Minew Minewsemi ms50sf7 User manual

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 1 -

MinewSemi

Subsidiary of Minew Technologies

Nordicsemi Strategy Partner

Bluetooth SIG Associated Member

Fira Alliance Adopter Member

Bluetooth Module

MS50SF7

Specification V1.0

Shenzhen Minewsemi Co.,

L t d .

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 2 -

Nordic nRF52832

Bluetooth Module

MS50SF7

The MS50SF7 is a surface-mount Bluetooth 5.0 module designed with the Nordic nRF52832

chip in a WLCSP package. It is a cost-effective and low-power System-on-Chip (SoC) solution,

suitable for Bluetooth Low Energy applications with strict size requirements.

MS50SF7 Basic parameter

Model

MS50SF7

Antenna

PCB

Chip Model

Nordic nRF52832

Module Dimension

9.8×8.4×2mm

Storage Capacity

512KB

RAM

64KB

Receiving Sensitivity

-96dBm

Emission Power

-40-+4dBm

RF Current

0dBm-5.3mA

Receiving Current

5.4mA

GPIO

Firmware

Application

Smart home , Intelligent wearable device, Consumer electronics,

Intelligent medical, Security equipment, Automotive equipment, Sports fitness equipment,

Instruments and apparatuses

PCB Antenna

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 3 -

INDEX

1 Product Introduction..............................................................................................................................- 4 -

2 Block Diagram........................................................................................................................................ - 5 -

3 Electrical Specification.......................................................................................................................... - 6 -

4 Mechanical Drawing............................................................................................................................. - 7 -

5 Pin Description........................................................................................................................................- 8 -

6 Pin Definition...........................................................................................................................................- 9 -

7 Electrical Schematic............................................................................................................................ - 10 -

8 Reference Design................................................................................................................................. - 11 -

9 PCB Layout........................................................................................................................................... - 12 -

10 Reflow and Soldering....................................................................................................................... - 14 -

11 Package Information........................................................................................................................ - 15 -

11.1 Package dimension............................................................................................................... - 15 -

11.2 Part number description....................................................................................................... - 16 -

12 Quality Disclaimer............................................................................................................................. - 17 -

13 Revision History.................................................................................................................................- 17 -

COPYRIGHT STATEMENT..............................................................................................................- 18 -

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 4 -

1 Product Introduction

The nRF52832 chip used in this module features an ARM Cortex-M4F RF transceiver with

faster MCU operating speed, reaching up to 64MHz. It has 512KB of FLASH program space,

64KB of RAM, and other powerful resources. This chip is suitable for low-power systems,

offering ultra-low sleep current and low power consumption during operation. The nRF52832

supports protocols such as ANT, Bluetooth Low Energy (BLE), BLE Mesh, Zigbee, and Thread.

With its compact size of 9.8*8.4mm and built-in PCB antenna, it can be utilized in applications

with strict size requirements. Additionally, it also allows for external antenna designs through

the ANT pins.

Features:

Bluetooth 5.0

Extremely compact size: 9.8mm*8.4mm*2mm

High performance

Supports protocols such as ANT, Bluetooth Low Energy (BLE), BLE Mesh, Zigbee, and

Thread

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 5 -

2 Block Diagram

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 6 -

3 Electrical Specification

Parameter

Values

Notes

Working Voltage

1.7V-3.6V

To ensure RF work, supply voltage suggest not lower than 2.3V

Working Temperature

-40℃~+85℃

Storage temperature is -40℃~+125℃

Transmission Power

-40 ~ +4dBm

Configurable

Current(RX)

5.4mA

RF receiving current under 1Mbps pattern

Current(TX)

5.3mA

RF transmission current under odB pattern

Module Dimension

9.8*8.4*2mm

Quantity of IO Port

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 7 -

4 Mechanical Drawing

*（Default unit：mm Default tolerance：±0.1）

Notice：Recommended pad size 0.5*0.4mm

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 8 -

5 Pin Description

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 9 -

6 Pin Definition

Pin Number

Symbol

Type

Description

ANT

External

antenna

pins

Using the module's built-in antenna, this pin is directly

suspended.

If not using the built-in antenna of the module, an external

antenna can be connected through this pin. When using an

external antenna, the resistor that is connected to the

antenna needs to be horizontally soldered to this pin.

VDD

Power

source

Power supply: 1.7V-3.6V, short-circuit VDD and VDDH to

use the pin to supply power

2/9/18/26/33-38

GND

Ground

3/28

SWCLK/SWDIO

Debug

Debug, when debug only need to connect power supply pin,

ground and these 2 pins.

4-8/10/12-17/19-25

/27/29-32

P0.0-P0.1/

P0.3-P0.10/

P0.12-P0.18/

P0.20-P0.21/P0.25/

P0.28-P0.31

I/O

I0 port for general purpose

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 10 -

7 Electrical Schematic

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 11 -

8 Reference Design

The Module doesn’t have 32.768kHz oscillator. To use it, add it as shown below:

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 12 -

9 PCB Layout

Module antenna area couldn’t have GND plane or metal cross line, couldn’t place components

nearby. It is better to make hollow out or clearance treatment or place it on the edge of PCB

board.

Notice: Refer to examples as below, and highly suggest to use the first design and the

adjustment of modules antenna design according to the first wiring.

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 13 -

Layout notes：

1) Preferred Module antenna area completely clearance and not be prevented by metals,

otherwise it will influence antenna’s effect (as above DWG. indication).

2) Cover the external part of module antenna area with copper as far as possible to reduce

the main board’s signal cable and other disturbing.

3) It is preferred to have a clearance area of 4 square meter or more area around the module

antenna (including the shell) to reduce the influence to antenna.

4) Device should be grounded well to reduce the parasitic inductance.

5) Do not cover copper under module’s antenna in order to avoid affect signal radiation or

lead to transmission distance affected.

6) Antenna should keep far from other circuits to prevent radiation efficiency reduction or

affects the normal operation of other lines.

7) Module should be placed on edge of circuit board and keep a distance away from other

circuits.

8) Suggesting to use magnetic beads to insulate module’s access power supply.

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 14 -

10 Reflow and Soldering

1) Do SMT according to above reflow oven temperature deal curve. Max. Temperature is

260℃;

Refer to IPC/JEDEC standard；

Peak TEMP<260℃；

Times：

≤2 times，

suggest only do once

reflow soldering on module surface in case of SMT double pad involved. Contact us if

special crafts involved.

2) Suggesting to make 0.2mm thickness of module SMT for partial ladder steel mesh, then

make the opening extend 0.8mm

3) After unsealing, it cannot be used up at one time, should be vacuumed for storage, couldn’t

be exposed in the air for long time. Please avoid getting damp and soldering-pan oxidizing.

If there are 7 to 30 days interval before using online SMT, suggest to bake at 65-70 ℃for

24 hours without disassembling the tape.

4) Before using SMT, please adopt ESD protection measure.

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 15 -

11 Package Information

11.1 Package dimension

*（Default unit：mm Default tolerance：±0.1）

* Note: Default weight tolerance all are within 10g（except the special notes)

Packing detail

Specification

Net weight

Gross

weight

Dimension

Quantity

1300PCS

420g

1000g

W=24mm，T=0.35mm

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 16 -

11.2 Part number description

Each module is with different code no. To devine whether with 32.768k or not, with on-board

antenna or external antenna, the code no. will be marked on the metal shield, description as

below：

Part No. in the first line

MS50SF7

Part No. in the

second line

1N32AIR

MS51SF1

Module code

Antenna category

PCB antenna

Ceramic antenna（Chip antenna）

IPEX Connector（1st Generation）

Low-frequency crystal

oscillator

With 32.768K Crystal Oscillaor

Without 32.768K Crystal Oscillator

SoC

m1805，nRF52805

nRF52810

nRF52820

nRF52832

nRF52833

nRF52833，nRF5340

SoC Package

=AA

=AB

=AC

RF Signal Output

internal

external

Packing mode

Reel tray

Tray pallet

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the

contents of this manual in other ways. Violators will be held accountable in accordance with the law.

- 17 -

12 Quality Disclaimer

The factory has passed the ISO9001 quality management system, ISO14001 environmental

management system and OAHS18001 occupational health and safety assessment . Each

product has been rigorously tested (transmission power test, sensitivity test, power

consumption test, stability test, aging test, etc.).

13 Revision History

Version

Change

Contributor

Date

Notes

1.0

First edition

Michelle

2023.6.9

MS50SF7

Specification V1.0

This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to

copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.

Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of the