LG GoldStar CB-28C20X User manual

GoldStar
Y
COLOUR
TV
SERVICE
MANUAL
|
SUA
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een
MODEL:
CB-28C20X
“4
GoldStar

CONTENTS
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DAISY
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3
SELVICHIIG
PRECAUTIONS
55
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7
Disassembly
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10
Exploded
View
Parts
List
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11
Replacement
Parts
List
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|
|
|
SAFETY PRECAUTIONS
WARNING
:
BEFORE
SERVICING
THIS
CHASSIS,
READ
THE
"X-RAY
RADIATION
PRECAUTIONS",
SAFETY
INSTRUCTIONS"
AND
"PRODUCT
SAFETY
NOTICE"
DESCRIBED
BELOW.
X-RAY RADIATION PRECAUTIONS
Excessive high voltage can produce potentially hazardous X-
RAY RADIATION. To avoid such hazards, the high voltage
Must not be above the specified limit. The nominai value of
the high voltage of this receiver is 29KV at Zero beam
current {minimum brightness) under specified power source.
The high voltage must not, under any circumstances, exceed
30KV. Each time a receiver requires servicing, the high
voltage should be checked. It is recommended the reading of
the high voltage be recorded as a part of the service record.
It is important to use an accurate and reliable high voltage
meter.
2.
The
only
source
of
X-RAY
RADIATION
in
this
TV
receiver
is
the
picture
tube.
For
continued
X-RAY
RADIATION
protection,
the
replacement
tube
must
be
exactly
the
same
type
tube
as
specified
in
the
parts
list.
.
Some
parts
in
this
receiver
have
special
safety-related
characteristics
for
X-RAY
RADIATION
protection.
For
continued
safety,
parts
replacement
should
be
undertaken
only
after
referring
to
the
PRODUCT
SAFETY
NOTICE
beiow.
SAFETY INSTRUCTIONS
Potential as high as 25,000-30,000 volts is present when this
receiver is operating. Operation of the receiver outside the
cabinet or with the back cover removed invoives a shock
hazard from the receiver.
(1) Servicing should not be attempted by anyone wno don't
know the precautions necessary through and through
when working on high-voltage equipment.
(2) Always discharge the picture tube anode to the CHASSIS
GROUND to reduce the shock hazard before removing the
anode cap.
(3) Perfectly discharge the high potential of the picture tube
before handling.
(WARNING: Risk of implosion. Handle with care.)
2. If any fuse in this TV receiver is blown, replace it with the
attached
at
back
cover.
(Do
not
use
a
line
isolation
transformer
during
this
check).
Use
an
AC
voitmeter
having
1000
ohms
per
volt
or
more
sensitivity
in
the
following
manner.
Connect
a
1000
ohm
resistor
between
a
known
good
earth
ground,
(water
pipe,
conduit,
etc.)
and
the
exposed
metallic
parts,
one
at
a
time.
Measure
the
AC
voltage
across
the
combination
of
1000
ohm
resistor.
Reverse
the
AC
plug
at
the
AC
outlet
and
repeat
AC
voitage
measurements
for
eacn
exposed
metallic
part.
Voltage
measured
must
not
exceed
1
volt
RMS.
This
corresponds
to
1
mA.
AC.
Any
value
exceeding
this
limit
constitutes
a
potential
shock
hazard
and
must
be
corrected
immediately.
FUSE specified in the chassis parts list only. AC Leakage Test
3. When replacing parts or circuit boards, wind the lead wires
around terminals before soldering.
4,
When
replacing
a
high
wattage
resistor
(oxide
metal
film
AC
VOLTMETER
resistor) in circuit board, keep the resistor 10 mm away from
Circuit board.
5. Keep wires away from high voitage or high temperature GOOD EARTH
components.
GROUND
SUCH
6. Before returning the set to the customer, always perform an AS A WATER
AC leakage current check on the exposed metallic parts of PIPE, CONDUIT
the
cabinet,
such
as
antennas,
terminals,
screwheads,
metal
ae
L
1000
chm
PLACE
THIS
P
ROBE
overlays,
control
shafts,
etc.,
to
be
sure
the
set
is
safe
to
zs
ON
EACH
EXP
OSED
Operate
without
danger
of
electrical
shock.
Since
this
TV
has
METALLIC
PARRT
AVC (Automatic Voltage Control) circuit, it may be operated
nonadjustably within the voltage area indicated in the label
PRODUCT SAFETY NOTICE
Many
electrical
and
mechanical
parts
in
this
chassis
have
special
safety-related
characteristics.
These
characteristics
xe
often
|
passed
without
being
noticed
by
a
visual
inspection
and
the
X-RAY
RADIATION
protection
afforded
by
some
of
then
cannot
necessarily
be
obtained
by
using
replacement
components
rated
for
higher
voltage,
wattage,
etc.
Replacement
parts
wich
have
these
special
safety
characteristics
are
identified
by
A
marks
on
the
schematic
diagram
and
the
replacement
parts
list.
Before
replacing
any
of
these
components,
read
the
parts
list
in
this
manual
carefully.
The
use
of
substitute
replacemmt.
parts
which
do
not
have
the
same
safety
characteristics
as
specified
in
the
parts
list
may
create
X-RAY
RADIATION.

SERVICING
PRECAUTIONS
CAUTION:
Before
servicing
receivers
covered
by
tnis
service
manual
and
its
supplements
ana
eddenda,
read
anc
*cilow
the
SAFETY
PRECAUTIONS
on
page
3
of
this
puolication.
NOTE:
if
unforeseen
circumstances
create
conflict
5etween
the
following
servicing
precautions
and
any
of
the
safety
precautions
on
page
3
of
this
publication,
always
follow
the
safety
precautions.
Remember.
Safety
First.
General
Servicing
Precautions
1.
Always
unplug
the
receiver
AC
power
cord
from
the
AC
power
source
before;
a.
Rernoving
or
reinsialling
any
component,
circuit
board
module
or
any
other
receiver
assembly.
b.
Disconnecting
or
reconnecting
any
receiver
electrical
plug
or
otner
electrical
connection.
<.
Connecting
a
test
substitute
in
garallel
with
an
electrolytic
capacitor
in
the
receiver.
CAUTION:
A
wrong
part
suostitution
or
incorrect
polarity
inszailation
of
electrolytic
capaecitcis
may
result
in
an
explosion
hazard.
d,
Discharging
the
picture
tube
ancde.
_
Test
hign
voitage
oniy
oy
measuring
it
with
an
appropriate
high
veitage
meter
or
other
voltage
Measuring
device
(DVM,
FETVGM,
etc)
equicced
with
a
suitable
high
voltage
probe.
Do
not
test
hign
voltage
Sy
“drawing
an
arc"
3.
Discharge
the
picture
tube
anode
cmy
by
(a)
first
connecting
one
ena
of
an
insulated
clip
lead
to
the
Cegaussing
or
KIre
aquadeg
grounding
system
shield
at
the
point
where
tne
picture
tube
socket
ground
lead
is
connected,
ana
then
it}
touch
the
other
end
cf
the
insulated
clip
lead
to
the
picture
tube
ancdeé
Dutton,
using
an
insulating
hanale
to
avoid
personal
contact
with
hign
veltage.
_
Do
not
soray
chemicals
on
or
near
this
receiver
or
any
of
its
assemblies.
5.
uniess
specified
otherwise
in
this
service manual,
clean
siectrical
contacts
oniv
oy
applying
the
following
mixture
to
tne
contacts
with
a
pipe
cleaner,
cotton-tipped
stick
or
comparable
nonabrasive
applicator:
1
%
(by
volume)
Acetone
and
90%
(by
volume?
isopropyl
aicchol
(S0%-99%
strength)
CAUTION:
This
is
a
fiammabie
mixture.
Uniess
specified
otherwise
in
this
service
Manual,
lubrication
of
contacts
in
not
required.
6.
Do
not
defeat
any
plug/socket
8+
voltage
interlocks
with
which
receivers
covered
by
this
service
manual
might
be
equipped.
_
Do
net
appiy
AC
power
to
this
instrument
and/or
any
of
it
electrical
assemblies
unless
ail
solid-state
cevice
heat
sinks
are
correctly
installed.
8.
Always
connect
the
test
receiver
ground
!ead
to
the
receiver
chassis
ground
before
connecting
the
test
receiver
positive
lead.
Always
remove
the
test
receiver
ground
lead
last.
9.
Use
with
this
receiver
only
the
test
fixtures
specified
in
this
service
manual.
CAUTION:
Co
not
connect
the
test
fixture
ground
strap
to
any
heatsink
in
this
receiver.
NN)
ott
oJ
Electrostatically
Sensitive
(ES)
Devices
Some
semiconductor
(solid
state)
devices
can
be
damaged
easily
by
static
electricity.
Such
components
commonly
are
called
Electrostatically
Sensitive
(ES)
Devices.
Examples
of
typical
ES
devices
are
integrated
Circuits
and
some
fieldeffect
transistors
and
semicounducto:
‘ship’
components.
Ths
following
techniques
should
be
usea
tc
nein
reduce
tne
incidence
of
component
damage
caused
ny
static
electricity.
+.
Immeciately
before
hancling
any
semiconductor
component
or
semiconductor-equippea
assemuly.
drain
off
any
electrostatic
charge
on
your
body
by
touching
2
known
aarta
ground.
Alternatively,
obtain
and
wear
a
commercially
availabie
discharging
wrist
strap
device,
wnich
should
te
removed
to
prevent
potential
shock
reasons
prior
to
applying
power to the unit under test.
_
After
removing
an
electrical
assembiy
equipped
with
ES
devices,
piace
the
assembly
on
2
concuctive
surface
such
as
aluminium
foil,
to
orevent
electrostatic
charge
ouildup
or
exposure
of
the
assembly.
3.
Use
only
a
grounded-tip
soldering
ircn
to
solder
or
unsolder
ES dev.ces.
4,
Use
only
an
anti-static
tvpe
soider
rernovai
device.
Some
solder
removai
devices
not
classified
as
“ant-static’
can
generate
electrical
charges
sufficient
to
Garnags
ES
devices
5.
Do
not
use
freon-cropeilea
chemicals.
These
can
ge
electrical
charges
sufficier:t
to
gamage
ES
devices.
.
Do
not
remove
a
replacement
ES
device
from
its
protective
package
until
immediately
before
you
are
reacy
<0
install
it.
(Most
replacement
ES
devices
are
packaged
with
leads
alectrically
snorted
together
bv
conductive
foarn,
aluminium
foil
or
comparable
conductive
material,
immediately
oefore
removing
the
srotective
material
from
the
leads
of
a
replacement
ES
device,
touch
he
proiective
material
to
the
chassis
or
circuit
assembiy
inta
whicn
tne
device
will
be
installed.
CAUTION:Be
sure
no
power
is
applied
to
the
chassis
oF
Circuit,
and
observe
all
other
saietv
precauticns
8.
Minimize
bodily
motions
when
hanaling
unpackagec
replacement
ES
devices.
(Otherwise
harmless
metion
such
as
the
bruching
together
of
your
clothes
fabric
cr
the
hiting
ef
your
foot
from
a
carpeted
floor
can
generate
static
electricity
sufficient
to
damage
an
£5
device.)
1)
Oo
“J
General Soldering Guidelines
1.
Use
a
grounded-tip,
!ow-wattage
soldering
iron
and
appropriate
tip
size
and
shnace
that
wil
anaintain
tip
temperature
within
the
range
cr
500°
F
to
600°.
2.
Use
an
appropriate
gauge
of
RMA
resin-core
solder
comocsed
of
60
parts
tin/40
parts
lead.
3.
Keep
the
soldering
iron
tip
clean
and
weil
tinned.
4.
Thoroughly
clean
the
surfaces
to
be
soldered.
Use
a
maii
wireoristle
(0.5
inch,
of
125cm)
brush
with
4
meta
handle.
Do
not
use
freon-oropeiled
sprav-on
cleaners.
.
Use
the
foilowing
unsoidering
technique
a.
Allow
the
soldering
iron
tp
to
reach
normal
iemperature.
(5G0°
F
to
600°
Fi
b.
Heat
the
component
lead
until
the
solder
melts.
c.
Quickly
draw
the
meited
soider
with
in
anti-static,
suction-type
solder
removal
device
or
withsclder
braid.
CAUTION:
Work
quickly
to
avoid
overheating
the
aircuitboard
printed
foil.
6. Use the following soldering technique.
a.
Allow
the
soldering
iron
tip
to
reach
a
normal
temperature
(500° F to 600° F}
b.
First,
hold
the
soldering
iron
tip
and
solier
the
strand
against
the
component
lead
until
the
soldermelts.
ol
-4-

c. Quickly move the soldering ircn tip to the junction of the
component !ead and the orinted circuit foil, and hold it
there only untii the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
doard printed foil.
. Closely inspect the solder area and remove any excess or
splashed solder with a smail wire-bristle brush.
C2.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following
technique should be used to remove and replace the IC. When
working with boards using the familiar round hole, use the
standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC !ead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-
type solder removal device (or with solider braid) before
removing the IC.
Replacement
1 Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(it is not necessary to reapply acrylic coating to the areas).
“Smail-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a “U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a"U" shape the replacement transistor jeads.
4, Connect the replacement transistor leads to the
corresponding leads extending from the circuit board and
crimp the “U" with long nose pliers to insure metal to metal
contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heatsink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
. Insert new transistor in the circuit board.
Solder each transistor lead, and clip off excess lead.
Replace heatsink. Oop
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendiculaly to the circuit
board. ’
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two “original” leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimo the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board
to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or ‘lift-off* the board.
The following guidelines and procedures should be followed
whenever this ccndition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper
pattern side of the circuit board. (Use this technique cnly on IC
connections).
1. Carefully remove the damaged copper pattern with a sharo
knife. (Remove only as much copper as absolutely
necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining cooper pattern.
3. Bend a small "U" in one end of*a smail gauge jumper wire and
carefully crimo it around the IC*pin. Solder the IC comection.
4. Route the jumper wire along the path of the cut-away
copper pattern and let it overlap the oreviously scraped end
of the good copper pattern. Soider the overlapped area and
clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the component side
of the circuit board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire yp ens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest componen: that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the leid of the
nearest component on one side of the pattern bre« to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so
that it does not touch components or sharp edges.
-5-

SPECIFICATIONS
NOTE
:
Specifications
and
others
are
subject
to
change
without
notice.
@ Video input system
:PAL
-
B/G
@
Power
requirements
:
230Vac
=
10%,
50
HZ
@
Intermediate
Frequency
(unit
:
MHZ)
@
Power
consumption
:
160W
max
.
Carrier
|
PAL-B/G
@ Sound output : 12W max x 2 way
a C—O
| |
|
Vision
(Vc)
|
38.9
Duai
/
Stereo
(2
carrier)
Sound
(Sc)
|
33.4
' 7
—————————
Ss
S
as
perenne
|
Color (Cc)
e@ Tuning range
| Band
| VHF-Low
VHF-High
|
34.47
|
@
Voice
coil
impedance
:
3
onm
fous
a
eae
ee
@
Antenna
input
impedance
:
VHF/UHF
750hm,
Unbalancec
For
TV
For
CATV
|
@
OSD
(On
Screen
Display)
:
Menu
method
Ch2-4
|
StT-S3,S1
|
|
S2
-
Si0,
i
@
Local
button:
Menu/OK
Ch5-12
|
Si1-
S20
Volume
up(+),
down(-}
i
$21-
S41
|
Program
up(+),
down(-)
Hyper
fg
Sy
a
UHF
Ch
21-
69
|
@ Function: Auto Program
Manual Program
Auto Sleep
@
Tuning
system:
FS
(Frequency
Synthesizer),
Quick
View
60
Program
Memory
Teletext
(TOP/FLOF/LIST)
Child Lock;
In
case
of
choosing
Lock
On,
you
can
power
on/off
only
with
e
External
conection:
S-VHS
in/Phono
Jack
AV
in
remote
controller.
To
cancel
of
this
mode,
select
lock
off
Jack
for
external
speaker(P654,
P653)
with
menu
button
on
remote
controller
only.
Scart 1(EURO-Socket, SK101)
Scart 2 (EURO-Socket, SK102)
Scart
1
|
Scart
2
:
Specifications
Video in/out
Audio in (2 way)
Audio out (2 way)
0.5Vrms +3cB, over 10Kohm
|
0.5Vrms+3dB,
below
1Kohm
0.7Vp-p + 3dB, 750hm

CONTROL DESCRIPTIONS
e@ Local control
e@ External A/V input Jack
Video Audio-L Audio-R
e Super A/V
| |
|
— Input Jack
1 | |
|
pot
2 3
|
|
VIDEO L-AUDIO-R
P }
AV3
e@ Head Phone Jack |
Voiurne & Dual | (Main)/Dual {I (Sub)
controlled sound output for Head-phone
| Button's name Description
To turn the TV power on
To show control menu
Refer to menu reference
To keep every selected control status
into memory
Volume Down | To decrease (-) sound volume
To increase (+) sound volume
|
Volume Up
6 Program Down | To change program No downwards
7 Program Up To change program No upwards
Seer =U
oO rep)
=
e@ Stand-by Indicator
Red color : Stand-by on
Yellow color : Stand-by off
e Stereo/Dual Sound Indicator
Mode} }| | —————
Mono | off | off |
Stereo on | on
Dual | on, off |
Dual I! off | on

e Menu Reference
aa | 4
TYPE
;
OSD
(On
Screen
Display)
Reference
hal
Y
1
|
MENU1
|
|
'
;
i
I
!
e
O47
inti
Contrast
1
|
&
31
TUN
Brightness
|
‘|
@
31
innit
Coiour
eee
J
7
|
Y
-
HHH
|
Volume
for
speaker
i
MENU
2
:
sevcceeesseen
(oe
|
Balance
|
VLAN
LALITLE
Treble
ra
HATE
|
Bass
TT
|
Volume
for
head-phone
a
;
|
Y
|
|
|
MENUS}
|
MODE
ones
|
|
ee
LOCK
OFF
°
AUTO
SLEEP
OFF
|
@
;
OFF
TIME--:--
|
TIME
Sors=
:
ey
|
;
rd
|
FINE
TUNING
|
|
Y
AUTO
PROGRAM
MEN
MANUAL SEARCH
j
PR
SKIP
OFF
|
@
FORCED
AV
OFF
°
|
|
Y
SYSTEM
BG
|
@
Receiving
System
OSD
!
me
hateianet:
i)
H
i
r
|
BBG
~~
DK
BH
lee
een
ee
we
ew ee
ee
eee
wee
eee
{
i
i
e
Use
Program
Down
/
Up
button
to
select
each
one
function
in
every
MENUs.
@
To
change
analog
level
in
MENU
1,
MENU
2
or
to
change
status
of
each
marked
(
@
)
in
Reference
column,
you
can
control
with
Volume
Down
/
Up
button.
:
NOTE:
To
keep
every
selected
status
in
memory,
press
OK
button.
|

DISASSEMBLY INSTRUCTIONS
important note
This set is disconnected from the power supply through the
converter transformer. An isolating transformer is necessary for
service operations on the primary side of the converter
transformer.
Back Cabinet Removal
Remove 10 screws residing on the back cabinet and carefuily
separate the back cabinet from the front cabinet.
CPT Removal
1. Puil out the CPT board from the CPT neck.
2. Place the front cabinet on soft material not to mar the front
surface or damage control knobs.
3. Remove 4 screws securing the picture tube mounting
brackets to the front cabinet.
4. Caretully separate CPT from the front cabinet.
Control
Board
Main
Board
Latch
Chassis Assy Removal
Slide the chassis back and out of the cabinet.
Speaker Assy Removal
1. Remove P651, P652 connector from Power, Deflection,
Sound-Amp Board.
2. Remove 2 screws for tweeter speaker and 4 for squawker
on front cabinet.
PICTURE TUBE HANDLING CAUTION
Due to high vacuum and large surface area of picture tube, great
care must be exercised when handling picture tube. Always |ift
picture tube by grasping it firmly around faceplate.
NEVER LIFT TUBE BY ITS NECK! The picture tube must not be
scratched or subjected to excessive pressure as fracture of
glass may result in an implosion of considerable violence which
can Cause personal injury or property damage.
Euro-Socket_
|
Speaker
Jacks
\
(SK101)
Power,
Deflec
tion,
Sound-Anp
Board
Euro-Socket
(SK102)

EXPLODED VIEW
a
, Se
IC:KS51800
COVER,BATTERY
_ 01SS518002A
303-H73A
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