LG 29WN600-W User manual

Internal Use Only
P/NO :
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
MFL62449391(2020.01-REV00)
29WN600 29WN600-W
LM80B
IPS LED MONITOR

- 2 -
Copyright © 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .........................................................................................8
ADJUSTMENT ...........................................................................................11
BLOCK DIAGRAM.....................................................................................13
EXPLODED VIEW......................................................................................14
ASSEMBLE AND DISASSEMBLE............................................................15
TROUBLE SHOOTING .............................................................................20

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Copyright © 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts should be replaced with the
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the original parts
and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH
BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded
through wrist band.
• Do not leave the module in high temperature and in areas of
high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the
module.
• If the surface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or LIPS
part, must disconnect the AC power because high voltage
appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If
the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

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Copyright © 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Copyright © 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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SPECIFICATION
NOTE: Specifications and others are subject to change without notice for improvement.
* Provided accessory: #7/#8
No Item Content Measureme
nt
Resul
t
Remark
1 Customer BRAND Checked OK
BRAND : LGE Product
OEM/ODM : Buyer Model
2 User Model Name 29WN600 Checked OK
3 Sale region World Wide Checked OK
4 Feature 29inch WFHD LCD Monitor Checked OK
5 Chassis Name LM80B Checked OK
6
Genera
l
Scope
External
SW
&Adj.
Joystick
Power off , Menu,
Game Mode, Input,
Exit
Checked OK
Function
Picture Mode Ratio, Smart Energy
Saving, Six Color, Audio
Volume(Speaker)
Checked OK
7 Power Cord
Length 1.55±0.05M 1.56M OK Refer to Suffix standard and
power cord table
Weight 0.17kg±10%, 0.165kg OK
Color White Checked OK
8 Cable
DisplayPort
Length -
N/A
Weight -
Color -
Impedanc
e -
HDMI
Length 1.5·0.05 M 1.5M OK
EAD63954402
Weight 0.11kg±10%,
Color White Checked OK
Impedanc
e 1) Cable : 100Ω±10%, Checked OK
9 Power
(Adapter)
Input: AC90~264V 47~63Hz
Output: DC 19V 3.42A,65W Adapter
(DA-65G19)
Color : White, Weight : 0.439kg·
10%
Checked OK EAY62990909
10 Applying module list
P/N Specification
Checked OK
EAJ6385030
1 LM290WW2-SSD1

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2.Applying module Character
1) Characteristic
No Item Content Remark
1 LCD Module
Feature
Maker LGD
Type IPS
Screen Diagonal [mm] 730.3 (29.0”)
Active Display Area [mm] 672.768(H) x 283.824(V)
Pixel Pitch [um] 0.2628 x 0.2628mm
Electrical Interface LVDS 4Ch
Color Depth 16.7M colors, 8-bits Data input
Surface Treatment Anti-Glare treatment of the front polarizer(Haze25%, 3H)
Operating Mode Transmissive mode, Normally Black
Back light Unit White LED
R/T [msec] 14(Typ., GTG_AVR)
* Standard Measurement Condition
1) Ambient Luminance Level : dark ( < 10 lux)
2) Ambient Temperature : Normal Temperature(10 ~ 25 Ȕ)
3) Warm-up Time : More than 30min (at Full White Pattern)
4) Input Signal : VESA 2560 x 1440@144Hz
5) Contrast : 70
6) Brightness : Max. 100
7) 6500K : Color Temperature Setting is 6500 K( if it’s not special specification)
8) Clock/Clock Phase : The Best Setting
9) Another Spec.: Product Specification Standard( LG(55)G1-1034 )
10) Cosmetic Spec. : LCD Module IIS Spec.

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TIMING CHART
Signal (Video & Sync)
– DisplayPort
mode section polarity
DOT
CLOCK
[MHz]
Frequency
[kHz]/[Hz]
Total
Period(E)
Display
(A)
Front
Porch
(D)
Sync.
(C)
Back
Porch
(B)
Resolution
1
H(Pixels) -
25.175
31.469 800 640 16 96 48
640 x 480
V(Lines) - 59.94 525 480 10 2 33
2
H(Pixels) -
31.5
37.5 840 640 16 64 120
640 x 480
V(Lines) - 75 500 480 1 3 16
3
H(Pixels) +
40.0
37.879 1056 800 40 128 88
800 x 600
V(Lines) + 60.317 628 600 1 4 23
4
H(Pixels) +
49.5
46.875 1056 800 16 80 160
800 x 600
V(Lines) + 75.0 625 600 1 3 21
5
H(Pixels) -
65.0
48.363 1344 1024 24 136 160
1024 x 768
V(Lines) - 60.0 806 768 3 6 29
6
H(Pixels) +
78.75
60.123 1312 1024 16 96 176
1024 x 768
V(Lines) + 75.029 800 768 1 3 28
7
H(Pixels) -
81.62
53.697 1520 1152 64 120 184
1152 x 864
V(Lines) + 60 895 864 1 3 27
9
H(Pixels) +
74.25
45 1650 1280 110 40 220
1280x720
V(Lines) + 60 750 720 5 5 20
10
H(Pixels) +
108
63.981 1688 1280 48 112 248
1280 x1024
V(Lines) + 60.02 1066 1024 1 3 38
11
H(Pixels) +
135
79.976 1688 1280 16 144 248
1280 x 1024
V(Lines) + 75.025 1066 1024 1 3 38
12 H(Pixels) + 108.0 60.00 1800 1600 24 80 96 1600 x 900
V(Lines) + 60.00 1000 900 1 3 96
13
H(Pixels) -
146.25
65.29 2240 1680 104 176 280
1680 x 1050
V(Lines) + 59.954 1089 1050 3 6 30
14
H(Pixels) +
148.50
67.50 2200 1920 88 44 148
1920 x 1080
V(Lines) - 60 1125 1080 4 5 36
15
H(Pixels) -
181.25
66.636 2720 2560 48 32 80 z
2560 x 1080
V(Lines) + 59.98 1111 1080 3 10 18
16
H(Pixels) -
228.25
83.915 2720 2560 48 32 80
2560 x 1080
V(Lines) + 74.99 1119 1080 3 10 26

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Main Recommended Timing(HDMI Video input)
Factory support mode Horizontal frequency Vertical frequency
(Preset Mode) (KHz) (Hz)
1 480P 31.5 60
2 576P 31.25 50
3 720P 37.5 50
4 720P 45 60
5 1080P 56.25 50
6 1080P 67.5 60

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4. Supporting timing
●Established I, Established II, Manufacturer timing ●Standard Timing
●Detailed Timing (1Page) ●Detailed Timing (2Page)
EDID
喺汞
PC Timing
朞磏
畲匶
朞滇
畲匶 渂砒朞
HDMI1/2
(1.4&2.0)
HDMI1/2
FreeSync(2.0) DisplayPortDisplayPort FreeSync
640 480
60
م م م م
67
  
72
  
75
م م م م
720 400 70
  
88
  
720 480 60(59.94)
مممم
800 600
56
  
60
م م م م
72
  
75
م م م م
832 624 75
م م م م
1024 768
87(I)
  
60
م م م م
70
  
75
م م م م
120


1152 864 60
مم

م

م

1152 870 75
م م م م
1280 720 60
مم

م

م

1280 800 60
م

م

م

م

1280 1024 60
مممم
75
مم

م

م

1600 900 60
م

م

م

م

1680 1050 60
م

م

م

م

1920 1080 60
م

م

م

م

75
م م

م

م

2560 1080
30 (29.99) 
50 (49.99) 
60 (59.98) م م م م
75 (74.99) م م م م
VF min (Hz) 56Hz 40Hz 56Hz 40Hz
VF max (Hz) 75Hz 75Hz 75Hz 75Hz
HF min (kHz) 30kHz 90kHz 30kHz 90kHz
HF max (kHz) 90kHz 90kHz 90kHz 90kHz
Clock (MHz) 240MHz 240MHz 240MHz 240MHz

ADJUSTMENT
-. “1. How to Enter the SVC mode”
#1) Monitor Power off using the Circle OSD
#2) Move joystick button Left 3 Times and Right 1 Time
#5) DC On (Click the Joystick Power button)
#6) Select the Menu
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
#7) you can see Service Menu at the top left side and you can get information from it.
-. Ā2. How to update the F/Wā(refer to Next Page)
#1). Connect Mstar Jig to monitor and PC.

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Only for training and service purposes
- 12 - LGE Internal Use Only
#2). Connect HDMI cable and select ĀConnectābutton.
#3). Select ĀReadābutton(1st) and find bin file(2nd) and then check the checksum value(3th).
#4). SelectĀAutoābutton(1st) and confirm the checkbox settings(2nd) and then selectĀRunābutton(3th).
*Please make sure that ĀFile Areaāoption is selected.
#5). After ISP is completed, do factory reset in the OSD main menu.

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BLOCK DIAGRAM (Main)
LVDS ( 51pin)
Headphone
(JK500)
HDMI 2
(JK101)
DP Input
(JK102)
LED Driver
(IC 503)
EEPROM
(IC200)
Flash Memory
(IC201)
MST9810LQ1
Scaler (IC202)
LED
(P502)
From Scaler
HP AMP
(IC501)
Control
(P200)
Speaker
(P700)
Audio AMP
(IC700)
From Scaler
LED Driver
(IC 504)
LED
(P503)
LVDS ( 40pin)
DC Jack (19V)
HDMI switch
(IC101)
HDMI 1
(JK100)
(34inch Only)

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41- - LGE Internal Use Only
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
300
210
400
900
910
920
930
500
510
120
330
520
540
or
530
220

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
Disassemble method



















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1 Place the monitor’s screen face down on a soft cloth.
.
2 Disassemble the Stand Base with disassemble the screw.

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3 disassemble the top cover
4 Remove the screw(2EA) and disassemble stand body.

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
5yGGzOXlhPGGGGG
n 
ඟ {Gk
n
Disassemble method

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6 Remove the tape and cable and speaker and control PCB assy
7 Remove the screw (2ea) and disassemble the PCB assy
Disassemble method

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8 Remove the screw (2ea) and disassemble the metal
9 Remove the screw (9ea) and disassemble the Cabinet
Disassemble method

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Trouble shooting : No Power
First of all, Check whether there is SVC Bulletin in GCSC System for these model.
No power issue
CHECK JK400 PIN4
YES
YES
YES
YES
YES
IS IC503 PIN15(19V),PIN16(5V)
CHECK ADAPTER
NO
NO
NO
NO
NO
CHECK IC503
CHECK IC401
CHECK IC406
CHECK CRYSTAL X200
IS IC401 PIN3(3.3V)
IS IC406 PIN3(1.15V)
IS IC202 PIN95,PIN96 PULSE
CHECK IC202