LG G5200 User manual

GSM Phone
SERVICE MANUAL
MODEL : G5200/W5200
P/N : MMBD0015801 JUNE, 2002
SERVICE MANUAL MODEL : G5200 / W5200

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1. INTRODUCTION.......................................4
1.1 Purpose ..................................................4
1.2 Regulatory Information .......................... 4
A. Security ..............................................4
B. Incidence of Harm ..............................4
C. Changes in Service ............................4
D. Maintenance Limitations ....................4
E. Notice of Radiated Emissions.............5
F. Pictures ..............................................5
G. Interference and Attenuation .............5
H. Electrostatic Sensitive Devices ..........5
1.3 Abbreviations ......................................... 6
2. PERFORMANCE .....................................8
2.1 H/W Feature ...........................................8
2.2 Technical Specification .......................... 9
3. TECHNICAL BRIEF ............................ 13
3.1 General Descreption ............................ 13
3.2 Receiver ............................................... 13
A. RF front end .....................................14
B. Demodulator and
baseband processing ...................... 14
C. DC Offset Compensation ................ 14
3.3 Transmitter Part ................................... 15
A. IF Modulator .................................... 15
B. OPLL ............................................... 16
C. Synthesizer ......................................16
D. TX APC Part ....................................17
E. Power Amplifier ................................17
3.4 13 MHz Clock ...................................... 18
3.5 Power Supplies and Control Signals ....18
3.6 Digital Main Processor ......................... 19
3.7 Analog Main Processor ........................ 24
3.8 Power Management ..............................26
3.9 Memories ..............................................28
3.10 Display and Interfaces ........................28
3.11 Keypad Switches and Scanning ..........29
3.12 Microphone .........................................30
3.13 Earpiece ............................................. 31
3.14 Hands-free Interface .......................... 32
3.15 Headset Jack Interface .......................32
3.16 Key Back-light Illumination ..................32
3.17 LCD Back-light Illumination ................ 33
3.18 Multi-Color LED Illumination .............. 33
3.19 Speaker & MIDI IC ............................. 34
4. TROUBLE SHOOTING ..................... 35
4.1 RF Components ................................. 35
4.2 Tx Trouble .......................................... 44
4.3 Power on Trouble ............................... 60
4.4 Charging Trouble ............................... 62
4.5 LCD Trouble ....................................... 64
4.6 Receiver Trouble ................................ 66
4.7 Speaker Trouble ................................. 69
4.8 Mic Trouble ..........................................72
4.9 Vibrator Trouble ................................. 75
4.10 Backlight Trouble ............................. 77
4.11 Folder on/off Trouble ........................ 79
4.12 SIM Detect Trouble .......................... 81
4.13 Earphone Trouble ............................ 83
4.14 HFK Trouble ..................................... 87
5. ASSEMBLY INSTRUCTION ............ 95
5.1 Disassembly ....................................... 95
6. DOWNLOAD ....................................... 102
6.1 Download Setup ............................... 102
6.2 Download Procedure ........................ 103
Table Of Contents

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7. BLOCK DIAGRAM ............................. 106
7.1 Main Board ....................................... 106
7.2 FPCB ................................................ 107
7.3 RF .................................................... 107
8. CIRCUIT DIAGRAM ........................... 109
8.1 Baseband Interface .......................... 109
8.2 MIDI .................................................. 110
8.3 KYE, I/F & LCD CON ....................... 111
8.4 RF .................................................... 112
9. PCB LAYOUT ..................................... 113
10. ENGINEERING MODE .................. 115
10.1 BB Test [MENU 1] ........................ 115
10.2 RF Test [MENU 2] ........................ 117
10.3 MF Mode [MENU 3] ...................... 118
10.4 Trace option [MENU 4] ................. 119
10.5 Call Timer [MENU 5] ..................... 119
10.6 Fact. Reset [MENU 6] ................... 119
10.7 S/W version [MENU 7] .................. 119
11. STAND ALONE TEST ................... 120
11.1 Introduction ................................... 120
11.2 Setting Method ............................. 120
11.3 Means of Test ............................... 120
12. AUTO CALIBRATION ................... 121
12.1 Overview ....................................... 121
12.2 Requirements ............................... 121
12.3 Menu and settings ........................ 121
12.4 AGC .............................................. 123
12.5 APC .............................................. 123
12.6 ADC .............................................. 123
12.7 Setting .......................................... 123
12.8 How to do calibration .................... 123
13. EXPLODED VIEW &
REPLACEMENT PART LIST ...... 124
13.1 Exploded View .............................. 124
13.2 Accessories .................................. 126
13.3 Replacement Part List .................. 127

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REVISED HISTORY
The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
G5200.
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
APRIL/2002 ISSUE 1 Initial Release

1. INTRODUCTION
- 4 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the G5200.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part
(for example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use
of common-carrier telecommunication service of facilities accessed through or connected to it. LGE
will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the G5200 or compatibility with
the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the G5200 must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.

1. INTRODUCTION
- 5 -
E. Notice of Radiated Emissions
The G5200 complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An G5200 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which
is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package
as described.

1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diodet
G5200 LG GSM Phone
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loopr
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter

1. INTRODUCTION
- 7 -
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE
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2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Li-ion, 750 mAh
Standard Battery Size: 41 73.9 5mm
Weight: 22 g
AVG TCVR Current GSM , EGSM: 243 mA, DCS: 209 mA
Stand by Current < 4 mA
Talk time Up to 3 hours (GSM TX Level 7)
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time 2 hours 30mins
RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm
TX output power GSM, EGSM: 32 dBm (Level 5)
DCS: 29.5 dBm (Level 0)
GPRS compatibility Class 10 (This only applies to G5200)
SIM card type 3V Small
Display 128 128 dots LCD(Main) , 96 64 dotsLCD(Sub)
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, Navigation Key, Up/Down Side Key
Side Key, Confirm Key, Clear Key , Hot Key)
Send Key, END/PWR Key
ANT External
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Receiver Yes
Roud Speaker Yes
Voice Recoding Yes
C-Mike Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit

2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n 0.2 MHz
RX: 935 + n 0.2 MHz (n = 1 ~ 124)
EGSM
1 Frequency Band TX: 890 + (n – 1024) 0.2 MHz
RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024)
DCS
TX: 1710 + (n – 512) 0.2 MHz
Rx: 1805 + (n – 512) 0.2 MHz (n = 512 ~ 885)
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE
- 10 -
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5 Output RF Spectrum 6,000 -71
(due to modulation) DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
6 Output RF Spectrum 1,800 -24
(due to switching transient) GSM
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status

2. PERFORMANCE
- 11 -
Item Description Specification
GSM, EGSM
8 Bit Error Ratio BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 *-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Distortion -20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency (13 MHz) tolerance ≤2.5 ppm

2. PERFORMANCE
- 12 -
Item Description Specification
19 32.768KHz tolerance ≤30 ppm
Full power
< 243 mA (GSM, EGSM) ; < 209 mA (DCS)
20 Power Consumption Standby
- Normal < 4 mA (Max. power)
21 Talk Time
GSM/ Level 7 (Battery Capacity 750mA): Up to 180 Min
GSM/ Level 12 (Battery Capacity 750mA): Up to 300 Min
Under conditions, Up to 200 hours:
1. Brand new and full 750mAh battery
2. Full charge, no receive/send and keep GSM in idle
22 Standby Time mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 80 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Voltage Fast Charge : < 500 mA
Slow Charge: < 60 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
25 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
Battery Bar Number Voltage
0 ~ 3.62 V
26 Battery Indicator 1 3.62 ~ 3.73 V
2 3.73 ~ 3.82 V
3 3.82 V ~
27 Low Voltage Warning 3.5 0.03 V (Call)
3.62 0.03 V (Standby)
28 Forced shut down Voltage 3.35 0.03 V
1 Li-ion Battery
29 Battery Type Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 750 mAh
Switching-mode charger
30 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 600 mA

3. TECHNICAL BRIEF
- 13 -
3. TECHNICAL BRIEF
3.1 General Descreption
The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a
VCTCXO part. And the main RF Chipset CX74017[U411]is a single-chip dual-band transceiver for
the extended global system for mobile communication[E- GSM900MHz]/Digital communication
system[DCS1800MHz] voice and data transfer applications.
This device integrated a direct conversion receiver architecture, which eliminates the need of
Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N
synthesizer part with built in TXVCO and Local-VCO.
3.2 Receiver
The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted
in the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.
The RF front-end circuit is shown Figure 3-1.
Figure 3-1. RF front-end circuit.

3. TECHNICAL BRIEF
- 14 -
A. RF front end
RF front end consists of Antenna Switch(U405), dual band LNAs integrated in transceiver(U411).
The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the
antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile
switch.
The Antenna Switch (U405) is used to control the Rx and TX paths. And, the input signals VC1 and
VC2 of a U405 are connected to 2-Input AND Gates(U401) to switch either TX or RX path on.
When the RX path is turned on, the received RF signal then feeds either Rx_900_RF or
RX_1800_RF path selected by GSM-RX and DCS-RX respectively. This Rx_900_RF path contains
one SAW filter, followed after the Antenna Switch (U405), to filter any unwanted signal apart from
the DCS RX band. And, the RX_1800_RF path is the same case.
The logic and current for Antenna Switch is given below Table 3-1.
Table 3-1. The logic and current
These two paths are then connected to the LNAGSMN (#11) and LNADCSIN (#13) of CX74017
(U411), respectively. A low-noise bipolar RF amplifier, contained within the U411, amplifies the RF
signal. The RF signals from the front-end pass to the receiver mixers within the U411 device.
B. Demodulator and baseband processing
In direct conversion receiver there is only one mixer down-converting received RF signal to BB
signal directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain
mode.
The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a
function of the expected signal strength at the antenna input so that a desired level is reached at
the Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.
The baseband signals pass via integrated low-pass filters to the baseband A/D converters.
The remainder of the channel filtering is performed by the baseband chipset. The demodulator
contains switches to maintain the sense of the baseband I/Q outputs with respect to the incoming
RF signal on both GSM900 and DCS 1800.
C. DC Offset Compensation
Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.
After compensation, the correction voltages are held on capacitors for the duration of the receive
slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the DC
compensation circuitry in the track mode.
VC1 VC2 Current
GSM TX 0 V 2.7 V 10.0 mA max
DCS TX 2.7 V 0 V 10.0 mA max
GSM/DCS RX 0 V 0 V < 0.1 mA

3. TECHNICAL BRIEF
- 15 -
3.3 Transmitter Part
The Transmitter part contains CX74017 active parts and PAM, APC IC, coupler and Antenna
Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop
block(OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO
which can operate at either final RF output frequency. The RF GMSK outputs from the transmit
VCO are fed directly to the RF power amplifiers.
Figure 3-2. Transmitter Block diagram
The peak output power and the profile of the transmitted burst are controlled by means of a closed
feedback loop. A dual band directional coupler is used to sample the RF output from either PA.
The PA outputs from the directional coupler pass to the antenna connector via Antenna Switch.
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side-
band rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A
converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into
two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and
QT/QTX. It is used as reference signal for the OPLL.
TXIP
TXIN

B. OPLL
The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector.
The other side of the phase detector input is LO signal. The phase detector generates an error
current proportional to the phase difference between the modulated signal from the offset mixer and
the reference signal from the LO.
The error current is filtered by a second order low-pass filter to generate an output voltage which
depends on the GMSK modulation and the desired channel frequency. This voltage controls the
transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency
modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter
tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation
and up-conversion process and provides significant filtering of spurious products.
C. Synthesizer
The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local osillator used in both transmit
and receive path to a precision frequency reference input. Fractional-N operation offers low phase
noise and fast setting times, allowing for multiple slot applications such as GPRS.
The generated frequency is given by the following equation
where : = Generated VCO frequency
N = N-divider ratio integer part
FN = Fractional setting
R = R-divider ratio
= Reference Frequency
3. TECHNICAL BRIEF
- 16 -
=
VCO
f
VCO
f

3. TECHNICAL BRIEF
- 17 -
The counter and mode settings of the synthesizer are also programmed via 3-wire interface.
Figure 3-3. Synthesizer Block diagram
D. TX APC Part
The AD8315[U412] is a dual band RF power controller for RF power amplifiers operating in the
850MHz to 2GHz range.
The AD8315[U412] controls the power output of the selected RF channel. RF power is controlled by
driving the RF amplifier power control pins and sensing the resultant RF output power via a
directional coupler. The RF sense voltage is peak detected using an on-chip Schottky diode.
This detected voltage is compared to the DAC voltage at the VSET pin to control the output power.
An internal input signal[TXRAMP] is applied to the positive input of the AD8315 amplifier during the
TXEN mode and a directional coupler near the antenna feeds a portion of the RF output signal back
to the AD8315 peak detector converts this signal to a low frequency feedback signal that balances
the amplifier when this signal equals the RAMP input signal level.
E. Power Amplifier
The PF08107B[U409] is Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to
1785MHz). The efficiency of module is the 50% at nominal output power for E-GSM and the 43% at
32dBm for DCS1800. This module should be operated under the GSM burst pulse. To avoid
permanent degradation, CW operation should not be applied. To avoid the oscillation at no input
power, before the input is cut off, the control voltage Vapc should be control to less than 0.5V.
We have to improve thermal resistance, the through holes should be layouted as many as possible
on PCB under the module. And to get good stability, all the GND terminals and the metal cap should
be soldered to ground plane of PCB.
13MHz
f
ref

3.4 13 MHz Clock
The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal
Oscillator) which oscillates at a frequency of 13 MHz.
It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522).
Figure 3-4. VCTCXO Circuit.
3.5 Power Supplies and Control Signals
There are two regulators used in the phone to provide RF power. One is contained inside of
ADP3408 (U101), power management IC to provide the power for the VCTXO (X302). The other is
used to provide the power for remaining RF circuits.
Table 3-2.
Figure 3-5. Regulator Circuit.
3. TECHNICAL BRIEF
- 18 -
.
Regulator Voltage Powers Enable Signal
Regulator 1
(U1, 2V7_VTCXO) 2.7 V 0.5 V VCTXO
Regulator 2
(U414, RF2V8) 2.85 V 0.5 V RF circuitry VSYNTHEN

3. TECHNICAL BRIEF
- 19 -
3.6 Digital Main Processor
The AD6522 is an ADI designed processor.
Figure 3-6. Top level block diagram of the AD6522 internal architecture.
BUS Arbitration Subsystem
It is to work as a cross point for data accesses between the three main busses. EBUS is for external
accesses, primarily from Flash memory for code and data. RBUS is for internal RAM access. PBUS
is for access to internal peripheral modules such as UART, RTC or SIM. In addition to the three
main system busses, it has SBUS, IOBUS and DMABUS.
DSP subsystem
It consists of ADI DSP, Viterbi coprocessor, Ciphering unit and a cache memory/controller system.
The DSP can run at a maximum clock frequency of 78 MHz at 2.45 V. The Viterbi and ciphering
accelerators enable a very efficient implementation of the channel equalization, encryption and
decryption tasks.