LG M227WAP-PMM User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP92C
MODEL : M227WAP M227WAP-PMM
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only
P/NO : MFL63261604(1002-REV00) Printed in Korea

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................13
TROUBLE SHOOTING ............................................................................19
BLOCK DIAGRAM...................................................................................23
EXPLODED VIEW .................................................................................. 2
SVC. SHEET ...............................................................................................
- 2 -

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Only for training and service purposes - 3 -
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View It is essential that these critical parts
should be replaced with the manufacturer’s specified
parts to prevent electric shock, fire or other hazard.
Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
Must mount the module using mounting holes arranged
in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
Make certain that treatment person’s body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a soft material. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

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Only for training and service purposes - 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 546.86 mm(21.53 inch) diagonal
3 Active Display area 476.64(H) 268.11(V) mm
4 Outline Dimension 495.6(H) x 292.2(V) x16.5(D) mm Typ. (Without Inverter)
5 Aspect Ratio 16:9
6 Pixel Number 1920 x RGB x 1080 pixel
7 Pixel Pitch 0.248(H) x 0.248(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16.7M color (6bit with A-FRC)
10 Electrical Interface LVDS
11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
12 Operating Mode Normally White
13 Backlight Unit 4 CCFL (4 lamps)
14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.
15 Color Gamut Normal 72% Panel(CIE1931)
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
. Module Specification
LGD, LM215WF1-TLA1 ( P/N : EAJ60156901)
1. Application Range.
This spec sheet is applied to the 55 cm(21.5 inch) LCD
Monitor TV used LP92C chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Temperature : 25 °C ± 5 °C (77 °F ± 9 °F),
CST : 40 °C ± 5° C
2.2 Relative Humidity : 65 % ±10 %
2.3 Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification, UL6500
EMC : CE, IEC, FCC Part 15Class A/ B
Safety : IEC/EN60065
EMI : EN55013
EMS : EN55020

5. General Specification
5.1 TV
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No Item Specification Remarks
1 Market Central and South America
2 Broadcasting system NTSC
PAL-M
PAL-N
BAND NTSC
3 Receiving system VHF 2 ~ 13
UHF 14 ~ 69
CATV 1 ~ 125
4 Receiving system Upper Heterodyne
5 Component Input (1EA) Y/Cb/Cr
Y/Pb/Pr
6 CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Rear) :PAL50, SECAM, NTSC, PAL60
7 RGB Input RGB-PC Analog(D-SUB 15Pin)
8 HDMI Input (1EA) HDMI1-DTV/PC HDMI version 1.3 , Support HDCP
9 Audio Input (3EA) RGB-PC/ DVI Audio
Component L/R Input
CVBS
10 Earphone out (1EA) Antenna, AV, Component,
RGB-PC, HDMI1

No Item Specification Remarks
1 Supported Sync. Type Separate Sync.(RGB), Digital(DVI)
2 Operating Frequency Analog Horizontal 30 ~ 69kHz
Vertical 56 ~ 61 Hz
Digital Horizontal 28 ~ 83kHz
Vertical 48 ~ 61 Hz
3 Resolution Analog Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
Digital Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
4 Input Voltage Voltage :100 – 240 V ac , 50 Hz or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On On Typ. On/On Active Blue 45W
mode Max On/On Active Blue 60W M227WAP
Typ. On/On Active Blue 50W
Max On/On Active Blue 65W M237WAP
Sleep mode Off/On Off Amber 1W RGB
On/Off
Power S/W Off Off mode - Off Off 0.5W Just operate power key
and remote controller power button
7 MTBF 50,000 HRS with 90% Confidence leve 22”AUO:40,000 Hours(min)
Lamp Life: 23”LGD:50,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
10 Storage Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing
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5.2 RGB - PC

No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10
Up/Down 65/65 80/80
2 Luminance Luminance (cd/m2) 250 300 -
Variation(%) 75 Min/ Max
3 Contrst Ratio CR 700 1000
Full white/Full black
4 Color Coordinates [CIE1931] White WX0.313
WYTyp. 0.329 Typ.
RED Xr -0.03 0.646 +0.03 RGB
Yr0.334 Vivid, 6500K
Green Xg0.303
Full white(100IRE)
Yg0.616
Blue Xb0.147
Yb0.067
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6. Chroma & Brightness
6.1 M227WDAP – 21.5” LCD Module (for more details, refer to the module spec.)
* Optical Test Condition
- Surrounding Brightness Level : dark
- Surrounding Temperature : 25±5°C
- warm-up Time : 30 Min
- Contrast, Brightness : Outgoing condition
- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.
* Active area
1. Active area of LCD PANEL is in bezel of cabinet.
2. Interval between active area and bezel
|A-B|<1.0 mm , |C-D|<1.0 mm
A: Interval between left of active area and bezel
B: Interval between right of active area and bezel
C: Interval between top of active area and bezel
D: Interval between bottom of active area and bezel
C
B
D
A
Active Area
Bezel

No Item module Min Typ Max Remark
1 22/23 inch 24000:1 30000:1 PC Mode(D-sub, DVI) For Checking Black Luminance,
wait for over 1 minute.
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8. Component Video Input (Y, PB, PR)
7. SET Optical Feature
7.1 PC Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))
No Item module Luminance (cd/m2) C/R(min) Remark
Min Typ Max Min Typ
1 22/23 inch - 250 300 - 700:1 71000:1 RGB
DFC 30000:1
No. Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 33.72 59.94 74.176 HDTV 1080I
11. 1920*1080 33.75 60.00 74.250 HDTV 1080I
12. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
7.2 Special feature(DFC)
-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub

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9. RGB Input ( PC )
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 640*480 31.469 59.94 25.175
2 800*600 37.879 60.317 40.0
3 1024*768 48.363 60.0 65.0
4 1152*864 54.34 60.05 80
5 1280*960 60 60 108.0
6 1280*1024 63.981 60.02 108.0
7 1680*1050 64.674 59.883 119.0
8 1680*1050 65.290 59.954 146.25
9 1920*1080 67.5 60 148.5
10. HDMI Input (DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
2 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 7Z20*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 33.72 59.94 74.176 HDTV 1080I
11 1920*1080 33.75 60.00 74.250 HDTV 1080I
12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
13 1920*1080 67.432 59.94 148.350 HDTV 1080P
14 1920*1080 67.5 60 148.5 HDTV 1080P
15 1920*1080 56.250 50 148.5 HDTV 1080P 50Hz

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Only for training and service purposes
11. Mechanical specification
11.1 M227WAP
No. Item Content Unit Remark
1. Product Width(W) Length(D) Height(H) mm
Dimension Before Packing 519.8 193.2 400.5 mm
After Packing 592 446 135 mm
2. Product Only SET 4.7 Kg
Weight With BOX 6.3 Kg
3. Container Individual or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden
Quantity 816 600 1700 1380
4. Stand
Type Detachable ( Base detachable)
Assy
Size(W x D x H) 271.2x 193.2x 108.4
Tilt Degree -5~15 degree
Tilt force 0.8~3.5kgf
Swivel Degree none
Swivel Force
5. Appearance General Refer to Standard of LG(55)G1-1020
*Appearance Gap spec
Front: 0.5 mm
Back & Bottom : 1.0 m

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ADJUSTMENT INSTRUCTION
1. Application
This document is applied to LP92C chassis 22” LCD Monitor
TV which is manufactured in Monitor Factory or is produced
on the basis of this data.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25°C±5°C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
6) Adjustment equipment: Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller
7) Don’t push The “IN STOP KEY” after completing the
function inspection.
3. Adjustment items
PCB assembly adjustment items
1) Download the MSTAR main software (IC603, Mstar ISP
Utility)
2) Auto Color Balance(ADC) - RGB
3) Auto Color Balance(ADC) – Component
4) Input Tool-Option/Area option.
5) Check SW Version.
SET assembly adjustment items
1) DDC Data input.
2) HDCP data input
3) Adjustment of White Balance.
4) Preset CH information
5) Factoring Option Data input.
. PCB assembly adjustment method
.1 Input Tool-Option, Area Option
Option adjustment following BOM (Tool Option 1, Area Option)
* Required Equipments
- Remote controller for adjustment
* Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market.
Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)
1) Push the IN-START key in the Adjust R/C.
2) Input the Option Number that was specified in the BOM, into
the Shipping area.
3) Select “Tool Option/ Area Option” by using E/D(CH+/-) key
, and press the number key(0~9) consecutively
ex) If the value of Tool Option1 is 7, input the data using
number key “7”
(If not changed the option, the input menu can differ from the
model spec.)
* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
* Before PCB check, you have to change the Tool option,
Areaoption and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
* Never push the IN-STOP KEY after completing the function
inspection.
.2 S/W program download
(Using MSTAR Download program)
Profile : This is for downloading the s/w to the flash memory of
IC603
Equipment
1) PC
2) ISP_tool program
3) Download jig
Connection structure
Connection condition
1) IC name and circuit number : Flash Memory and IC603
2) Use voltage : 3.3V (5 pin)
3) SCL : 15 pin
4) SDA : 12 pin
5) Tact time : about 2min
LW91A LPL L22FHD
Main V1.00
HDCP 0
UTT XX
Tool Option 1 37000
Tool Option 2 112
Area Option 20

.2.1 Preliminary steps
(1) Download method 1 (PCB Assy)
(2) Connect the download jig to D-sub jack
.2.2 Download Steps
(1) Execute ‘ISP Tool’ program in PC, then a main window will
be opened
(2) Click the connect button and confirm “Dialog Box”.
(3) Click the Config button and Change speed
E2PROM Device setting : over the 350Khz
(4) Read and write bin file
Click ”(1)Read” tab, and then load download file(XXXX.bin)
by clicking “Read”.
(5) Click “Auto(2)” tab and set as below
(6) click “Run(3)”.
(7) After downloading, check “OK(4)” message.
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.3. ADC Process
.3.1 ADC calibration
* MSPG-925
- Component: series Model : 216 (720P@60Hz)
- RGB: Model : 60(1024X768@60Hz)
.3.2 PC input ADC
.3.2.1 Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage: 700 m Vp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 SERIES)
Adjustment pattern (PC )
- Adjust by commanding AUTO_COLOR_ADJUST.
.3.2.2 Confirmation
- We confirm to address “0xF3 (offset), 0xF4 (gain)” in page
“0x0E” of EEPROM the value is “0xAA’ or not.
- If the value is not “xAA”, we adjust once more.
- We can write the ADC values from “0x06~0x0B” addresses
in a page “0x0E”.
*Manual ADC process using Service Remocon. After enter
Service Mode by pushing "ADJ" key, execute "Auto-RGBB" by
pushing " " key at "Auto-RGB".
.3.3 COMPONENT input ADC
.3.3.1 Component Gain/Offset Adjustment
- Convert to Component in Input-source
- Signal equipment displays
Impress Resolution 720p
MODEL : 216 in Pattern Generator(720P/60Hz 100% Color
Bar Mode)
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)
Adjustment pattern (COMPONENT )
- Adjust by commanding AUTO_COLOR_ADJUST.
.3.3.2 Confirmation
- We confirm to address “0xF3 (offset), 0xF4 (gain)” in page
“0x0E” of EEPROM the value is “0xAA’ or not.
- If the value is not “xAA”, we adjust once more.
- We can write the ADC values from “0x06~0x0B” addresses
in a page “0x0E”.
*Manual ADC process using Service Remocon. After enter
Service Mode by pushing "ADJ" key, execute "Auto-RGB" by
pushing " " key at "Auto-RGB".

5. EDID
(The Extended Display
Identification Data ) / DDC(Display
Data Channel) download
* Caution 1: Use the proper cables below for EDID Writing
* Caution 2: Write EDID data to EEPROM by using DDC2B
Protocol.
5.1 Profile : To be possible for plug and
play
5.2 Equipment
1) Adjusting PC with S/W for writing EDID Data.(S/W : EDID
TESTER Ver.2.5)
2) A Jig for EDID Download
3) Cable : D-sub 15Pin cable, HDMI cable.
5.3 DDC EDID Write (RGB 128Byte )
- Connect D-sub Signal Cable to D-Sub Jack.
- Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
- Check whether written EDID data is correct or not.
5. DDC EDID Write (HDMI 256Byte)
- Connect HDMI Signal Cable to HDMI Jack.
- Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
- Check whether written EDID data is correct or not
5.5 EDID data
1) M227WAP
5.5.1. RGB EDID Data
1) M227WAP
5.5.2. HDMI EDID Data
1) M227WAP
- All data are HEXA
- Adjustable Data :
**: week
***: year ex) when year 2008 : input “12”
**** : CHECK SUM (deferent along week, year)
- 16 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
For Analog EDID For HDMI EDID
No. Item content 16bit Data
1 Manufacturer ID GSM 1E6D
2 ProductID 22426(Analog) 579A
22428(HDMI) 579C
3 Year 2009 13
4 Version Analog : 1
Digital : 1 1
5 Revision Analog :
Digital : 3
6 Model Name M227W
****
** ***
*
****
****
** *** *

6.HDCP(High-Bandwidth Digital
Contents Protection)
* confirmation
* Before HDCP Download, you have to Set the Configuration
that CMD delay.
-> Configuration -> Option-> I2C delay(Write Byte : 0.5
ms, Read Byte : 0.5ms,
Read CMD Byte : 0.5ms)
* Change the DDC -> After Write Data delay Time 20ms
* Check the Communication Clock -> 45KHz.
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on Main M-STAR IC(LGE7871)
which is 0x80~0xA0 addresses of 0x00~0x01
page(EEPROM MAP PAGE0~PAGE1 / START :A080).
4) AC off/on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925.
5) HDCP Key value is different among the sets
7.Adjustment of White Balance
7.1 Purpose and Principle for adjustment
of the color temperature
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the
saturation,Fix the one of R/G/B gain to C0 and
decrease the others.
- Adjustment mode : Cool , Medium , Warm
** Required Equipment
- Remote controller for adjustment
- Color Analyzer : CA-210
- CH : 09 (LCD MNT, Normal) Ë M197WAP / M227WAP/
M237WAP
- Auto W/B adjustment instrument(only for Auto adjustment)
- PC (for communication through RGB)
- Pattern Generator (MSPG-925FS series. )
7.2 Connecting diagram of equipment for
measuring (For Automatic Adjustment)
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only
key
- Maintain the DDC adjustment mode with same condition
of Heat-run
-> Maintain after AC off/on in status of Heat-run pattern
display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode)
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment)
- Need to transmit the aging off command to TV set after
finishing the adjustment.)
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance
Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Target Value CA-210(LCD MNT, Normal: CH 09
( Standard color coordinate and temperature when using the
CA210 equipment)
* Luminance min value is 130cd/m2in the cool/ medium/ warm
mode(Typ: 170)
* Test Signal: Inner pattern (216gray,85IRE)
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Don’t push The “IN STOP KEY” after completing the function
inspection.
*When doing Adjustment, Please make circumstance as below.
- 17 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Mode Color coordinate Temp
XY
Cool 0.285±0.003 0.293±0.003 11,000K
Medium 0.295±0.003 0.305±0.003 8,000K
Warm 0.313±0.003 0.329±0.003 6,500K

7.3. Adjustment of White Balance for
Manual Adjustment
Color analyzer(CA110, CA210) should be used in the calibrated
ch by CS-1000(LCD : CH9)
Operate the zero-calibration of the CA-100+ or CA-210, then
stick sensor to the module when adjusting.
For manual adjustment, it is also possible by the following
sequence.
1) Push the ADJ key two times (Entering White Blalance
mode)
2) Stick sensor to center of the screen and select each items
(Red/Green/Blue Gain and Offset) using / (CH + / -)
key on R/C.
3) Adjust R/G/B Gain using / (VOL + / -) key on R/C.
(Fix the one of R/G/B and change the others).
4) Adjust all modes(Cool, Mediun, Warm): Fix the one of
R/G/B gain and change the others.
5) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
[CASE]
First adjust the coordinate much away from the target
value(x, y).
1. x, y > target
a) Decrease the R, G.
2. x, y < target
a) First decrease the B gain,
b) Decrease the one of the others.
- In case of decreasing the x, decreasing the R: fix G
- In case of decreasing the y , decreasing the G: fix R
3. x > target , y < target
a) First decrease B, so make y a little more than the
target.
b) Adjust x value by decreasing the R
4. x < target , y > target
a) First decrease B, so make x a little more than the
target.
b) Adjust x value by decreasing the G
** Caution **
Color Temperature: COOL, Medium, Warm
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of
of Module)
* W/B condition
- Surrounding Temperature : 20 % ~ 80 %
- Surrounding Temperature : 25±5 °C
8. Function Check
8.1 Check display and sound
Check Input and Signal items (cf. work instructions)
1) TV
2) AV (SCART1/ SCART2/ CVBS/ S-Video)
3) COMPONENT (1080i)
4) RGB ( PC: 1920 x 1080 @ 60Hz)
5) DVI ( PC: 1920 x 1080 @ 60Hz)
6) HDMI
7) PC Audio In
* Display and Sound check is executed by Remote controller
9. Preset CH write condition
1) AC on time on only one after assembled automatically
2) CH recover on SVC OSD manually
- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 19 -
TROUBLESHOOTING
1. TV/CATV doesn’ t display

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes - 20 -
2. AV, Component doesn’ t display