LG 15LS1RA User manual

R
LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LN71A
MODEL : 15LS1RA 15LS1RA-MK
website:http://biz.LGservice.com

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................18
EXPLODED VIEW .................................................................................. 20
REPLACEMENT PARTS LIST ............................................................... 22
SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500oF to 600oF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500oF to 600oF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500oF to 600oF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
1. General Specification
NOTE : Specifications and others are subject to change without notice for improvement .
NO. Item Content Remark
1 User Model Name 15LS1R-MK CSA(NTSC, PAL M/N)
2 Feature 15" LCD TV
3 Chassis Name LN71A
4 General Scope External SW &Adj. POWER, INPUT, MENU, ENTER, VOL(F/G), CH(D/E) 8Keys
5 Power Cord Length : 1.87±0.04 M NATION
Shape : Wall-out,
Color : BLACK
6 Power Adapter No
7 LCD Module Feature Maker CPT
Type TFT Color LCD Module
Active Display Area 15.0 inches diagonal [304.1(H) x 228.1(V)]
Pixel Pitch [mm] 0.297mm(H) x 0.297mm(V) x RGB
Electrical interface LVDS
Color Depth 6BIT WHITE FRC, 16.2M colors P/N :
Size [mm] 326.6(W) x 253.5(H) x 14.0(D) EAJ36404601
Surface Treatment Anti Glare CLAA150XP07
Operating Mode Normally White, TN
Back light Unit CCFL, 4 tables, edge-light(top/bottom)
R/T Typ R.T. : 5ms + F.T. : 6ms (Typ.)
No.
1 Product Dimension Width (W) Length (D) Height (H)
Before Packing 463.3 166.3 353.5 With Stand
After Packing 527.0 175.0 470.0
2 Product Weight Only SET 3.94kg(CPT)
With BOX 5.04kg(CPT)
3 Container Individual or Palletizing 20ft 40ft
Loading Indi. Wooden Indi. Wooden
Quantity 858 720 1716 1584
4 Stand Assy Type Base detachable
Size (W x D x H) 302.2(W) x 166.3(D) x 68(H)
Tilt Degree -3(-0/+3) ~ +10(±2)
Tilt force Target 1.5Kgf (0.8Kgf ~ 2.0Kgf)
Swivel Degree —NON
Swivel Force —NON
5 Appearance General Refer to Standard of LG(55)G1-1020
Item Content Remark
2. Mechanical specification

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3. Engineering Specification
No. ITEM Specification Remark
1 ENERGY VIDEO POWER CONSUMPTION LED COLOR
Normal Active ≤40W Green
Stand By Off ≤1W(110V) Red
≤1W(220V)
2 D-SUB 1 : RED 2 : Green
10 : Digital GND
Pin configuration 3 : Blue 4 : ID2 (GND)
5 : S.T (GND) 6 : RED GND
7 : Green GND 8 : Blue GND
9 : N.C 10 : D-GND
11: ID0(GND) 12 :SDA
13: H-Sync 14 : V-Sync
15: SCL Shell : GND
3 Control Function 1) Contrast/Brightness
2)H-Position/ V-Position
3) Tracking : Clock/Phase
4) Auto Configure
5) Reset
4. Optical Characteristic
No Item Specification Remark
Min Tpy Max
1 Viewing Angle [CR≥5] Horizontal / Vertical 150 170 Deg
2 Luminance Luminance (cd/m2) 250 350 APC : Clear,ACC : Cool
White Lumnance Uniformity 75% 80% White (100 IRE)
3 Contrast Ratio CR 2400 3000 All whit / All black
(Set up Level = 0 IRE)
4 CIE Color Coordinates White Wx 0.298 0.313 0.328 In Video input
(Warm) Wy 0.314 0.329 0.344 APC : Clear
White Wx 0.270 0.285 0.300 White (85 IRE)
(Normal) Wy 0.278 0.293 0.308
White Wx 0.261 0.276 0.291
(Cool) Wy 0.268 0.283 0.298

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5. Outgoing Condition
No Item Condition Remark
1 Power Off
2 Volume Level 30
3 Main Picture Input TV
4 Main Last Channel TV 2
5 Mute Off
6 Channel Auto Programme To start
Manual Programme TV 2
Memory
Fine 0
Favourite Programme
7 PICTURE APC Clear
Optimum
Soft
User Contrast 100
Brightness 50
Color 60
Sharpness 50
Tint 0
ACC Cool
Normal
Warm
User Red 0
Green 0
Blue 0
Reset To set
8 SOUND DASP Flat
Music
Movie
Sports
User
AVL Off
Balance 0
9 TIME Clock -- : -- AM
Off timer -- : -- AM
Off
On time -- : -- AM
Ch, TV 2
Vol. 30
Off
Auto off Off
10 SPECIAL Language English 3 Languages
Key lock Off
Caption/ Text Mode 1
Mode 2
Text 1
Text 2
Off

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1. Application Range
This document is applied to 15", 20” LCD TV.(chassis : LN71A)
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : Free Voltage
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller
* Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and check the following tabs.
* Port type - Choose the your port type, Normally “LPT1”,
or “LPT2”
* Speed - Choose the speed from 70 to 99
* JIG - Choose the your JIG type, Normally “Mstar” or
“LGE”, and then click the Apply.
3) Click “Connect” tab. If flash memory is detected normally,
Flash memory type will be displayed.
Example:‘MX25L4005’(MX) or ‘Winb25X40’(Winbond),,,etc
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
5) Click “Auto” tab and set as below, and then click “Run”.
6) After downloading, check “OK” message.
3. Main PCB check process
* APC - After Manual - Insert, executing APC
3.1. ADC Process
(1) PC input ADC (15inch only)
1) Auto RG Gain/ Offset Adjustment
(a) Convert to PC in Input-source.
(b) Signal equipment displays.
- Output Voltage : 730 mVp-p
- Impress Resolution XGA (1024 x 768 @ 60Hz)
- Pattern : gray pattern that left & right is black and
center is white signal.(Refer below picture)
(Model : 60, Pattern : 28 at MSPG925L)
(c) Adjust by commanding AUTO_COLOR_ADJUST
(0xF1) 0x00 0x02 instruction.
ADJUSTMENT INSTRUCTION
(4)
filexxx.bin
(6) ........OK
(5)

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2) Confirmation
(a) We confirm whether “0x8C” address of EEPROM
“0xB4” is “0xAA” or not.
(b) If “0x8C” address of EEPROM “0xB4” isn’t “0xAA”,
we adjust once more.
(c) ADC result is displayed to “OK” or “NG” on left and
lower of the screen.
(d) We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”.
(2) Component input ADC
1) Auto Component Gain/Offset adjustment
a) Convert to Component in Input-source
b) Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution : Component 480p.
Pattern: 8color & 16gray pattern(Refer below picture).
(Model:212, Pattern: 8 at MSPG925L)
c) Adjust by commanding AUTO_COLOR_ADJUST
(0xF1) 0x00 0x02 instruction.
2) Confirmation
a) We confirm whether “0x8E” address of EEPROM
“0xB4” is “0xAA” or not.
b) If “0x8C” address of EEPROM “0xB4” isn’t “0xAA”, we
adjust once more
c) ADC result is displayed to “OK” or “NG” on left and
lower of the screen.
d) We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”.
* Manual ADC process(using Service Remocon)
- RGB & Component Mode
After enter Service Mode by pushing “INSTART” key,
execute “Auto-RGB” by pushing “_” key at “Auto-RGB”
Before : “ADC RGB-NA” “ADC CPNT-NA”
After : “ADC RGB-OK” “ADC CPNT-OK”
3.2. Function Check
(1) Check display and sound
- Check Input and Signal items
1) TV
2) Video (CVBS/ S-Video)
3) Component (YPbPr)
4) RGB (PC : 1024 x 768@60Hz) - 15” only
* Display and Sound check is executed by Remote control.
4. Total Assembly line process
4.1. Adjustment Preparation
(1) Above 30 minutes Heat-run in RF no signal
(2)15 Pin D-Sub Jack is connected to the signal of Pattern
Generator.
4.2. Confirm color coordinate of RGB-15” only
(1) Set Input to RGB
(2) Input signal : XGA(1024 x768 @ 60Hz), Full white 216/255
gray level (85 IRE, Model : 60, Pattern : 78 at MSPG925L)
(3) Set CSM : Cool
(4) Confirm whether x=0.276 ± 0.03, y=0.283 ± 0.03, y ≥180 or not.
4.3. Confirm color coordinate of Video
(1) Set Input to Video.
(2) Input signal : CVBS, NTSC @ 60Hz
Full White 216/255 gray level (85 IRE, Model : 201
Patter : 78 at MSPG925L)
(3) Set APC : Clear / ACC : Cool
(4) Confirm whether x = 0.276±0.03, y = 0.283±0.03, y ≥180
(15”)/ Y ≥250(20”) or not.
4.4. Confirm color coordinate of Component
(1) Set Input to Component.
(2) Input signal : Component(YPbPr), 480P
Full White 216/255 gray level and 480P
(Model : 212 Patter : 78 at MSPG925L)
(3) Set APC : Clear / ACC : Cool
(4) Confirm whether x = 0.276±0.03, y = 0.283±0.03, y ≥180
(15”)/ Y ≥250(20”) or not.
4.5. Other quality
(1) Confirm that each items satisfy under standard condition
that was written product spec.
(2) Confirm Video and Sound at each source.
1) Video
(a) Select input Video(S-video) and check whether
picture is displayed or not.
(b) Select input Video(CVBS) and check whether picture
is displayed or not.
(c) Select input Component 480P and check whether
picture is displayed or not.
2) TV : Select input TV and check below item.(In Gumi factory)
CH04 (US-04) - Stereo Sound Check
CH30 (US-30) - Dual Sound Check
CH02 (US-02) - Stereo, SAP Sound Check
- Caption Check
3) RGB(PC/DTV) - 15” only
Select input RGB and check whether picture is
displayed or not.
4) Component
Select input component and check whether picture is
displayed or not.
Auto Color Balance
ADC RGB0OK CPNT-OK
Auto-RGB To set
Red Offset xxx
Green Offset xxx
Blue Offset xxx
Red Gain xx
Green Gain xx
Blue Gain xx
Reset To set

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4.6. Power consumption confirmation
(1) Check if Power LED Color and Power Consumption
operate as standard.
(2) Measurement Condition : 230V@ 60Hz (Analog)
(3) Confirm Stand-by operation.
4.7. DDC EDID
(1) Connect D-sub Signal Cable to D-Sub Connector.
(2) Write EDID data to EEPROM(24C02) by using DDC2B
protocol.
(3) Check whether written EDID data is correct or not. (refer to
Product spec).
4.8. Outgoing condition Configuration
(1) After all function test, press IN-STOP Key by Service
Remote control. And make ship condition.
(2) When pressing IN-STOP key by service remote control,
green and red LED are blinked alternatively. And then
Automatically turn off.(Must not AC power off during
blinking)
4.9. Option data setting (SVC OSD setting)
- NTSC Service Mode OPTION DATA(According to Suffix)
5. Adjustment Command
5.1. Adjustment Command(LENGTH=84)
15LS1RA-MK 20LS1RA-MK
3970 1920
Resolution 2 0
Module 0 0
TV 1 1
Video 1 1
COMPONENT 1 1
PC-RGB 1 0
DVI 0 0
HDMI 0 0
Area Option[A B]
PAL
(A) 0 : FACTORY MODE OFF
1 : FACTORY MODE ON
[Caution] FACTORY MODE ON only used in factory.
(B) 0: default Option setting.
1~4: The other Area Option setting.(Reserved)
[Caution] Initial Setting of Area Option is [1 0] in production line.
After IN-STOP, Area Option will change [0 0].
If Area Option isn’t 00 after IN-STOP, must change to 00. (Using G
key on R/C)
NTSC
S. Am : For South America
Korea : For Korea
Item Condition Remark
2HR-OFF 1 0 : 2 Hour off option-OFF
1 : 2 Hour off option-ON
FACTORY-MODE 0 0 : EEPROM Write Protection On
1 : EEPROM Write Protection Off
CHANNEL-MUTE 1 0 : Channel Mute Off
1 : Channel Mute On
VAL
00
00
data
00
00 – 100
00 – 100
00 – 100
00 – 100
00 – FF
00 – FF
00 – FF
00 – 7F
00 – 7F
00 – 7F
00 – 3F
00 - 64
02
0, 1, 2, 3
00, FF
0, 1, 2, 3
Description
EEPROM all clear
EEPROM Read
EEPROM Write by
some values
Color Save
They have different
range each mode,
FOS Adjustment
Drive adjustment
Offset adjustment
Bright adjustment
Luminance adjustment
Auto COLOR
Adjustment
0: COOL
1: NORMAL
2: WARM
3: USER
00: Factory mode off
FF: Factory mode On
0 : TV
1 : AV1
2 : AV2
3 : Component
4 : RGB
5 : DVI
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Adjustment Contents
EEPROM ALL INIT.
EEPROM Read
EEPROM Write
COLOR SAVE
(R/G/B cutoff, Drive,
Contrast, Bright)
H POSITION
V POSITION
CLOCK
PHASE
R DRIVE
G DRIVE
B DRIVE
R CUTOFF
G CUTOFF
B CUTOFF
BRIGHT
CONTRAST
AUTO_COLOR_
ADJUST
CHANGE_COLOR_
TEMP
FACTORY_
DEFAULT
AUTO_
INPUTCHANGE
CMD(hex)
E4
E7
E8
EB
20
30
90
92
16
18
1A
80
82
84
10
12
F1
F2
F3
F4
ADR
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00

5.2. EEPROM DATA READ
(1) Signal Table
(2) Command Set
Purpose : To read the appointment Address of E2PROM by
128(80h)-byte
5.3. E2PROM Data Write
(1) Signal Table
LEN : 84h+Bytes
CMD : 8Eh
ADH : E2PROM Slave Address(A0,A2,A4,A6,A8),
Not 00h(Reserved by BufferToEEPROM)
ADL : E2PROM Sub Address(00~FF)
Data : Write data
(2) Command Set
<Purpose>
1) EDID write : 16-byte by 16-byte, 8 order (128-byte) write
(TO “00 – 7F” of “EEPROM Page A4”)
2)FOS Default write : 16-mode data (HFh, HFl, VF, STD,
HP, VP, Clk, ClkPh, PhFine) write
3) Random Data write : write the appointment Address of
E2PROM
5.4. VRAM Read
1) Send CMD(70h) to read Video RAM value from MICOM
And save its value to 128-Bytes Buffer(Common Buffer for
the use of EDID).
2) Delay 500ms(Time to wait and read vZideo RAM from
MICOM)
3) Be transmitted the contents of MICOM’s 128-bytes Buffer to
PC.(128th Data is the CheckSum of 127-bytes data : That’s
OK if the value of adding 128-bytes Data is Zero)
ADL(hex)
0
80
0
80
0
80
0
80
Details
0-Page 0~7F Read
0-Page 80~FF Read
1-Page 0~7F Read
1-Page 80~FF Read
2-Page 0~7F Read
2-Page 80~FF Read
3-Page 0~7F Read
3-Page 80~FF Read
Adjustment Contents
EEPROM READ
CMD(hex)
E7
ADR(hex)
A0
A2
A4
A6
ST OP
A AD16F
ST OP
ST ART
A
A
A
Dn
A A A506E 03 CMD ADH
84
ST ART AA
ADL A CS
128 Bytes
Delay 100ms
ST OP
A
AA
AA 506E 03 CMD ADH84+ n
ST ART
ADL A
CS
A
A
Data_1 A. . . Data_n A
- 12 -
No.
1
2
Adjustment contents
EEPROM WRITE
CMD(hex)
E8
LEN
94
84+n
Details
16-Byte Write
n-byte Write
A
CS
AData1
6F
ST ART
. . . Data12 ST OP NA
ST OP
A A A A A50 6E 03 70 00 84
ST ART
AA 00 A CS

Mode Section Polarity DOT CLOCK Frequency Total Period(E) Display(A) Front Sync.(D) Back Resolution Remark
[MHz] [kHz]/ [Hz] Porch (B) Porch (F)
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480 O
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600 O
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) + 35.999 35.156 1024 800 40 128 72 800 x 600 O
V(Lines) + 56.250 800 600 1 4 24
4 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768 O
V(Lines) - 60.004 806 768 3 6 29
- 13 -
6. Signal Timing(Resolution) - 15” only

- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check short of main B/D
or Change LIPS.
Change IC903.
Change LED Assy.
Check 15V or 5V
of LIPS.
Check Output of
IC903.
Check LED Assy.
Check P901, P270, Connector.
Fail
Fail
Change Q904.
Check Output of
Q904. Fail
Pass
Fail
Pass
Pass
Pass
:[A]Process

- 15 -
No Raster
Check LED Status
on display unit.
Check the input/
Output of IC100.
Check
IC900, IC901, IC906, IC908,
IC909, IC910.
Check inverter
connector or inverter.
Check inputting source cable
and jack.
Repeat [A] PROCESS.
Fail
Change IC900, IC901, IC906,
IC908, IC909, IC910.
Fail
Change IC100.
Fail
Change inverter connector or
inverter.
Fail
Change panel link cable or
module.
Fail
Check panel link
cable or module.
Pass
Pass
Pass
Pass
Pass
:[B]Process

- 16 -
No Raster on AV Signal
(Component, CVBS, S-VHS) No Raster on TV(RF) signal
Change R103, R104, R106, R108,
R132, L822, L800, L801.
Check the
signal of R103, R104,
R106, R108, R132, L822,
L800, L801.
Repeat
[A] Process . Check the output
of TU500.
Check the
input/ output of IC100.
Check inputting source cable
and jack.
Fail
Fail Fail
Fail
Re-solder or change the defect part.
Check X100.
Check 5V of TU500.
Re-solder or change the
defect part.
Pass
Pass
Pass

- 17 -
No Sound
Check the speaker wire
Change source input.
Check the
input source. Fail
Pass
Re-solder or Change the defect part.
Check X100.
Check the input/output
of IC100 Fail
Pass
Re-solder or change the defect part.
Check the input/output
of IC400 Fail
Pass
Change the speaker
Check the speaker
Fail
Pass

- 18 -
BLOCK DIAGRAM
IR detector
5V
LVDS MODULE
MX25L4005A
(Serial Flash)
Control Board(Tact Switch)
LED
Speaker Left Speaker Right
TTL MODULE
15V 5V 15V 12V_Panel
5V 5V
15V
LIPS
YPbPr in
Aud io in
Video in
Audio in
Y in
C in
Control in/out
EEPROM
(24C64)
CVBS
Jack
S-Video
Jack
Stereo -In
(Option)
H/P
Output
LED / IR / Control
Power
Video
Audio
Dat a
Address Data
CLK,DQM, WEZ,CASZ,RASZ
EEPROM
(24C02)
M12L16161A -5TG
(SDRAM)
CVBS TunerCVBS Tuner
SCL/SDA
SCL/SDA
SCL/SDA
SIF_OUT
MST96585
(Scaler + Video Decoder)
Component D-Sub
RS-232C
(Option)
Rx/Tx
3.3V
12V
Regulator
Regulator
Regulator
Regulator
Regulator
5V 1.8V
LED/IR Board
Control
MX232A
(RS-232C)
ON/OFF
PWM_DIM
DIM _CTL
YDA1 38
(Audio amp)
Rx/Tx
FET Switch
(SI4925BDY)
5V
12V
IF_Video

- 19 -
MEMO

- 20 -
EXPLODED VIEW
300 200
120
120
590 431
580
520
411
400
530
441
440
430