Panasonic TH-65PHD8BK User manual

©2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-65PHD8BK
TH-65PHD8EK
TH-65PHD8UK
GPH8D Chassis
High Definition Plasma Display
Specifications
Power Source (UK) 120 V
A
C, 50/60Hz
Power Source (BK/EK) 220 - 240 V
A
C, 50/60 Hz
Power Consumption (UK)
Maximum 675 W
Stand-b
y
condition Save OFF 0.7 W, Save ON 0.5 W
Power off condition 0.2 W
Power Consumption (BK/EK)
Normal use 615 W
Stand-b
y
condition Save off 0.9 W, Save on 0.7 W
Power off condition 0.35 W
Plasma Displa
y
panel Drive method:
A
C type 65-inch, 16:9 aspect ratio
Contrast Ratio 3000:1
Screen size 56.5” (1,434 mm) (W) × 31.7” (806 mm) (H) × 65” (1,645 mm) (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA, SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
ORDER NO. ITD0509054CE
D10

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 PCB Structure sheet of GPH8D chassis 9
6 Service Hint 10
7 Disassembly 11
7.1. Removal of the Back Cover 11
7.2. Removal of the HA-Board and the HB-Board 11
7.3. Removal of the Slot Block 12
7.4. Removal of the J-Board 12
7.5. Removal of the HX-Board 12
7.6. Removal of the PB-Board 12
7.7. Removal of the D-Board 13
7.8. Removal of the P-Board 13
7.9. Removal of the SU-Board and the SD-Board 15
COMPONENT / RGB (UK)
Y
/ G (BNC) 1.0 Vp-p
/
composite (75-ohm)
0.7 Vp-p
/
non-composite (75-ohm)
PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (UK) (HIGH-DENSIT
Y
Mini-D-SUB 15PIN) R,G,B
/
0.7 Vp-p (75-ohm)
HD, VD
/
1.0 - 5.0 Vp-p (high impedance)
Component
Y
:1.0 Vp-p (75-ohm : include sync)
PB
/
CB:0.7 Vp-p (75-ohm)
PR
/
CR:0.7 Vp-p (75-ohm)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
PC (BK/EK) (HIGH-DENSIT
Y
Mini-D-SUB 15PIN) R,G,B
/
0.7 Vp-p (75-ohm)
HD, VD
/
1.0 - 5.0 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (8Ω) 20 W [10 W + 10 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
(UK)
Remote Control Transmitter EUR7636090R
(BK/EK)
Batteries (UK) 2×
AA
Size
Batteries (BK/EK) 2 × R6 Size
Fixing bands (TMME203) × 2
Dimensions (
W
×H×D) 61.2” (1,554 mm) × 36.4” (925 mm) × 3.9” (99 mm)
(exclusive of protruding portion)
Mass (weight) (UK)
main unit onl
y
approx. 172.0 lbs
with speakers approx. 181.7 lbs
Mass (weight) (BK/EK)
main unit onl
y
approx. 78.0 kg net
with speakers approx. 82.4 kg
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below. EN55022, EN55024, EN61000-3-2, EN61000-3-3. (BK/EK)
CONTENTS
Page Page
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.10. Removal of the SC-Board 15
7.11. Removal of the SS2-Board and the SS3-Board 16
7.12. Removal of the SS-Board 16
7.13. Removal of the H3-Board (L, R) 16
7.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board 17
7.15. Removal of the Fan 18
7.16. Removal of the Escutcheon 19
7.17. Removal of the S1-Board and the V1-Board 20
7.18. Removal of the Plasma Panel 21
8 Location of Lead Wiring 24
9 Adjustment Procedure 26
9.1. Driver Set-up 26
9.2. Initialization Pulse Adjust 27
9.3. P.C.B. (Printed Circuit Board) Remove 27
9.4. Adjustment Volume Location 28
9.5. Test Point Location 28
10 Service mode 29
10.1. CAT (computer Aided Test) mode 29
10.2. IIC mode structure (following items value is sample data.)
31
11 Alignment 32
11.1. PC / RGB panel white balance 32
11.2. HD / 525ip / 625ip panel white balance 34
12 Trouble shooting guide 36
12.1. Self Check 36
12.2. No Power 37
12.3. No Picture 37
12.4. Local screen failure 38
13 Option Setting 39
14 Circuit Board Layout 41
14.1. P-Board (P-1), (P-2) 41
14.2. PB-Board 45
14.3. HA-Board 46
14.4. HB-Board 47
14.5. HX-Board 48
14.6. J-Board 49
14.7. D-Board 51
14.8. C1-Board 53
14.9. C2-Board 54
14.10. C3-Board 55
14.11. C4-Board 56
14.12. C5-Board 57
14.13. C6-Board 58
14.14. SC-Board 59
14.15. SU-Board 62
14.16. SD-Board 63
14.17. SS-Board 64
14.18. SS2 and SS3-Board 67
14.19. H3, S1 and V1-Board 68
15 Schematic Diagrams 69
15.1. Schematic Diagram Notes 69
15.2. Main Block Diagram 70
15.3. P-Board (1 of 2)Block Diagram 71
15.4. P-Board (2 of 2)Block Diagram 72
15.5. P-Board (1 of 3) Schematic Diagram 73
15.6. P-Board (2 of 3) Schematic Diagram 74
15.7. P-Board (3 of 3) Schematic Diagram 75
15.8. PB and V1-Board Block and Schematic Diagram 76
15.9. HA-Board Block and Schematic Diagram 77
15.10. HB-Board Block Diagram 78
15.11. HB-Board (1 of 2) Schematic Diagram 79
15.12. HB-Board (2 of 2) Schematic Diagram 80
15.13. HX-Board Block and Schematic Diagram 81
15.14. J-Board (1 of 2) and H3-Board Block Diagram 82
15.15. J-Board (2 of 2) Block Diagram 83
15.16. J-Board (1 of 4) and H3-Board Schematic Diagram 84
15.17. J-Board (2 of 4) Schematic Diagram 85
15.18. J-Board (3 of 4) Schematic Diagram 86
15.19. J-Board (4 of 4) Schematic Diagram 87
15.20. D-Board (1 of 2) Block Diagram 88
15.21. D-Board (2 of 2) Block Diagram 89
15.22. D-Board (1 of 12) Schematic Diagram 90
15.23. D-Board (2 of 12) Schematic Diagram 91
15.24. D-Board (3 of 12) Schematic Diagram 92
15.25. D-Board (4 of 12) Schematic Diagram 93
15.26. D-Board (5 of 12) Schematic Diagram 94
15.27. D-Board (6 of 12) Schematic Diagram 95
15.28. D-Board (7 of 12) Schematic Diagram 96
15.29. D-Board (8 of 12) Schematic Diagram 97
15.30. D-Board (9 of 12) Schematic Diagram 98
15.31. D-Board (10 of 12) Schematic Diagram 99
15.32. D-Board (11 of 12) Schematic Diagram 100
15.33. D-Board (12 of 12) Schematic Diagram 101
15.34. C1, C2, C5 and C6-Board Block Diagram 102
15.35. C2, C3, C4 and C5-Board Block Diagram 103
15.36. C1-Board (1 of 2) Schematic Diagram 104
15.37. C1-Board (2 of 2) Schematic Diagram 105
15.38. C2-Board (1 of 2) Schematic Diagram 106
15.39. C2-Board (2 of 2) Schematic Diagram 107
15.40. C3-Board (1 of 2) Schematic Diagram 108
15.41. C3-Board (2 of 2) Schematic Diagram 109
15.42. C4-Board (1 of 2) Schematic Diagram 110
15.43. C4-Board (2 of 2) Schematic Diagram 111
15.44. C5-Board (1 of 2) Schematic Diagram 112
15.45. C5-Board (2 of 2) Schematic Diagram 113
15.46. C6-Board (1 of 2) Schematic Diagram 114
15.47. C6-Board (2 of 2) Schematic Diagram 115
15.48. SC, SU and SD-Board Block Diagram 116
15.49. SC-Board (1 of 3) Schematic Diagram 117
15.50. SC-Board (2 of 3) Schematic Diagram 118
15.51. SC-Board (3 of 3) Schematic Diagram 119
15.52. SU-Board (1 of 2) Schematic Diagram 120
15.53. SU-Board (2 of 2) Schematic Diagram 121
15.54. SD-Board (1 of 2) Schematic Diagram 122
15.55. SD-Board (2 of 2) Schematic Diagram 123
15.56. SS, S1, SS2 and SS3-Board Block Diagram 124
15.57. SS-Board (1 of 2), S1, SS2 and SS3-Board Schematic
Diagram 125
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

15.58. SS-Board (2 of 2) Schematic Diagram 126
16 Parts Location 127
16.1. Exploded View 127
16.2. Cable relation 129
16.3. Packing summary 130
17 Mechanical Replacement Parts List 133
18 Replacement Parts List 134
18.1. Relpacement Parts List Notes 134
18.2. Electrical Replacement Parts List 135
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

1 Applicable signals
5
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1 .)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1 .
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
6
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
todamage an ES device).
7
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

5 PCB Structure sheet of GPH8D chassis
Board Name Function Remarks
D Digital Signal Processor,
Format Converter,
Plasma AI Processor
1
J Slot Interface (Audio/Video/Sync input Switch),
SYNC processor, Audio processor,
Speaker out amplifier,
DC-DC converter
1
SS Sustain drive 1
SC Scan drive 1
SU Scan out (Upper) 1
SD Scan out (Lower) 1
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 LED (stand-by / Power on) & Remote receiver 1
PB Fan control 1
P Line filter, Power supply 1
HX PC / RS-232C
HB BNC Composite Video 2
HA BNC Component Video 3
Remarks
1: Recommend PCB´s for initial service for GPH8D chassis.
2: For TH-65PHD8BK/EK/UK
3: For TH-65PHD8UK
9
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

6 Service Hint
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
10
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7 Disassembly
· To remove P.C.B., wait for 1 minute after power was off for
discharge from electrolysis capacitors.
· and marks indicate screw positions.
7.1. Removal of the Back Cover
1.Remove the screws (×20 ,×9 ,×4 ) and then remove
the Back Cover.
7.2. Removal of the HA-Board and
the HB-Board
7.2.1. TH-65PHD8UK
· Removal of the HB-Board
1.Remove the 4 screws (A) of the HB Terminal Block and
then remove the HB Terminal Block.
2.Remove the 4 screws (B).
3.Remove the 2 screws (C) and then remove the HB-Board.
· Removal of the HA-Board
1.Remove the 4 screws (D) of the HA Terminal Block and
then remove the HA Terminal Block.
2.Remove the 4 screws (E).
3.Remove the 2 screws (F) and then remove the HA-Board.
7.2.2. TH-65PHD8EK/BK
· Removal of the HB-Board
1.Remove the 4 screws (G) of the HB Terminal Block and
then remove the HB Terminal Block.
2.Remove the 4 screws (H).
3.Remove the 2 screws (J) and then remove the HB-Board.
11
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.3. Removal of the Slot Block
1.Disconnect the couplers(J1, J3, J4, J5, J6, J7, J10, J34).
2.Remove the 4 screws and then remove the Slot Block.
7.4. Removal of the J-Board
1.Remove the HA Terminal Block and the HB Terminal Block.
(Reference to Removal of the HA-Board and the HB-Board)
2.Remove the Slot Block.
(Reference to Removal of the Slot Block)
3.Remove the 8 screws and then remove the J-Board.
7.5. Removal of the HX-Board
1.Remove the HA Terminal Block and the HB Terminal Block.
(Reference to Removal of the HA-Board and the HB-Board)
2.Remove the Slot Block.
(Reference to Removal of the Slot Block)
3.Remove the J-Board.
(Reference to Removal of the J-Board)
4.Remove the 6 screws and then remove the Slot Case.
5.Remove the 4 Hexagonal-Head screws and the 1 screw of
the HX-Board and then remove the HX-Board.
7.6. Removal of the PB-Board
1.Disconnect the couplers(PB30, PB31, PB32, PB33, PB34,
PB35, PB37, PB38).
2.Remove the 3 scewqs and then remove the PB-Board
Block.
3.Remove the 1 screw and then remove the PB-Board.
12
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.7. Removal of the D-Board
1.Remove the PB-Board Block.(Reference to Removal of the
PB-Board)
2.Disconnect the couplers(D1, D3, D5, D20, D25).
3.Remove the flexible cables from the couplers(D31, D32,
D33, D34).
4.Remove the 3 screws and then remove the D-Board.
7.8. Removal of the P-Board
1.Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25, P30).
2.Remove the 8 screws and then remove the P-Board.
7.8.1. Removal of the P(P-1)-Board
1.Disconnect the couplers(CN01, CN02, CN03).
2.Remove the 5 screws.(Top view)
3.Remove the 8 screws.(Bottom view)
4.Remove the P(P-1)-Board from the 6 molding props.
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.8.2. Removal of the P(P-2)-Board
1.Disconnect the couplers(CN05, CN06, CN08).
2.Remove the 5 screws.(Top view)
3.Remove the 8 screws.(Bottom view)
4.Remove the P(P-2)-Board from the 6 molding props.
Note:
· When assembling the P(P-1)-Board and the P(P-2)-
Board, the position of each hole of the insulation
sheets(A, B, C, D) is set to the position of each hole of
the P(P-1)-Board and the P(P-2)-Board and then
assemble them. ( marks indicate setting positions.)
14
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.9. Removal of the SU-Board and
the SD-Board
1.Disconnect the couplers(SC45, SC46).
2.Remove the each 4 screws.
3.Slide the SU-Board and the SD-Board to the left (arrow1).
4.Disconnect the coupler(SU45).
5.Remove the flexible cables from the couplers(SU1, SU2,
SU3, SU4) and then remove the SU-Board.
6.Disconnect the coupler(SD46).
7.Remove the flexible cables from the couplers(SD1, SD2,
SD3, SD4) and then remove the SD-Board.
7.10. Removal of the SC-Board
1.Disconnect the couplers(PB31, PB32).
2.Remove the each 4 screws and then remove the Fan Block
(C).
3.Slide the SU-Board and the SD-Board to the left.
(Refarence to Removal of the SU-Board and the SD-Board)
4.Disconnect the couplers(SC2, SC20, SC23).
5.Remove the 10 screws of the SC-Board and slide the SC-
Board in the direction of the arrow (A) and then remove the
SC-Board.
Note:
Remove the SC-Board not to damage the flexible cables
of the SU-Board and the SD-Board, parts on the SC-
Board.
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.11. Removal of the SS2-Board and
the SS3-Board
1.Disconnect the coupler(SS23).
2.Remove the flexible cables from the couplers(SS51, SS52).
3.Disconnect the coupler(SS27).
4.Remove the flexible cables from the couplers(SS57, SS58).
5.Remove the each 3 screws and then remove the SS2-
Board and the SS3-Board.
7.12. Removal of the SS-Board
1.Disconnect the couplers(PB35, PB38).
2.Remove the 4 screws and then remove the Fan Block (D).
3.Disconnect the couplers(SS11, SS12, SS23, SS27, SS34,
SS35, SS42, SS44).
4.Remove the flexible cables from the couplers(SS53, SS54,
SS55, SS56).
5.Remove the 10 screws of the SS-Board and slide the SS-
Board in the direction of the arrow (B) and then remove the
SS-Board.
Note:
Remove the SS-Board not to damage the flexible cables
of the Plasma Panel and parts on the SS-Board.
7.13. Removal of the H3-Board (L,
R)
1.Remove the each 2 screws and then remove the Speaker
Terminal Blocks (L, R).
2.Disconnect the coupler(H37).
3.Remove the 3 screws (K) and then remove the H3-Board.
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.14. Removal of the C1, C2, C3, C4,
C5 and the C6-Board
1.Remove the each 4 screws and then remove the Fan
Blocks (A, B).
2.Remove the each 2 screws and then remove the Speaker
Terminal Blocks (L, R).
7.14.1. Removal of the C1-Board
1.Remove the flexible cable from the coupler(C10).
2.Disconnect the coupler(C11).
3.Remove the 8 screws and then remove the flexible cables
from the couplers(CA1, CA2, CA3, CA4).
4.Remove the 6 screws and then remove the C1-Board.
7.14.2. Removal of the C2-Board
1.Remove the flexible cables from the couplers(C20, C21,
C24, C25).
2.Disconnect the couplers(C22, C23).
3.Remove the 6 screws and then remove the flexible cables
from the couplers(CA5, CA6, CA7).
4.Remove the 6 screws and then remove the C2-Board.
7.14.3. Removal of the C3-Board
1.Remove the flexible cable from the coupler(C31).
2.Disconnect the couplers(C33, C35).
3.Remove the 8 screws and then remove the flexible cables
from the couplers(CA8, CA9, CA10, CA11).
4.Remove the 6 screws and then remove the C3-Board.
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.14.4. Removal of the C4-Board
1.Remove the flexible cable from the coupler(C41).
2.Disconnect the couplers(C42, C43, C44).
3.Remove the 8 screws and then remove the flexible cables
from the couplers(CB8, CB9, CB10, CB11).
4.Remove the 6 screws and then remove the C4-Board.
7.14.5. Removal of the C5-Board
1.Remove the flexible cables from the couplers(C50, C51,
C54, C55).
2.Disconnect the couplers(C52, C53).
3.Remove the 6 screws and then remove the flexible cables
from the couplers(CB5, CB6, CB7).
4.Remove the 6 screws and then remove the C5-Board.
7.14.6. Removal of the C6-Board
1.Remove the flexible cable from the coupler(C60).
2.Disconnect the coupler(C61).
3.Remove the 8 screws and then remove the flexible cables
from the couplers(CB1, CB2, CB3, CB4).
4.Remove the 6 screws and then remove the C6-Board.
7.15. Removal of the Fan
1.Disconnect the couplers(PB31, PB32, PB33, PB34, PB35,
PB37, PB38).
2.Remove the each 4 screws and then remove the Fan
Blocks(A, B, C, D).
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

7.15.1. Removal of the Fan (Middle/R)
1.Remove the 4 screws and then remove the Fan (Middle/R).
7.15.2. Removal of the Fan (Big) and the
Fan (Middle/L)
1.Remove the 4 screws and then remove the Fan (Big).
2.Remove the 4 screws and then remove the Fan (Middle/L).
7.15.3. Removal of the Fan (SC/SS) on the
SC-Board side
1.Remove the each 4 screws and then remove the Fans
(SC/SS).
7.15.4. Removal of the Fan (SC/SS) on the
SS-Board side
1.Remove the each 4 screws and then remove the Fans (SC/
SS).
7.16. Removal of the Escutcheon
1.Disconnect the couplers(J34, SS34).
2.Remove the 13 screws.
3.Pull the bottom of the Escutcheon in the direction of the
arrow1 and lift up the Escutcheon in the direction of the
arrow2 and then remove the Escutcheon.
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TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK

4.Remove the 2 screws(L) and then remove the S1-Board
Block and then Power Button Block.
5.Remove the 2 screws(M) amd then remove the V1-Board
and the Hinge Button Block.
7.17. Removal of the S1-Board and
the V1-Board
1.Remove the Escutcheon.
(Refernce to Removal of Escutcheon)
2.Remove the 2 screws (N) and then remove the S1-Board
Block.
3.Remove the 1 screw (P) and then remove the S1-Board.
4.Remove the 2 screws (R) and then remove the V1-Board.
5.Disconnect the coupler(S34) and then remove the S1-
Board.
6.Disconnect the coupler(V34) and then remove the V1-
Board.
20
TH-65PHD8BK / TH-65PHD8EK / TH-65PHD8UK