LG D237IPS User manual

P/NO : MFL67261203 (1108-REV00) Printed in Korea
OLOR MONITOR
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
CAUTION
BEFORE SERVI ING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LM94H
MODEL: D237IPS
Internal Use Only

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .......................................................................................10
ADJUSTMENT .........................................................................................11
BLOCK DIAGRAM...................................................................................15
TROUBLE SHOOTING ............................................................................20
EXPLODED VIE .................................................................................. 24
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
PRECAUTION
ARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components sed in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts sho ld be replaced with the
man fact rer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design witho t obtaining written
permission from man fact rer or yo will void the original parts
and labor g arantee.
TAKE CARE DURING HANDLING THE LCD MODULE ITH
BACKLIGHT UNIT.
• M st mo nt the mod le sing mo nting holes arranged in fo r
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will res lt in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
s ch as pencil or pen as this may res lt in damage to the panel.
• Protect the mod le from the ESD as it may damage the
electronic circ it (C-MOS).
• Make certain that treatment person’s body are gro nded
thro gh wrist band.
• Do not leave the mod le in high temperat re and in areas of
high h midity for a long time.
• The mod le not be exposed to the direct s nlight.
• Avoid contact with water as it may a short circ it within the
mod le.
• If the s rface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or ro gh cloth may damage
the panel.)
ARNING
BE CAREFUL ELECTRIC SHOCK !
• If yo want to replace with the new backlight (CCFL) or LIPS
part, m st disconnect the AC power beca se high voltage
appears at inverter circ it abo t 650Vrms.
• Handle with care wires or connectors of the inverter circ it. If
the wires are pressed ca se short and may b rn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please se only a plastic screwdriver to protect yo rself
from shock hazard d ring service operation.
1.5 Kohm/10W
To Instr ment's
exposed
METALLIC PARTS
Good Earth Gro nd
s ch as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Gro nd
for 1 second, Resistance m st be less than 0.1
*Base on Adj stment standard
Ω
0.15 F

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
man al and its s pplements and addenda, read and follow the
SAFETY PRECAUT ONS on page 3 of this p blication.
NOTE: If nforeseen circ mstances create conflict between the
following servicing preca tions and any of the safety preca tions on
page 3 of this p blication, always follow the safety preca tions.
Remember: Safety First.
General Servicing Precautions
1. Always npl g the receiver AC power cord from the AC power
so rce before;
a. Removing or reinstalling any component, circ it board
mod le or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical pl g or
other electrical connection.
c. Connecting a test s bstit te in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part s bstit tion or incorrect polarity
installation of electrolytic capacitors may res lt in an
explosion hazard.
2. Test high voltage only by meas ring it with an appropriate high
voltage meter or other voltage meas ring device (DVM,
FETVOM, etc) eq ipped with a s itable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service man al, clean
electrical contacts only by applying the following mixt re to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by vol me) Acetone and 90% (by
vol me) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixt re.
Unless specified otherwise in this service man al, l brication of
contacts in not req ired.
5. Do not defeat any pl g/socket B+ voltage interlocks with which
receivers covered by this service man al might be eq ipped.
6. Do not apply AC power to this instr ment and/or any of its
electrical assemblies nless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver gro nd lead to the receiver
chassis gro nd before connecting the test receiver positive
lead.
Always remove the test receiver gro nd lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixt re gro nd strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semicond ctor (solid-state) devices can be damaged easily
by static electricity. S ch components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circ its and some field-effect transistors and
semicond ctor "chip" components. The following techniq es
sho ld be sed to help red ce the incidence of component
damage ca sed by static by static electricity.
1. Immediately before handling any semicond ctor component or
semicond ctor-eq ipped assembly, drain off any electrostatic
charge on yo r body by to ching a known earth gro nd.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which sho ld be removed to
prevent potential shock reasons prior to applying power to the
nit nder test.
2. After removing an electrical assembly eq ipped with ES
devices, place the assembly on a cond ctive s rface s ch as
al min m foil, to prevent electrostatic charge b ild p or
expos re of the assembly.
3. Use only a gro nded-tip soldering iron to solder or nsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges s fficient to damage ES devices.
5. Do not se freon-propelled chemicals. These can generate
electrical charges s fficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package ntil immediately before yo are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by cond ctive foam, al min m foil
or comparable cond ctive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, to ch the protective material
to the chassis or circ it assembly into which the device will be
installed.
CAUTION: Be s re no power is applied to the chassis or circ it,
and observe all other safety preca tions.
8. Minimize bodily motions when handling npackaged
replacement ES devices. (Otherwise harmless motion s ch as
the br shing together of yo r clothes fabric or the lifting of yo r
foot from a carpeted floor can generate static electricity
s fficient to damage an ES device.)
General Soldering G idelines
1. Use a gro nded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperat re within the
range or 500ºF to 600ºF.
2. Use an appropriate ga ge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoro ghly clean the s rfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) br sh with a metal handle.
Do not se freon-propelled spray-on cleaners.
5. Use the following nsoldering techniq e
a. Allow the soldering iron tip to reach normal temperat re.
(500ºF to 600ºF)
b. Heat the component lead ntil the solder melts.
c. Q ickly draw the melted solder with an anti-static, s ction-
type solder removal device or with solder braid.
CAUTION: Work q ickly to avoid overheating the circ it
board printed foil.
6. Use the following soldering techniq e.
a. Allow the soldering iron tip to reach a normal temperat re
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead ntil the solder melts.
c. Q ickly move the soldering iron tip to the j nction of the
component lead and the printed circ it foil, and hold it there
only ntil the solder flows onto and aro nd both the
component lead and the foil.
CAUTION: Work q ickly to avoid overheating the circ it
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle br sh.

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circ it boards have slotted holes (oblong) thro gh
which the IC leads are inserted and then bent flat against the
circ it foil. When holes are the slotted type, the following techniq e
sho ld be sed to remove and replace the IC. When working with
boards sing the familiar ro nd hole, se the standard techniq e
as o tlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying p on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static s ction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Caref lly insert the replacement IC in the circ it board.
2. Caref lly bend each IC lead against the circ it foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle br sh.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circ it board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circ it board and crimp the "U" with
long nose pliers to ins re metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from aro nd the transistor leads.
2. Remove the heat sink mo nting screw (if so eq ipped).
3. Caref lly remove the transistor from the heat sink of the circ it
board.
4. Insert new transistor in the circ it board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendic lar y to the circ it
board.
3. Observing diode polarity, wrap each lead of the new diode
aro nd the corresponding lead on the circ it board.
4. Sec rely crimp each connection and solder it.
5. Inspect (on the circ it board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each f se or resistor lead at top of the circ it board hollow
stake.
2. Sec rely crimp the leads of replacement component aro nd
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circ it board to
prevent excessive component temperat res.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circ it
board will weaken the adhesive that bonds the foil to the circ it
board ca sing the foil to separate from or "lift-off" the board. The
following g idelines and proced res sho ld be followed whenever
this condition is enco ntered.
At I onnections
To repair a defective copper pattern at IC connections se the
following proced re to install a j mper wire on the copper pattern
side of the circ it board. (Use this techniq e only on IC
connections).
1. Caref lly remove the damaged copper pattern with a sharp
knife. (Remove only as m ch copper as absol tely necessary).
2. caref lly scratch away the solder resist and acrylic coating (if
sed) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small ga ge j mper wire and
caref lly crimp it aro nd the IC pin. Solder the IC connection.
4. Ro te the j mper wire along the path of the o t-away copper
pattern and let it overlap the previo sly scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess j mper wire.
At Other onnections
Use the following techniq e to repair the defective copper pattern
at connections other than IC Pins. This techniq e involves the
installation of a j mper wire on the component side of the circ it
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ens re that a hazardo s
condition will not exist if the j mper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect ins lated 20-ga ge j mper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Caref lly crimp and solder the connections.
CAUTION: Be s re the ins lated j mper wire is dressed so the
it does not to ch components or sharp edges.

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
SPECIFICATIONS
1. General Specification
No Item Content Remark
1 C stomer BRAND
2 User Model Name D237ISP
3 Sale region World wide
4 Feat re 58 cm (23 inch) HD TFT LCD MONITOR ( FPR IPS 3D MNT)
5 Chassis Name LM94H
External SW &Adj. Men , 3D, A to, Inp t , Exit, Power
6 General OSD,DDC2B,DDC2AB, HDCP, Control Lock,
Scope F nction Original Ratio/Wide, Black level, A to Bright
Energy saving, FPR 3D, HDMI 1.4a, DDD S/W
Length : 1.55 m ± 0.02 m
7 Power Cord Shape : Wall-o t
Color : Black
Length : 1.50 m ± 0.03 m EAD57734003
Signal Cable Shape : Detachable Type
(D-SUB) Color : Black
Pin : Triple Row, 15 Pin D-S b
8 Cable Length : 1.50 m ± 0.03 m
DVI Shape : Detachable Type
Color : Black EAD57760001
Pin : Triple Row, 18-Position DVI-D
9 Power LPB(LED Power B/D) : Lienchang EAY62208902
10 3D Glasses Plastic Frame Type + Clip Type EBX61588301
No Item Content Remark
Width (W) Length (D) Height (H)
1 Prod ct Before Packing 556.2 mm 60.4 mm 345.1 mm Witho t stand
Dimension 556.2 mm 177.8 mm 412.7 mm With stand
After Packing 624 mm 477 mm 134 mm
2 Prod ct Only SET 4.86 kg
Weight With BOX 6.82 kg
3 Container Individ al or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden For the EU Pallet
Q antity 714 600 1428 1260
Type Base Attachable, Tilt Only
4 Stand Size (W x D x H) 256.0 x 177.8 x 127.6 Incl de stand body and base
Assy Tilt Degree -5° ~ 18°
Tilt force 0.8 kg ~ 2.0 kg
5 Appearance General Refer to Standard of LG(56)G2-1011
2. Mechanical specification

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
3. Optical Character
No Item Criteria Remark
1 Viewing Angle Horizontal(R/L) : + 178° / - 178° (2D mode, Typ.), + 65° / - 65° (3D mode, Typ)
<CR ≥10> Vertical(Top/Bottom) : + 178° / - 178° (2D mode, Typ.), 14° / 14° (3D mode, Typ)
2 L minance Average L minance (cd/m2) 180(Min.)-->2D(F ll white pattern, 0.7V) MEDIUM
40(3D mode, Min.)
Average L minance (cd/m2) 200(Min.) / 250(Typ.)-->2D(F ll white pattern, 0.7V) WARM
76(3D mode, Min.)
Average L minance (cd/m2) 180(Min.)-->2D(F ll white pattern, 0.7V) COOL
40(3D mode, Min.))
S per Energy Saving On Max 15% down from S-Energy Saving Off
L minance Uniformity -
3 Contrast Ratio Mod le: 600(Min), 1000(Typ) DFC : 7,000,000:1 (Min.)
4 Response Time 14ms(TYP) 25ms (MAX)
5 Light Leakage Condition: Do not visible at 300 L x
7 3D Crosstalk 1.8% (Typ), 5%(Max)
8Optimal viewing Distance 50 cm ~90 cm
4. Engineering Specification
1 S pported Sync. Type Separate Sync., Digital
2 Operating Freq ency Analog/ Horizontal 30 ~ 83kHz
Digital Vertical 56 ~ 75 Hz
HDMI Horizontal 30 ~ 83kHz
Vertical 56 ~ 61 Hz
3 Resol tion Analog/ Max. 1920 x 1080 @ 60 Hz
Digital Recommend 1920 x 1080 @ 60 Hz
HDMI Max. 1920 x 1080 @ 60 Hz
Recommend 1920 x 1080 @ 60 Hz
4 Inp t Voltage Voltage : 100 – 240 V ac, 50 Hz or 60 Hz, 0.7A
5 Inr sh C rrent Cold Start : 50 A, Hot : 120 A
Operating Condition Sync(H/V) Video LED Wattage
Test condition
43 W (Max.) 1. 1920 x 1080 @ 60 Hz
6 On Mode On/On Active RED 41 W (Typ.) 2. b rst pattern
3. 100 V - 240 V
4. After aging 30 min
Off/On RED 1W nder
Sleep Mode On/Off Off blinking
Off/Off
Off Mode - - Off 1 W nder
(Power switch off)
7 MTBF 50,000 HRS with 90% LED Life : 30,000 Ho rs(Min.)
Confidence level
8 Using Altit de 5,000 m (for Reliability) 3,000 m (for FOS)
Temperat re 10°C ~ 35°C
9 Environment 0perating H midity 10 % ~ 80 %
Condition Storage Temperat re -20°C ~ 60°C
H midity 5% ~ 90% non-condensing

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
5. LCD Panel Characteristic
(1) Standard Meas rement Condition
• Ambient L minance Level : dark ( < 10 l x)
• Ambient Temperat re : Normal Temperat re(10 ºC ~ 25 ºC)
• Warm- p Time : More than 30 min (at F ll White Pattern)
• Inp t Signal : VESA 1920X1080 @60 Hz
• Energy saving : off
• Brightness : Max. 100
• WARM :
• Clock/Clock Phase : A to
(2) Another Spec.: Prod ct Specification Standard( LG(55)G1-1034 )
(3) Cosmetic Spec. : LCD Mod le IIS Spec.
5.1 Display Area
1) Active Display Area of the LCD Monitor Sho ld be within Cabinet’s Bezel.
2) Distance Difference between Active Area and Bezel
| A-B|<1.0 mm , | C-D|<1.0 mm
A: The Distance from The Left of Active Area to the Bezel
B: The Distance from The Right of Active Area to the Bezel
C: The Distance from The Top of Active Area to the Bezel
D: The Distance from The Bottom of Active Area to the Bezel
C
B
D
A
Active Area
Bezel
No Item Content Remark
Maker LGD
Type TFT Color LCD Mod le
Active Display Area 58.42 cm(23 inches) diagonal
Pixel Pitch [mm] 0.2652 (H) x 0.2652 (V)
1 LCD Mod le Electrical Interface 2ch-LVDS
Feat re Color Depth 6bit + A-FRC, (16,7M colors)
Size [mm] 533.2(H) x 312.0(V)) x 11.0(D) mm(Typ.)
S rface Treatment Hard coating(3H) &
Anti-Glare treatment of the front polarizer
Operating Mode Transmissive mode, Normally Black
Back light Unit White LED(4-string LED Backlight)
R/T Typical 14ms
Max 25ms
Minim m Normal Maxim m
White Wx 0.294
Wy Typ-0.03 0.309 Typ+0.03 Medi m
2 CIE Color White Wx 0.283 Cool
Coordinates Wy Typ-0.03 0.298 Typ+0.03
White Wx 0.313
Wy Typ-0.03 0.329 Typ+0.03
Red Rx 0.638
Ry 0.330 Warm
Green Gx Typ-0.03 0.312 Typ+0.03
Gy 0.623
Bl e Bx 0.150
By 0.068

6. EDID
6.1 EDID ( 128 Bytes )
6.1 EDID ( 128 Bytes )
6.1.1 EDID Ver. 1.3 FOR ANALOG ( 128Byte)
6.1.2 EDID Ver. 1.3 FOR DIGITAL (128Byte)
6.1.3 EDID Ver. 1.3 FOR HDMI (256Byte)
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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
7
IPS

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
TIMING CHART
(1) Signal(Video & Sync)
(2) H/V Timing

ADJUSTMENT
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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
1. Coverage
Apply to 58 cm (23 inch) Wide monitor made in Monitor Factory
(G mi Korea) or made in accordance with the standard of G mi
Factory process.
2. Appointment
2.1 Adj stment m st be done as fixed seq ence, and adj stment
seq ence can be modified after agreement withthe responsible
R&D engineer considering mass-prod ction condition.
2.2 Power : AC 100 - 240 Voltage (Free)
2.3
Inp t signal: As Prod ct Standard
2.4 Warm- p Time: Over than 5 min tes
2.5 Adj stment eq ipment : White balance eq ipment (CA-
110/210), Display adj st eq ipment, VG-819(or VG828),
Oscilloscope, PC (More than 486 comp ter ) & White balance
adj st program., HDCP Adj sting Jig eq ipment.
3. Adjustment
3.1 Overview
Use factory a tomation eq ipment and adj st a tomatic
movement. B t, do via passivity adj st in errorocc rrence.
3.2 Adjustment order
(refer to the Adj stment standard and adj stment command table)
3.2.1 Board Assembly Line
· Connect inp t signal to 15pin D-s b.
· Check the firmware version & model name. And write the
firmware code to the serial Flash ROM by ISP.
· Ready for adj stment : check whether adj stment command
works normally or not and the operating state of each mode.
· Check the display state of gray color when 256 gray scale
patterns is embodied.
· Read by EEPROM Read Command to check whether initial
val e is correct or not.
3.2.2 Total Assembly Line
· Inp t analog signal. (1920x1080@60Hz)
· Write HDCP Key to EEPROM(24C16) by sing DDC2AB
protocol & HDCP Adj sting Jig eq ipment [ Address 0xAC 80,
325 bytes ]
· If error is occ rred, write and check again.
· After finishing it, send the HDCP INIT command (E6 00 00) and
wait abo t 20 sec.
· Ready : Heat-r n d ring 5 min tes in the state with signal
· Connect inp t signal to D-s b.
· Defa lt val e before adj stment : Energy saving: off , Brightness
“100(Max)”
3.2.3 Adj stment of Horizontal/Verticality screen
position, Clock and Clock Phase at each Mode.
· There is no special factory mode adj stment.
Writing initial val e of EEPROM in Board Assembly line is
adj sting Preset Mode and Reset mode. (EEPROM is
initialized when AC Power is ON first.)
· If the change of FOS data is needed after M.P, it is possible by
writing Mode Data with EEPROM write command or modifying
the Mode Data in MICOM itself.
# Ca tion) M st keep power-on more than 3 seconds after AC
Power-on first time.
3.2.4 Color coordinates adj stment and L minance
adj stment.
3.2.4.1 Color coordinates adj stment
· Monitor Contrast / Brightness
- Energy saving : off
- Brightness : 100(Max)
· CA-110/CA-210: Set “Channel 7” --> CA-110: channel: 8. CA-
210: Channel 14
· Signal Generator : At c t-off and drive --> 16 step pattern for
ADC
- O tp t Voltage : 700 mVp-p
- O tp t Mode : Mode 12 ( 1920x1080+ 60Hz ) mode Setting.
3.2.4.2.Adj stment : Board Assembly Line
EXX41 and EXX48 model se internal ADC, no need connect
D-s b cable
Internal ADC steps as below;
On AC power on with Aging mode, checking the ADC val es
and then decide to do or not,
- Read ADC OFFSET and GAIN flags from 0xFE, 0xFF on NVRAM
- If those val es are not 0xAA on Aging mode, m st do internal
ADC calibration.
- If the res lt of internal ADC calibration is OK, save the ADC res lt
and make the OFFSET and GAIN flags to 0xAA and make the
Internal_ ADC flag to INTERNAL.
- Display the res lt of ADC on Aging Mode OSD and Service OSD
D237IPS Model doesn’t se internal ADC. If don’t se internal
ADC, please follow below step.
· Inp t 16 step pattern for ADC (Mode12, pattern 11). (Video level
: 700 mVp-p)
· Adj st by commanding AUTO_COLOR_ADJUST
· Confirm “S ccess” message in Screen or Check the data of
0xFE, 0xFF address of EEPROM(0XA6) is 0xAA after waiting 5
seconds
· If there is “FAULT” message or the data of 0xFE, 0XFF address
of EEPROM(0xAA) is not 0xAA, do adj st again
· If all Adj stment is completed, the val es of WARM (6500K),
User Color and COOL (9300K) are saved a tomatically.
3.2.4.3. Confirm at Total Assembly Line: adj stment
· Check the data of 0xFE, 0xFF address of EEPROM(0xA6) is
0xAA.
· If the data of 0XFE, FF address of EEPROM (0xA6) is not 0xAA,
do adj st again by 3.2.4.2.
. 3.2.4.4. Only Confirm PRESET WARM (6500K) Color
coordinates and PRESET COOL (9300K) Color
coordinates. (D237IPS model is not TCO5.0 model.) .
· Set as Aging mode ON, by commanding AGING_ON/OFF
command code.
· Select Mod le that is being sed in present prod ction by
commanding MODULE SELECT.
· Send SYSTEM RESET command to set Mod le data.
· Inp t F ll White Pattern (Video level : 700 mVp-p)

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
· Set as COOL (9300K) by commanding
COLOR_MODE_CHANGE Command code.
· Confirm x/y color coordinate as below:
Color Coordinate (0~5min) Color Coordinate (20~30min)
x 0.283
±
0.03 0.283 ± 0.03
y 0.305 ± 0.03 0.298 ± 0.03
and confirm Y (L minance) = min 150cd/m2, Typ 180cd/m2
· Save COOL (9300K) Color by commanding COLOR SAVE
Command code.
· Inp t F ll White Pattern (Video level : 700 mVp-p)
· Set as WARM (6500K) by commanding
COLOR_MODE_CHANGE Command code.
Confirm x/y color coordinate as below:
Color Coordinate (0~5min) Color Coordinate (20~30min)
x 0.313 ± 0.03 0.313 ± 0.03
y 0.335 ± 0.03 0.329 ± 0.03
and confirm Y (L minance) = min 200cd/m2, Typ 250cd/m2
· Save WARM (6500K) Color by commanding COLOR SAVE
Command code.
3.2.4.5. Confirm User color coordinates .
· Confirm Whether User color is saved same as WARM(6500K).
· After confirming Color coordinates, M st ret rn to WARM(6500K)
3.2.5 Confirm Operation state.
3.2.5.1 Operation mode : Confirm whether each appointed mode
operate correctly or not.
3.2.5.2 Confirmation of Adj stment condition and operation :
Confirm whether it meet A to/Man al eq ipment Adj stment
standard or not.
· Confirm Analog screen state : Confirm screen state at below
mode.
Appointment mode :
640*480 @60Hz (Mode 2),
800*600@75Hz(Mode 5),
1024*768@60Hz(Mode 6),
1280*1024@60Hz(Mode 9),
1680*1050@60Hz(Mode 11),
1920*1080@60HZ(Mode 12),
SMPTE pattern(Check 0%,5%,95%,100%)
–Mode can be added.
· Check HDCP signal screen by sing Video generator that
generate HDCP signal
3.2.5.3. Confirm A to adj stment operation.
· Inp t Analog 1 Dot on/off & Rectangle Pattern at Mode
12(1920x1080@60 Hz)
· Confirm adj stment operation by changing Clock, Phase, H/V
Position.
· Check Clock, Phase by pressing AUTO Key.
· Confirm first set of new lot by periods
3.2.5.4 Other q ality
· Confirm that each items satisfy nder standard condition that was
written prod ct spec.
· Confirm Applying Mod le & MICOM Setting --> Confirm with
Service OSD
- Confirm at Service OSD by “A to/Vol me + Power key” on
.(from Power off)
- Confirm first set of new lot by periods, and confirm periodically
when there is Process change or Adj stment setting change.
3.2.5.5. OSD & Adj stment device Confirmation : Confirm
operation mentioned as prod ct spec.
· Vary Brightness and Contrast and confirm the variation of
L minance and display stat s.
· Operate the f-engine f nction and confirm variation of L minance.
· Make s re to do FACTORY RESET after confirmation of OSD
f nction.
3.2.5.6. Confirm the display state by inp tting 8 color Bar Pattern &
256 Gray Scale pattern.
3.2.5.7. DPM operation confirmation : Check if Power LED Color
and Power Cons mption operates as standard.
· Meas rement Condition : 230 V@ 50 Hz (Analog)
· Confirm DPM operation at the state of screen witho t Video
Signal.
3.2.5.8. DDC EDID Write
- HDMI part EDID data
- D237IPS No need inp t HDMI EDID on the line, F/W incl de
HDMI EDID, aging on MODE If AC ON, HDMI EDID a tomatic
load to EEPROM(24C02).
Other model if need inp t EDID on the line, please refer below
steps:
· Confirm whether mod le selection is correct or not on the self-
diagnostics OSD
with signal cable disconnected.
· Connect HDMI Signal Cable to DVI-D wafer.
· Write EDID DATA to EEPROM(24C02) by sing DDC2B protocol.
· Check whether written EDID data is correct or not.
-DVI part EDID data
· Confirm whether mod le selection is correct or not on the self-
diagnostics OSD
· Connect Digital Signal Cable to DVI-D wafer.
· Write EDID DATA to EEPROM(24C02) by sing DDC2B protocol.
Check whether written EDID data is correct or not.
.- Analog part EDID data
· Connect analog Signal Cable to D-s b wafer.
· Write EDID DATA to EEPROM(24C16) by sing DDC2B protocol.
· Check whether written EDID data is correct or not.
(refer to Prod ct spec).
-> After writing EDID, send Elapsed Time Clear command.
(Elapsed time sho ld not be displayed, after EDID writing)
: Confirm periodically (in the first set of new lot, process
change) whether mod le name and
aging time disappeared on the self-diagnostics OSD with signal
cable disconnected.
-> If Elapsed Time Clear command isn’t exec ted, mod le name,
aging time and TCO word appear on the self-diagnostics
OSD.(Mod le name and aging time sho ld not appear after
writing EDID)
-> Make s re to do FACTORY RESET at the final process.
3.2.5.9. 3D f nction check:
#1. HDMI (HDMI1.4 Format)
For this, we need to check it with 3D DVD, and 3D Video,
and check the pict re q ality with 3D Glasses.

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
3.2.5.10. Shipping condition
· Energy saving : Off
· Power Switch : Off
· Brightness : “100(Max)”
· Color Select : Warm
· Lang age Select : Refer to prod ct spec.
· Check HDMI A dio headphone f nction, after check, please set
signal so rce to RGB Mode by Hand.
4. Pattern for Adjustment
Pattern 0 : FULL BLACK (State of witho t video signal )
Pattern 1 : FULL WHITE (Don’t display other Character except for
White Pattern)
Pattern 3 : FULL WHITE
Pattern 4 : Cross hatch pattern (Horizontal 10Line, Vertcial 8Line) &
Rectangle Pattern
Pattern 5 : 1 Dot on, 1 Dot off & Rectangle Pattern
Pattern 6 : Vertical Sync only inp t (Use signal cable of which Pin
#5 is GND)
Pattern 7 : Horizontal Sync only inp t (Use signal cable of which
Pin #5 is GND)
Pattern 8 : State of witho t Vertical/Horizontal Sync and Video
Signal. (Use signal cable of which Pin #5 is GND)
Pattern 9 : 8 Color Bar Pattern + 16 Gray Level Pattern
Pattern 10 : SMPTE Pattern
Pattern 11 : 16 Gray Step Pattern (700mV)

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
5.Standard of Auto/Manual equipment adjustment
*Note 1 (Test condition):
- mode12(1920x1080 @60Hz),
- B rst pattern
- 230Vac @50Hz
- Analog & Digital & HDMI
- After aging 30min

BLOCK DIAGRAM (Main)
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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
DESCRIPTION OF BLOCK DIAGRAM (Main)
1. Video Controller Part.
-RGB inp t: Transfer RGB analog signal to TTL signal thro gh ADC block.
-DVI & HDMI inp t : Transfer TMDS encoded signal to TTL signal.
-Scalar : Transfer signals of vario s resol tion to original mod le resol tion.
-O tp t : O tp t LVDS encoded digital signal.
2. Power Part.
-5VS so rce : It°Øs s pplied by LPB(LED Power Board) - Mod le, eeprom IC and p ll- p se this so rce.
-3.3V, 1.2V so rce : It is consists of LDO that transfer 5VS to 3.3V and 1.2V and the Scalar IC, Flash IC se those
so rce.
3. MICOM Part.
MICOM part is embedded in Video control part, and It is consists of EEPROM that storage system control data,
CODE memory, MICOM and reset IC. First, MICOM J dges inp t signal mode by checking freq ency and polarity
of inp t H/V signal, and set the resister val e in each IC to control. Next, control a to set, H/V position, clock and
phase that ser co ld control by OSD.
4. ETC.
Key, ambient Sensor, Headphone o t

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
LPB BLOCK DIAGRAM(Power Side)

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
LPB BLOCK DIAGRAM(LED Driver Side)

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
DESCRIPTION OF BLOCK DIAGRAM (LPB)
1) POWER INPUT : AC 100 ~ 240 V Inp t.
2) EMI NOISE FILTER CIRCUIT : Circ it to decrease noise to be flowed o tside and to be generated in circ it. This is
consisted of high freq ency filtering capacitors and choke filter.
3) AC-DC RECTIFIED CIRCUIT : Circ it to change AC Voltage to high DC Voltage.
This is consisted of Bridge Diode, Capacitor.
4) NOISE REMOVAL CIRCUIT : This is consisted of RC circ it, deleting Peak Noise.
5) MAIN TRANSFORMER : This change primary High Voltage to designed secondary low Voltage.
6) 19V / 5V RECTIFIED AND FILTER CIRCUIT
: This reg late DC Voltage to inp t at Transformer for stable secondary voltage.
7) SWITCHING PWM CONTROL : This transfer primary DC Voltage to main transformer after switching effectively.
8) FEEDBACK : This is circ it to se circ it control, circ it protection f nction.
9) LED Driver SWITCHING FET
: This transfer DC Voltage to inp t from Power Side to LED Boost p Circ it after Switching effectively.
10) Boost p Circ it : This is circ it to make high DC Voltage more than LED String Voltage.
11) LED CONTROLLER : This is circ it to se LED circ it control, circ it protection f nction.

TROUBLESHOOTING GUIDE
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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service p rposes LGE Internal Use Only
1. NO PO ER