LG A175 User manual

Internal Use Only
Service Manual
LG-A175
Date: March, 2011 / Issue 1.0

- 2 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION..................................................................... 3
1.1 Purpose ........................................................................................................3
1.2 Regulatory Information.........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE...................................................................... 7
2.1 H/W Features..............................................................................................7
2.2 Technical Specification...........................................................................9
3. TECHNICAL BRIEF................................................................ 14
3.1 Digital Main Processor......................................................................... 14
3.2 Power Management ............................................................................ 18
3.3 FEM with integrated Power Amplifier Module
(SKY77542/SKY77543, U401) ........................................................... 30
3.4 Crystal(26 MHz, X101) ......................................................................... 32
3.5 RF Subsystem of PMB8810 (U101) ................................................. 32
3.6 MEMORY(M36W0R5040U62S, U102)............................................ 36
3.7 SIM Card Interface................................................................................. 38
3.8 LCD Interface........................................................................................... 39
3.9 Battery Charger Interface................................................................... 41
3.10 Keypad Interface................................................................................. 42
3.11 Audio Front-End.................................................................................. 44
3.12 KEY BACLKLIGHT LED Interface .................................................... 50
3.13 Vibrator Interface................................................................................ 51
3.14 HALL IC.................................................................................................... 52
4. TROUBLE SHOOTING .......................................................... 53
4.1 RF Component ....................................................................................... 53
4.2 RX Trouble ................................................................................................ 54
4.3 TX Trouble................................................................................................. 58
4.4 Power On Trouble.................................................................................. 62
4.5 Charging Trouble................................................................................... 65
4.6 Vibrator Trouble ..................................................................................... 67
4.7 LCD Trouble ............................................................................................. 69
4.8 Speaker Trouble ..................................................................................... 73
4.9 Earphone Trouble.................................................................................. 76
4.10 Microphone Trouble.......................................................................... 79
4.11 SIM Card Interface Trouble.............................................................. 81
4.12 KEY backlight Trouble....................................................................... 83
4.13 FM Radio Trouble................................................................................ 85
5. DOWNLOAD......................................................................... 88
6. BLOCK DIAGRAM...............................................................101
7. CIRCUIT DIAGRAM ............................................................102
8. BGA Pin Map......................................................................107
8.1 BGA PIN MAP (Top View)..................................................................107
9. PCB LAYOUT.......................................................................109
10. ENGINEERING MODE ......................................................113
11. AUTO CALIBRATION........................................................114
11.1 Overview..............................................................................................114
11.2 Configuration of Tachyon..............................................................114
11.3 Description of Basic File ................................................................115
11.4 Procedure.............................................................................................116
11.5 AGC.........................................................................................................118
11.6 APC .........................................................................................................118
11.7 ADC.........................................................................................................118
11.8 Target Power.......................................................................................119
12. EXPLODED VIEW & REPLACEMENT PART LIST .............120
12.1 EXPLODED VIEW................................................................................120
12.2 Replacement Parts ...........................................................................121
12.3 Accessory .............................................................................................135

- 3 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 4/110
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

- 4 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 5/110
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION

- 5 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 6/110
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

- 6 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 7/110
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

2. PERFORMANCE
- 7 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 8/110
2.1 H/W Features
Item Feature Comment
Standard Battery Lithium-ion r, 3.7V 950mAh
Stand by TIME 1500hr @ Paging Period 9, RSSI 85dBm
Talk time 11hr @ GSM Tx Level 10
Charging time Approx. 4 hours
RX Sensitivity GSM, EGSM: -108dBm, DCS: -108dBm
TX output power GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V Small
Display MAIN : 1.52” TFT 128 Ý128 pixel 262K Color
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Left/Right Navigation Key
Send Key, PWR Key ,Soft Key(Left/Right)
ANT Internal
EAR Phone Jack Yes
PC Synchronization Not Support
Speech coding EFR/FR/HR
Data and Fax Not Support
2. SYSTEM SPECIFICATION
GPRS compatibility Not Support
Vibrator Yes
Loud Speaker Yes
Voice Recoding Not Support
Microphone Yes
2. PERFORMANCE

2. PERFORMANCE
- 8 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 9/110
2. SYSTEM SPECIFICATION
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI 32 poly
Item Feature Comment
Camera Not Support
FM Radio 87~108MHz supported

2. PERFORMANCE
- 9 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 10/110
2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850/EGSM
TX: 880 ~ 915MHz
RX: 925 ~ 960 MHz
DCS/PCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ധ3dB 14 15dBm ധ3dB
7 29dBm ധ3dB 15 13dBm ധ3dB
8 27dBm ധ3dB 16 11dBm ധ5dB
9 25dBm ധ3dB 17 9dBm ധ5dB
10 23dBm ധ3dB 18 7dBm ധ5dB
11 21dBm ധ3dB 19 5dBm ധ5dB
12 19dBm ധ3dB
GSM850/EGSM
5 33dBm ധ2dB 13 17dBm ധ3dB
Level Power Toler. Level Power Toler.
1 28dBm ധ3dB 9 12dBm ധ4dB
2 26dBm ധ3dB 10 10dBm ധ4dB
3 24dBm ധ3dB 11 8dBm ധ4dB
4 22dBm ധ3dB 12 6dBm ധ4dB
5 20dBm ധ3dB 13 4dBm ധ4dB
6 18dBm ധ3dB 14 2dBm ധ5dB
7 16dBm ധ3dB 15 0dBm ധ5dB
DCS/PCS
0 30dBm ധ2dB 8 14dBm ധ3dB
2. SYSTEM SPECIFICATION

2. PERFORMANCE
- 10 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 11/110
5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification
2. SYSTEM SPECIFICATION

2. PERFORMANCE
- 11 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 12/110
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 14·4 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2·3 dB
DCS/PCS
2. SYSTEM SPECIFICATION

2. PERFORMANCE
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 13/110
Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR Over 17 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
16 System frequency
(13 MHz) tolerance ˺2.5 ppm
17 32.768KHz tolerance ˺30 ppm
18 Ringer Volume
At least 65 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
2. SYSTEM SPECIFICATION
19 Charge Current Fast Charge : Typ. 410 mA
Total Charging Time : < 3.5 hours

2. PERFORMANCE
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 14/110
2. SYSTEM SPECIFICATION
Item Description Specification
2 -> 1
Bar Number Power
4 -> 2 -101·2
-93 ·2
20 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2 3.74 ·0.05 V
21 Battery Indicator
22 Low Voltage Warning
( Blinking Bar)
1 time per 1 minute (Receiver)
1 time per 3 minutes(Speaker)
23 Forced shut down
Voltage 3.3 ·0.05V
24 Battery Type
Lithium-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
25 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 4.8 V, 400 mA
> 3.75·0.05 V
3.63 ·0.05 V
3.57 ·0.05 V
5 -> 4
-106 ·2
1 -> 0
-104 ·2
-92 ·2
5

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 15/110
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 110 Hardware Block Diagram

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ 16/110
3. TECHNICAL BRIEF
3.1.1 General
Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– WFWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.1.3 Baseband
• High performance fixed-point TEAKlite DSP
• C166S-V2 high performance microcontroller with a 16KB Instruction Cache and a Data cache Buffer.
• FM Stereo Radio Receiver with RDS
• There are several Interfaces:
– I2S interface for DAI connections (for Tape Approval) and external Audio component connection.
– High Speed SSC Interface for connection of companion chips (like Serial SD Cards)
– High Speed SSC Interface dedicated to Display control
– USIM Interface with support of Protocol T=1 and Dual USIM support.
– Keypad Interface (6x4 or 5x5 keys)
– External Memory Controller (EBU) for external RAM/NOR FLASH/Busrt Flash/NAND Flash/Serial Flash
(SPI/SQI) and Parallel Display connection
– Asynchronous serial interface.
– Asynchronous serial interface for WLAN/BT/GPS control (incl. IrDA support capability) .
– JTAG Interface, OCDS, Multi-Core Debug and Real Time Trace facilities.
– Black & white and 128x160 - 16bit color displays are supported
– PWM source to drive vibrator
– Keypad and display backlight supported.
– HASH Unit support for hashing.

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
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3. TECHNICAL BRIEF
Crystal Oscillator
• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic
Mixed Signal and Power Management Unit
• Embedded stepdown converter (1.8V)
• DC/DC boost for voltages up to 15 V for driving White or Blue LEDs
• 8-ȳloud speaker driver (700 mW)
• 16-ȳearpiece driver
• 32-ȳheadset driver
• Measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient
temperature)
• Accessory Detection
• PCB ID detection as part of measurement interface.
• Differential microphone input
• System start up circuitry
• Charger circuitry for NiCd, NiMh and LiIon cells with integrated Control Current/Voltage Charging.
• Integrated regulators for direct connection to battery.
C166S-V2 Buses
The C166S-V2 is connected to four buses:
1. IMB (Internal Program) bus (64b - 0 cycle instruction bus))
2. DPMI (Data-Program) Bus (16b - 0 cycle data bus)
3. X-Bus (16b - 3 cycle peripheral bus)
4. PD-Bus (16b 0 cycle peripheral bus)
Bus Interconnections
The interconnection between the X-Bus and the TEAKlite Bus uses:
• Multicore Synchronization
• Shared Memory.

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
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3. TECHNICAL BRIEF
3.1.4 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 ɆV EMF
– Support for US & EU bands
– Stereo recording
3.1.5 Display
• Type
– 128*128, QQVGA, 262k TFT color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling,
antialiased bitmap fonts)

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
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3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated
in the integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical
standard phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 110
3. TECHNICAL BRIEF
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8 V supply rail. This voltage rail is used to supply main parts of the
system, like the digital core of the chip (via LDO LCORE), parts of the mixed signal macro, parts of the RF
macro and the external memory if a 1.8V memory is used.

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
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3. TECHNICAL BRIEF
Linear voltage Regulators (low dropout) LDOs
The LDOs are used to generate the supply for the different supply domains not directly supplied out of
the DC/DC converter.
LCORE
The LCORE LDO provides the VCORE supply used for most of the digital parts of the chip
LPMU
The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts
like ADC, sense amplifier etc.
LAUX
The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending
on the phone application, e.g. for the display or Camera.
LSIM
The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard
SIM cards.
Other LDOs
The RF module has implemented several LDO’s for different RF Power domain.
The mixed signal module has some LDO’s for the audio driver and microphone supply.

3. TECHNICAL BRIEF
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Only for training and service purposes
LGE Internal Use Only
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
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3. TECHNICAL BRIEF
Table. 3-2-1 Power supply Domains (without RF)