LG GD510 User manual

Service Manual Model : GD510
Internal Use Only
Service Manual
GD510
Date: October, 2009 / Issue 1.0

- 3 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
1.3. ABBREVIATION ...........................................................7
2. PERFORMANCE............................................... 9
2.1 H/W Feature................................................................9
2.2 Technical specification ...............................................10
3. Technical brief .............................................17
3.1 GD510 Functional Block diagram ...............................17
3.2 Baseband Processor (BBP) Introduction ......................18
3.3 Power management IC...............................................27
3.4. Power ON/OFF .........................................................31
3.5 SIM & uSD interface ..................................................32
3.6 Memory ....................................................................34
3.7 LCD Display ..............................................................35
3.8 Keypad Switching & Scanning ....................................36
3.9 Keypad back-light illumination....................................37
3.10 LCD back-light illumination ......................................38
3.11 JTAG & ETM interface connector ..............................39
3.12 Audio......................................................................40
3.13 Charging circuit.......................................................41
3.14 FM radio & BLUETOOTH...........................................42
3.15 u-USB Multi Media Interface connector.....................44
3.16 General Description .................................................46
3.17 Receiver part...........................................................47
3.18.Transmitter part.......................................................48
3.19 RF synthesizer.........................................................49
3.20 DCXO .....................................................................49
3.21 Front End Module control.........................................50
3.22 Power Amplifier Module...........................................51
3.2. PAM Schematic........................................................52
4. PCB layout picture ....................................... 53
5. Trouble shooting .......................................... 55
5.1 Trouble shooting test setup ........................................55
5.2 Power on Trouble.......................................................56
5.3 Charging trouble........................................................59
5.4 LCD display trouble ...................................................61
5.5 Camera Trouble.........................................................63
5.6 Receiver & Speaker trouble........................................65
5.7 Microphone trouble ...................................................68
5.8 Vibrator trouble..........................................................70
5.9 Keypad back light trouble...........................................72
5.10 SIM & uSD trouble...................................................74
5.11 Touch trouble ..........................................................77
5.12 Trouble shooting of Receiver part..............................78
5.13 Trouble shooting of Transmitter part ..........................84
6. DOWNLOAD & S/W UPGRADE....................... 93
7. BLOCK DIAGRAM........................................103
8. CIRCUIT DIAGRAM...................................... 105
9. BGA Pin Map .............................................. 113
10. PCB LAYOUT .............................................117
11. RF Calibration .......................................... 123
11.1 Test Equipment Setup ............................................123
11.2 Calibration Step.....................................................123
12. Stand-alone Test......................................128
12.1 Test Program Setting ...........................................1288
12.2 Tx Test..................................................................131
12.3 Rx Test..................................................................132
13. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................133
13.1 EXPLODED VIEW ...................................................133
13.2 Replacement Parts ................................................135
13.3 Accessory .............................................................153

- 4 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
GD510 Operational Description Revision A
LG Electronics 2/112 LGE Property
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
A
* The information in this manual is subject to change without notice and should not be
construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without
notice, to make changes to equipment design as advances in engineering and manufacturing
methods warrant.
zThis manual provides the information necessary to install, program, operate and
maintain the GD510.

- 5 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
GD510 Operational Description Revision A
LG Electronics 7/112 LGE Property
I. Introduction
1.1. Purpose
This manual provides the information necessary to repair, calibration, description and
download the features of the GD510.
1.2. Regulatory Information
1.2.1. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges you’re your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System
users are responsible for programming and configuring the equipment to prevent unauthorized
use. LGE does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through
or connected to it. LGE will not be responsible for any charges that result from such
unauthorized use.
1.2.2. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and
possibly causing harm or interruption in service to the telephone network, it should disconnect
telephone service until repair can be done. A telephone company may temporarily disconnect
service as long as repair is not done.
1.2.3. Changes in Service
A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of the GD510 or compatibility
with the network, the telephone company is required to give advanced written notice to the
user, allowing the user to take appropriate steps to maintain telephone service.
1.2.4. Maintenance Limitations
Maintenance limitations on the GD510 must be performed only at the LGE or its authorized
agents. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory
status of the system and may void any remaining warranty.
1.2.5. Notice of Radiated Emissions
The GD510 complies with rules regarding radiation and radio frequency emission as defined
by local regulatory agencies. In accordance with these agencies, you may be required to
provide information such as the following to the end user.

- 6 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
GD510 Operational Description Revision A
LG Electronics 8/112 LGE Property
1.2.6. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look
slightly different.
1.2.7. Interference and Attenuation
AGD510 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
1.2.8. Electrostatic Sensitive Devices
ATTENTION
A board, which contains Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using
a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these
protective packages until these are used. When returning system boards or parts such as
EEPROM to the factory, use the protective package as described.

- 7 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
GD510 Operational Description Revision A
LG Electronics 5/112 LGE Property
ABBREVIATION
For the purposes of this manual, following abbreviations apply:
୛APC Automatic Power Control
୛BB Baseband
୛BER Bit Error Ratio
୛CC-CV Constant Current – Constant Voltage
୛CLA Cigar Lighter Adapter
୛DAC Digital to Analog Converter
୛DCS Digital Communication System
୛dBm dB relative to 1 milli-watt
୛DSP Digital Signal Processing
୛EEPROM Electrical Erasable Programmable Read-Only Memory
୛GEGPRS Enhanced General Packet Radio ServiceG
୛EL ElectroluminescenceG
୛ESD Electrostatic Discharge
୛FPCB Flexible Printed Circuit Board
୛GMSK Gaussian Minimum Shift Keying
୛GPIB General Purpose Interface Bus
୛GPRS General Packet Radio Service
୛GSM Global System for Mobile Communications
୛IPUI International Portable User Identity
୛IF Intermediate Frequency
୛LCD Liquid Crystal Display
୛LDO Low Drop Output
୛LED Light Emitting Diode
୛LGE LG Electronics
୛OPLL Offset Phase Locked Loop
୛PAM Power Amplifier Module
୛PCB Printed Circuit Board
୛PGA Programmable Gain Amplifier
୛PLL Phase Locked Loop
୛PSTN Public Switched Telephone Network
୛RF Radio Frequency
୛RLR Receiving Loudness Rating
୛RMS Root Mean Square
୛RTC Real Time Clock
୛SAW Surface Acoustic Wave
୛SIM Subscriber Identity Module
୛SLR Sending Loudness Rating
1.3 Abbreviation

- 8 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
GD510 Operational Description Revision A
LG Electronics 6/112 LGE Property
୛SRAM Static Random Access Memory
୛STMR Side Tone Masking Rating
୛TA Travel Adapter
୛TDD Time Division Duplex
୛TDMA Time Division Multiple Access
୛UART Universal Asynchronous Receiver/Transmitter
୛VCO Voltage Controlled Oscillator
୛DCXO Digitally Controlled Crystal Oscillator
୛WAP Wireless Application Protocol
ଝ8PSK 8 Phase Shift Keying

- 9 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 9/112 LGE Property
II. General Performance
2.1 H/W Feature
Item Feature Comment
Standard Battery Li-ion, 900mAh
AVG TCVR Current 270mA typ @PL5
Standby Current 2.3 mA typ @PP9
Talk time 3 hours (GSM TX Level 7)
Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM/GSM850:-105dBm˨,DCS/PCS:-105dBm˨
TX output power EGSM/GSM850 : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display Main 240 u400 pixels, 3” WQVGA, 262K color
Status Indicator Send Key, Shortcut Key, Volume Up/Down Key, PWR
Key, Camera Key, Lock Key
ANT Built in antenna
EAR Phone Jack u USB multi port Headset jack
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit

- 10 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 10/112 LGE Property
2.2 Technical specification
Item Description Specification
1Frequency Band
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) u0.2 MHz (n = 512 a885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) u0.2 MHz (n = 512 a810)
RX: TX + 80MHz
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm ±2dB 13 17 dBm ±3dB
6 31 dBm ±3dB 14 15 dBm ±3dB
7 29 dBm ±3dB 15 13 dBm ±3dB
8 27 dBm ±3dB 16 11 dBm ±5dB
9 25 dBm ±3dB 17 9 dBm ±5dB
10 23 dBm ±3dB 18 7 dBm ±5dB
11 21 dBm ±3dB 19 5 dBm ±5dB
12 19 dBm ±3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm ±2dB 8 14 dBm ±3dB
1 28 dBm ±3dB 9 12 dBm ±4dB
2 26 dBm ±3dB 10 10 dBm ±4dB
3 24 dBm ±3dB 11 8 dBm ±4dB
4 22 dBm ±3dB 12 6 dBm ±4dB
5 20 dBm ±3dB 13 4 dBm ±4dB
6 18 dBm ±3dB 14 2 dBm ±5dB
4Power Level
7 16 dBm ±3dB 15 0 dBm ±5dB

- 11 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 11/112 LGE Property
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
6,000 -71
DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
5Output RF Spectrum
(due to modulation)
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
1,800 -24
DCS1800/PCS1900
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
6Output RF Spectrum
(due to switching transient)
1,800 -27

- 12 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 12/112 LGE Property
7 Spurious Emissions Conduction, Emission Status
Conduction, Emission Status
8Bit Error Ratio
EGSM
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9Rx Level Report accuracy r3 dB
10 SLR 8r3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 0 -12
1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
11 Sending Response
4,000 0 /
12 RLR 2r3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 2 -7
500 * -5
1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
13 Receiving Response
* Mean that Adopt a straight line in between
300 Hz and 1,000 Hz to be Max. level in the
range.
14 STMR 13 r5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
-10 33.3
0 33.7
7 31.7
16 Distortion
10 25.5

- 13 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 13/112 LGE Property
17 Side tone Distortion Three stage distortion < 10%
18 <Change> System frequency (26 MHz)
tolerance d2.5 ppm
19 <Change>32.768KHz tolerance d30ppm
20 Power consumption Standby
- Normalஆd3 mA(@PP9)
21 Talk Time EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min
22 Standby Time
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
2. Full charge, no receive/send and keep GSM
in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
23 Ringer Volume
At least 65 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current Fast Charge : < 400 mA
Slow Charge: < 120 mA
Antenna Bar Number Power
7>-92 dBm a
5-97dBm a –93dBm
4-100dBm a –98dBm
2-103dBm a –101dBm
1-105dBm a –104dBm
0 < –106 dBm
25 Antenna Display
Off No Service
Battery Bar Number Voltage (±0.05V)
3 3.69V~4.2V
2 3.53V~3.69V
1 3.43V~3.53V
26 Battery Indicator
0 3.35V~3.43V
3.53VĻ±0.05V (Call)
27 Low Voltage Warning 3.43VĻ±0.05V (Standby)
28 Forced shut down Voltage 3.3 r0.05 V

- 14 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 14/113 LGE Property
29 Battery Type
Li-ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 900mAh
30 Travel Charger
Switching-mode charger
Input: 150 a240 V, 50/60Hz
Out put: 5.6, 0.7A

- 15 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 15/113 LGE Property
* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)]
Item Description Specification
1 RMS EVM 9%
2 Peak EVM 30%
3 95th Percentile EVM 15%
4 Origin Offset Suppression 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm ±3dB 13 17dBm ±3dB
6 27dBm ±3dB 14 15dBm ±3dB
7 27dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB
9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm ±3dB 8 14dBm ±3dB
1 26/25dBm ±3dB 9 12dBm ±4dB
2 26/25dBm ±3dB 10 10dBm ±4dB
3 24dBm ±3dB 11 8dBm ±4dB
4 22dBm ±3dB 12 6dBm ±4dB
5 20dBm ±3dB 13 4dBm ±4dB
6 18dBm ±3dB 14 2dBm ±5dB
5 Power Level
7 16dBm ±3dB 15 0dBm ±5dB
GSM900/EGSM
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6Output RF Spectrum
(due to modulation)
6,000 -71

- 16 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
GD510 Operational Description Revision A
LG Electronics 16/113 LGE Property
GSM900/EGSM
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
7Output RF Spectrum
(due to switching transient)
1,800 -30
G

- 17 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. Technical brief
3. Technical brief
GD510 Operational Description Revision A
LG Electronics 17/113 LGE Property
III. Technical brief
III-1 Baseband circuit
3.1. GD510 Functional Block diagram.
The functional component arrangement is mentioned below diagram.
Figure 1 GD510 Functional block diagram
3-1. Baseband circuit
snlGz
GD510 BLOCK DIAGRAM(0723)
PMB6821(PM IC)
BB IC(PMB8877)
(2G NAND +
1G DDR SDRAM)
Charging IC
Ր-SD + SIM Socket
TRANSCEIVER
PMB6272
DGM1110M014
BT IC
BC7820
Vibrator
LCD, 3.0”
262K TFT WQVGA
KEY PAD
KEY Back Light
Charge Pump
(AAT3169)
LED Matrix Module
SD1 (1.35V)
SD2(1.8V)
SD2(1.8V)
VAUX (2.9V)
VIO(2.62V)
VSIM(2.9V)
VMME (2.9V)
VUMTS(2.85V)
VUSB(3.1V) VLED (2.9V)
VAUDIOa(2.5V)
VAUDIOb(2.5V)
VRF1(2.85V)
VRF2(1.53V)
VRF3(2.70V)
VPLL(1.35V)
VRTC(2.0V)
VVIB(2.8V)
VBAT
DCS/PCS
GSM850/900
FEM PAM(TQ7M5005H)
3M CAM
FE1 FE2
PA_MODE
PA_BAND
TXON_PA
PA_LEVEL
AFC
I/I_/Q/Q_
RF_EN
RF_CLK
RF_DA
26M_MCLK
26M_TCXO
ANT
BPF
BT ANT
FM ANT
UART
/
/
I2S
/
BT_CLK
ADD(0:29)
/
DATA(0:15)
/
32kHz
HEADSET MIC
HEADSET RECEIVER
MAIN MIC
FM RADIO
FM RADIO
AUIDO AMP(MAX9877)
EPN11
EPP11
EPPA11
EPPA21
RXIN-
RXIN+
INA1
INA2 MAIN SPEAKEROUT-
OUT+
MIC1(P/N)
MIC2(P/N)
VMICP/N
I2C
/
INB1/2
tply
iwhzz
wylThtw
Match
Match
Match
Match
Controller
Battery
CHG_EN
T_IN1
I2C
/
(LED CTRL : 5 ea)
I2C
/
I2C
/
I2C
/
VBAT
END_KEY
COL
ROW
KEY_COL
KEY_ROW
2V11_RTC
2V11_RTC
B/UP BAT.
CAM_ I2C
/
I2C1
I2C1
I2C1
I2C1
CIF
MMC I/F
/
MMC I/F
VIB_EN
GPIO
PA_MODE
PA_BAND
TXON_PA
PA_LEVEL
UART
I2S
ymGpu{lymhjl
Memory
FM_ANT
T|ziGj
USW_P/USW_M
VBUS_USB
DIF
/
DIF
Touch Window
3-Axis Accelerometer
CAM_I2C
CAM_I2C
I 2C
/
I 2C
KEY_EN
GPIO
MUIC USW_ID
I2C
UART
HEADSET RECEIVER
HEADSET MIC
Solarcell Battery Cover (option)

- 18 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical brief
GD510 Operational Description Revision A
LG Electronics 18/113 LGE Property
3.2. Baseband Processor (BBP) Introduction
Figure 2 Top level block diagram of the S-GOLD3TM (PMB8877)
3.2.1. General Description
S-GOLD3TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD3TM Provides multimedia extensions such as camera,
software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed
signal portions of the base band in 0.09um, 1.2V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3TM support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12) and EGPRS (up to class 12) without additional external hardware.
3.2.2. Block Description
zProcessing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and
the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core

- 19 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. Technical brief
GD510 Operational Description Revision A
LG Electronics 19/113 LGE Property
zARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
zDSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
zShared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
zController Bus system
The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal
and external memories and with the peripheral buses.
zClock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
zFunctional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame
synchronous low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 3 USIF with autobaud detection, hardware flow control and integrated
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards
(up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

- 20 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical brief
GD510 Operational Description Revision A
LG Electronics 20/113 LGE Property
3.2.3. External Devices connected to memory interface
Table 1. Memory interface
Device Name Maker Remark
FLASH K522H1HACB-B060 Samsung Synchronous / A synchronous
DDR K522H1HACB-B060 Samsung Synchronous 166MHz
LCD IM200DST2A LGIT 8bit access 2 times transmission
Melody IC Not Used S/W Infineon Software CODEC
3.2.4. RF Interface (T_OUT)
S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2. RF Interface Spec.
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 FE2 FEM control
T_OUT2 PA_BAND TX RF band select
T_OUT3 FE1 FEM control
T_OUT4 Other function -
T_OUT5 Other function -
T_OUT6 PA MODE PAM Mode select
3.2.5. USIF Interface
GD510 have three USIF Drivers as follow :
- USIF1 : Hardware Flow Control / SW upgrade / Calibration
- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface
- USIF3 : BT Interface
Table 3. USIF Interface Spec.
Resource Name Remark
USIF1
USIF1_TXD UART_TX Transmit Data
USIF1_RXD UART_RX Receive Data
USIF1_CTS USB_DAT_VP
USIF1_RTS USB_SE0_VM
USIF2
USIF2_TXD SOLBAT_CHG_EN
USIF2_RXD ACCEL_INT
USIF2_CTS UART_BT_CTS
USIF2_RTS UART_BT_RTS.
USIF3
USIF3_TXD UART_BT_TX BT Transmit tx
USIF3_RXD UART_BT_RX BT Receive rx

- 21 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. Technical brief
GD510 Operational Description Revision A
LG Electronics 21/113 LGE Property
3.2.6. ADC channel
BBP ADC block is composed of 10 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4. S-Gold3 ADC channel usage
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 N.C
M3 N.C
M4 N.C
M5 N.C
M6 N.C
M7 N.C
M8 VSUPPLY Battery supply voltage measure
M9 N.C
M10 N.C
3.2.7. GPIO map
Over a hundred allowable resources, GD510 is using as follows except dedicated to SIM and Memory.
GD510 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is
shown in below table
Table 5 S-Gold3 GPIO pin Map
Port Function Net Name Description
KEY MATRIX G
KP_IN0 G
KP_IN1 G
KP_IN2 G
KP_IN3 KP_IN(3) G
KP_IN4 G
KP_IN5 KP_IN(5) G
KP_IN6 KP_IN(6) G
KP_OUT0 KP_OUT(0) G
KP_OUT1 LIN_INVERT G
KP_OUT2 KP_OUT(2) G
KP_OUT3 KP_OUT(3) G
USIF1 G
USIF1_RXD UART_RX UART, RS232 Data
USIF1_TXD UART_TX UART, RS232 Data
USIF1_RTS_N USB_DAT_VP USB Data
USIF1_CTS_N USB_SE0_VM USB Data
USIF2 G
USIF2 _RXD ACCEL_INT
USIF2 _TXD SOLBAT_CHG_EN Solar cell charge Enable