LG T5100 User manual

Service Manual Model : T5100
Service Manual
T5100
P/N : Date: June, 2004 / Issue 1.0

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* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the T5100.
REVISED HISTORY
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
May / 2004 ISSUE 1 Initial Release

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1. PERFORMANCE..................................... 6
1.1 H/W Feature ............................................ 6
1.2 Technical Specification ........................... 7
2. TECHNICAL BRIEF ............................ 12
2.1 General Description .............................. 12
2.2 Receiver Part ........................................ 12
2.2.1. RF Front End .............................. 13
2.2.2 Demodulator and base-band
processing .................................... 13
2.3 Synthesizer Part .................................... 13
2.4 Transmitter Part .................................... 14
2.4.1 IF Modulator ................................. 15
2.4.2 OPLL ............................................ 15
2.4.3 Power Amplifier Module ............... 16
2.5 26MHz Clock ......................................... 17
2.6. Power Supplies [LDO] .......................... 17
2.7 Digital Baseband ................................... 18
A. General Description .......................... 18
B. Block Description .............................. 18
C. External Devices connected to
memory interface .............................. 20
D. RF Interface (TPU, TSP block) ......... 20
E. SIM interface .................................... 20
F. UART Interface ................................. 21
G. GPIO Map ........................................ 22
2.8 Analog Baseband .................................. 23
A. General Description .......................... 23
B. Audio Signal Processing & Interface
........................................................... 23
C. Baseband Codec(BBC) .................... 24
D. Voltage Regulation(VREG) .............. 24
E. ADC Channels .................................. 26
F. Switch ON/OFF ................................. 26
G. Memories ......................................... 26
2.9 USB ....................................................... 27
2.10 DSP (For Video related process) ........ 27
A. General Description .......................... 27
B. Power circuit ..................................... 27
C.External Memory Interface ................ 28
D.Video Interface .................................. 28
E. External Audio Codec Interface ........ 29
F. DSP Pin description .......................... 30
G. LCD module pin description ............. 32
H.Camera module pin description ......... 33
I. Keypad Connector pin description ..... 34
3. BASEBAND PART TROUBLE
SHOOTING
.................................................................... 36
3.1 Main PCB side components - 1 ............. 36
3.2 Main PCB side components - 2.............. 37
3.3 Keypad side components ...................... 39
3.4 Power-On Trouble ................................. 40
3.5 Charging Trouble .................................. 40
3.6 LCD Display Trouble ............................. 43
3.7 Speaker/Receiver Trouble .................... 46
3.8 Microphone Trouble .............................. 51
3.9 Earphone Trouble ................................. 52
3.10 Vibrator Trouble .................................. 56
3.11 Keypad Backlight Trouble ................... 58
3.12 Folder On/Off and Trouble .................. 60
3.13 SIM Detect Trouble ............................. 63
3.14 Camera Trouble ................................... 65
3.15 Camera Flash Trouble ......................... 67
3.16 Infrared Data Association Trouble........ 69
4. RF PART TROUBLESHOOTING
.................................................................... 71
4.1 RF Components ..................................... 71
4.2 Trouble Shooting of Receiver Part ......... 72
4.2.1 Checking LDO Circuit .................. 73
4.2.2 Checking VCTCXO Circuit ........... 74
4.2.3 Checking RF Chipset Control
Signal ........................................... 75
4.2.4 Checking Mobile S/W and FEM
Circuit ........................................... 76
4.2.5 Checking Rx IQ Circuit ................. 78
4.3 Trouble Shooting Transmitter Part ......... 79
4.3.1 Checking LDO Circuit .................. 80
4.3.2 Checking VCTCXO circuits .......... 80
Table Of Contents

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4.3.3 Checking RF Chipset Control
Signals ......................................... 80
4.3.4 Checking Tx IQ signals ................ 81
4.3.5 Check PAM circuits ...................... 82
4.3.6 Checking Mobile S/W & FEM
circuits .......................................... 83
5. DISASSEMBLY INSTRUCTION .... 84
5.1 Disassembly .......................................... 84
6. Download ...................................... 99
6.1 Download Setup .................................... 99
6.1.1 In case of using the Data kit ......... 99
6.1.2 In case of using the PIF ............... 99
6.2 Download Procedure ........................... 100
6.3 T5100 Multimedia Chip Download ...... 107
7. Service and Calibration .............. 113
7.1 Service S/W ........................................ 113
7.1.1 Overview .................................... 113
7.1.2 Hardware and Software
Environment ............................... 113
7.1.3 Software Installation ................... 113
7.1.4 Common Properties of Service
Software ..................................... 113
7.2 Calibration ........................................... 116
7.2.1 Overview .................................... 116
7.2.2 Equipment List ........................... 116
7.2.3 Equipment Setup ....................... 117
7.2.4 Calibration steps ........................ 117
7.2.5 Test JIG Operation ..................... 120
8. CIRCUIT DIAGRAM ..................... 121
8.1 RF Interface ........................................ 122
8.2 Baseband Interface ............................. 123
8.3 LCD Connector, Camera Connector,
Keypad Connector .............................. 124
8.4 DSP ..................................................... 125
8.5 Memory Interface, USB interface ........ 126
8.6 MIDI, Audio ......................................... 127
8.7 I/O Receptacle, USB Interface, IrDA
Interface .............................................. 128
8.8 Keypad ................................................ 128
9. PCB LAYOUT ...................................... 129
9.1 Main Top ............................................. 129
9.2 Main Bottom ........................................ 130
9.3 Keypad Top ......................................... 131
9.4 Keypad Bottom .................................... 132
10. ENGINEERING MODE ................... 133
11. STANDALONE TEST ...................... 135
11.1 Setting Method ................................ 135
11.1.1 COM Port ............................. 135
11.1.2 Tx Test ................................. 135
11.1.3 Rx Test ................................. 135
12. EXPLODED VIEW &
REPLACEMENT PART LIST ....... 136
12.0 EXPLODED VIEW .......................... 136

1. PERFORMANCE
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1.1 H/W Feature
1. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 950mAh
AVG TCVR Current 240mA
Standby Current < 4.5mA
Talk time 4.8hours (GSM TX Level 7)
Standby time 260 hours (Paging Period:9, RSSI: -85dBm)
Charging time 2.5 hours
RX Sensitivity GSM900 : -105dBm, DCS : -105dBm
TX output power GSM, EGSM: 33dBm (Level 5)
DCS : 30dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 176 x 220 TFT LCD(main)
96 x 96 TFT LCD(sub)
Soft icons
Keypad
Status Indicator 0 ~ 9, #, *, Navigation Key, Up/Down Side
Key, Shutter Side Key, Confirm Key,
Clear Key, Send Key, END/PWR Key
ANT Internal
EAR Phone Jack 4 pole earphone jack
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recording Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit

1. PERFORMANCE
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1.2 Technical Specification
Item Description Specification
GSM900
TX: 890 + n x 0.2 MHz (n=1 ~ 124)
890 + (n-1024) x 0.2 MHz (n=975 ~ 1023)
RX: TX + 45 MHz
1Frequency Band
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1ppm
GSM900
Level Power Toler. Level Power Toler.
533 dBm ᴦ2dB 13 17 dBm ᴦ3dB
631 dBm ᴦ3dB 14 15 dBm ᴦ3dB
729 dBm ᴦ3dB 15 13 dBm ᴦ3dB
827 dBm ᴦ3dB 16 11 dBm ᴦ5dB
925 dBm ᴦ3dB 17 9 dBm ᴦ5dB
10 23 dBm ᴦ3dB 18 7 dBm ᴦ5dB
11 21 dBm ᴦ3dB 19 5 dBm ᴦ5dB
12 19 dBm ᴦ3dB
4Power Level DCS1800
Level Power Toler. Level Power Toler.
030 dBm ᴦ2dB 8 14 dBm ᴦ3dB
128 dBm ᴦ3dB 9 12 dBm ᴦ4dB
226 dBm ᴦ3dB 10 10 dBm ᴦ4dB
324 dBm ᴦ3dB 11 8 dBm ᴦ4dB
422 dBm ᴦ3dB 12 6 dBm ᴦ4dB
520 dBm ᴦ3dB 13 4 dBm ᴦ4dB
618 dBm ᴦ3dB 14 2 dBm ᴦ5dB
716 dBm ᴦ3dB 15 0 dBm ᴦ5dB

1. PERFORMANCE
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Item Description Specification
GSM900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS1800
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM900
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
Output RF Spectrum
1,200 -21
6(due to switching transient) 1,800 -24
DCS1800
Max. (dBm) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27

1. PERFORMANCE
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Item Description Specification
7Spurious Emissions Conduction, Emission Status
Conduction, Emission Status
GSM900
8Bit Error Ratio BER (Class II) < 2.439% @-102dBm
DCS1800
BER (Class II) < 2.439% @-102dBm
9Rx Level Report accuracy ᴦ3 dB
10 SLR 8 ᴦ3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 /
12 RLR 2 ᴦ3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 2 -7
500 *-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*Meanthat Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR > 17 dB
15 Stability Margin > 6 dB

1. PERFORMANCE
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Item Description Specification
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion -10 33.3
033.7
731.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18 <Change> System frequency ᴪ2.5 ppm
(13 MHz) tolerance
19 <Change>32.768KHz tolerance ᴪ30ppm
Standby
20 Power consumption - Normal ,ᴪ4.5mA(Mix. power)
21 Talk Time GSM900/Lvl 7 (Battery Capacity 950mA): 288 min
GSM900/Lvl 12(Battery Capacity 950mA): 490 min
Under conditions, at least 250 hours:
1. Brand new and full 950mAh battery
2. Full charge, no receive/send and keep GSM in idle
22 Standby Time mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current Fast Charge : < 550 mA
Slow Charge: < 100 mA
Antenna Bar Number Power
5–85 dBm ~
25 Antenna Display 4–90 dBm ~ –86 dBm
3–95 dBm ~ –91 dBm
2–100 dBm ~ –96 dBm
1–105 dBm ~ –101 dBm
0~–105 dBm

1. PERFORMANCE
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Item Description Specification
Battery Bar Number Power
03.62V.
26 Battery Indicator 13.68V.
23.74V.
33.87V.
43.88V.ᴦ0.03V
3.62V.ᴦ0.03V (Call)
27 Low Voltage Warning 3.5V.ᴦ0.03V (Standby)
28 Forced shut down Voltage 3.35V ᴦ0.03 V
1 Li-ion Battery
29 Battery Type Standard Voltage = 3.7V
Battery full charge voltage = 4.2V
Capacity: 950mAh
Switching-mode charger
30 Travel Charger Input: 100 ~ 240 V, 60Hz
Output: 5.2V, 800mA