Lex System 3I370DW User manual

3I370DW
Intel® Coffee Lake-S Core™ I processor + Intel Q370,
DDR4 LAN / DP / HDMI / USB / PCIe / M.2
All in One
9 / 8th gen. Intel Coffee Lake-S Core™ I CPU
HDMI, DP, eDP, PCIe, PCIe mini card, M.2,
Multi-LAN, COM, Audio, SATA, USB
Wide Range DC-input
NO. 3I370DW
Release date: May 26th. 2020
RISK OF EXPLOSION IF BATTERY IS REPLACED
BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING
TO THE INSTRUCTIONS
CAUTION

i
3I370DW
Warning!...................................................................................................................................
Hardware Notice Guide ......................................................................................................
CHAPTER 1 GENERAL INFORMATION .................................................................................
1-1 MAJOR FEATURE................................................................................................................
1-2 SPECIFICATION ..................................................................................................................
1-3 INSTALLING THE CPU / NORTH BRIDGE CHIP HEATSINK. (SOCKET VERSION) .........
1-4 INSTALLING THE SO-DIMM ................................................................................................
1-4-1 REMOVING THE SO-DIMM .............................................................................................
1-5 INSTALLING THE MINI PCI-e CARD (FULL SIZE) ..............................................................
1-6 DIRECTIONS FOR INSTALLING THE M.2B KEY MINI CARD .............................................
CHAPTER 2 HARDWARE INSTALLATION ............................................................................
2-1 DIMENSION-3I370DW .........................................................................................................
2-2 LAYOUT-3I370DW-FUNCTION MAP-TOP ..........................................................................
2-2-1 LAYOUT-3I370DW-FUNCTION MAP-BOT .......................................................................
2-3 FUNCTION MAP-3I370DW ..................................................................................................
2-4 CONNECTOR MAP-3I370DW-TOP .....................................................................................
2-4-1 CONNECTOR MAP-3I370DW-BOT ..................................................................................
2-5 DIAGRAM-3I370DW-TOP ....................................................................................................
2-5-1 DIAGRAM-3I370DW-BOT .................................................................................................
2-6 LIST OF JUMPERS ..............................................................................................................
2-7 JUMPER SETTING DESCRIPTION .....................................................................................
2-8 JSB1: CMOS DATA CLEAR .................................................................................................
2-9 JSB2: ME DATA CLEAR .......................................................................................................
2-10 JVL1: eDP PANEL POWER SELECT .................................................................................
CHAPTER 3 CONNECTION ....................................................................................................
3-1 LIST OF CONNECTORS.......................................................................................................
3-2 CBT1: CMOS BATTERY 1x2 PIN (1.25MM) WAFER ..........................................................
3-3 CA1: LINE-OUT / LINE-IN / MIC-IN 2x5 PIN (2.0MM) WAFER ............................................
3-4 CC1 / CC2 COM PORT1 / 2 2x5 PIN (2.0MM) WAFER ......................................................
3-5 CCIO1 / CCIO2 / CCIO3 / CCIO4 COM PORT3 / PORT4 / PORT5 / PORT6 AND DI/DO
2x5 PIN (2.0MM) WAFER ...........................................................................................................
3-5-1 FOR COM 3 / 4 / 5 / 6 ........................................................................................................
3-5-2 FOR DI/DO ........................................................................................................................
3-5-2-1 IO DEVICE: F81966 LPC DIO UNDER WINDOWS .......................................................
3-6 CDH1 DISPLAY PORT AND HDMI CONNECTOR ..............................................................
3-7 CFP1 FRONT PANEL CONNECTOR 2x5 PIN (2.0MM) WAFER ........................................
3-8 LAN ......................................................................................................................................
3-9 CLPC1: FOR LPC SIGNAL 2x5 PIN WAFER (2.0MM) ........................................................
Contents
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3-10 CO1: I2C BUS 4 PIN (1.25MM) WAFER ............................................................................
3-11 CPI1: MOTHERBOARD DC POWER INPUT (ATX 2x3 PIN 2.54MM WAFER) .................
3-12 CPO1: +12V / +5V DC VOLTAGE OUTPUT WAFER CONNECTOR (BLACK) ..................
3-13 CPS1: EXTERNAL POWER-ON SYNC CONTROL ...........................................................
3-14 USB 3.0 AND USB 2.0 ........................................................................................................
3-15 EDP1: eDP INTERFACE (2x10 pin 1.25MM WAFER) .......................................................
3-16 SATA2 / 3: SATA PORT 1x7 PIN CONNECTOR .................................................................
3-17 SIM1: NANO PUSH-PUSH SIM SOCKET ..........................................................................
3-18 SODIMM1 / 2 SOCKET ......................................................................................................
3-19 MPCE1 PCI EXPRESS MINI CARD ...................................................................................
3-20 NGFF1: B KEY SIZE ...........................................................................................................
3-21 CONNECTOR WAFER OF COMPATIBLE BRAND AND PART NUMBER LIST ................
CHAPTER 4 INTRODUCTION OF BIOS ................................................................................
4-1 ENTER SETUP ....................................................................................................................
4-2 BIOS MENU SCREEN & FUNCTION KEYS ........................................................................
4-3 GENERAL HELP ..................................................................................................................
4-4 MENU BARS ........................................................................................................................
4-5 MAIN ....................................................................................................................................
4-6 ADVANCED ..........................................................................................................................
4-6-1 PCH-FW CONFIGURATION ............................................................................................
4-6-2 TRUSTED COMPUTING ..................................................................................................
4-6-3 F81966 SUPER IO CONFIGURATION .............................................................................
4-6-3-1 SERIAL PORT 1 CONFIGURATION ..............................................................................
4-6-3-2 SERIAL PORT 2 CONFIGURATION ..............................................................................
4-6-3-3 SERIAL PORT 3 CONFIGURATION ..............................................................................
4-6-3-4 SERIAL PORT 4 CONFIGURATION ..............................................................................
4-6-3-5 POWER FAILURE ..........................................................................................................
4-6-4 HARDWARE MONITOR ....................................................................................................
4-6-5 INTEL TXT INFORMATION ...............................................................................................
4-6-6 USB CONFIGURATION ....................................................................................................
4-6-7 NETWORK STACK CONFIGURATION ............................................................................
4-6-8 NVMe CONFIGURATION .................................................................................................
4-7 CHIPSET ..............................................................................................................................
4-7-1 SYSTEM AGENT (SA) CONFIGURATION ........................................................................
4-7-1-1 GRAPHICS CONFIGURATION .....................................................................................
4-7-1-2 PEG PORT CONFIGURATION ......................................................................................
4-7-2 PCH-IO CONFIGURATION ...............................................................................................
4-7-2-1 PCI EXPRESS CONFIGURATION ................................................................................
4-7-2-2 SATA AND RST CONFIGURATION ...............................................................................
4-8 SECURITY ...........................................................................................................................
4-9 BOOT ...................................................................................................................................

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4-10 SAVE & EXIT ......................................................................................................................
4-11 HOW TO UPDATE INSYDE BIOS ......................................................................................
APPENDIX B: RESOLUTION LIST ............................................................................................
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Copyright
This manual is copyrighted and all rights are reserved. It does not allow any non
authorization in copied, photocopied, translated or reproduced to any electronic or
machine readable form in whole or in part without prior written consent from the
manufacturer.
In general, the manufacturer will not be liable for any direct, indirect, special, incidental
or consequential damages arising from the use of inability to use the product or
documentation, even if advised of the possibility of such damages.
The manufacturer keeps the rights in the subject to change the contents of this
manual without prior notices in order to improve the function design, performance,
quality, and reliability. The author assumes no responsibility for any errors or omissions,
which may appear in this manual, nor does it make a commitment to update the
information contained herein.
Trademarks
Intel is a registered trademark of Intel Corporation.
AMI is a registered trademark of AMI
All other trademarks, products and or product's name mentioned here are for
identifi cation purposes only, and may be trademarks and/or registered trademarks
of their respective companies or owners.
© Copyright 2020
All Rights Reserved.
User Manual edition 0.1, May 26th. 2020

1
Warning !
1. Battery
Batteries on board are consumables.
The life time of them are not guaranteed.
2. Fanless solution with HDD
The specifi cation & limitation of HDD should be considered carefully when
the fanless solution is implemented.
3. We will not give further notifi cation in case of changes of
product information and manual.
4. SATA interface does not support Hot SWAP function.
5. There might be a 20% inaccuracy of WDT at room temperature.
6. Please make sure the voltage specifi cation meets the requirement
of equipment before plugging in.
8. Caution! Please notice that the heat dissipation problem could cause the MB
system unstable. Please deal with heat dissipation properly when
buying single MB set.
9. Please avoid approaching the heat sink area to prevent users from
being scalded with fanless products.
12. It is important to install a system fan toward the CPU to decrease
the possibility of overheating / system hanging up issues,
or customer is suggested to have a fi ne cooling system to dissipate heat
from CPU.
11. DO NOT apply any other material which may reduce cooling
performance onto the thermal pad.
10. If users repair, modify or destroy any component of product unauthorizedly,
We will not take responsibility or provide warranty anymore.
7. There are two types of SSD, commercial grade and industrial grade, which
provide diff erent read / write speed performance, operation temperature and
life cycle. Please contact sales for further information before making orders.

2
Hardware Notice Guide
1. Before linking power supply with the motherboard, please attach DC-in adapter to
the motherboard fi rst. Then plug the adapter power to AC outlet.
Always shut down the computer normally before you move the system unit or
remove the power supply from the motherboard. Please unplug the DC-in adapter fi rst
and then unplug the adapter from the AC outlet.
Please refer photo 1 as standard procedures.
2. In case of using DIRECT DC-in (without adapter), please check the allowed range
for voltage & current of cables. And make sure you have the safety protection for
outer issues such as short / broken circuit, overvoltage, surge, lightning strike.
3. In case of using DC-out to an external device, please make sure its voltage and
current comply with the motherboard specifi cation.
4. The total power consumption is determined by various conditions
(CPU / motherboard type, device, application, etc.). Be cautious to the power cable
you use for the system, one with UL standard will be highly recommended.
5. It’s highly possible to burn out the CPU if you change/ modify any parts of
the CPU cooler.
6. Please wear wrist strap and attach it to a metal part of the system unit
before handling a component. You can also touch an object which is
ground connected or attached with metal surface if you don't have wrist strap.
7. Please be careful to handle & don't touch the sharp-pointed components on
the bottom of PCBA.
8. Remove or change any components form the motherboard will VOID the warranty of
the motherboard.
9. Before you install / remove any components or even make any jumper setting
on the motherboard, please make sure to disconnect the power supply fi rst.
(follow the aforementioned instruction guide)
10. "POWERON after PWR-Fail" function must be used carefully as below:
When the DC power adaptor runs out of power, unplug it from the DC current;
Once power returns, plug it back after 5 seconds.
If there is a power outage, unplug it from the AC current, once power returns,
plug it back after 30 seconds. Otherwise it will cause system locked or made
a severe damage.
Remark 1:
Always insert / unplug the DC-in horizontally & directly to / from the motherboard.
DO NOT twist, it is designed to fi t snugly.
Moreover, erratic pull / push action might cause an unpredictable damage to the
component & system unit.
*

3
2
1
3
1
2
3
Photo 1 Insert
Unplug

4
Chapter-1
General Information
The 3I370DW with latest Intel 8th Gen Coffee Lake-S Core i CPU and Pentium® /
Celeron® Processor All-In-One board in the LGA1151 package with Intel® Q370 Express
chipset. The 3I370DW supports high-speed data transfer interfaces such as PCIe3.0, USB
3.1, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 memory up to 32GB in two
SO-DIMM slots, as well as graphics interface for HDMI and DisplayPort displays.
High-performance and power-efficient communication platform, the embedded
motherboard of 3I370DW is specially designed for IoT, industrial, digital signage, medial,
POS, retail and factory automation applications. 3I370DW with a wide variety of expansion
options including PCIe(x16), PCIe(x8), PCIe(x4), PCIe(x1), or 2 PCIe(x8), 2 PCIe(x4),
2 PCIe(x1), selectable by raiser cards. The platform comes with Intel Gigabit Ethernet
controllers and supports Wake-On LAN, vPro with TPM 2.0 and the PXE function in BIOS
for Intel LAN chipset, it is perfect control board for networking devices.
The 3I370DW SBC equipped with a variety of interfaces: 5 x LAN, 4 x RS232 / RS422 /
485 serial ports, 4 x USB3.1, 4 x USB2.0, DP, HDMI & eDP) and expansion slots such
as PCIe / mPCIe / M.2 slots for I/O modules (Digital I/O, WiFi, 3G / 4G, LoRA, Bluetooth)
Connection options, is ideal solution to integrate with diagnostic test tools and control
equipment, with excellent fl exibility to meet any needs.
In addition to industrial grade components, TWISTER 3I370DW & TINO 3I370DW are with
excellent thermal dispatched design, enable to operate smoothly with automation, machine
vision, industrial communication, military and intelligent transportation applications in
various harsh environments such as mountains, cold polar climate, mines, oil fi elds and
deserts.

5
1. The Desktop Coff ee Lake-Platform processor includes Integrated Display Engine,
GPU and Integrated Memory Controller. The processor is designed be off ered in a
LGA1151 package.
2. Intel Q370 Chipset Family Platform Controller Hub (PCH)
3. Supports Two Channels of DDR4 SO-DIMM SDRAM, Max. 32GB, data transfer rates
of 2400MT/s and 2666 MT/s
4. Intel Desktop Coff ee Lake-Platform Processor Integrated Graphics.
GEN 9 architecture supports up to 72 Execution Units (EUs), depending on the
processor SKU.
5. Integrated Gigabit LAN Controller with Intel I219LM Gigabit Ethernet PHY supports
vPro. total support 5 x 10 / 100 / 1000 Mbps Intel LAN ports
6. Support DP, HDMI, eDP1.4 2 lanes on Board.
7. Support 4 x RS232 auto switch to RS485 / RS422 by BIOS,
(up to 6 series ports for option)
8. 4 x type A USB3.1 external and 4 x USB 2.0 internal
9. ALC886 HD Audio Specifi cation 1.0 Two channels sound.
10. Two SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
11. Support extended 1 x Mini PCIe card for PCIe x 1, mSATA and USB3.0 interface
12. One M.2 B-Key 3042 for PCIe x 2, mSATA & USB3.0 device. Support PCIe NVMe
storage. There are 1 x SIM Card Socket for 3G / 4G LTE module.
13. Hardware digital Input & Output, 8 x DI / 8 x DO, (up to 16DI / 16DO for option),
Hardware Watch Dog Timer, 0~255 sec programmable
14. 1 PCIe x 16 Golden Finger supports 1 PCIe x 1, 4, 8, 16 with Riser Cards
15. Support TPM 2.0
1-1 Major Feature

6
1. CPU: Desktop Coff ee Lake Platform processor. The processor is designed be
off ered in a LGA1151 package.
2. Memory: Two SO-DIMM slots for DDR4 SDRAM, Max. 32GB, data transfer rates of
2400MT/s and 2666 MT/s
3. Graphics: Intel 9th generation (Gen 9) LP graphics and media encode / decode
engine supports OpenGL x 4.5, OpenCL x 2.1, Direct3D x 2015, Direct3D 11.2,
Direct2D eDP 1.4 2 Lanes up to 1920 x 1080, DP 1.2 4096 x 2160, HDMI 1.4 up
to 3840 x 2160
4. SATA: Integrated Serial ATA Host Controller Up to 2 SATA port, SATA Gen3 Data
transfer rates up to 6.0 Gb/s (600 MB/s).
5. LAN: LAN1 Intel I219LM Gigabit Ethernet PHY. LAN2~5 Intel I210-IT LAN chipset or
Intel I211-AT LAN chipset (Option) with 10 / 100 / 1000 Mbps.
6. I/O Chip: Chipsets for 4 ports RS232 / 422 / 485 (6 ports for option)
7. USB: 4 type A USB 3.1 connector onboard and 4 USB 2.0 (internal)
8. Sound: Support line in, line out and MIC in
9. eDP: Support eDP 1.4 2 Lanes up to 1920 x 1080
10. WDT/DIO: Hardware digital Input & Output, 8 x DI / 8 x DO (16DI / 16DO for option) /
Hardware Watch Dog Timer, 0~255 sec programmable
11. Expansion interface: one full-size PCIe Mini card for PCIe x 1, mSATA and USB3.0
interface, 1 M.2 B-key for PCIe x 2, mSATA & USB 3.0 devices with 1 SIM socket.
12. Golden Finger: PCIe x 16 Golden Finger supports 1 PCIe x 1, 4, 8,16 with Riser Cards
13. TPM: Infi neon SLB 9665 TT 2.0 Trusted Platform Module
14. BIOS: AMI UEFI BIOS
15. Dimension: 130 x 155 mm
16. Power: DC IN +12V~36V
1-2 Specifi cation

7
1-3 Installing the CPU / North Bridge Chip Heatsink.
(Socket Version)
1. Put the "CPU Under Bracket" with the CPU
location at the back side of motherboard
2. Open of CPU pin anti- crash cover
3. Install the CPU 4. Screw the CPU mounting bracket via
four M2.5*4 screws
5. Apply thermal grease to the top of the CPU 6. Insert the CPU Heat Sink above the CPU and
tighten it with the diagonal screws.

8
1-4 Installing the SO-DIMM
1. Align the SO-DIMM with the connector at a 45 degree angle.
2. Press the SO-DIMM into the connector until you hear a click.

9
Notices:
1.The connectors are designed to ensure the correct insertion. If you feel resistance,
check t h e connectors & golden fi nger direction, and realign the card.
2. Make sure the retaining clips (on two sides of the slot) lock onto the notches of
the card fi rmly.

10
1-4-1 Removing the SO-DIMM
1. Release the SO-DIMM by pulling outward the two retaining clips and
the SO-DIMM pops up slightly.
2. Lift the SO-DIMM out of its connector carefully.

11
1-5 Installing the Mini PCI-e Card (Full Size)
1. Unscrew the screw on the board
3. Gently push down the Mini Card and screw the screw back.
2. Plug in the Mini Card in a 45 angle

12
1. Unscrew the screw on the board
3. Gently push down the Mini Card and screw the screw back.
2. Plug in the Mini Card in a 45 angle
1-6 Directions for installing the M.2B Key Mini Card

13
2-1 Dimension-3I370DW
Chapter-2

14
2-2 Layout-3I170DW-Function Map
TOP
COM1
COM2
COM3 or 4DI/4DO
COM4 or 4DI/4DO
COM5 or 4DI/4DO
COM6 or 4DI/4DO
SATA
USB 2.0
CPU FAN
+12V & +5V Output
HDD LED,
PWR LED,
LAN LED,
Power LED,
Reset Button
LPC
Full Size, mini card
(PCIe/mSATA/
USB 3.0/2.0)
M.2 B KEY 3042
(PCIe x2/mSATA/
USB 3.0/2.0)
Line Out
Line In
Mic In
DDR4 SODIM CH-B DDR4 SODIM CH-A
Power Sync
LAN5
LAN4
LAN3
LAN2
LAN1
UP:Display Port
Down:HDMI
DC-IN
+12~36V
eDP Panel
Power Jumper
eDP

15
2-2-1 Layout-3I170DW-Function Map
BOT
Nano SIM
USB 3.0
USB 3.0
USB 3.0
USB 3.0