Lenovo ThinkSystem SR670 V2 User manual

ThinkSystem SR670 V2
Maintenance Manual
Machine Types: 7Z22, 7Z23

Note
Before using this information an the pro uct it supports, be sure to rea an un erstan the safety
information an the safety instructions, which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_ ocumentation/p f_files.html
In a ition, be sure that you are familiar with the terms an con itions of the Lenovo warranty for your server,
which can be foun at:
http:// atacentersupport.lenovo.com/warrantylookup
Second Edition (June 2021)
© Copyright Leno o 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If ata or software is elivere pursuant to a General Services
A ministration “GSA” contract, use, repro uction, or isclosure is subject to restrictions set forth in Contract No. GS-
35F-05925.

Contents
Safety . . . . . . . . . . . . . . . . . . iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Specifications . . . . . . . . . . . . . . . . 1
General specifications . . . . . . . . . . . 2
4-DW GPU Mo el / 8-DW GPU Mo el
specification . . . . . . . . . . . . . . . 6
SXM GPU Mo el specification . . . . . . . . 8
Particulate contamination . . . . . . . . . . 8
Firmware up ates . . . . . . . . . . . . . . . 9
Tech Tips . . . . . . . . . . . . . . . . . 13
Security a visories . . . . . . . . . . . . . 13
Power on the server . . . . . . . . . . . . . 14
Power off the server . . . . . . . . . . . . . 14
Chapter 2. Ser er components . . . . 15
The 4-DW GPU Mo el Front view . . . . . . . . 16
The 8-DW GPU Mo el Front view . . . . . . . . 18
The SXM GPU Mo el front view . . . . . . . . 21
Rear view . . . . . . . . . . . . . . . . . 22
Front panel . . . . . . . . . . . . . . . . 25
Front I/O mo ule . . . . . . . . . . . . . . 26
External LCD iagnostics han set . . . . . . . 27
System-boar layout . . . . . . . . . . . . . 34
System-boar connectors . . . . . . . . . 34
System-boar switches . . . . . . . . . . 36
Parts list. . . . . . . . . . . . . . . . . . 38
The 4-DW GPU Mo el (2.5-inch rive
configuration) parts list . . . . . . . . . . 39
The 4-DW GPU Mo el (3.5-inch rive
configuration) parts list . . . . . . . . . . 43
The 8-DW GPU Mo el parts list . . . . . . . 47
The SXM GPU Mo el parts list . . . . . . . 51
Power cor s . . . . . . . . . . . . . . . . 55
Chapter 3. Internal cable routing . . . 57
I entifying connectors . . . . . . . . . . . . 58
Drive backplane connectors . . . . . . . . 58
GPU istribution boar connectors . . . . . 61
Rear riser boar connectors . . . . . . . . 63
Front I/O expansion boar connectors . . . . 63
Retimer assembly connectors . . . . . . . 64
4-DW GPU Mo el with 8x 2.5-inch rives cable
routing . . . . . . . . . . . . . . . . . . 65
Configuration A cable routing. . . . . . . . 67
Configuration A with HBA/RAID a apter cable
routing . . . . . . . . . . . . . . . . 72
Configuration C cable routing . . . . . . . 77
4-DW GPU Mo el with 4x 3.5-inch rives cable
routing . . . . . . . . . . . . . . . . . . 81
Configuration B cable routing . . . . . . . 83
Configuration B with HBA/RAID a apter cable
routing . . . . . . . . . . . . . . . . 88
8-DW GPU Mo el cable routing . . . . . . . . 93
Configuration D cable routing . . . . . . . 95
Configuration E cable routing. . . . . . . . 101
SXM GPU Mo el cable routing . . . . . . . . . 106
Configuration F cable routing. . . . . . . . 108
Configuration G cable routing . . . . . . . 114
Chapter 4. Hardware replacement
procedures . . . . . . . . . . . . . . . 121
Installation Gui elines . . . . . . . . . . . . 121
Safety inspection checklist. . . . . . . . . 122
System reliability gui elines . . . . . . . . 123
Han ling static-sensitive evices . . . . . . 123
Server replacement . . . . . . . . . . . . . 124
Remove the server from rack . . . . . . . . 124
Install the server to rack . . . . . . . . . . 127
Common components . . . . . . . . . . . . 133
Air baffle replacement . . . . . . . . . . 133
CMOS battery (CR2032) replacement . . . . 136
External LCD iagnostics han set
replacement . . . . . . . . . . . . . . 139
Fan cage replacement . . . . . . . . . . 143
Fan replacement . . . . . . . . . . . . 145
Flash power mo ule replacement . . . . . . 147
Front I/O mo ule replacement . . . . . . . 150
Front panel replacement . . . . . . . . . 155
Heat sink Torx T30 nut replacement . . . . . 159
Intrusion switch replacement . . . . . . . . 162
M.2 backplane an M.2 rive replacement . . 166
Memory mo ule replacement . . . . . . . 172
Network a apter replacement . . . . . . . 179
OCP Ethernet a apter replacement . . . . . 181
PCIe riser an PCIe a apter replacement . . . 183
PCIe riser boar replacement . . . . . . . 192
Power istribution boar replacement . . . . 194
Power supply unit replacement . . . . . . . 197
Processor an heat sink replacement . . . . 200
Serial port mo ule replacement . . . . . . . 212
System boar replacement (traine technician
only) . . . . . . . . . . . . . . . . . 214
Top cover replacement . . . . . . . . . . 225
© Copyright Lenovo 2021 i

4-DW GPU Mo el / 8-DW GPU Mo el
components . . . . . . . . . . . . . . . . 227
2.5-/3.5-inch hot-swap rive replacement. . . 228
2.5-/3.5-inch rive backplane replacement . . 232
2.5-/3.5-inch rive cage assembly
replacement . . . . . . . . . . . . . . 236
EDSFF hot-swap rive replacement . . . . . 239
EDSFF rive backplane replacement. . . . . 244
EDSFF rive cage assembly replacement . . . 246
Front I/O expansion boar replacement . . . 248
GPU a apter replacement . . . . . . . . . 250
GPU istribution boar replacement . . . . . 255
GPU a apter link bri ge replacement . . . . 260
SXM GPU Mo el components . . . . . . . . . 263
2.5-inch hot-swap rive replacement . . . . 264
2.5-inch rive cage assembly replacement . . 267
2.5-inch rive backplane mo ule
replacement . . . . . . . . . . . . . . 270
2.5-inch rive backplane replacement . . . . 273
Front I/O expansion boar mo ule
replacement . . . . . . . . . . . . . . 275
Front I/O expansion boar replacement . . . 279
Lenovo Neptune(TM) liqui -to-air (L2A) hybri
cooling mo ule replacement (traine
technician only) . . . . . . . . . . . . . 281
SXM GPU replacement (traine technician
only) . . . . . . . . . . . . . . . . . 296
SXM GPU boar replacement (traine
technician only) . . . . . . . . . . . . . 302
SXM GPU power istribution boar
replacement . . . . . . . . . . . . . . 312
Retimer assembly replacement . . . . . . . 318
Complete the parts replacement . . . . . . . . 328
Chapter 5. Problem
determination . . . . . . . . . . . . . 331
Event logs . . . . . . . . . . . . . . . . . 331
Light Path Diagnostics . . . . . . . . . . . . 333
Front panel . . . . . . . . . . . . . . . 333
External LCD iagnostics han set . . . . . . 334
Power supply LEDs . . . . . . . . . . . 341
System-boar LEDs . . . . . . . . . . . 342
General problem etermination proce ures . . . . 345
Resolving suspecte power problems . . . . 346
Resolving suspecte Ethernet controller
problems . . . . . . . . . . . . . . . 346
Troubleshooting by symptom: . . . . . . . . . 347
Power on an power off problems . . . . . . 347
Memory problems . . . . . . . . . . . . 349
Har isk rive problems . . . . . . . . . 353
Monitor an vi eo problems . . . . . . . . 353
Keyboar , mouse, KVM switch or USB- evice
problems . . . . . . . . . . . . . . . 355
Optional- evice problems . . . . . . . . . 355
Serial- evice problems . . . . . . . . . . 356
Intermittent problems. . . . . . . . . . . 357
Power problems . . . . . . . . . . . . . 358
Network problems . . . . . . . . . . . . 358
Observable problems. . . . . . . . . . . 359
Software problems. . . . . . . . . . . . 361
Appendix A. Hardware
disassembling for recycle . . . . . . . 363
Disassemble the system boar for recycle . . . . 363
Disassemble the retimer assembly for recycle . . . 365
Appendix B. Getting help and
technical assistance . . . . . . . . . . 367
Before you call . . . . . . . . . . . . . . . 367
Collecting service ata . . . . . . . . . . . . 368
Contacting Support . . . . . . . . . . . . . 369
Appendix C. Notices. . . . . . . . . . 371
Tra emarks . . . . . . . . . . . . . . . . 372
Important notes . . . . . . . . . . . . . . . 372
Telecommunication regulatory statement. . . . . 372
Electronic emission notices . . . . . . . . . . 373
Taiwan BSMI RoHS eclaration. . . . . . . 373
Taiwan import an export contact information . . . 373
Index . . . . . . . . . . . . . . . . . . 375
ii ThinkSystem SR670 V2 Maintenance Manual

Safety
Before installing this pro uct, rea the Safety Information.
Antes e instalar este pro uto, leia as Informações e Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhe sforskrifterne, før u installerer ette pro ukt.
Lees voor at u it pro uct installeert eerst e veilighei svoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet koh asta Safety Information.
Avant 'installer ce pro uit, lisez les consignes e sécurité.
Vor er Installation ieses Pro ukts ie Sicherheitshinweise lesen.
Prima i installare questo pro otto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før u installerer ette pro uktet.
Antes e instalar este pro uto, leia as Informações sobre Segurança.
© Copyright Lenovo 2021 iii

Antes e instalar este pro ucto, lea la información e seguri a .
Läs säkerhetsinformationen innan u installerar en här pro ukten.
Safety inspection checklist
Use the information in this section to i entify potentially unsafe con itions with your server. As each machine
was esigne an built, require safety items were installe to protect users an service technicians from
injury.
Notes:
1. The pro uct is not suitable for use at visual isplay workplaces accor ing to §2 of the Workplace
Regulations.
2. The set-up of the server is ma e in the server room only.
CAUTION:
This equipment must be installed or ser iced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Leno o assumes you are qualified in the
ser icing of equipment and trained in recognizing hazards energy le els in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical groun ing of the server is require for operator safety an correct system function.
Proper groun ing of the electrical outlet can be verifie by a certifie electrician.
Use the following checklist to verify that there are no potentially unsafe con itions:
1. Make sure that the power is off an the power cor is isconnecte .
2. Check the power cor .
• Make sure that the thir -wire groun connector is in goo con ition. Use a meter to measure thir -
wire groun continuity for 0.1 ohm or less between the external groun pin an the frame groun .
• Make sure that the power cor is the correct type.
To view the power cor s that are available for the server:
a. Go to:
i ThinkSystem SR670 V2 Maintenance Manual

http:// csc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type an mo el for your server to isplay the configurator page.
. Click Power ➙ Power Cables to see all line cor s.
• Make sure that the insulation is not fraye or worn.
3. Check for any obvious non-Lenovo alterations. Use goo ju gment as to the safety of any non-Lenovo
alterations.
4. Check insi e the server for any obvious unsafe con itions, such as metal filings, contamination, water or
other liqui , or signs of fire or smoke amage.
5. Check for worn, fraye , or pinche cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been remove or tampere
with.
© Copyright Lenovo 2021

i ThinkSystem SR670 V2 Maintenance Manual

Chapter 1. Introduction
The ThinkSystem SR670 V2 server (7Z22, 7Z23) is a 3U rack server esigne for high-volume network
transaction processing. This high-performance, multi-core server is i eally suite for networking
environments that require superior microprocessor performance, input/output (I/O) flexibility, an high
manageability.
Figure 1. ThinkSystem SR670 V2 — 8-DW GP Model
Specifications
The following information is a summary of the features an specifications of the server. Depen ing on the
mo el, some features might not be available, or some specifications might not apply.
The ThinkSystem SR670 V2 mo els are liste as below:
• The 4-DW GPU Mo el
• The 8-DW GPU Mo el
• The SXM GPU Mo el
Refer to the following tables for server general specification an mo el unique specifications.
General specification:
“General specifications” on page 2
4-DW GPU Model and 8-DW GPU Model:
“4-DW GPU Mo el / 8-DW GPU Mo el specification” on page 6
SXM GPU Model
“SXM GPU Mo el specification” on page 8
© Copyright Lenovo 2021 1

General specifications
The following information is a summary of the features an specifications general to the 4-DW GPU Mo el,
the 8-DW GPU Mo el, an the SXM GPU Mo el.
Table 1. General specifications
Specification Description
Dimension 3 U server
• Height: 131 mm (5.16 inches)
• Wi th (with EIA flange): 482 mm (18.97 inches)
• Depth: 953.1 mm (37.52 inches)
Processor Supports multi-core Intel Xeon processors, with integrate memory controller an
Intel Mesh UPI (Ultra Path Interconnect) topology.
• Two processor sockets with minimal requirement of two installe on the system
boar .
• Designe for LGA 4189 sockets
• Scalable up to 40 cores
• Supports 3 UPI links at 11.2 GT/s
• Supports TDP up to 270 watts
For a list of supporte processors, see: https://static.lenovo.com/us/en/serverproven/
in ex.shtml.
Memory • Capacity
– Minimum: 32 GB
– Maximum:
– RDIMM: 2 TB
– Persistent Memory (PMEM) + RDIMM: 3TB
• Memory mo ule types:
– Double- ata-rate 4 (TruDDR4) error correcting co e (ECC) 3200 MT/s
registere DIMM (RDIMM)
– Persistent Memory (PMEM)
• Capacity:
– RDIMM: 16 GB (2Rx8), 32 GB (2Rx4, 2Rx8), an 64 GB (2Rx4)
– PMEM: 128 GB
• Slots: 32 ual inline memory mo ule (DIMM) connectors that support up to:
– 32 DRAM DIMMs
– 16 DRAM DIMMs an 16 PMEMs
For a list of supporte processors, see: https://static.lenovo.com/us/en/serverproven/
in ex.shtml.
M.2 Drive The server support the following M.2 rive capacity:
• 128 GB
• 240 GB
• 480 GB
• 960 GB
For a list of supporte processors, see: https://static.lenovo.com/us/en/serverproven/
in ex.shtml.
2ThinkSystem SR670 V2 Maintenance Manual

Table 1. General specifications (continued)
Specification Description
Integrate functions • Lenovo XClarity Controller (XCC), which provi es service processor control an
monitoring functions, vi eo controller, an remote keyboar , vi eo, mouse, an
remote rive capabilities.
• One system-management RJ-45 connector on the rear to connect to a systems-
management network. This connector is e icate to the Lenovo XClarity
Controller functions an runs at 1 GB spee .
• A group of two or four Ethernet connectors on OCP 3.0 Ethernet a apter
• Up to four USB 3.2 Gen1 ports:
– Three on the rear of the server
– (Optional) One on the front of the server1.
• One internal USB 3.2 Gen1 port
• (Optional) One USB 2.0 port on the front of the server1.
• (Optional) External LCD iagnostics han set connector on the front of the server1.
• Up to two VGA connectors
– One on the rear of the server
– (Optional) One on the front of the server1.
• (Optional) One serial port connector on the rear of the server2.
Notes:
1. Available when the front I/O mo ule is installe in the server.
2. Available when the serial port cable is installe in the server.
Network • OCP 3.0 Ethernet network a apter
Rear button NMI button
RAID a apter Har ware RAID 0, 1, 10, 5, 50
• ThinkSystem 530-8i Internal SAS/SATA RAID
RAID 0, 1, 10, 5, 50, 6, 60
• ThinkSystem 930-8i Internal SAS/SATA RAID w/ 2GB Cache
• ThinkSystem 930-8e External SAS/SATA RAID (0, 1, 10, 5, 50, 6, 60) w/ 4GB
Cache
• ThinkSystem 940-8i Internal SAS/SATA/NVMe RAID (0, 1, 10, 5, 50, 6, 60) w/ 4GB
Cache
• ThinkSystem 940-8i Internal SAS/SATA/NVMe RAID (0, 1, 10, 5, 50, 6, 60) w/ 8GB
Cache
Host bus a apter • ThinkSystem 430-8i Internal SAS/SATA
• ThinkSystem 430-8e External SAS/SATA
System fan • Five 80 mm x 80 mm x 56 mm ual-rotor fans
Minimal configuration for
ebugging • Two processors in socket 1 an 2
• Two DRAM memory mo ules in slots 14 an 30
• Two power supplies in bay 1 an 2
• One boot rive, M.2, 2.5-inch, 3.5-inch, or EDSFF rive, an RAID a apter if
configure . (If OS is nee e by ebugging)
• Five system fans
Chapter 1.Intro uction 3

Table 1. General specifications (continued)
Specification Description
Operating systems Supporte an certifie operating systems:
• Microsoft Win ows Server
• VMware ESXi
• Re Hat Enterprise Linux
• SUSE Linux Enterprise Server
References:
• Complete list of available operating systems: https://lenovopress.com/osig.
• OS eployment instructions: “Deploy the operating system” in Setup Guide.
Acoustical noise emissions The server has the following acoustic noise emissions eclaration:
• Soun power level (LWA )
– I ling:
– SXM: 7.0 Bel
– GPU Typical: 7.0 Bel
– GPU Max: 7.8 Bel
– Operating:
– SXM: 8.3 Bel
– GPU Typical: 8.1 Bel
– GPU Max: 8.6 Bel
• Soun pressure level (LpAm):
– I ling:
– SXM: 54 BA
– GPU Typical: 54 BA
– GPU Max: 64 BA
– Operating:
– SXM: 69 BA
– GPU Typical: 66 BA
– GPU Max: 72 BA
Notes:
• These soun levels were measure in controlle acoustical environments
accor ing to proce ures specifie by ISO7779 an are reporte in accor ance
with ISO 9296.
• The eclare acoustic soun levels are base on the specifie configurations,
which may change epen ing on configuration/con itions.
– SXM configuration: two 270W processors, thirty-two 64 GB DIMMs, eight HDD
or SSD, NVIDIA SXM4 400W, two 1P HDR (CX6 car )
– GPU Typical configuration: two 205W processors, thirty-two 64 GB DIMMs,
Diskless with M.2 or any isk, 4 or 8 NVIDIA A100, INTEL E810-DA2 10/25GbE
SFP28 2-port Ethernet A apter
– GPU Max configuration: two 270W processors, thirty-two 64 GB DIMMs, eight
NVMe, 4 or 8 NVIDIA A40s, Mellanox ConnectX-6 Lx 10/25GbE SFP28 2-port
• Government regulations (such as those prescribe by OSHA or European
Community Directives) may govern noise level exposure in the workplace an may
apply to you an your server installation. The actual soun pressure levels in your
4ThinkSystem SR670 V2 Maintenance Manual

Table 1. General specifications (continued)
Specification Description
installation epen upon a variety of factors, inclu ing the number of racks in the
installation; the size, materials, an configuration of the room; the noise levels
from other equipment; the room ambient temperature, an employee's location in
relation to the equipment. Further, compliance with such government regulations
epen s on a variety of a itional factors, inclu ing the uration of employees'
exposure an whether employees wear hearing protection. Lenovo recommen s
that you consult with qualifie experts in this fiel to etermine whether you are in
compliance with the applicable regulations.
Environment ThinkSystem SR670 V2 complies with ASHRAE Class A2 specifications. System
performance may be impacte when operating temperature is outsi e AHSARE A2
specification.
• Air temperature:
– Operating
– ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
temperature ecreases by 1°C for every 300 m (984 ft) increase in altitu e
above 900 m (2,953 ft).
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/storage: -40°C to 60°C (-40°F to 140°F)
• Maximum altitu e: 3,050 m (10,000 ft)
• Relative Humi ity (non-con ensing):
– Operating
– ASHRAE Class A2: 8% to 80%; maximum ew point: 21°C (70°F)
– Shipment/storage: 8% to 90%
• Particulate contamination
Attention: Airborne particulates an reactive gases acting alone or in
combination with other environmental factors such as humi ity or temperature
might pose a risk to the server. For information about the limits for particulates an
gases, see “Particulate contamination” on page 8.
Note: The server is esigne for stan ar ata center environment an
recommen e to be place in in ustrial ata center.
Chapter 1.Intro uction 5

4-DW GPU Model / 8-DW GPU Model specification
The following information is a summary of the features an specifications of the 4-DW GPU Mo el an the 8-
DW GPU Mo el servers. Depen ing on the mo el, some features might not be available, or some
specifications might not apply.
Table 2. The 4-DW GP Model / 8-DW GP Model specification
Specification Description
Weight • 4-DW GPU Mo el weights approximately 36.7 kg ( 81 lbs.), epen ing on your
configuration.
• 8-DW GPU Mo el weighs approximately 39 kg (86 lbs.), epen ing on your
configuration.
Storage expansion The 4-DW GPU Model supports one of following storage configuration:
• Up to eight hot-swap 2.5-inch SAS/SATA/NVMe rives
• Up to four hot-swap 3.5-inch SATA rives
The 8-DW GPU Model supports the following storage configuration:
• Up to six hot-swap EDSFF rives
Expansion slots • Front I/O expansion board
– Slot 1 to 2 (Front I/O expansion boar )
– PCI Express 4.0 x16, FH/FL
• Front GPU expansion board
– Slot 3 to 6 (4-DW GPU Mo el)
– PCI Express 4.0 x16, ouble-wi e, FH/FL
– Slot 3 to 10 (8-DW GPU Mo el)
– PCIe Express 4.0 x16, ouble-wi e / single-wi e, FH/FL
• Rear PCIe riser 1
– Slot 15 to 16 (Rear PCIe riser 1 with one riser slot cable )
– Slot 15: PCI Express 4.0 x16, FH/HL
– Slot 16: PCI Express 4.0 x16 / x8, FH/HL
• Rear PCIe riser 2
– Slot 20 to 21 (Rear PCIe riser 2 with one riser slot cable )
– Slot 20: PCI Express 4.0 x16, FH/HL
– Slot 21: PCI Express 4.0 x16 / x8, FH/HL
• OCP
– Slot 27 (OCP):
– PCI Express 4.0 x16 / x8 OCP 3.0 Ethernet a apter connector
Note: When Front I/O expansion boar is installe , rear PCIe riser 1 an rear PCIe
riser 2 are not available.
6ThinkSystem SR670 V2 Maintenance Manual

Table 2. The 4-DW GP Model / 8-DW GP Model specification (continued)
Specification Description
Graphics processing unit
(GPU)
The 4-DW GPU Model supports one of following GPU configuration:
• Up to four PCIe x16, ouble-wi e, FH/FL GPUs
The 8-DW GPU Model supports the following GPU configuration:
• Up to eight PCIe x16, ouble-wi e, FH/FL GPUs
• Up to eight PCIe x16, single-wi e, FH/FL GPUs
Note:
The DisplayPort ports on the Nvi ia A40 GPU are not supporte when use in the
ThinkSystem SR670 V2.
Electrical input This server supports up to four units of CFF V4 power supplies with N+N
re un ancy. Following is the list of supporte types:
• 2400-watt Platinum, input power 200-240 VAC
• 1800-watt Platinum, input power 200-240 VAC
Important: Power supplies an re un ant power supplies in the enclosure must be
with the same power rating, wattage or level.
Chapter 1.Intro uction 7

SXM GPU Model specification
The following information is a summary of the features an specifications of the SXM GPU Mo el servers.
Depen ing on the mo el, some features might not be available, or some specifications might not apply.
Table 3. The SXM GP Model specifications
Specification Description
Weight SXM GPU Mo el weights approximately 39.5 kg ( 87 lbs.), epen ing on your
configuration.
Storage expansion Support the following configurations:
• Eight hot-swap 2.5-inch NVMe rives
• Four hot-swap 2.5-inch NVMe rives
Note: OCP Ethernet a apter is available when only four 2.5-inch NVMe rives are
installe in the server.
Expansion slots The SXM GPU Model supports one of following expansion slot configuration:
• Front I/O expansion board
– Slot 1 to 2 (Front I/O expansion boar )
– PCI Express 4.0 x16, FH/HL
• OCP
– Slot 27 (OCP):
– PCI Express 4.0 x16 / x8 OCP 3.0 Ethernet a apter connector
Note: OCP Ethernet a apter is available when only four 2.5-inch NVMe rives are
installe in the server.
Graphics processing unit
(GPU)
One set of HGX A100 4-GPU, 400W/GPU
Electrical input This server supports four units of CFF V4 power supplies with N+N re un ancy.
Following is the list of supporte types:
• 2400-watt Platinum, input power 200-240 VAC
Important: Power supplies an re un ant power supplies in the enclosure must be
with the same power rating, wattage or level.
Particulate contamination
Attention: Airborne particulates (inclu ing metal flakes or particles) an reactive gases acting alone or in
combination with other environmental factors such as humi ity or temperature might pose a risk to the
evice that is escribe in this ocument.
Risks that are pose by the presence of excessive particulate levels or concentrations of harmful gases
inclu e amage that might cause the evice to malfunction or cease functioning altogether. This
specification sets forth limits for particulates an gases that are inten e to avoi such amage. The limits
must not be viewe or use as efinitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives an gaseous
contaminant transfer. In the absence of specific limits that are set forth in this ocument, you must
implement practices that maintain particulate an gas levels that are consistent with the protection of human
health an safety. If Lenovo etermines that the levels of particulates or gases in your environment have
cause amage to the evice, Lenovo may con ition provision of repair or replacement of evices or parts
on implementation of appropriate reme ial measures to mitigate such environmental contamination.
Implementation of such reme ial measures is a customer responsibility.
8ThinkSystem SR670 V2 Maintenance Manual

Table 4. Limits for particulates and gases
Contaminant Limits
Reactive gases Severity level G1 as per ANSI/ISA 71.04-19851:
• The copper reactivity level shall be less than 300 Angstroms per month (Å/month ≈ 0.0039 μg/
cm2-hour weight gain).2
• The silver reactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μg/cm2-hour
weight gain).3
• The reactive monitoring of gaseous corrosivity must be con ucte approximately 5 cm (2 in.) in
front of the rack on the air inlet si e at one-quarter an three-quarter frame height off the floor
or where the air velocity is much higher.
Airborne
particulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For ata centers without airsi e economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration metho s:
• The room air might be continuously filtere with MERV 8 filters.
• Air entering a ata center might be filtere with MERV 11 or preferably MERV 13 filters.
For ata centers with airsi e economizers, the choice of filters to achieve ISO class 8 cleanliness
epen s on the specific con itions present at that ata center.
• The eliquescent relative humi ity of the particulate contamination shoul be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The erivation of the equivalence between the rate of copper corrosion growth in the thickness of the corrosion
pro uct in Å/month an the rate of weight gain assumes that Cu2S an Cu2O grow in equal proportions.
3 The erivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
pro uct in Å/month an the rate of weight gain assumes that Ag2S is the only corrosion pro uct.
4 The eliquescent relative humi ity of particulate contamination is the relative humi ity at which the ust absorbs
enough water to become wet an promote ionic con uction.
5 Surface ebris is ran omly collecte from 10 areas of the ata center on a 1.5 cm iameter isk of sticky
electrically con uctive tape on a metal stub. If examination of the sticky tape in a scanning electron microscope
reveals no zinc whiskers, the ata center is consi ere free of zinc whiskers.
Firmware updates
Several options are available to up ate the firmware for the server.
You can use the tools liste here to up ate the most current firmware for your server an the evices that are
installe in the server.
Best practices relate to up ating firmware is available at the following site:
http://lenovopress.com/LP0656
The latest firmware can be foun at the following site:
https:// atacentersupport.lenovo.com/tw/en/pro ucts/servers/thinksystem/sr670v2/ ownloa s/ river-list/
Chapter 1.Intro uction 9

UpdateXpress System Packs (UXSPs)
Lenovo typically releases firmware in bun les calle Up ateXpress System Packs (UXSPs). To ensure that all
of the firmware up ates are compatible, you shoul up ate all firmware at the same time. If you are up ating
firmware for both the Lenovo XClarity Controller an UEFI, up ate the firmware for Lenovo XClarity Controller
first.
Update method terminology
• In-band update. The installation or up ate is performe using a tool or application within an operating
system that is executing on the server’s core CPU.
• Out-of-band update. The installation or up ate is performe by the Lenovo XClarity Controller collecting
the up ate an then irecting the up ate to the target subsystem or evice. Out-of-ban up ates have no
epen ency on an operating system executing on the core CPU. However, most out-of-ban operations
o require the server to be in the S0 (Working) power state.
• On-Target update. The installation or up ate is initiate from an Operating System executing on the
server’s operating system.
• Off-Target update. The installation or up ate is initiate from a computing evice interacting irectly with
the server’s Lenovo XClarity Controller.
• UpdateXpress System Packs (UXSPs). UXSPs are bun le up ates esigne an teste to provi e the
inter epen ent level of functionality, performance, an compatibility. UXSPs are server machine-type
specific an are built (with firmware an evice river up ates) to support specific Win ows Server, Re
Hat Enterprise Linux (RHEL) an SUSE Linux Enterprise Server (SLES) operating system istributions.
Machine-type-specific firmware-only UXSPs are also available.
Firmware updating tools
See the following table to etermine the best Lenovo tool to use for installing an setting up the firmware:
Tool
Update
Methods
Suppor-
ted
Core
System
Firmware
Updates
I/O
De ices
Firm-
ware
Updates
Graphi-
cal user
interface
Com-
mand
line
interface
Supports
UXSPs
Leno o XClarity Pro isioning Manager
V3
(LXPM V3)
In-ban 2
On-
Target
√ √
Leno o XClarity Pro isioning Manager
V3
(LXPM V3)
In-ban 2
On-
Target
√ √
Leno o XClarity Controller
(XCC)
Out-of-
ban
Off-
Target
√Selecte
I/O
evices
√
10 ThinkSystem SR670 V2 Maintenance Manual

Tool
Update
Methods
Suppor-
ted
Core
System
Firmware
Updates
I/O
De ices
Firm-
ware
Updates
Graphi-
cal user
interface
Com-
mand
line
interface
Supports
UXSPs
Leno o XClarity Essentials OneCLI
(OneCLI)
In-ban
Out-of-
ban
On-
Target
Off-
Target
√All I/O
evices
√ √
Leno o XClarity Essentials
UpdateXpress
(LXCE)
In-ban
Out-of-
ban
On-
Target
Off-
Target
√All I/O
evices
√ √
Leno o XClarity Essentials Bootable
Media Creator3
(BOMC)
In-ban
On-
Target
√All I/O
evices
√
(BOMC
applica-
tion)
√
(BOMC
applica-
tion)
√
Leno o XClarity Administrator
(LXCA)
In-ban 1
Out-of-
ban 2
Off-
Target
√All I/O
evices
√ √
Leno o XClarity Integrator (LXCI) for
VMware Center
Out-of-
ban
Off-
Target
√Selecte
I/O
evices
√
Leno o XClarity Integrator (LXCI) for
Microsoft Windows Admin Center
In-ban
Out-of-
ban
On-
Target
Off-
Target
√All I/O
evices
√ √
Chapter 1.Intro uction 11

Tool
Update
Methods
Suppor-
ted
Core
System
Firmware
Updates
I/O
De ices
Firm-
ware
Updates
Graphi-
cal user
interface
Com-
mand
line
interface
Supports
UXSPs
Leno o XClarity Integrator (LXCI) for
Microsoft System Center Configuration
Manager
In-ban
On-
Target
√All I/O
evices
√ √
Notes:
1. For I/O firmware up ates.
2. For BMC an UEFI firmware up ates.
• Leno o XClarity Pro isioning Manager V3
From Lenovo XClarity Provisioning Manager V3, you can up ate the Lenovo XClarity Controller firmware,
the UEFI firmware, an the Lenovo XClarity Provisioning Manager V3 software.
Note: By efault, the Lenovo XClarity Provisioning Manager V3 Graphical User Interface is isplaye
when you press F1. If you have change that efault to be the text-base system setup, you can bring up
the Graphical User Interface from the text-base system setup interface.
A itional information about using Lenovo XClarity Provisioning Manager V3 to up ate firmware is
available at:
https://sysmgt.lenovofiles.com/help/topic/LXPMv3/platform_up ate.html
• Leno o XClarity Controller
If you nee to install a specific up ate, you can use the Lenovo XClarity Controller interface for a specific
server.
Notes:
– To perform an in-ban up ate through Win ows or Linux, the operating system river must be installe
an the Ethernet-over-USB (sometimes calle LAN over USB) interface must be enable .
A itional information about configuring Ethernet over USB is available at:
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.systems.management.xcc. oc/NN1ia_c_
configuringUSB.html
– If you up ate firmware through the Lenovo XClarity Controller, make sure that you have ownloa e
an installe the latest evice rivers for the operating system that is running on the server.
Specific etails about up ating firmware using Lenovo XClarity Controller are available at:
http://sysmgt.lenovofiles.com/help/topic/com.lenovo.systems.management.xcc. oc/NN1ia_c_
manageserverfirmware.html
• Leno o XClarity Essentials OneCLI
Lenovo XClarity Essentials OneCLI is a collection of comman line applications that can be use to
manage Lenovo servers.Its up ate application can be use to up ate firmware an evice rivers for your
servers. The up ate can be performe within the host operating system of the server (in-ban ) or remotely
through the BMC of the server (out-of-ban ).
Specific etails about up ating firmware using Lenovo XClarity Essentials OneCLI is available at:
http://sysmgt.lenovofiles.com/help/topic/toolsctr_cli_lenovo/onecli_c_up ate.html
• Leno o XClarity Essentials UpdateXpress
12 ThinkSystem SR670 V2 Maintenance Manual