LG M2343A User manual

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : LP63A
MODEL: M2343A (M2343A-BZC.A**NLF)
( ) **Same model for Service

- 2 -
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Size : 318.3 (V) x 546.0 (H) x 42.1 (D)
Pixel Pitch : 0.372mm x 0.372mm
Color Depth : 8bit, 16.7M colors
Active Video Area : 22.95 inches (582.96mm)diagonal
Surface Treatment : Anti-Glare, Hard Coating (3H)
Backlight Unit : 6 UCCFL
Opraating Mode : Transmissive mode, Normally Black
Electrical Interface : LVDS
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥10
Left : -85°min., -89°(Typ) Right : +85°min., +89°(Typ)
Top : +85°min., +89°(Typ) Bottom : -85°min., -89°(Typ)
2-2. Luminance : 320(min.), 450(typ.)
2-3. Contrast Ratio : 600(min.), 800(typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
1) Type : Separate Sync, Composite, SOG, Digital
3-3. Operating Frequency
Horizontal(Analog) : 30 ~ 83kHz
Horizontal(Digital) : 30 ~ 72kHz
Vertical : 56 ~ 85Hz
4. SPECIAL FUNCTION
4-1. Audio AMP
1) Output: 7Wrms + 7Wrms
2) Freq. Character: 250Hz~20KHz Range(-3dB)
3) Input: PC - 0.7 0.1Vrms
AV - 0.7 0.1Vrms
4-2. SPEAKER
1) Impedance : 8
2) Input : Max-12W, Normal-7W
4-3. TV
1) Type : PAL
2) Tuner IF : PIF - 38.9MHz
SIF - 33.4MHz
CIF - 34.47MHz
3) Receiving Channel : VHF- Low: 45.25~140.25MHz
HIGH: 147.25~423.25MHz
UHF - 431.25~855.25MHz
4-4. AV
1) Video Level : Input - 0.7 0.15Vp-p
2) Sync Level : Input - 0.286 0.075Vp-p
3) Color Burst : Input - 0.214 0.072Vp-p
4) Audio Level : AV Input - 0.7 0.1Vrms
PC Input - 0.7 0.1Vrms
5) Video Cross Talk : 43dB
5. Max Resolution
Analog : 1600 x 1200@60Hz
Digital : 1360 x 768@60Hz
6. Recommed Resolution
Analog/Digital : 1360 x 768@60Hz
7. POWER SUPPLY
7-1. Power
100-240V~, 50/60Hz
7-2. Power Consumption
8. ENVIRONMENT
7-1. Operating Temperature : 10°C~35°C (50°F~95°F)
7-2. Operating Humidity : 10%~80%
7-3. MTBF : 50,000 Hours (Min.)
9. DIMENSIONS (with TILT/SWIVEL)
Width : 588 mm (23.54'')
Depth : 260 mm (11.22'')
Height : 447 mm (18.35'')
10. WEIGHT (with TILT/SWIVEL)
Net. Weight : 11.3 kg (24.92 lbs)
Gross Weight : 17.5 kg (35.06 lbs)
CONTENTS
SPECIFICATIONS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
SERVICE PRECAUTIONS ...................................... 4
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9
DESCRIPTION OF BLOCK DIAGRAM ................. 10
ADJUSTMENT ....................................................... 11
TROUBLESHOOTING GUIDE .............................. 13
WIRING DIAGRAM ............................................... 17
EXPLODED VIEW...................................................18
REPLACEMENT PARTS LIST ...............................20
SCHEMATIC DIAGRAM..........................................29
MODE
ON MODE (NORMAL)
SLEEP MODE
POWER OFF
H/V SYNC
ON/ON
-
-
VIDEO
ACTIVE
OFF
OFF
POWER CONSUMPTION
less than 110 W
less than 5 W
less than 3 W
LED COLOR
BLUE
AMBER
OFF

- 3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter

SERVICING PRECAUTIONS
- 4 -
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

- 6 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

TIMING CHART
- 7 -
VIDEO
SYNC
F
E
C
A
B
D
MODE
D-SUB : 1~17, DVI-D: 1~14
section Polarity Dot
Clock Frequency Total
Period
( E )
Display
( A )
Front
Porch
( D )
Sync.
( C )
Back
Porch
( B ) Resolution
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350
V(Lines) - 70.8 449 350 37 2 60
2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) + 70.8 449 400 12 2 35
3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) - 75 500 480 1 3 16
5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480
V(Lines) - 85.0 509 480 1 3 25
6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 625 600 1 3 21
8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600
V(Lines) + 85.061 631 600 1 3 27
9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624
V(Lines) +/- 74.55 667 624 1 3 39
10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
11 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
12 H(Pixels) + 94.5 68.68 1376 1024 48 96 208 1024 x 768
V(Lines) + 85.00 808 768 1 3 36
13 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
14 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768
V(Lines) + 59.799 798 768 3 5 22
15 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
16 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x 1024
V(Lines) + 75.02 1066 1024 1 3 38
17 H(Pixels) + 162.00 75.00 2160 1600 90 30 88 1600 x 1200
V(Lines) + 60 1250 1200 1 3 46

- 8 -
DISASSEMBLY
Disassembly Back door. Remove the screws.
Open the Backcover's latch with Jig.
Remove the 10 screws from each side of metal frame.
Remove the screws.
# 1 # 2
# 3 # 4
# 6
Remove the 6 screws from each up of metal frame.
# 5

- 9 -
BLOCK DIAGRAM
CVBS
TV/Tunor
S-Video
TDA9178
YUV YUV
TC90A65F
(Comb filter)
Y/C
MST9883c
DDR
Memory
LVDS Output
IN1 (SCART1) IN2 (SCART2) IN3 (Y,C) IN1 (CVBS)
DC/DC
Converter
DC/DC
Converter
SP (R) SP (L)
Audio
amp
(MP7720)
H/phone
(TPA6110)
To Inverter
To LCD Module
To Inverter
CCIR656
TV-Out MNT-Out
MAX232
To Control W/W
Tuner
SAW
12V
24V
5V
Power
Adapter
MST5151
DVI-D Analog
Audio in
SCART 1 SCART 2
UOC lll
IFVO
CVBSO(PiP)

DESCRIPTION OF BLOCK DIAGRAM
- 10 -
1. Format Converter (MST9883C)(U603)
This IC contain A/D converter, Pre-amp and PLL circuit that converting
Analog video signal(0.7p-p RGB) to digital signal.(656 Format)
2. Power Supply Block DC-DC Converter (U313)
This is TC DC Voltage (24V->5V) Main Control system from AC Adator
3. DC/DC Converter block
DC/DC Converter convert the input 5V,15V to proper 3.3V,5V,12V for
Main control system.
For shooting heat trouble, we use the DC/DC converting IC
4. Audio Amplifier (MPS7720)(U201,U202)
This block is composed of MPS7720 and peripheral device
The function of the audio amplifier is that to amplify audio L / R signal transmitted from audio decoder. The audio signal is amplified
according to pre-defined DC volume control curve. Also, headphone amplifier (TPA6110) is controlled through line-out
5. Audio / Video / IF Decoder(U501)
This block is composed of UOC III and peripheral devices.
Micom controls this IC through IIC Line.
1) Video Decoder
This Block Selects input Video signals (like CVBS, Y/C, SCART RGB) and output RGB signal.
On decoding, We can control signal like Contrast, Brightness, Sharpness, Color, tint signals including Adaptive Comb Filter
2) Audio Decoder
This block analyzes audio input signal through A/V Jack and PC audio and Tuner IF.
The analyzed signals transmitted to audio amplifier (MPS7720)
On decoding, We can control signal like Bass, treble.
3) IF Decoder
This block can change IF signal to audio and video signal that transmitted to Video/audio decoder.
6. Video Signal Processor
It is composed of MST5151A(U401)
MST5151A includes A/D Converter and LVDS Transmitter
MST5151A is directly Inputted Analog and Digital Signal or Video Signal from Video Decoder
This Signal is converted into compatible Signal by MICOM's control and then MST5151A transmit it to LCD Module.
7. TUNER(TU701)
Micom controls this IC through IIC Line.
TUNER makes IF and transmits IF signal to UOC III

- 11 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys”file to
“c:\WINNT\system32\drivers”folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update”button
c) Click “Write”button
EEPROM initialize:<COMMAND: 0xE4 0x00 0x00>
ADC adjustment(Black):<COMMAND: 0xF1 0x00 0x00>
ADC adjustment(white):<COMMAND: 0xF1 0x00 0x01>
Factory shipping condition :
:<COMMAND: 0xE4 0x00 0x01> or Remotecontroller "MENU + 3 +0 +2 + 0"
=>SVC MENU => NVRAM initial => ON
Teletext language selection
: Remotecontroller "MENU + 3 +0 +2 + 0" =>SVC MENU =>Teletext Language
=> 0~5 (According to product spec or suffix)

- 12 -
SERVICE OSD
SERVICE MENU
Model Name : M2343A V1.00
LP Elapsed Time : 19H
Nvram Initial : OFF
Teletext Language : 0
WB Adjust 0
Teletext TOP OFF
Autooff after 2Hours ON
RGB Test
Prev
MENU
SERVICE MENU
Model Name : M2343A V1.00
LP Elapsed Time : 19H
Nvram Initial : OFF
Teletext Language : 0
WB Adjust 0
Teletext TOP OFF
Autooff after 2Hours ON
RGB Test
Prev
MENU
Description of operation
- Nvram Initial : Reset the NVRAM
- Teletext Language : Sets the Teletext Coad
- WB Adjust : Adjusts the white balance
- Teletext TOP : The use the TOP (On / Off)
- Auto Off after 2Hours
- RGB Test : Adjusts RGB Gain, Offset, Sub-Contrast/Sub-Brightness
Description of operation
- Aging Mode : Sets the aging mode
- Baud Rate : Sets the Baud Rate
- mst9883c ADC : Sets the TV/AV ADC
Figure 1. Cable Connection
220
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC POWER
ST
VGS MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
Video Signal
Generator

- 13 -
TROUBLESHOOTING GUIDE
1. NO POWER
Check Key Board
NO
NO
NO
Check Adaptor Jack Board
Change DC-DC Converter IC
(U313)
Check Crack of Damage
Of Circuit Item
Around U317,U304
NO Check U401
YES
YES
YES
YES
CHECK J301 Voltage
Pin #12,#2 : 24V
Check U317 Pin #3 : 3.3V
Check U304 Pin #3 : 2.5V
Check X401 : 14.318Mhz
1
2
3
1
Waveforms
J301-#12,2(24V) 3X401(14.318Mhz)
2U317-#3(3.3V)
NO POWER
(POWER INDICATOR OFF)
U313 IC
Pin #13 : 24V

- 14 -
2. NO RASTER(OSD IS NOT DISPLAYED)
NO RASTER
(OSD IS NOT DISPLAYED)
NO
NO
Change J401
NO Change Pannel Link Cable
Change Micom
YES
YES
YES
YES
Check Pannel Link
Cable
Check J801 Crack
J801 Check
#27,28,29,30 : 12V
Check J103,104
Pin #12,15 : 24V(Inverter)
Check U401(MST5151A)

- 15 -
3. NO RASTER ON AV1, AV2, TV
NO RASTER ON VIDEO
SIGNAL
Check Peripheral Circuit
Of J802(Scart)
NO Change Video Board Ass'y
YES
YES
YES
YES
Check Video Board
Check
U317 Pin #3 : 3.3V
Check U909 Pin #1 : 5V
AV1,2(Scart),AV3(CVBS)
Svideo J903, 904 Cable
Check.
In Case of TV
NO Change Video Board Ass'y
NO
YES
Check Peripheral Circuit
Check Tuner TU701
Check Connection of EXT.
YES
4 5
Waveforms
45
U317-#3(5V) U317-#1(3.3V)
Check Cable of J701,702

- 16 -
4. NO SOUND
NO SOUND
NO
NO
Check Speaker Condition
Check Adaptor Jack Board
Change the IC U201, 202
(Amp IC)
YES
YES
YES
Check U201,202
Pin #1 : 24V
NO Change the IC U203
(TPA6110A2) Zarphun IC
Check U203
Pin #4, 8 : 5V
Check U201,202
Pin #7 : 5V

- 17 -
30P
4P
12P
10P
8P
14P
11P
7P
main
etc total
video jack
adapter jack
power key
headphone
6631T10003S
6631T10003R
6631T20033J
6631T11012W
6631T20023J
6631T20028U
6631T10003Q
6631900061B
WIRING DIAGRAM

EXPLODED VIEW
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EXPLODED VIEW PARTS LIST
010
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3091TKL135C Cover Assembly, L2343 BRAND .. A-C/SKD
6304FLP350A LCD,Panel-TFT, LC230WX3-SLA1 23.0INCH 1365X768 450CD COLOR 72% -
3809TKL093C Cover Assembly, L2343 L096 A-C/SKD
3043TKK218D Base Assembly, M2343A . C-C/SKD,SILVER SPRAY
3551TKK564C Cover Assembly, L2343 REAR CABLE-ASSY A - C/SKD
6871TST806B PCB Assembly,Sub, M2343A CONTROL TOTAL BRAND CL-77
6871TST814B PCB Assembly,Sub, M2343A-BZB SKD HEADPHONE TOTAL BRAND CL-77
6871TST807B PCB Assembly,Sub, M2343A-BZB POWER-KEY(SKD) ETC TOTAL BRAND CL-77
6400GKTX01B Speaker,Fullrange, F1527C-6428-2 FERRITE 7W 8OHM 84DB 210HZ 71X41X28mM LUG
66339A0016A Inverter,DC/AC, LG PHILIPS LCD 6632L-0132B(KTY-MAIN
66339A0016B Inverter,DC/AC, LG PHILIPS LCD 6632L-0133B(KTY-SUB
4951TKS194H Plate Assembly, FRAME M2343A-BZC MAIN FRAME, G-C/SKD
33139L2014A Main Total Assembly, M2343A BRAND LP63A
6871TST813B PCB Assembly,Sub, M2343A-BZB SKD ETC TOTAL BRAND RS-232C /CL-77
49519K0001D Plate Assembly, REAR M2343A-BZC, C- C/SKD
6871TSTT01B PCB Assembly,Sub, M2343A-BZB SKD ADAPTER JACK SUB TOTAL BRAND CL-77
6871TST805C
PCB Assembly,Sub, M2343A-BZB VIDEO-JACK-SKD INTERFACE TOTAL M2343A ANRDLF LP63A
3551TKK563E Cover Assembly, L2343 REAR .. FOR M40 CHASSIS, D-C/SKD
6410VEH008A
Power Cord, SP-022+IS-034 H05VV-F 3GX0.75mm2 CT-12_1.8M_BLK SP-22 IS-34 1.8M NONE 250V 10A/16A H05VV-F 3X0.75MM2 BLACK VDE SEMKO N
Description
Part No.
Ref. No.
* Note: Safety mark

- 20 -
DATE: 2006. 04. 07.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C101 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C102 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C108 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C109 0CC101CK41A C1608C0G1H101JT 100pF 5% 50V
C110 0CC101CK41A C1608C0G1H101JT 100pF 5% 50V
C111 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C112 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C113 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C114 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C115 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C116 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C117 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C118 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C119 0CC680CK41A C1608C0G1H680JT 68pF 5% 50V
C120 0CC101CK41A C1608C0G1H101JT 100pF 5% 50V
C121 0CC101CK41A C1608C0G1H101JT 100pF 5% 50V
C122 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C123 0CE476WF6DC MVK6.3TP16VC47M 47uF 20% 16V
C124 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C125 0CC471CK41A C1608C0G1H471JT 470pF 5% 50V
C126 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C127 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C128 0CC471CK41A C1608C0G1H471JT 470pF 5% 50V
C129 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C130 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C134 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C135 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C139 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C140 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C141 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C142 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C143 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C144 0CC471CK41A C1608C0G1H471JT 470pF 5% 50V
C145 0CE476WC6DC MVK5.0TP6.3VC47M 47uF 20% 6.
C146 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C147 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C150 0CH8106F691 MVK4.0TP16VC10M 10uF 20% 16V
C151 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C152 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C153 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C154 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C155 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C157 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C158 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C161 0CK474CH94A 0603F474Z250CT 470nF -20TO+8
C162 0CK474CH94A 0603F474Z250CT 470nF -20TO+8
C163 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C164 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C165 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C166 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C201 0CH8476H691 MVK8.0TP25VC47M 47uF 20% 25V
C202 0CK104CK56A 0603B104K500CT 100nF 10% 50V
DATE: 2006. 04. 07.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C203 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C204 0CC221CK41A C1608C0G1H221JT 220pF 5% 50V
C205 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C206 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C207 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C208 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C209 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C210 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C211 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C212 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C213 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C214 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C215 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C216 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C217 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C218 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C219 0CK474CH94A 0603F474Z250CT 470nF -20TO+8
C220 0CK474CH94A 0603F474Z250CT 470nF -20TO+8
C221 0CK224CF56A 0603B224K160CT 220nF 10% 16V
C222 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C223 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C224 0CK105CF94A 0603F105Z160CT 1uF -20TO+80%
C225 0CK224CF56A 0603B224K160CT 220nF 10% 16V
C226 0CH8476H691 MVK8.0TP25VC47M 47uF 20% 25V
C227 0CH8476H691 MVK8.0TP25VC47M 47uF 20% 25V
C228 0CK474CH94A 0603F474Z250CT 470nF -20TO+8
C230 0CE227EF638 KMG5.0TP16VB220M 220uF 20% 1
C231 0CE227EF638 KMG5.0TP16VB220M 220uF 20% 1
C232 0CH8106F691 MVK4.0TP16VC10M 10uF 20% 16V
C233 0CC331CK41A C1608C0G1H331JT 330pF 5% 50V
C234 0CC331CK41A C1608C0G1H331JT 330pF 5% 50V
C250 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C251 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C252 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C253 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C254 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C255 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C256 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C257 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C258 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C259 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C260 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C261 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C262 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C302 0CE475EK638 KMG5.0TP50VB4.7M 4.7uF 20% 5
C303 0CE107EJ618 KMG5.0TP35VB100M 100uF 20% 3
C306 0CE107EJ618 KMG5.0TP35VB100M 100uF 20% 3
C307 0CK103CK51A 0603B103K500CT 10nF 10% 50V
C308 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C311 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C313 0CK104CK56A 0603B104K500CT 100nF 10% 50V
C333 0CK102CK56A 0603B102K500CT 1nF 10% 50V X
C334 0CE477EF638 KMG5.0TP16VB470M 470uF 20% 1
C335 0CE477EF638 KMG5.0TP16VB470M 470uF 20% 1
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
MAIN BOARD
CAPACITORS