LG M1994A-PTJ User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LN73A
MODEL : M1994A M1994A-PTJ
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................14
TROUBLE SHOOTING ............................................................................17
BLOCK DIAGRAM...................................................................................23
DESCRIPION OF BLOCK DIAGRAM .....................................................24
RIPS BOARD BLOCK DIAGRAM ...........................................................25
EXPLODED VIE .................................................................................. 26
SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
any electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide etal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 Ω and 5.2 Ω.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
easure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt R S which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
AC Volt-meter
When 25A is impressed between Earth and 2 Grond
nd
* Base on Adjustment standard
Good Earth Ground
To Instrument's
such as WATER PIPE,
CONDUIT etc.
exposed
ETALLIC PARTS
for 1 second, Resistance must be less than 0.1
IMPORTANT SAFETY NOTICE
0.15uF
Ω

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DV ,
FETVO , etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
( ost replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. inimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of R A resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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Only for training and service purposes
LGE Internal Use Only
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: aintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
4. Module Specification
4.1 M1994A-PTJ : LM190WX1-TLG1(2)
1. Application Range.
This spec sheet is applied to the 19” Wide Monitor TV used
LN 3A chassis.
2. Specification
Each part is tested as below without special appointment
2.1 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Te t method
3.1 Performance : LGE test method followed.
3.2 Demanded other specification
3.3 Safety : CE, IEC specification
EMC : CE, IEC
No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Active Display area 408.24 (H) x 255.15 (V)
3 Outline Dimension 428(H) x 2 8(V) x 16.5(D) mm Typ.
4 Pixel Pitch 0.2835mm(H) x 0.2835mm(V) x RGB mm
5 Color arrangement RGB vertical Stripe
6 Color Depth 16. M color
Electrical Interface LVDS
8 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)
9 Operating Mode Normally White
10 Backlight Unit 4 CCFL(4 lamps)
11 Response Time 2.6ms(Typ.), .4ms(Max.) ms Typ.

5. General Specification
5.1 TV
- -
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LGE Internal Use Only
C2008
5.2 RGB / DVI
No Item Specification Remarks
1 Supported Sync. Type Separate Sync., Digital
2 Operating Frequency Analog Horizontal 28 ~ 83kHz
Vertical 56 ~ 5 Hz
Digital Horizontal 28 ~ 83kHz
Vertical 56 ~ 5 Hz
3 Resolution Analog Max. 1440x900 @ 5Hz
Recommand 1440x900 @ 60Hz
Digital Max. 1440x900 @ 60Hz
Recommand 1440x900 @ 60Hz
4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On On mode On/On Active Blue 55W(Max) Test condition:
On/On Active Blue 50W (Typ) -RGB-PC input with Max Resolution
Sleep mode Off/On Off Amber 1W -The others condition is to be default
On/Off
- Power supply (220V@60Hz, 110V@50Hz)
Power S/W Off Off mode - Off Off 1W
MTBF 50,000 HRS with 90% Confidence level
Lamp Life 50,000 Hours (Min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
9 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
10 Storage Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing
No Item Specification Remark
1 Vi deo input applicable system
PAL/SECAM BG
PAL/SECAM DK
PAL I
NTSC
2 Receivable Broadcasting System
PAL/SECAM BG
PAL/SECAM DK
PAL I
NTSC-M
VHF / UHF : C1~ C69
CATV : S1~ S4
PAL
3 RF Input Channel
VHF / UHF : 2 ~83
CATV : 1~ 1
NTSC
DK BG
VHF/UHF
CATV
C1~C62
S1~S41
C1~C 5
S2~S44
4 Input Voltage AC 100 ~ 240 V, 50Hz/60Hz
5 Market NON-EU
6 Tuning System
FVS 100 program
FS
PAL, 200 PR.(Op tion ; China only)
NTSC
Operating Environment
Temp : 10 ºC ~ 35º C
Humidity : 20 % ~ 80 %
8 Storage Environment
Temp : -10 ºC ~ 60º C non condensing
Humidity : 5 % ~ 90 % non condensing
9 Display LCD Module

- 8 -
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Only for training and service purposes
LGE Internal Use Only
C2008
6. Optical characteri tic pecification
6.1 Optical characteristic (Module)
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle<CR≥10> Right/Left 0/ 0 85/85
Up/Down 60/ 0 5/85
2. Luminance Luminance RGB-PC 250 300 APC : Clear, ACC : 6500K
(cd/m2) Full White (100 IRE)
AV/TV component 200 250 APC : Clear, ACC : Cool
Full White (100 IRE)
White Luminance Uniformity 5
3. Contrast Ratio CR RGB-PC/AV 500 850 At DFC Mode
TV/ Component Min 20.000 : 1
4. CIE Color Coordinates White Wx 0.313
Wy 0.329
In RGB-PC input
RED Rx Typ 0.641 Typ
Ry -0.03 0.335 +0.03 APC: Clear
Green Gx 0.298 ACC: 6500K
Gy 0.611 White
Blue Bx 0.14 (100 IRE)
By 0.0 0
* Optical Test Condition
- Surrounding Brightness Level : dark
- Surrounding Temperature : 25 ± 5°C
- warm-up Time : 30 Min
- Input Siganl : RGB-PC/AV/Component/TV
- Contrast, Brightness : Outgoing condition
6.2 Chroma
No Item Min Typ Max Remark
1. Cool Wx 0.255 0.285 0.315 In AV/Component
Wy 0.263 0.293 0.323 /TV input White 85IRE
2. Normal Wx 0.265 0.295 0.325
Wy 0.2 5 0.305 0.335
3. Warm Wx 0.283 0.313 0.343
Wy 0.299 0.329 0.359
4. 6500k Wx 0.283 0.313 0.343 In RGB-PC input Full White 100IRE
Wy 0.299 0.329 0.359
5. 9300k Wx 0.253 0.283 0.313
Wy 0.268 0.298 0.328

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
- 9 -
7. Model Specification
No Item Specification Remark
1. Market NON-EU
2. Broadcasting system
PAL BG/DK/I,
SECAM BG/DK
NTSC-M
VHF / UHF : C1~ 69
CATV : S1~S4 PAL
3. RF Input Channel VHF / UHF : 2~83
CATV : 1~ 1 NTSC
4. CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Rea r) :PAL50, SECAM, NTSC, PAL60
5. S-Video Input (1EA) PAL, SECAM, NTSC 4 System(Rear) : PAL50, SECAM, NTSC, PAL60
6. Component Input (1EA) Y/ Pb /Pr 480i /480p/5 6i/5 6p/ 20p/1080i
RGB-PC Max 1440 * 900@ 5Hz (M1994A)
Max 1680 * 1050@60Hz (M2294A)
. RGB Input (1EA)
RGB-DTV 480p, 5 6p, 20p, 1080i
DVI-PC Max 1440 * 900@60Hz (M1994A)
Max 1680 * 1050@60Hz (M2294A)
8. DVI Input (1EA)
DVI-DTV 480p, 5 6p, 20p, 1080i
9 HDM I Input (1EA) HMDI-DTV 480p, 5 6p, 20p, 1080i
10. Audio Input (3 EA) CVBS, PC Audio, Component L/R Input
* The spec range of Color coordinates is same with the one of module, because this model does not adjust white balance.
* Active area
- Active area of LCD PANEL is in bezel of cabinet.
- Interval between active area and bezel
| A-B|<1.0 mm , | C-D|<1.0 mm
A: Interval between left of active area and bezel
B: Interval between right of active area and bezel
C: Interval between top of active area and bezel
D: Interval between bottom of active area and bezel
C
B
D
A
Active Area
Bezel

No. Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)
1. 20*480 15. 3 59.94 13.500 480i
2. 20*480 15. 5 60.00 13.514 480i
3. 20*5 6 15.625 50.00 13.500 5 6i
4. 20*480 31.4 59.94 2 .000 480p
5. 20*480 31.50 60.00 2 .02 480p
6. 20*5 6 31.25 50.00 2 .000 5 6p
. 1280* 20 44.96 59.94 4.1 6 20p
8. 1280* 20 45.00 60.00 4.250 20p
9. 1280* 20 3 .50 50.00 4.25 20p
10. 1920*1080 33. 2 59.94 4.1 6 1080i
11. 1920*1080 33. 5 60.00 4.250 1080i
12 1920*1080 28.125 50.00 4.250 1080i
- 10 -
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Only for training and service purposes
LGE Internal Use Only
C2008
9 Component Video Input (Y, PB, PR)
8. General Specification
No Item Specification Remark
ENERGE SYNC (V/H) VIDEO LED COLOR POWER
CONSUMPTION
55W Max.
On mode On/On Active Blue 50W Typ.
Off/On
Power S/W
on Sleep mode On/Off Off Amber 1W
1.
Power S/W
Off Off mode - Off Off 1W
2. D-SUB
Pin configuration
1 : RED
3 : Blue
5 : S.T (GND)
: Green GND
9 : N.C
11: ID0 (GND)
13: H-Sync
15: SCL
2 : Green
4 : ID2 (GND)
6 : RED GND
8 : Blue GND
10: D-GND
12:SDA
14: V-Sync
Shell: GND
10: Digital GND
3. MTBF 50,000 HRS with 90% Confidence level Lamp Lif e : 50,000 Hours(min)
4. Using Altitu de 5,000 m (for Reliabilit y) 3,000m(for FOS)
5. Control Function 1) Contrast/Brightness/Co lor/Sharpness/Tint
2) Power On/Off, Input select, Menu, Enter, Volume ( , ), ( , )

Copyright LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
C2008
- 11 -
10.2 Input ( DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 20*480 31.4 59.94 2 .000 480p
2. 20*480 31.50 60.00 2 .02 480p
3. 20*5 6 31.25 50.00 2 .000 5 6p
4. 1280* 20 3 .5 50.00 4.250 20p
5. 1280* 20 44.96 59.94 4.1 6 20p
6. 1280* 20 45.00 60.00 4.250 20p
. 1920*1080 33. 2 59.94 4.1 6 1080i
8 1920*1080 33. 5 60.00 4.250 1080i
9 1920*1080 28.125 50.00 4.250 1080i
10. RGB
10.1 Input ( PC )
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 20*400 31.468 0.08 28.321
2 640*480 31.469 59.94 25.1 5
3 640*480 3 .5 5 31.5
4 800*600 3 .8 9 60.31 40.0
5 800*600 46.8 5 5.0 49.5
6 1024* 68 48.363 60.0 65.0
1024* 68 60.123 5.029 8. 5
8 1152*864 6 .500 5.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 9.9 6 5.035 135.0
11 1440*900 55.5 59.90 88. 50
12 1440*900 55.935 59.88 106.50
13 1440*900 0.635 4.984 136. 5
10.13 EDID Data
*
****
* * *
** ***

- 12 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C2008
11.3 EDID Data
** ** ** **
*****
** ***
11.2 Input ( DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 20*480 31.4 59.94 2 .000 480p
2. 20*480 31.50 60.00 2 .02 480p
3. 20*5 6 31.25 50.00 2 .000 5 6p
4. 1280* 20 3 .5 50.00 4.250 20p
5. 1280* 20 44.96 59.94 4.1 6 20p
6. 1280* 20 45.00 60.00 4.250 20p
. 1920*1080 33. 2 59.94 4.1 6 1080i
8 1920*1080 33. 5 60.00 4.250 1080i
9 1920*1080 28.125 50.00 4.250 1080i
11. DVI
11.1 Input ( PC )
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 20*400 31.468 0.08 28.321
2 640*480 31.469 59.94 25.1 5
3 640*480 3 .5 5 31.5
4 800*600 3 .8 9 60.31 40.0
5 800*600 46.8 5 5.0 49.5
6 1024* 68 48.363 60.0 65.0
1024* 68 60.123 5.029 8. 5
8 1152*864 6 .500 5.000 108.0
9 1280*1024 63.981 60.02 108.0
10 1280*1024 9.9 6 5.035 135.0
11 1440*900 55.5 59.90 88. 50
12 1440*900 55.935 59.88 106.50

- 13 -
Copyright LG Electronics. Inc. All right reserved.
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C2008
12.2 EDID Data
*
***
*****
****
12. HDMI
12.1 Input ( DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 20*480 31.4 59.94 2 .000 480p
2. 20*480 31.50 60.00 2 .02 480p
3. 20*5 6 31.25 50.00 2 .000 5 6p
4. 1280* 20 3 .5 50.00 4.250 20p
5. 1280* 20 44.96 59.94 4.1 6 20p
6. 1280* 20 45.00 60.00 4.250 20p
. 1920*1080 33. 2 59.94 4.1 6 1080i
8 1920*1080 33. 5 60.00 4.250 1080i
9 1920*1080 28.125 50.00 4.250 1080i
1) All data are HEXA
2) All data are HEXA
3) Adjustable Data :
*: Serial No.
**: week
***: year ex) when year 2008 : input “12”
**** : CHECK SUM (deferent along Serial No, week, year)

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- 14 -
ADJUSTMENT INSTRUCTION
1. Application
This document is applied to 19” LCD onitor TV (for Brazil)
which is manufactured in TV (or onitor) Factory or is
produced on the basis of this data.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. agnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard
2.5. Reserve after operation: Above 30 inutes
2.6. Adjustment equipments: Color Analyzer (CA-210 or CA-
110), Pattern Generator ( SPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller
* When TN300 is connected, TV function is available.
3. Main PCB check process
# APC - After anual-Insult, executing APC
# Download
1. Execute ISP program " star ISP Utility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check
"OK" message.
If display "Error", Check connect computer, jig, and
set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and
set.
4. Click "Read" tab, and then load download
file(XXXX.bin) by clicking "Read"
5. Click "Auto" tab and set as below
6. Click "Run".
7. After downloading, check "OK" message.
3.1 ADC Process
"If a scaler IC changed for PCB repairing, it is need to do
ADC process at all times."
3.1.1 PC input ADC
3.1.1.1 Auto RGB Gain/Offset Adjustment
• Convert to PC in Input-source
• Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
odel: 60 in Pattern Generator
Pattern: 29 in Pattern Generator ( SPG-925 SERISE)
[gray pattern that left & right is black and center is white
signal (Refer below picture)].
Adjustment pattern (PC )
• Adjust by commanding AUTO_COLOR_ADJUST(0xF1)
0x00 0x02 instruction.
3.1.1.2 Confirmation
• We confirm whether “0x8B, 0x8C” address of EEPRO
“0xB4” is “0xAA” or not.
• If “0x8B, 0x8C” address of EEPRO “0xB4” isn’t
“0xAA”, we adjust once more
• We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”
* anual ADC process using Service Remocon. After enter
Service ode by pushing “INSTART” key,
execute “Auto-RGB” by pushing “ ” key at “Auto-RGB”.
(2) OK
(1) (3)
(6)
filexxx.bin
(5)
(7) ……….OK
(4)
filexxx.bin

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Only for training and service purposes
LGE Internal Use Only
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3.2.1CO PONENT input ADC
3.2.1.1Component Gain/Offset Adjustment
• Convert to Component in Input-source
• Signal equipment displays
Impress Resolution 480P
MODEL : 212 in Pattern Generator
(480p ode, Y: 100%, Pb/Pr: 75%)
PATTERN : 08 in Pattern Generator
( SPG-925 SERISE)
Adjustment pattern (CO PONENT )
• Adjust by commanding AUTO_COLOR_ADJUST(0xF1)
0x00 0x02 instruction
3.2.1.2 Confirmation
• We confirm whether “0x8D, 0x8E” address of EEPRO
“0xB4” is “0xAA” or not.
• If “0x8D, 0x8E” address of EEPRO “0xB4” isn’t
“0xAA”, we adjust once more
• We can confirm the ADC values from “0x00~0x05”
addresses in a page “0xB4”
3.2 Function Check
3.2.1 Check display and sound
• Check Input and Signal items. ( cf. work instructions)
1.TV
2.AV (CVBS/ S-Video)
3.CO PONENT (480P)
4.RGB (PC : 1024 x 768 @ 60hz )
5.DVI-PC
6.HD I-DTV
7.PC Audio In and H/P Out
8.AV Sound
* Display and Sound check is executed by Remote controller.
4. Total Assembly line process
4.1 Adjustment Preparation
• Above 30 minutes H/run in Video no signal
• 15 Pin D-Sub Jack is connected to the signal of Pattern
Generator.
4.2 Confirm color coordinate of RGB
- Check White Balance
• Set Input to RGB.
• Input signal : (1024 x 768 @ 60Hz)
Full white 255/255 gray level
(100 IRE, odel : 60, Pattern : 4 at SPG925L)
• Set ACC : 6500k
• Confirm whether x = 0.313±0.03, y = 0.329±0.03 or not.
• Confirm whether luminance over 200cd/m2
• Set ACC : 9300k
• Confirm whether x = 0.283±0.03, y = 0.298±0.03 or not.
- Check sRGB
• Set Input to RGB.
• Input signal : (1024 x 768 @ 60Hz)
Full white 255/255 gray level
(100 IRE, odel : 60, Pattern : 4 at SPG925L)
• Set ACC : sRGB
• Confirm whether x = 0.313±0.03, y = 0.329±0.03 or not.
• Confirm whether luminance = 180±50 cd/m2
4.3 Confirm color coordinate of AV
• Set Input to AV.
• Input signal : CVBS, NTSC @ 60Hz
Full white 216/255 gray level
(85 IRE, odel : 201, Pattern : 78 at SPG925L)
• Set APC : Clear / ACC : Cool
• Confirm whether x= 0.285°±0.03, y= 0.293°±0.03 or not.
4.4 Confirm color coordinate of CO PONENT
• Set Input to CO PONENT.
• Input signal : 480P
Full white 216/255 gray level
(85 IRE odel : 212, Pattern : 78 at SPG925L)
• Set APC : Clear / ACC : Cool
• Confirm whether x= 0.285°±0.03, y= 0.293°±0.03 or not.
4.5 Confirm Auto adjustment operation.
• Input 1Dot on/off & Rectangle Pattern at odel 60
(1024*768@60Hz).
• Confirm adjustment operation by changing Clock,
Phase, H/V Position.
• Check Clock, Phase by pressing AUTO Key after
varying the Clock & the Phase
4.6 Other quality
• Confirm that each items satisfy under standard condition
that was written product spec.
Confirm Video and Sound at each source
4.6.1 AV
Select input AV(S-video) and whether picture is
displayed or not
Select input AV(CVBS) and whether picture is
displayed or not
4.6.2 TV
• Select input TV and check below item
1> In Gumi Factory
US04 – CAPTION, Stereo
4.6.3 RGB
4.6.3.1
Select input RGB model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
4.6.4 CO PONENT
Select input CO PONENT and whether picture is
displayed or not

- 16 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4.6.5 DVI-PC
4.6.5.1
Select input DVI model 112(1440*900@60hz), 64 Gray
Scale pattern and whether picture is displayed or not
4.6.6 HD I-DTV
4.6.5.1
Select input HD I model 112(1080i), 64 Gray Scale
pattern and whether picture is displayed or not
4.7 DP operation confirmation
Check if Power LED Color and Power Consumption
operate as standard.
Set Input to RGB and connect D-sub cable to set
• easurement Condition : 230V@ 50Hz (Analog)
• Confirm DP operation at the state of screen without
Signal
4.8 HDCP(High-Bandwidth Digital Contents Protection)
SETTING
• Connect D-sub Signal Cable to D-Sub Jack
• Input HDCP key with HDCP-key- in-program
• HDCP Key value is stored on EEPRO (AT24C64)
which is E00~F20 addresses of 0xBC~0xBE page
• AC off/ on and on HDCP button of SPG925 and
confirm whether picture is displayed or not of using
SPG925
• HDCP Key value is different among the sets.
4.9 Outgoing condition Configuration
• After all function test., press IN-STOP Key by SVC
Remote controller. And make Outgoing Condition.
• When pressing IN-STOP key by SVC remocon, Green
and red LED are blinked alternatively. And then
automatically turn off. ( ust not AC power OFF during
blinking)
4.10 internal pressure
• Confirm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second
5. EEPROM DATA
5.1 EEPRO DATA READ
5.2.1 Signal Table
5.2 E2PRO Data Write
5.2.1 Signal Table
LEN : 84h + Byte
C D : 8Eh
ADH : E2PRO Slave Address (A0, A2, A4, A8), Not 00h
(Reserved by Buffer to E2PRO )
ADL : E2PRO Sub Address ( 00~ FF)
Data : Write data
- use
• EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 – 7F” of “EEPRO Page A4”)
• FOS Default write : 16-mode data
(HFh,HFl,VF,STD,HP,VP,Clk,ClkPh,PhFine) write
• Random Data write : write the appointment Address of
E2PRO
5.4 VRA Read
• Send C D(70h) to read Video RA value from ICO
And save its value to 128-Bytes Buffer(Common Buffer
for the use of EDID)
• Delay 500ms ( Time to Wait and Read Video RA from
ICO )
• Be transmitted the contents of ICO ’s 128-bytes
Buffer to PC.
(128th Data is the CheckSum of 127-bytes data : That’s
OK if the value of adding 128-bytes Data is Zero)
ADH ADL LEN
BC 00 128
BC 80 128
BE 00 33
Delay 100ms
----------------------------------------------------------------------
128 Bytes
STOP
A A D1 6F
STOP
START
A
A
A
Dn
A A A 50 6E 03 C D ADH84 START AA ADL A CS
STOP
AAA AA 50 6E 03 C D ADH84+n START ADL A
CS
A
AData_1 A . . . Data_n A
No. Adjustment contents C D(hex) LEN Details
1 EEPRO WRITE E8 94 16-Byte Write
2 84+n n-byte Write
STOP
AAAA A 506E 03 70 0084 START AA 00 A CS
ACSA Data1 6F START . . . Data128 STOP
NA

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 17 -
TROUBLESHOOTING
Check P201 Connector.
Fail Check 15V or ST_5V
of Power B/D
Pass
CHECK 15V or ST_5V
of Power B/D
Check Output of
IC201 (3.3V),
IC203(1.8V)
Pass
Check Output of
IC207 (11V)
Check Output of
IC206 (3.3V),
IC208(1.8V)
Pass
Pass
5V 15V
1. NO PO ER (LED INDICATOR OFF) : [A] Process
Fail
Fail Change LED Assy.
Check LED Assy.
Pass
Re-soldering of Change
defect part of IC301,Q205
Check short of
IC301, Q205
Pass
Change IC201, IC203
Fail Re-soldering of Change
defect part of IC204
Check short of
IC204
Pass
Change IC207
Fail
Fail
Fail Re-soldering of Change
defect part of IC301,IC400
Check short of
IC301, IC200
Pass
Change IC206, IC208
Fail

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LGE Internal Use Only
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Fail
Fail
Fail
Repeat A RPOCESS.
Change Panel Link Cable
or odule
Change odule.
Check LED status
On Display Unit.
Check Panel Link
Cable or odule.
Check the LVDS
Output of IC301
Pass
Pass
Pass
2. No Raster : [B] Process
Fail
Fail
Change Inverter Connector
or Inveter
Chage R305
Check Inverter
Connector or inverter.
Check Output
of R305
Pass
Pass
Check Input source Cable
and Jack.

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LGE Internal Use Only
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Fail
Fail
Fail
Check input source cable
and jack.
Check the JK103
Re-soldering or Change the
defect part.
Re-soldering or Change the
defect part, Check the X300
Pass
Check the input/output
of R151, R152
Check the input/output
of R310, R312, R315
Check the input/output
of IC301.
Pass
Pass
3. No Raster on RGB Signal
Repeat [A,B] process.
Pass
X300

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LGE Internal Use Only
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4. No Raster Component Signal
Fail
Fail
Fail
Check input source cable
and jack.
Check the JK105
Re-soldering or Change the
defect part.
Re-soldering or Change the
defect part, Check the X300
Pass
Check the input/output
of R288
Check the input/output
of R319
Check the input/output
of IC301.
Pass
Pass
Repeat [A,B] process.
Pass
X300