LG GB110 User manual

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GB110
GB110 GB110
GB110
Service Manual
Service ManualService Manual
Service Manual
LG Electronics

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Table Of Contents
1. INTRODUCTION……………….….3
1.1 Purpose……………………………..……3
1.2 Regulatory Information……………..…...3
2. PERFORMANCE………………..…5
2.1 H/W Features………………………..…..5
2.2 S/W Features………………………….…6
3. TECHNICAL BRIEF…………..….13
3.1 Digital Main Processor( PMB7890 )….……..13
3.2 Memory chip ( S71GL064NA0BFW0Z0 )….……18
3.3 Power Amplifier Module ( SKY77518 ) …...21
3.4 RF SAW (B9308)……….………………22
3.5 Audio Amplifier (TPA6205A1)…….….23
3.6 Charger IC (MP26021)……………...….24
3.7 Camera Driver (AIT701A)……..….…...26
3.8 FM Radio (Si4703)………………..…....30
3.9 LCD Interface…………………………..32
3.10 SIM Card Interface…………….….….34
3.11 KEYPAD Interface…………….…..….35
3.12 Key LED Interface………….…..…….36
3.13 Vibrator Interface…………….…….…37
3.14 Micro SD Interface….…………….….38
4. TROUBLE SHOOTING…….…….39
4.1 Power On Trouble……………………...39
4.2 SIM Card Trouble…………………..….42
4.3 Vibrator Trouble…………………….….44
4.4 Keypad Trouble………………………...46
4.5 RTC Trouble……………………………48
4.6 Key Backlight Trouble……………….…50
4.7 LCM Backlight Trouble………….…….53
4.8 LCM Trouble…………………………...55
4.9 Microphone Trouble……………………57
4.10 Receiver Trouble………………………59
4.11 Speaker Trouble……………………….61
4.12 Headphone Trouble……………………63
4.13 Charging Trouble……………………....67
4.14 FM Radio Trouble……………………..69
4.15 Camera Trouble………………………..75
4.16 Micro SD Trouble……………………..78
4.17 RF Trouble…………………………..80
5. DOWNLOAD………………………93
5.1 Download setup………………………...93
5.2 Download Process………………………95
6. BLOCK DIAGRAM……………...106
7. CIRCUIT DIAGRMA…………….107
8. BGA IN PIN Check……………….113
9. PCB LAYOUT…………………….116
10.ENGINEERING MODE…………118
11.CALIBRATION…………………..120
11.1 Test equipment setup………….…..….120
11.2 APT Technologies………………..…...120
12. Stand alone test………………..…135
12.1 Test Program Setting………………....135
12.2 TX Test …………………………..…..137
12.3 RX Test…………………………….....138
13. EXPLODED VIEW&
REPLACEMENT PART LIST…..…139
13.1 Exploded View…………………….….139
13.2 Replacement Part…………………..…142

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1. INTRODUCTION
1.1 Purpose
This manual provides information necessary to repair, description and download the features of this
model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part(for example ,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
system users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use .The manufacturer dose not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunications service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent . The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that authorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.

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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Devices(ESD),are indicated by the sign .
Following information is ESD handing:
. Service personnel should ground themselves by using a wrist strap when exchange system boards.
.When repairs are made to a system board , they should spread the floor with anti-static mat which is
also grounded .
.Use a suitable, grounded soldering iron .
. Keep sensitive parts in these protective packages until these are used.
.When returning system boards or parts like EEPROM to the factory, use the protective packages as
described.

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2. PERFORMANCE
2.1 H/W Features
Solution EGOLD Voice v2 (ULC2+) Infineon
Type Bar type
Antenna Type Internal (dual-Band)
Main Display 1.5” 128x128 CSTN/65k
Camera Yes, VGA
Battery 950mAh Li-ion inner pack 950mAh: 55x34x50mm
FM Receiver Yes , US/Europe band support (87.5~108MHz)
Embedded FM antenna Yes Pogo pin contact FPC type FM
Antenna on Battery cover.
Loud Speaker Yes
Memory Size 64Mb+16Mb User memory at least 1MB
Memory Card
Yes, Micro SD (up to 2GB) Flip type u-SD holder under
battery
LMT (Lost Mobile Tracker) Yes LMT for: AMA
M-DOG: China

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2.2 S/W Features
Feature Detail Item Description
OS OSE Operating System Y
Speech Code FR,EFR,HR,AMR-NB Y
AMR code GSM Full Rate
3GPP Adaptive Multi Rate (AMR-NB)
Y
FM Radio Y
MP3 Ring
Tone
MP3 decode Y
Integrated hands
free
speaker
Speaker phone mode Y
Key Tone
Volume
6 Level (Include Mute) Y
Ring Tone
Volume
6 Level (Include Mute) Y
Ring Tone MP3 ring tone/10 Midi Y
Call Alert type Ring, Vibrate, Ring & Vibrate, Ring after vibrate,
Silent
Y
Earpiece
Volume
6 Level (Include Mute) Y
Audio
Mute Y
GSM dual
band MS
900-1800
Configuration is during software compile time. YFrequency
Bands
PCS dual band
MS 850-1900
N/A N
Circuit NDate Service
Packet N
Infrared (IrDA) N
Bluetooth N
USB N
USB Mass
storage
N
Connectivity
RS232(UART) Only for Phone tool & download Y
Voice Function Voice
Recording
N

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Voice
Command
N
Answering
machine
N
Capture Size 128x128, 160x120, 320x240, 640x480 Y
Preview Size Full Screen: 128x128 Y
Quality Low, Normal, High Y
EV +4, +3, +2, +1, 0, -1, -2, -3, -4 Y
WB Auto, Daylight, Tungsten,
FLUORESCENT, Cloud,
INCANDESCENCE
Y
Zoom 640x480 : 1x
320x240 : 1x, 2x
160x120/128x128 : 1x, 2x, 4x
Y
Effect Normal, Sepia, Grayscale, Color invert Y
Continuous
Shot
1 Shot, 3 shot, 6 shot Y
Self Timer 3 seconds, 5 seconds, 10 seconds Y
Shutter tone Off, tone1, tone2, tone3 Y
Storage Phone/SD card Y
Camera
Reset Setting Restore to default setting Y
Browse detail
image Info
YImage Viewer
Full Screen
View
Y
Browse file
tree
Y
Copy,
Rename,
Delete, Move
files
Y
File Manager
Rename,
Delete,
Multi-Delete,
Create folder
Y
RSSI 6 level (0~5 level) Y
Battery level 4 level (0~3 level) Y
Display
RTC Date & Time Display Y

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PLMN/Service
Indicator
Y
Quick Access
Mode In Idle
Profile/ SMS + Voice Mail Y
Dimming
Clock
N
Dual Clock N
Home shortcut Display Shortcut icon in Idle Y
Last Dial
Number
Max : 20 records Y
Last Received
Number
Max : 20 records Y
Last Missed
Number
Max : 20 records Y
Scratch Pad
Memory
N
Call History
Call Duration Last Call time, Total Call Time Y
Last Call
Charge Units
NCall Cost
Total Charge
Units
N
Call Waiting Y
Call Swap Y
Call Retrieve Y
Auto Answer Not supported in Headset Mode Y
Auto Redial Y
Calling Line Y
Full Call Divert Y
Speed Dialing Y
Last Number
Redial
Y
Multi Party Call Y
Call
Management
ECT Explicit Call Transfer (4 + Send) N
Automatic Network
Selection
YNetwork
Manual
Network
Y

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Preferred
Network
Y
Network
Service Status
Y
DTMF
Signaling
YDTMF
DTMF Enable
& Disable
Y
Read Cell
Broadcast
Y
On/Off setting Receive On/Off Y
Alert setting Y
Language
setting
Y
Cell Broadcast
Topics Setting Y
Entry 500 Y
Field Name, Mobile, Home, Office Y
Copy ME <-> SIM Y
Move ME <-> SIM Y
FDN Y
SDN Y
Email Entry N
Picture ID N
Video Caller ID N
vCard N
Business Card Y
Contacts(Phone
Book)
Delete Delete, Delete All(SIM or Phone), Multi
Delete
Y
CFU Call Forwarding Unconditional Y
CFB Call Forwarding on Mobile Subscriber
Busy
Y
CFNRy Call Forwarding on No Reply Y
CFNRc Call Forwarding on Mobile Subscriber Not
Reachable
Y
BAOC Barring of All Outgoing Calls Y
Supplementary
Services
BOIC Barring of Outgoing International Calls Y

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BOICexHC Barring of Outgoing International Calls
except those directed to the Home PLMN
Country
Y
BAIC Barring of All Incoming Calls Y
BICRoam Barring of Incoming Calls when Roaming
Outside the/Home PLMN Country
Y
Conference
Call
Up to 5 Y
Plug in Type 3V & 1.8 V Y
SIM Lock Service Provider / Network Lock Y
SIM
SIM Toolkit Class 3 Y
Read
Message
Y
Write and Edit
Message
Y
Send and Receive
Message
Y
Reply to
Message
Y
Forward
Message
Y
Extract Number from
Message
Y
Message
Status
Y
Message
Unread
Y
Settable Message
Center Number,
Reply Path
and Validity
Y
Visible and Audible
Message
Receive
Y
(No for
Audible)
Voice Mail Y
Short Message
Settable Voice Mail
Center
Number
Y

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Message
Protocol
Normal, Fax, National Paging, X400,
ERMES, Voice
Y
Message Overflow
Indicator
Y
Message
Center
Number
Y
Nokia Smart
Message
N
Development & Test
Facility
Y
Field Test
Facility
Y
Display
Software
Version
Y
IMEI Y
Restore
Factory
Setting
Y
Miscellaneous
Function
Battery
Charging
Mode
Y
Language Selectable Auto Language YText Input
Predictive
word input
T9 Y
Calendar MAX: 20 records (18 chars) Y
To Do N
Scheduler
Memo MAX: 10 records (80 chars) Y
Setting Local
Time
Y
Display Two Number
of
Cities Time
Dual Clock N
Daylight
saving
N
World Time
NITZ Y
Unit converter Length, Weight, Volume, Surface, Y

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Velocity, Temperature, User-defined
Stop Watch Y
Calculator + - * / Y
Phone Book
Sync
Only For service Center YPC Sync
Message Sync N
Game Will use Ruby’s Game, 1 game Y
Emergency
Call
Y
Handset Lock Y
Security Code When Delete All Y
SIM Lock Y
Security
Keypad Lock Y
12/24 Hour Y
Calendar Y
Time Zone Y
Daylight
saving
Y
Alarm
Manager
Y
Dimming
Clock
N
Power-off
Alarm
Y
Real Time
Clock
On Alarm
Event
Y
Mobile
Tracking
software
For India, Asia YOthers
M-DOG For China Y
Accessory microSD
Adapter
Y
Stereo earmic
(without hook
switch)
Y
User Memory Min: 1 MB Y

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3. TECHNICAL BRIEF
3.1Digital Main Processor
Figure.3-1 PMB7890 FUNCTIONAL BLOCK DIAGRAM

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3.1.1 Overview of X-GOLDTM102
The X-GOLDTM102 is a GSM baseband modem including RF transceiver covering the low
bands GSM850 / GSM900 and high bands GSM1800 / GSM1900 bands. X-GOLDTM102 is Dual
Band, therefore, it supports by default a low / high pair of bands at the same time:
1. GSM850 / GSM1800
2. GSM850 / GSM1900
3. GSM900 / GSM1800
4. GSM900 / GSM1900.
The X-GOLDTM102 is optimized for voice-centric Mobile Phone applications.
The X-GOLDTM102 is designed as a single chip solution that integrates the digital, mixed-signal,
RF functionality and a direct-to-battery Power Management Unit.
The transceiver consists of:
• Constant gain direct conversion receiver with an analog I/Q baseband interface
• Fully integrated Sigma/Delta-synthesizer capability
• Fully integrated two-band RF oscillator
• Two-band digital GMSK modulator with digital TX interface
• Digitally controlled crystal oscillator generating system clocks.
The X-GOLDTM102 supports a direct to battery connection, hence eliminating the need for an
external Power Management Unit. The X-GOLDTM102 has different power down modes and an
integrated power up sequencer.
The X-GOLDTM102 is powered by the C166®S-V2 MCU and TEAKLite® DSP cores. The
operating temperature range from -30°C to 85°C. It is manufactured using the 0.13 μm CMOS
process.
3.1.2 Features
Baseband
• High performance fixed-point TEAKlite DSP
• C166S-V2 high performance microcontroller with a 16KB Instruction Cache and a Data cache
Buffer.
• There are several Interfaces:
– I2S interface for DAI connections (for Tape Approval) and external Audio component connection.
– High Speed SSC Interface for connection of companion chips (like Serial SD Cards)
– High Speed SSC Interface dedicated to Display control
– USIM Interface with support of Protocol T=1
– Keypad Interface (6x4 or 5x5 keys)
– EBU for external RAM/NOR FLASH/Busrt Flash/NAND Flash/Parallel Display connection
– Asynchronous serial interface.
– Asynchronous serial interface for WLAN/BT/GPS control (incl. IrDA support capability) .
– JTAG Interface, OCDS, Multi-Core Debug and Real Time Trace facilities.
– Black & white and color displays are supported

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– PWM source to drive vibrator
– Keypad and display backlight supported.
– HASH Unit support for hashing.
Receiver
• Constant gain, direct conversion receiver with fully integrated blocking filter
• Two integrated LNAs
• No need of interstage and IF filter
• Highly linear RF quadrature demodulator
• Programmable DC output level
• Very low power budget.
• GPRS (up to Class 10 type1)
Transmitter
• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz @ 20 MHz
• Single ended outputs to PA, Pout = +3.5 dBm
• Very low power budget.
RF-Synthesizer
• ΣΔSynthesizer for multi-slot operation
• Fast lock-in times (< 150 μs)
• Integrated loop filter
• RF Oscillator
• Fully integrated RF VCO.
Crystal Oscillator
• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.
Mixed Signal and Power Management Unit
• DC/DC boost for voltages up to 15 V for driving White or Blue LEDs
• 8-Ohm loud speaker driver (250/350 mW)
• 16-Ohm earpiece driver
• 32-Ohm headset driver
• Measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient
temperature)
• Accessory Detection
• PCB ID detection
• Differential microphone input
• System start up circuitry
• Charger circuitry for NiCd, NiMh and LiIon cells with integrated Control Current/Voltage Charging.
• Integrated regulators for direct connection to battery.
Package
X-GOLDTM102 utilizes an PG-VF2BGA-189-1 lead-free (green) package. The high degree of
integration in
X-GOLDTM102 in conjunction with a sophisticated designed ball-out allows building a complete

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mobile phone with
all its peripherals on a 4-layer PCB.
3.1.3 System Platform Application
X-GOLDTM102 was developed for very low cost Dual Band GSM/GPRS system solutions.
Here are some potential System Platform configurations that can be built with X-GOLDTM102
Solution:
3.1.4 GSM System Description
The X-GOLDTM102 is suited for mobile stations operating in the GSM850/900/1800/1900 bands.
In the receiver path the antenna input signal is converted to the baseband, filtered, and then
amplified to target
level by the RF transceiver chip set. Two A-to-D converters generate two 6.5 Mbit/s data streams.
The decimation
and narrowband channel filtering is done by a digital baseband filter in each path. The DSP
performs:
1. The GMSK equalization of the received baseband signal (SAIC support available)
2. Viterbi channel decoding supported by an hardware accelerator.
The recovered digital speech data is fed into the speech decoder. The X-GOLDTM102 supports
fullrate, halfrate,
enhanced fullrate and adaptive multirate speech CODEC algorithms.
The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data
stream is D-to-A
converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a
programmable gain stage.
The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output
driver for
external loud speaker is implemented.
In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.
The prefiltered
and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal
passes a digital
decimation filter.

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The X-GOLDTM102 performs speech and channel encoding (including voice activity detection
(VAD) and
discontinuous transmission (DTX)) and digital GMSK modulation.
In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency
in the 850 MHz,
900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The X-GOLDTM102 supports dual
band
applications.
Finally, an RF power module amplifies the RF transmit signal at the required power level. Using
software, the
X-GOLDTM102 controls the gain of the power amplifier by predefined ramping curves (16 words,
11 bits).
For baseband operation, the X-GOLDTM102 supports:
• High Speed Circuit Switched Data (HSCSD) class 4
• Packet-oriented data (GPRS) class 4 with a coding scheme from 1 to 4. It provides fixed, dynamic,
and extended dynamic modes.
If the X-GOLDTM102 is only used as a modem, then it supports:
• High Speed Circuit Switched Data (HSCSD) class 10
• Packet-oriented data (GPRS) class 10 with coding schemes from 1 to 4. It provides fixed,
dynamic, and extended dynamic modes.
The X-GOLDTM102 can support Class B operation. The mobile phone can be attached to both
GPRS and GSM services (one service at a time). During a GPRS connection Class B enables
either:
• Making or receiving a voice call
• Sending or receiving an SMS.
During voice calls or SMS, GPRS services are suspended and then resumed automatically after
the call or SMS session has ended.
3.1.5 Bus Concept
The X-GOLDTM102 has two cores (a microcontroller and a DSP), each with its own bus.
There is an Shared memory interconnection between the TEAKlite bus and the C166S-V2 X-Bus.
C166S-V2 Buses
The C166S-V2 is connected to four buses:
1. IMB (Internal Program) bus
2. DPMI (Data-Program) Bus
3. X-Bus
4. PD-Bus.
TEAKLite Bus
The TEAKlite is connected to the TEAKlite bus.

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Bus Interconnections
The interconnection between the X-Bus and the TEAKlite Bus uses:
• Multicore Synchronization
• Shared Memory.
3.1.6 Clock Concept
The X-GOLDTM102 has a flexible clock control.
3.1.7 Interrupt Concept
The C166 MCU carries out the X-GOLDTM102 interrupt system.
3.1.8 Debug Concept
The X-GOLDTM102 includes a multi-core debug. The C166 and TEAKlite cores can be debugged
in parallel with:
• A single JTAG port (that is, on a single host)
• Mutual breakpoint control.
C166 Debug Concept
The debugging of the C166 uses the OCDS and the Cerberus.
The X-GOLDTM102 also inlcudes a Real Time Trace module for software debugging.
TEAKLite Debug Concept
TEAKlite debugging uses the OCEM and the SEIB.
3.1.9 Power Management
The X-GOLDTM102 provides the power management unit (PMU) for the complete mobile phone
application. The integrated PMU is directly connected to the battery and provides a set of linear
voltage regulators (LDO’s). These LDO’s generate all required supply voltages and currents
needed in a low feature mobile phone.
The charger unit controls the charging of NiCd, NiMh, LiPolymer and LiON batteries. Only a few
external parts are required to support charging from a DC wall adaptor. In addition, the charger
generates the power-on reset after battery insertion or charger connection. The supported battery
voltage range is 3.1 to 5.1 V for NiCd/NiMH and 3.1 to 4.6 V for LiPolymer and LiON batteries. The
upper voltage limit is programmable.The charger supports constant current precharging,
full-charging (pulsed charging) and software controlled constant current charging. The charging
functions are protected by hardware timer. Charger idle voltages up to 20 V can be handled. An
integrated overvoltage protection protects batteries and system against overvoltage.
White/blue backlight generation is supported with a special driver for very a low external parts
count. Power consumption during operation phases is minimized due to flexible clock switching
In the Standby Mode most parts of the device are switched off, only a small part is running at
32kHz and the
controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off
during Standby via SW.
This Units (associated to the Measurement Unit) provides also support for a accessory
detection .

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3.1.10 On-Chip Security Concept
Secure boot is based on a public/private key approach. Flash images that are not signed with the
private key during phone manufacture cannot be loaded. Verification of the Flash code is done with
the public key. The public key as well as hash and verify algorithms are stored in the ROM, which
ensures a hardware secured boot procedure.
The following security features are supported:
• Prevention of illegal Flash programming
• Flash programming makes use of the X-GOLDTM102 ID for personalization checks with IMEI and
SIM-lock protection
The security features use the following mechanism:
• Boot ROM flow:
– Controls the boot transition to external flash
– Controls the flash update
• Flash tied to the individual chip via an ID using e-fuses, that is, each X-GOLDTM102 chip has its
own fused ID.
• Harware support of SHA1 algorithm to reduce the booting time.
Further details on the X-GOLDTM102 security concept are not publicly documented.
GSM Cipher Unit
This unit on the TEAKlite bus calculates the GSM/EDGE encryption keystream and the
GSM/EDGE decryption
keystream. It implements the following algorithms: A5/1, A5/2, and A5/3.
3.1.11 Asynchronous Operation Mode Concept
The X-GOLDTM102 can operate in either:
• The traditional synchronous mode with the 26 MHz system clock synchronized on the base
station
• A special asynchronous mode (XO concept).
In the asynchronous mode the 26 MHz clock input is not synchronized with the base station; the
residual frequency offset is compensated in the digital signal processing domain. This processing
includes frequency and timing compensation of the baseband and voiceband signals.

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3.2 Memory chip (S71GL064NA0BFW0Z0)
Figure.3-2 S71GL064NA0BFW020 FUNCTIONAL BLOCK DIAGRAM
Features
_ Power supply voltage of 2.7 to 3.1V
_ 100 ns access time (S71GL128N)
_ 105 ns access time (S71GL512N)
_ 25 ns page read times
_ Packages:
– 12.0 x 9.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
– 11.6 x 8.0 mm x 1.2 mm FBGA (TLA084) (S71GL128N)
_ Operating Temperature
– -25°C to +85°C (Wireless)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages and consists of
_ One Flash memory die
_ One pSRAM