LG GC900F User manual

Service Manual Model : GC900F
Internal Use Only
Service Manual
GC900F
Date: May, 2009 / Issue 1.0

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
1.3. ABBREVIATION ...........................................................7
2. PERFORMANCE............................................... 9
2.1 Supporting Standard....................................................9
2.2 Main Parts : Solution..................................................10
2.3 H/W features.............................................................10
2.4 HW Spec. ................................................................12
3. BB CIRCUIT TECHNICAL BRIEF..................... 17
3.1 Functional Block Diagram ..........................................17
3.2 Baseband Processor Introduction ..............................18
3.3 Power management IC...............................................31
3.4 Power ON/OFF ..........................................................38
3.5 SIM Interface.............................................................39
3.6 T - Flash connector....................................................40
3.7 Memory ...................................................................41
3.8 LCD Display ..............................................................42
3.9 LCD back-light illumination ........................................43
3.10 Battery voltage monitor............................................44
3.11 Audio......................................................................45
3.12 WLAN/Bluetooth/FM (LBEH19UNBC).........................49
3.13 18PIN Interface connector........................................51
4. RF Circuit Technical Brief ............................52
4.1 General Description ...................................................52
4.2 GSM Part..................................................................55
4.3 WCDMA Part.............................................................59
4.4 GSM Power Amplifier Module.....................................61
4.5 WCDMA Band1/8 Power Amplifier Module ..................62
4.6 WCDMA Band1/8 Low Noise Amplifier ........................64
4.7 WCDMA Band1/2 Duplexer ........................................65
4.8 WCDMA Band5/8 Duplexer ........................................66
5. Trouble shooting ..........................................67
5.1 Trouble shooting test setup ........................................67
5.2 Power on trouble .......................................................68
5.3 Charging Trouble .......................................................73
5.4 USB Trouble ..............................................................76
5.5 SIM Detect Trouble ....................................................79
5.7 Micro SD Trouble .......................................................82
5.8 Audio Trouble ............................................................84
5.9 Microphone Trouble ...................................................88
5.10 Camera Trouble.......................................................92
5.11 Main LCD Trouble ....................................................96
5.12 WiFi /Bluetooth Trouble ............................................98
5.13 A-GPS Trouble.......................................................104
5.14 SIDE FPCB ............................................................108
5.15 Speaker Module ....................................................110
5.16 Ambient Sensor.....................................................112
5.17 Touch Sensor ........................................................113
6. Download & S/W upgrade .........................115
7. BLOCK DIAGRAM........................................126
8. CIRCUIT DIAGRAM...................................... 127
9. BGA Pin Map ..............................................139
10. PCB LAYOUT .............................................143
11. RF Calibration .......................................... 151
11.1. Test Equipment Setup ...........................................151
11.2. Calibration Step....................................................151
12. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................157
12.1 EXPLODED VIEW ...................................................157
12.2 Replacement Parts ................................................159
12.3 Accessory .............................................................192

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1.Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the GC900F.
1.2.Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There might be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. LGE does
not warrant that this product is immune from the above case but will prevent unauthorized use of
common carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the GC900F or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
GC900F service manual
D. Maintenance Limitations
Maintenance limitations on the GC900F must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
GC900F may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following
information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
GC900 service manual
1.3. ABBREVIATION
For the purposes of this manual, following abbreviations apply:
◆
APC Automatic Power Control
◆
BB Baseband
◆
BER Bit Error Ratio
◆
CC-CV Constant Current – Constant Voltage
◆
CLA Cigar Lighter Adapter
◆
DAC Digital to Analog Converter
◆
DCS Digital Communication System
◆
dBm dB relative to 1 milli-watt
◆
DSP Digital Signal Processing
◆
EEPROM Electrical Erasable Programmable Read-Only Memory
◆
EGPRS Enhanced General Packet Radio Service
◆
EL Electroluminescence
◆
ESD Electrostatic Discharge
◆
FPCB Flexible Printed Circuit Board
◆
GMSK Gaussian Minimum Shift Keying
◆
GPIB General Purpose Interface Bus
◆
GPRS General Packet Radio Service
◆
GSM Global System for Mobile Communications
◆
IPUI International Portable User Identity
◆
IF Intermediate Frequency
◆
LCD Liquid Crystal Display
◆
LDO Low Drop Output
◆
LED Light Emitting Diode
◆
LGE LG Electronics
◆
OPLL Offset Phase Locked Loop
◆
PAM Power Amplifier Module
◆
PCB Printed Circuit Board

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
GC900 service manual
◆
PGA Programmable Gain Amplifier
◆
PLL Phase Locked Loop
◆
PSTN Public Switched Telephone Network
◆
RF Radio Frequency
◆
RLR Receiving Loudness Rating
◆
RMS Root Mean Square
◆
RTC Real Time Clock
◆
SAW Surface Acoustic Wave
◆
SIM Subscriber Identity Module
◆
SLR Sending Loudness Rating
◆
SRAM Static Random Access Memory
◆
STMR Side Tone Masking Rating
◆
TA Travel Adapter
◆
TDD Time Division Duplex
◆
TDMA TimeDivisionMultipleAccess
◆
UART Universal Asynchronous Receiver/Transmitter
◆
VCO Voltage Controlled Oscillator
VCTCXO
◆
Voltage Control Temperature Compensated Crystal
Oscillator
WAP
◆
Wireless Application Protocol
◆8PSK 8PhaseShiftKeying

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
GC900 service manual
2.1. Supporting Standard
Item Feature Comment
Supporting Standard WCDMA 900 / WCDMA
2100/HSDPA
GSM850/EGSM/DCS/PCS1 with
seamless handover
Phase 2+(include AMR)
SIM Toolkit : Class 3
Frequency Range GSM850 TX : 824 - 849MHz
GSM850 RX : 869 - 894MHz
EGSM TX : 880 - 915 MHz
EGSM RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz
DCS RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz
PCS RX : 1930 - 1990 MHz
WCDMA900 TX : 880 - 915 MHz
WCDMA900 RX : 925 - 960 MHz
WCDMA2100 TX : 1920 - 1980 MHz
WCDMA2100 RX : 2110 - 2170 MHz
HSDPA TX : 880 - 915 MHz
1920-1980MHz
HSDPA RX : 925 - 960 MHz
2110-2170MHz
WLAN 802.11g : 2400 – 2483.5 MHz
Application Standard WAP 2.0, JAVA 2.1

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2. PERFORMANCE
GC900 service manual
2.2. Main Parts : Solution
Item Part name Comment
Digital Baseband PMB8878 (Infineon)
Analog Baseband PMB8878 (Infineon)
RF chip TQ7M5005 (TriQuent))
2.3. H/W features
Item Feature Comment
Form Factor Color LCD – Bar Type
1)Capacity
Standard : Li-Ion, 10000mAhBattery
2) Packaging Type : Soft Pack
Item Feature Comment
Size 105.9 ×55.3 ×11.97mm
Weight 105g With Battery
GSM 227 hours @paging period 5Stand-by
time WCDMA 227hours @DRX=7
GSM 170min @ Power Level 5Talk
time WCDMA 170min @Tx=12dBm
Charging time 2hours 20min @power
OFF/1000mAh
Rx sensitivity EGSM900 : -105 dBm
DCS1800 : -105 dBm
PCS1900 : -105 dBm
WCDMA2100 : -106.7 dBm
GSM/
GPRS
EGSM900 : 33 dBm
DCS1800 : 30 dBm
PCS1900 : 30 dBm
Class4 (EGSM900)
Class1(DCS)
Class1(PCS)
TX output
power
EDGE EGSM900 : 27 dBm
DCS1800 : 26 dBm
PCS1900 : 26 dBm
E2 (EGSM900)
E2 (DCS)
E2 (PCS)

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
GC900 service manual
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
Display Main LCD(3”, 480 x 800)/TFT
Built-in Camera 5 Mega pixel
ANT Main : Internal Fixed Type
System connector 18 Pin
Ear Phone Jack Φ3.5 4 Pole, Stereo
PC synchronization Yes
Speech coding FR, EFR, HR, AMR
Vibrator Built in Vibrator
Bluetooth V2.1 with A2DP
Voice Recording Yes
Speaker Phone
mode Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable No
T-Flash Yes Not Equipped

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
GC900 service manual
2.4. HW Spec.
GC900 service manual
2.4.1 GSM Transmitter/Receiver spec.
GC900 service manual
Item Specification
Frequency
GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz
EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz
DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz
PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and
Burst Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out
to less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out
to larger than 1800kHz offset to
the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS : 1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching
transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection –
Speech channels ± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression
-GSM : -31dBm - DCS : -
29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
GC900 service manual
2.4.2 WCDMA Transmitter spec.
Item Specification
Transmit Frequency WCDMA850 : 824 – 849MHz
WCDMA2100 : 1920 MHz ~ 1980 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ ±5 MHz,
> 43 dB @ ±10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤f<150kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤f<1GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤f < 12.75 GHz
< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤f ≤935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤960GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤f ≤1880 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥-20 dBm
Peak Code Domain Error < -15 dB at Pout t-20 dBm

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2. PERFORMANCE
GC900 service manual
2.4.3 WCDMA Receiver spec.
Item Specification
Receive Frequency WCDMA850 : 869 MHz ~ 894 MHz
WCDMA2100 : 2110 ~2170 MHz
Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
A
djacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84
MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44
dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤f ≤12.75 GHz
Inner Loop Power Control In
Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
GC900 service manual
2.4.4 HSDPA Transmitter Spec..
Sub-Test
1=1/15, 2=12/15 21~25dBm/3.84MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm/3.84MHz
Maximum Output Power
3GPP Not Complete
Error Vector Magnitude
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Spectrum Emission
Mask
HS-DPCCH
824 MHz ~ 849 MHz 1920MHz ~ 1980 MHzTransmit Frequency
SpecificationItem
+/- 2.35End of CQI4
+/- 0.60Middle of CQI3
+/- 0.61Start of CQI2
+/- 2.36Start of Ack/Nack1
5
Transmitter
power step
tolerance
[dB]
Power
step
size, P
[dB]
Power step slot
boundary
Power
step
Sub-
test in
table
C.10.1.
1 MHz-49dBc8.5 ~ 12.5 MHz
1 MHz
-35-10×(△f-7.5)dBc
7.5 ~ 8.5 MHz
1 MHz
-35-1×(△f-3.5)dBc
3.5 ~ 7.5 MHz
30 kHz
-35-15×(△f-2.5)dBc
2.5 ~ 3.5 MHz
Measurement
Bandwidth
Minimum requirement
Frequency offset from
carrier △f

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
GC900 service manual
13
2.4.5 HSDPA Receiver Spec..
2.4.6 WLAN 802.11g Transmitter and Receiver Spec.
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
Maximum Input Level
(BLER or R), 16QAM Only
869 MHz ~ 894 MHz 2110 MHz ~2170 MHz
Receive Frequency
S
p
ecificationItem
within ±25 PPMChip clock Frequency
Toler ance
≤ 20dBm under (Europe), ≤30dBm under (USA)
Tx Power Level
PER ≤ 10%,
ACR ≥16dB@6Mbps, ACR ≥15dB@9Mbps,
ACR ≥13dB@12Mbps, ACR ≥11dB@18Mbps,
ACR ≥8dB@24Mbps, ACR ≥4dB@36Mbps
ACR ≥0dB@48Mbps, ACR ≥-1dB@54Mbps
※ACR shall be measured by setting the desired signal's strength
3 dB above the rate-dependent
sensitivity specified in min input sensitivity
Rx Adjacent Channel
Rejection
≥-20dBm
(
6,9,12,18,24,36,48,54Mb
p
s
)@
PER ≤10%
Rx Max in
p
ut Sensitivit
y
PER ≤10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Min input Sensitivity
< -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Spurious Emissions
≤-5dBTransmitter constellation error
(rms EVM)
≤-20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤-28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤-40 @ ±30MHz offset (20MHz ~ 30Mhz)
Spectrum Mask
within ±25 PPM
Frequency Tolerance
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )Transmit Frequency
SpecificationItem

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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3. BB CIRCUIT TECHNICAL BRIEF
3. BB CIRCUIT TECHNICAL BRIEF
GC900 service manual
3.1 Functional Block Diagram
MicroSD Flash
LED
1
8
P
i
n
C
r
a
d
l
e
C
o
n
n
e
c
t
o
r
TV
Out
UART
2.0HS
DATA(00:15)
Filter
Analog I2S
SpeakerAMP
I2C
WM8990
Headset AMP
SDRAM
1Gbit
NAND
Flash
2Gbit
DATA(00:15)
16bit MM_AD[0]~[15}
FMAudio
FMAudio
SW
Sub
PMIC I2C
AMD
PMIC
PMB6821
A258
DQ[15:0]
AD[22:0]
CSb
OEb
WEb
IN Tb
MR
WAITb
LCDD[23:0]
CMD
CS
WE/RE
E/RW
LCD
MIPI CLK+
MIPI CLK-
MIPI DATA+
MIPI DATA-
VIPCL KO
MIPI
[PW D N ]
[RESET ]
[STR O BE –
CONTROL]
GPIO
USB
TxC LK
TxL R
TxD
RxD I2S
SD C 0C L K
SD C 0C M D
SD C 0D Q O
SD C 0D Q 1
SD C 0D Q 2
SD C 0D Q 3
SDIO
12M
32K
GPIO
RF
EDGE
PAM
FEM
Duplex UMTS
PAM
Transceiver
PMB6952
EDGE
WCDMA
UMTS 900/2100
GSM850/900/1800/1900
I2C
AMD
1.2FS
BT
＋
FMRadio
+
WiFi
26M
MOTOR
DRIVER
32K
LNA
A-GPS
Proximity
MP-EH
PMB8879
USIM
NAND
DATA
KEYPAD I/F
MIC1
UART1
VIB_DRV_N
MMIC
I/F
SDRAM_DATA
EBU_ADDR
UART0
I2C
I2S
USIM I/F
Audio Out
RCV
USB
ADDR
32K
Hard Key
26M
SW
Main MIC
SDIO
Touch 3-Axis
Sensor
PWM Output
B_LEDcontrol
Charge Pump
BD6088
6CH I2C
AMD
LCDWVGA
480X800
CAMERA8MP
VIP0D ATA0
VIP0D ATA1
VIP0D ATA2
VIP0D ATA5
VIP
SC L
SD A
I2C
VGA
CAM_
PMIC
MIPI
R CV
RCV/SPKSW
SP K
Ear Jack
AMP
USB
MON_TXD,RXD
USB_SELECT
MIC2
HS_MIC
MON
L,ROUT_SPK
MoviNAND
2GByte
(Boot)
[Figure 3.1] Functional Block Diagram

- 18 -
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3. BB Circuit Technical brief
GC900 service manual
3.2 Baseband Processor Introduction
[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)

- 19 -
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LGE Internal Use Only
3. BB Circuit Technical brief
GC900 service manual
3.2.1 General description
S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a
mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital
functionality for a dual mode mobile phone in a single chip.
Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm
CMOS technology to meet the ever increasing demands of the market for feature rich and high
performance terminals at low costs.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external
hardware.
3.2.2. Block Description
zProcessing core
- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate
Motion Estimation algorithms with based video encoding schemes..
- TEAKLite DSP core
zARM9-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory (I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
zTEAKLite®-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
- 5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit

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3. BB Circuit Technical brief
GC900 service manual
zShared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.
zController Bus system
The processor cores and their peripherals are connected by powerful buses.
- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the
internal and external memories and with the peripheral buses.
- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.
- A controller FPI bus for connecting the low performance controller peripherals such as keypad
etc. called hereafter fPI2 bus.
- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with
8channels offloads the controller from data transfers.
- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called
AHB_PER1 and AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer
AHB ‘backbone’ by asynchronous, burst capable AHB2AHB bridges which are shared between
accessing masters.
- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and
AHB_PER2 by its second master interface.
zTEAKLite® Bus System
- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals.
Also the data bus is connected into the controller system via shared RAMs to the FPI3 bus.
- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.
zClock system
The clock system allows widely independent selection of frequencies for the essential parts of the S-
GOLD®3H. Thus power consumption and performance can be optimized for each application.
zFunctional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with four additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
·GMSK Modulator: gauss-filter with B*T=0.3
·EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

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Only for training and service purposes
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3. BB Circuit Technical brief
GC900 service manual
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- f8 and f9 Cipher unit
- Advanced static and dynamic power management features including TDMA-Frame
synchronous low-power mode and enhanced CPU modes(idle and sleep modes)
- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly
coupled to the display interface. The resulting building block consisting of 2D engine and Display
interface is called Display Content Controller (DCC)
- Security crypto box supporting
· AES, DES, 3 DES
· Hash function
· RSA acceleration
· Secret Root Key (e-fuse) and Key Management
· True Random Number Generator
- Sample Rate Converter (SRC) for audio up-sampling
- Comprehensive static and dynamic Power Management
· Various frequency options during operation mode
· 32 kHz clock in standby mode
· Sleep control in standby mode
· RAMs and ROMs in power save mode during standby mode
· Additional leakage current reduction in standby mode possible by switching off for the
TEAKLitre® subsystem.
- Extensive debug support for the controller and the DSP system
· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow
trace) for ARM
· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®
· Multi-core debug support
· 4 Monitor pins for important internal signals and most pad signals
· Cerberus debugging unit
- 2 General Purpose Timers with 3 32-bit timers
- Serial number
- A real time clock with alarm functions
- 2 capture/compare units with 16 channels. One channel active during sleep mode.