable hould 16 AWG
Desserrez la vis du terminal de mise àla terre.
Branchez le câble de mise àla terre àla terre.
L’appareil de protection pour la source d’alimentation doit fournir 30 A de courant.
Cet appareil de protection doit être branché à la source d’alimentation avant
l’alimentation.
Le câble doit 16 AWG
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Key Features .................................................................................................................................9
Package Content...........................................................................................................................9
Ordering Information ...................................................................................................................9
System Specifications.................................................................................................................10
Physical Overview.......................................................................................................................11
Motherboard Information..........................................................................................................13
Opening the Bottom Chassis ......................................................................................................25
Opening the Top Chassis ............................................................................................................27
Installing the System Memory....................................................................................................29
Installing the mSATA Storage (Optional)....................................................................................31
Installing the Wi-Fi Module (Optional).......................................................................................33
Installing the LTE/5G Module (Optional)....................................................................................35
Installing the SSD (Optional).......................................................................................................39
DIN Rail Mounting (Optional).....................................................................................................41
Main Page...................................................................................................................................43
Advanced Page ...........................................................................................................................44
Chipset........................................................................................................................................67
Security.......................................................................................................................................75
Boot Menu..................................................................................................................................78
Save and Exit Menu ....................................................................................................................79
Warranty Policy ..........................................................................................................................81
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ICS-I370 is the next-generation compact fanless industrial cyber security appliance with Intel® Atom™ E3900
CPU (Apollo Lake). Deployed in remote, unmanned, and harsh environments, ICS-I370 supports rich LAN
ports with advanced Gen3 LAN bypass, SFP, and extended operating temperature from -40ºC to 70ºC. It
also boosts a flexible design with versatile mounting options (wall mount or DIN-rail), onboard TPM, wireless
connectivity options, and front access I/O ports, making it perfect for performing OT cybersecurity measures
at critical infrastructures such as oil refineries, substations, power plants, and manufacturing factories.
Industrial-Grade Cyber Security Platform
Intel® Atom™ X7-E3950 / X5-E3940 (formerly Apollo Lake)
8x, or 6x GbE RJ45 Ports with 1 or 2 pairs Bypass (SKU A/B/E)
6x, or 4x GbE RJ45 Ports and 2x GbE SFP Ports (SKU C/D/F)
Onboard 64GB eMMC and TPM 2.0 Security
I/O Ports: 2x USB 3.0 Ports, 1x DB9 Console Port, 2x DIO
1x M.2 B-Key for LTE/5G sub6 with dual SIM, and 1x M.2 E-Key for Wi-Fi
Your package contains the following items:
1x ICS-I370 Industrial-Grade Cyber Security Platform
1x Phoenix Connector Kits
SKU No.
Main Features
ICS-I370A
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3950, 8x RJ45 w/ 1 pair
Bypass
ICS-I370B
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3950, 8x RJ45 w/ 2 pair
Bypass
ICS-I370C
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3950, 6x RJ45, 2x SFP w/
1 pair Bypass
ICS-I370D
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3950, 6x RJ45, 2x SFP w/
2 pair Bypass
ICS-I370E
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3940, 6x RJ45 w/ 1 pair
Bypass
ICS-I370F
Industrial-Grade Cyber Security Platform with Intel® AtomTM E3940, 4x RJ45, 2x SFP w/
1 pair Bypass
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Processor System
Processor Options
SKU A/B/C/D: Intel® Atom™ E3950
SKU E/F: Intel® Atom™ E3940
Frequency
1.60 GHz
Core Number
4
Chipset
SoC
BIOS
AMI SPI Flash BIOS
Memory
Technology
DDR3L, non ECC
Max. Capacity
Up to 8GB
Socket
1x SODIMM
Ethernet
Controller
LAN3 & LAN4 by Intel® i210-IS/IT/AT;
LAN1 & LAN 2 by Intel i210-IT/AT
Speed
10/100/1000 Mbps
Interface
SKU A: 8x GbE RJ45, 1x Pair Bypass;
SKU B: 8x GbE RJ45, 2x Pair Bypass;
SKU C: 6x GbE RJ45; 2x SFP, 1x Pair Bypass;
SKU D: 6x GbE RJ45; 2x SFP, 2x Pair Bypass;
SKU E: 6x GbE RJ45, 1x Pair Bypass;
SKU F: 4x GbE RJ45; 2x SFP, 1x Pair Bypass
Isolation Protection
1.5 KV magnetic isolation protection
Storage
Type
Onboard eMMC 64GB;
1x mSATA;
1x SATA for 2.5” SSD/HDD or mSATA via m-SATA board (Optional);
1x 2.5” SSD/HDD Drive (Optional)
I/O Interface
Serial Port
1x D89 Console Port
USB Port
2x USB 3.0, Type A Port
Reset Button
Default H/W reset, selectable by jumper to SW reset
Power Input
2-pin terminal block for power On/Off control
LED
Power Status / Storage Access / LTE Status / LTE Signal / DI/DO /
LAN TX/RX
Expansion Interface
M.2
1x M.2 3042 B-Key w/ Dual SIM for LTE/5G sub6;
1x M.2 2230 E-Key for Wi-Fi 5/6
Watchdog Timer
Watchdog timer 256 level time interval system reset, software
programmable
Graphics
Controller
Intel® HD Graphics 500
VGA
1x DP Port
Mechanical
Dimension (W x H x D)
160 x 156.5 x 81mm (6.29” x 6.16” x 3.18”)
Fanless
Yes
Weight
2kg
Mounting
DIN rail,
Environmental
Operating Temperature
-40°C ~70°C
Storage Temperature
-40°C ~70°C
Relative Humidity
10% ~ 90%, Non-condensing
Power
Power Supply Voltage
Dual DC Input from 12~36V
Connector
1x 6-pin Terminal Block for Dual DC Input
Dual Power Inputs
Yes
Driver Support
Microsoft Windows
Windows 10 IoT
Linux
Kernal 3.X
Certification
EMC
CE/FCC Class A, UL
Compliance
RoHS
ICS-I370 User Manual
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Q
No.
Description
F1
LED Indicators
F2
Console Port
1x DB9 Console Port
F3
USB Port
2x USB 3.0 Type A Ports
F4
LAN/SFP Port
SKU A/B: 8x GbE RJ45 (1 or 2 pair bypass) Ports
SKU C/D: 6x GbE RJ45; 2x GbE SFP (1 or 2 pair bypass) Ports
SKU E: 6x GbE RJ45 (one pair bypass) Ports
SKU F: 4x GbE RJ45; 2x GbE SFP (one pair bypass) Ports
F5
Display Port
1x Display Port
F6
DIO
2x4-pin Terminal block for 2x DI & 2x DO
F7
Antenna
2x Antenna Holes
LED Indicator: Power Status/ Storage Access/ SFP Status/ LTE Status
4x LTE Signal Level Status
F3
F7
F1
F2
2x4 Programmable
F4
F6
F5
F1
ICS-I370 User Manual
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No.
Description
B1
Power Control
1x 2-pin Terminal Block for Power On/Off Control
B2
Reset Button
1x Reset Button. Use a pin to reset the system
B3
Antenna
2x Antenna Hole
No.
Description
T1
Power Input
1x 2-pin Terminal Block for Dual DC input 12~36V (Typical 12V/24Vdc)
T2
Antenna
2x Antenna Holes
B1
B2
B3
T1
T2
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ICS-I370 User Manual
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The pin headers on the motherboard are often associated with important functions. With the shunt (Jumper)
pushed down on the designated pins (the pin numbers are printed on the circuit board, surrounding the pin
header), certain feature can be enabled or disable. When changing the jumpers, make sure your system is
completely turned off.
1. RST2: Reset Button
Push SW No Lock TS-02PV-130, 4-pin, H:7.1mm, Dip Zeetek
2. RST1: HW/SW Reset Select
3. JCMOS 1/2: Clear CMOS
Jumper
Description
1-2 (Default)
Normal
2-3
Clear CMOS
4. DP1: Display Port Connector
Pin No.
Description
Pin No.
Description
1
DP0_TXP0
2
GND
3
DP0_TXN0
4
DP0_TXP1
5
GND
6
DP0_TXN1
7
DP0_TXP2
8
GND
9
DP0_TXN2
10
DP0_TXP3
11
GND
12
DP0_TXN3
23
DPP_AUX_EN_N
14
CONFIG2
25
DPP_AUX_CHP
16
GND
17
DPP_AUX_CHN
18
HPD
19
RETURN
20
DP_PWR
Jumper
Description
1-2
Software reset
2-3 (Default)
Hardware reset
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5. JSPI1: SPI ROM Connector (For RD Debug)
Pin No.
Description
Pin No.
Description
1
SPI0_HOLD_N
2
NC
3
SPI0_CS_N
4
V1P8_A_SPI
5
SPI0_MISO_R
6
NC
7
NC
8
SPI0_CLK
9
GND
10
SPI0_MOSI
6. LPC1: LPC Connector (For RD Debug)
Pin No.
Description
Pin No.
Description
1
DEBUG_CLK_24M
2
LPC_AD1
3
PLTRST_BUF2_N
4
LPC_AD0
5
L_FRAME_N
6
V3P3_S
7
LPC_AD3
8
GND
9
LPC_AD2
10
GND
7. SATAPWR1: SATA Power Connector
Pin No.
Description
1
V12_S
2
GND
3
GND
4
V5_S
8. SATA1: SATA Connector
Pin No.
Description
Pin No.
Description
1
GND
5
SATA_RXN1_C
2
SATA_TXP1_C
6
SATA_RXP1_C
3
SATA_TXN1_C
7
GND
4
GND
9. COM1: BO2WI Mini D-Sub
Pin No.
Description
Pin No.
Description
1
NC
2
COM1_R_RXD
3
COM1_R_TXD
4
NC
5
GND
6
NC
7
NC
8
NC
9
NC
ICS-I370 User Manual
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10. USB1: Dual USB 3.0 Type A Connector
Pin No.
Description
Pin No.
Description
1
V5S_USB3_1
10
V5S_USB3_2
2
USB2_0-
11
USB2_1-
3
USB2_0+
12
USB2_1+
4
GND
13
GND
5
USB3_R0-
14
USB3_R1-
6
USB3_R0+
15
USB3_R1+
7
GND
16
GND
8
USB3_T0-
17
USB3_T1-
9
USB3_T0+
18
USB3_T1+
13. RJ1: LAN 1/2 Connector
Pin No.
Description
Pin No.
Description
1
P1_MDXP0
13
P2_MDXP0
2
P1_MDXN0
14
P2_MDXN0
3
P1_MDXP1
15
P2_MDXP1
4
P1_MDXP2
16
P2_MDXP2
5
P1_MDXN2
17
P2_MDXN2
6
P1_MDXN1
18
P2_MDXN1
7
P1_MDXP3
19
P2_MDXP3
8
P1_MDXN3
20
P2_MDXN3
9
V3P3_S
21
V3P3_S
10
P1_LED_LINK_N
22
P2_LED_LINK_N
11
P1_LINK1000
23
P2_LINK1000
12
P1_LINK100
24
P2_LINK100
14. RJ3: LAN 10/100/1000 RJ45 Connector
Pin No.
Description
1
LAN3_MDI0P
2
LAN3_MDI0N
3
LAN3_MDI1P
4
LAN3_MDI1N
5
P1V5_LAN3
6
P1V5_LAN3
7
LAN3_MDI2P
8
LAN3_MDI2N
9
LAN3_MDI3P
10
LAN3_MDI3N
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11
LAN3_L100_N
12
LAN3_L1000_N
13
P3V3_LAN3
14
LAN3_ACTLED_N
15. RJ4: LAN 10/100/1000 RJ45 Connector
Pin No.
Description
1
LAN4_MDI0P
2
LAN4_MDI0N
3
LAN4_MDI1P
4
LAN4_MDI1N
5
P1V5_LAN4
6
P1V5_LAN4
7
LAN4_MDI2P
8
LAN4_MDI2N
9
LAN4_MDI3P
10
LAN4_MDI3N
11
LAN4_L100_N
12
LAN4_L1000_N
13
P3V3_LAN4
14
LAN4_ACTLED_N
16. FIBER1: SFP Connector
Pin No.
Description
Pin No.
Description
1
GND
11
GND
2
SFP3_TX_FAULT
12
SFP3_RD_N
3
SFP3_TX_DIS
13
SFP3_RD_P
4
SFP3_I2C_SDA
14
GND
5
SFP3_I2C_SCL
15
P3V3_SFP3_R
6
SFP3_MOD_ABS
16
P3V3_SFP3_T
7
SFP3_RS0
17
GND
8
SFP3_RX_LOS
18
SFP3_TD_P
9
SFP3_RS1
19
SFP3_TD_N
10
GND
20
GND
17. FIBER2: SFP Connector
Pin No.
Description
Pin No.
Description
1
GND
11
GND
2
SFP4_TX_FAULT
12
SFP4_RD_N
ICS-I370 User Manual
18
3
SFP4_TX_DIS
13
SFP4_RD_P
4
SFP4_I2C_SDA
14
GND
5
SFP4_I2C_SCL
15
P3V3_SFP4_R
6
SFP4_MOD_ABS
16
P3V3_SFP4_T
7
SFP4_RS0
17
GND
8
SFP4_RX_LOS
18
SFP4_TD_P
9
SFP4_RS1
19
SFP4_TD_N
10
GND
20
GND
18. MSATA1: MSATA Connector
Pin No.
Description
Pin No.
Description
1
NC
2
V3P3_S
3
NC
4
GND
5
NC
6
NC
7
NC
8
NC
9
GND
10
NC
11
NC
12
NC
13
NC-
14
NC
15
GND
16
NC
Mechanical Key
17
NC
18
GND
19
NC
20
NC
21
GND
22
NC
23
SATA_RXP0_C
24
V3P3_S
25
SATA_RXN0_C
26
GND
27
GND
28
NC
29
GND
30
NC
31
SATA_TXN0_C
32
NC
33
SATA_TXP0_C
34
GND
35
GND
36
NC-
37
GND
38
NC
39
V3P3_S
40
GND
41
V3P3_S
42
NC
43
NC
44
NC
45
NC
46
NC
47
NC
48
NC
49
NC
50
GND
51
NC
52
V3P3_S
ICS-I370 User Manual
19
19. PSBTN1: External Power Button (2-pin Phoenix Connector)
Pin No.
Description
Pin No.
Description
1
EXT_PWRBTN
2
GND
20. JP10: Board to Board Power Connector
Pin No.
Description
Pin No.
Description
1
NC
2
V12_A
3
GND
4
V12_A
5
GND
6
V12_A
7
GND
8
V12_A
9
GND
10
V12_A
21. J9: Board to Board Connector
Pin
No.
Description
Pin
No.
Description
Pin
No.
Description
Pin
No.
Description
1
GND
41
GND
2
V3P3_S
42
P1_S0_2
3
GND
43
CTS#2
4
GND
44
LAN34GND
5
USB2_DP4
45
RTS#2
6
USB2_DP3
46
GND
7
USB2_DN4
47
SOUT#2
8
USB2_DN3
48
CTS#3
9
GND
49
SIN#2
10
GND
50
RTS#3
11
PCIE5_TXP
51
GND
12
USB3_TX3_P
52
SOUT#3
13
PCIE5_TXN
53
CTS#4
14
USB3_TX3_N
54
SIN#3
15
GND
55
RTS#4
16
GND
56
GND
17
PCIE5_RXP
57
SOUT#4
18
USB3_RX3_P
58
CTS#5
19
PCIE5_RXN
59
SIN#4
20
USB3_RX3_N
60
RTS#5
21
GND
61
GND
22
GND
62
SOUT#5
23
BUF_PCIE5_CLKP
63
SOUT#6
24
BUF_PCIE4_CLKP
64
SIN#5
25
BUF_PCIE5_CLKN
65
SIN#6
26
BUF_PCIE4_CLKN
66
GND
27
GND
67
V5_S
28
GND
68
NC
29
PLTRST_BUF3_N
69
GND
30
NC
70
V3P3_S
31
NC
71
V3P3_S
32
LATCH_EN_GPH
72
V3P3_S
33
NC
73
GND
34
LATCH_DIS_GPL
74
GND
35
GND
75
V5_S
36
GPIO_BYPASS_EN
76
V3P3_A
37
SMB_CLK_BUF2
77
GND
38
P1_RT_1
78
GND
39
SMB_DATA_BUF2
79
V5_S
40
P1_S0_1
80
V12_S
ICS-I370 User Manual
20
1. RJ2: RJ45 Jack with LED
Pin No.
Description
1
LAN1_MDI0P
2
LAN1_MDI0N
3
LAN1_MDI1P
4
LAN1_MDI1N
5
TCL1
6
TCL2
7
LAN1_MDI2P
8
LAN1_MDI2N
9
LAN1_MDI3P
10
LAN1_MDI3N
11
LAN1_LINK_2500_N
12
LAN1_LINK_1000_N
13
LAN1_LINK_ACT_N
14
P3V3_LAN1
2. RJ3: RJ45 Jack with LED
Pin No.
Description
1
LAN2_MDI0P
2
LAN2_MDI0N
3
LAN2_MDI1P
4
LAN2_MDI1N
5
TCL1
6
TCL2
7
LAN2_MDI2P
8
LAN2_MDI2N
9
LAN2_MDI3P
10
LAN2_MDI3N
11
LAN2_LINK_2500_N
12
LAN2_LINK_1000_N
13
LAN2_LINK_ACT_N
14
P3V3_LAN2
3. RJ1: LAN 1/2 Connector, RJ45 Jack with LED
Pin No.
Description
Pin No.
Description
1
P3_MDXP0
13
P4_MDXP0
2
P3_MDXN0
14
P4_MDXN0
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