MitraStar MIO-6706 User manual

Table of Contents
MIO-6706 User’s Guide
2
Table of Contents
Table of Contents .................................................................................................................................2
Chapter 1
Introduction...........................................................................................................................................3
1.1 MIO-6706 Overview ............................................................................................................................3
Chapter 2
The Development Kit ............................................................................................................................4
2.1 The Dimensions ..................................................................................................................................4
2.2 Connecting the Boards and Powering Up ...........................................................................................4
2.3 Connecting to a Computer and Starting Up ........................................................................................4
2.4 Other Information ................................................................................................................................7
2.5 Regulations/Certifications ...................................................................................................................8
Chapter 3
Wi-SUN Module Specifications............................................................................................................9
3.1 Wi-SUN Module PCB Size ..................................................................................................................9
3.2 Specifications ......................................................................................................................................9
3.3 Other Information ..............................................................................................................................10
3.4 Power Tree ........................................................................................................................................10
3.5 GPIO for Sub-1G TX/RX Switching ...................................................................................................10
3.6 Regulation/Certifications ...................................................................................................................10

MIO-6706 Quick Start Guide
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Chapter 1
Introduction
1.1 MIO-6706 Overview
The Wi-SUN (Wireless Smart Ubiquitous Network) Module Development Kit lets you try out the
MIO-6706 Wi-SUN Module.
The MIO-6706 is a Wi-SUN Module designed to be integrated with IoT sensors and gateways for
data transfer. The Wi-SUN network technology follows IEEE 802.15.4g/e and supports most
available sub-GHz frequencies. The Wi-SUN solution provides the advantages of long range
applications, low power, higher speed, hybrid mesh, and cost effectiveness. It provides open-
standards based secure, interoperable communications for large scale IoT, Smart Utility, and Smart
City networks.

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Chapter 2
The Development Kit
2.1 The Dimensions
The fixture board PCB size is 55 x 40 mm. The IO board PCB size is 75 x 70 mm.
2.2 Connecting the Boards and Powering Up
1Connect the fixture board and the IO board. Connect the included antenna to the IO board’s
antenna connector.
2Connect the Micro-USB port of the Development Kit to the included Micro-USB adapter.
3Connect the adapter to a proper power source to power up the Development Kit.
2.3 Connecting to a Computer and Starting Up
Follow the steps below to connect the Development Kit to a computer and start it up.
1Power up the Development Kit by following the steps in Section 2.2 on page 4.
2Connect the 4-pin UART port of the Development Kit to your computer’s USB port with an RS232
cable. Make sure the computer is powered on.
3You can access the Development Kit via various command tools in Linux and Windows
environments. The following example uses Windows 10 and Tera Term.
4In Windows, open Device Manager and check for a new COM port. COM8 is used in this example.

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Figure 1 New COM Port
5Open Tera Term and click Setup > Serial port....
Figure 2 Tera Term: Setup > Serial port...

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6Select the new COM port in the Port field.
Figure 3 Select Port
7Set the baud rate in the Speed field to 115200. Click OK to save the settings.
Figure 4 Set Speed
8The following screen appears. You can now start using commands for the Development Kit.

Chapter 2 The Development Kit
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Figure 5 Setup Complete
2.4 Other Information
Table 1 Other Information
1Environmental
Requirements
• Operating Temp: -20°C~+70°C
• Storage Temp: -30°C~+85°C
• Operating Humidity: 10% to 90% Non-Condensing
• Storage Humidity: 10% to 95% Non-Condensing
2 Other Requirements • Timer function
• Heat resistance and fireproofing

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2.5 Regulations/Certifications
Regulations (draft report only)
Table 2 Regulations/Certifications
COUNTRY/
REGION CERTIFICATION STANDARD FREQUENCY BAND BOM
U.S.A. FCC FCC Part 15C
§15.247
902 - 928 MHz 902 - 928 MHz
Taiwan NCC LP0002 §5.8 Taiwan, Asia Regions 920 - 925 MHz

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Chapter 3
Wi-SUN Module Specifications
3.1 Wi-SUN Module PCB Size
The Wi-SUN PCB size is 18 x 32 mm.
3.2 Specifications
Table 3 Wi-SUN Module Specifications
Frequency Band FCC: 902~928 MHz, NCC: 920~925MHz
Maximum Power
Consumption
400 mW
Link Rate Maximum is 300 kbps
Also support 50 kbps, 100 kbps, 150 kbps
TX FCC maximum peak conducted output power:
18.95 dBm at 50 kbps
18.96 dBm at 100 kbps
19.02 dBm at 150 kbps
18.99 dBm at 300 kbps
NCC maximum peak conducted output power:
18.98 dBm at 50 kbps
18.92 dBm at 100 kbps
11.28 dBm at 150 kbps
8.37 dBm at 300 kbps
RX Sensitivity in Wi-SUN mode:
-98 dBm at 50 kbps
-96 dBm at 100 kbps
-94 dBm at 150 kbps
-91 dBm at 300 kbps
Antenna Defined by customer

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3.3 Other Information
3.4 Power Tree
The I O board provides + 3.3V power t o t he syst em .
3.5 GPIO for Sub-1G TX/RX Switching
Figure 6 Trut h Table
3.6 Regulation/Certifications
Regulat ions ( EVT Test on ly, no cert if icat e)
Table 4 Other Information
1Environmental
Requirem ent s
• Operat ing Tem p: - 2 0° C~ + 70° C
• St orage Tem p: - 3 0° C~ + 85° C
• Operat ing Hum idit y: 10% t o 90% Non - Con den sin g
• St orage Hum idit y: 10% to 95% Non- Condensing
2 Ot her Requirem ent s • Tim er funct ion
• Heat resist ance and fireproofing
Table 5 Regulations
CERTIFICATION STANDARD
FCC FCC Part 15C § 15.247
NCC LP0002 §5.8.

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Federal Communication Commission Interference Statement
This equipm ent has been t est ed and found to com ply with the lim it s for a Class B digit al device,
pursuant t o Part 15 of t he FCC Rules. These lim its are designed to provide reasonable protect ion
against har m ful int erference in a resident ial installation. This equipm ent generates, uses and can
radiat e radio frequency energy and, if not inst alled and used in accordance wit h the inst ruct ions,
m ay cause harm ful int erference to radio com m unicat ions. However, t here is no guarant ee t hat
int erference will not occur in a particular installat ion. I f t his equipm ent does cause har m ful
int erference to radio or t elevision reception, which can be det erm ined by t urning the equipm ent off
and on, t he user is encouraged to t ry t o correct t he int erference by one of the following m easures:
• Reorient or relocat e t he receiving antenna.
• I ncrease t he separat ion bet ween t he equipm ent and r eceiv er.
• Connect t he equipm ent int o an outlet on a cir cuit different from t hat t o which the receiver is
connected.
• Consult t h e dealer or an ex per ienced radio/ TV t echnician for help
FCC Caution: Any changes or m odificat ions not expressly approved by t he party responsible for
com pliance could void t he user’s aut horit y t o operat e this equipm ent .
This device com plies wit h Part 15 of the FCC Rules. Operat ion is subj ect t o t he follow in g t wo
conditions: ( 1) This device m ay not cause harm ful int erference, and ( 2) t his device m ust accept any
int erference received, including interference that m ay cause undesired operat ion.
FCC Ra dia t ion Ex posu r e St a t e m e nt :
This equipm ent com plies with FCC radiat ion exposure lim its set forth for an uncont rolled
environm ent . This equipm ent should be inst alled and operat ed w it h m inim um dist ance 20cm
bet ween the radiat or & your body.
I M PORTAN T N OTE:
This m odule is int ended for OEM int egrat or. This m odule is only FCC authorized for the specific rule
par ts list ed on t he grant, and t hat t he host product m anufact urer is responsible for com pliance t o
any other FCC r ules that apply t o t he host not covered by t he m odular t ransm itt er grant of
certificat ion. The final host product still requires Part 15 Subpart B compliance t est ing wit h the
m odular t ransm it ter installed.
Addit ional t est ing and certificat ion m ay be necessary w hen m ult iple m odules are used.
LABEL OF THE END PRODUCT:
The final end product m ust be labeled in a visible area wit h the following " Contains TX FCC I D:
ZMY- MI O6706" .
Antenna information
An tenna ( 1 )
No. Manufact urer Model No. Ant enna Type Ant enna Gain
1 Hon gBo 290- 1054 0 PCB An t enna - 0.43 dBi
An tenna ( 2 )
No. Manufact urer Model No. Ant enna Type Ant enna Gain
1 Hon gBo 56- 001- 00 0023 Z PCB Ant en na - 0.85 dBi

Chapter 3 Wi-SUN Module Specifications
MIO-6706 Quick Start Guide
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National Communications Commission (NCC)
「取得審驗證明之低功率射頻器材,非經核准,公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之特性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,應立即停用,並
改善至無干擾時方得繼續使用。前述合法通信,指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合
法通信或工業、科學及醫療用電波輻射性電機設備之干擾。」。
「本模組於取得認證後將依規定於模組本體標示審驗合格標籤 , 並要求平台廠商於平台上標示 「本產品內含射頻模
組 」。
Antenna information
An tenna ( 1 )
No. Manufact urer Model No. Ant enna Type Ant enna Gain
1 Hon gBo 290- 1054 0 PCB An t enna - 2.05 dBi
An tenna ( 2 )
No. Manufact urer Model No. Ant enna Type Ant enna Gain
1 Hon gBo 56- 001- 00 0023 Z PCB Ant en na - 1.01 dBi
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