Mobiletek LYNO L306 User manual

L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 0
L306 Hardware Design
GSM/WCDMA Module Series
Version：V1.8
Date：2018-03-06
Shanghai Mobiletek Communication Ltd

L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 1
Notice
Some features of the product and its accessories described herein rely on the software installed,
capacities and settings of local network, and therefore may not be activated or may be limited by local
network operators or network service providers. Thus, the descriptions herein may not exactly match
the product or its accessories which you purchase. Shanghai Mobiletek Communication Ltd reserves
the right to change or modify any information or specifications contained in this manual without prior
notice and without any liability.
Copyright
This document contains proprietary technical information which is the property of Shanghai Mobiletek
Communication Ltd. copying of this document and giving it to others and the using or communication
of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of
damages. All rights reserved in the event of grant of patent or the registration of a utility model or
design. All specification supplied herein are subject to change without notice at any time.
DISCLAIMER
ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY
APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,
INCLUDINGBUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY,
RELIABILITY OR CONTENTS OF THIS MANUAL.TO THE MAXIMUM EXTENT PERMITTED BY
APPLICABLE LAW, IN NO EVENT SHALL SHANGHAI MOBILETEKCOMMUNICATION LTD BE
LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR
LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED
SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT.
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L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 2
Version History
Date
Version
Modify records
Author
2016-07-06
V1.0
First Release
Rc.dong,Lb.xu
2016-07-29
V1.1
Modify HSPA Description
Lb.xu
2016-08-05
V1.2
Modify Band Support Description
Lb.xu
2016-11-10
V1.3
Modify error
Rc.dong
2017-03-15
V1.4
Replace Figure 3-6 and Figure 3-9,update Log,
update the boot circuit
Rc.dong
2017-06-25
V1.5
Modify chapter “storage and production”; add the
PIN definition of the L306G; Add description of
L306G, Delete L306M/H information. Add description
of the Ring signal
Rc.dong,Lb.xu
2017-07-14
V1.6
Adjust the direction of the module package
Rc.dong
2017-10-10
V1.7
Modify chapter “storage and production”; add label
description; delete SD card and SPI, update Log
Rc.dong
2018-03-06
V1.8
Add differences between L306E/A and L306G;
modify description of the PIN59 and PIN82; update
Figure 3-9 and Figure 3-10
Rc.dong
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L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 3
CONTENT
1. Introduction ...................................................................................................................................... 5
1.1 Hardware Diagram ......................................................................................................................... 5
1.2 Main features ................................................................................................................................. 5
1.3 Specifications................................................................................................................................. 6
1.4 Interfaces ....................................................................................................................................... 7
2. Package Information ........................................................................................................................ 8
2.1 Pin Configuration ........................................................................................................................... 8
2.2 Pin definition .................................................................................................................................. 9
2.3 Package Information .................................................................................................................... 13
2.3.1 Dimensions ........................................................................................................................... 13
2.3.2 Product labeling..................................................................................................................... 14
2.3.3 Module size........................................................................................................................... 16
2.3.4 Recommend Pad................................................................................................................... 18
3. Interface Circuit Design .................................................................................................................. 20
3.1 Power Section.............................................................................................................................. 20
3.1.1 Power Supply ........................................................................................................................ 20
3.1.2 Power pin description ............................................................................................................ 21
3.1.3 Hardware Power On/Off......................................................................................................... 21
3.1.4 Hardware reset...................................................................................................................... 22
3.2 USIM Interface............................................................................................................................. 23
3.2.1 Pin Description ...................................................................................................................... 23
3.2.2 USIM application ................................................................................................................... 23
3.3 USB Interface .............................................................................................................................. 24
3.4 PCM Interface .............................................................................................................................. 25
3.5 IIC Interface ................................................................................................................................. 26
3.6 UART Interface ............................................................................................................................ 27
3.6.1 Pin Description ...................................................................................................................... 27
3.6.2 UART application................................................................................................................... 28
3.7 Interactive Application Interface.................................................................................................... 29
3.8 LED Interface............................................................................................................................... 29
3.8.1 LED Control circuit................................................................................................................. 29
3.8.2 LED State description............................................................................................................ 30
4. Electrical characteristics ................................................................................................................. 32
4.1 Electrical characteristics............................................................................................................... 32
4.2 Temperature characteristic ........................................................................................................... 32
4.3 Absolute Maximum Power ............................................................................................................ 33
4.4 Recommended operating conditions ............................................................................................ 33
4.5 Power consumption...................................................................................................................... 33
4.6 Power Sequence.......................................................................................................................... 35
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L306 Hardware Design
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4.7 Digital Interface Characteristics .................................................................................................... 35
4.8 ESD............................................................................................................................................. 36
5. RF Features................................................................................................................................... 38
5.1 Frequency Band........................................................................................................................... 38
5.2 Data link....................................................................................................................................... 39
5.3 Antenna Design............................................................................................................................ 40
6. Storage and Production.................................................................................................................. 44
6.1 Storage........................................................................................................................................ 44
6.2 Production ................................................................................................................................... 44
6.2.1 Module confirmation and moisture ......................................................................................... 45
6.2.2 SMT reflow attentions ............................................................................................................ 46
6.2.3 SMT stencil design and the problem of less tin soldering ....................................................... 47
6.2.4 SMT attentions ...................................................................................................................... 47
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L306 Hardware Design
Copyright © Shanghai Mobiletek Communication Ltd 5
1. Introduction
L306 is a small UMTS/HSPA+ module for LCC package, with stable and reliable performance. It
supports UMTS/HSDPA/HSUPA900(850)/2100(1900) and can be completely compatible with existing
GSM/GPRS/EDGE networks.
1.1 Hardware Diagram
Figure 1-1 L306 functional architecture
1.2 Main features
CPU
ARM Cortex-R4@481MHz
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L306 Hardware Design
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Flash
RAM: 512Mb LPDDR1, 200 MHZ
Flash: 1Gb NAND
L306 series frequency bands
Standard
Frequency
L306E
L306A
L306G
GSM
GSM850 MHZ
●
●
●
EGSM900 MHZ
●
●
●
DCS1800 MHZ
●
●
●
PCS1900 MHZ
●
●
●
WCDMA
UMTS850 MHZ
●
●
UMTS900 MHZ
●
●
UMTS1732 MHZ
●
UMTS1900 MHZ
●
●
UMTS2100 MHZ
●
●
HSPA
HSDPA
●
●
●
HSUPA
●
●
●
1.3 Specifications
Supply Voltage Range：3.3～4.2V（type3.8V）
Dimensions：30mm * 30mm * 2.65mm
Package：94-pin LCC
Operation Temperature Range：-40℃～+85℃
Storage Temperature Range：-45℃～+90℃
Antenna：Main Antenna、Diversity Antenna
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L306 Hardware Design
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Weight ：Approx 5g
1.4 Interfaces
IIC
PCM: Digital audio interface
SIM: Support 1.8V/3V
UART: High speed UART
USB 2.0: High Speed ,480Mbps
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L306 Hardware Design
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2. Package Information
2.1 Pin Configuration
Figure 2-1 L306 Pin View
ANT GND SIM Power IO Other Key PCM USB UART
83
84
85
86
94
87
93
88
92
91
90
89
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
81
GN D
GN D
PWR KE Y
SY SR STB
GN D
GPIO47
UR XD1
UT XD1
GPIO48
GN D
NC
US B_DM
US B_DP
GN D
VI O 18
LP RD B
US IM_ DATA
US IM_ RESET
US IM_ CLK
US IM_ VCC
GN D
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
82
GN D
AN T1
GN D
GN D
GPIO49
GPIO44
GPIO28
GPIO52
GPIO46
NETL I GHT /GP IO5 4
WAKE UP / GPI O0
STATU S/G PI O 51
GPIO53
NC
NC
GPIO17
NC
GN D
NC
GN D
AN T2
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
GN D NC GN D GN D PC M_ C LK PC M_ SYN C PC M_ DIN PC M_ DOU T UART0_DTR UART0_T X UART0_D CD UART0_R ING UART0_R X UART0_C T S UART0_RTS GN D GN D VBAT VBAT GN D
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
NC NC NC NC NC NC
GPIO3 9
NC
GPIO3 8
NC NC NC NC NC NC NC
GN D
VBAT VBAT
GN D
Pin59:ANT1
Pin
Module
L306E/A L306G
Main_ANT
Main_ANTMIMO_ANT
NC
Pin82:ANT2
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L306 Hardware Design
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2.2 Pin definition
Table 2-1 Differences Between L306E/A and L306G
Pin
NO.
Pin name
Type
L306E/A
L306G
59
ANT1
ANT
Main _ANT
NC
82
ANT2
ANT
MIMO_ANT
Main _ANT
Table 2-2 L306E/A/G Pin description
Pin
NO.
Pin name
Type
Function Description
Power
domain
State (1)
1.
GND
G
Ground
GND
2.
GND
G
Ground
GND
3.
PWRKEY
I
Powerkey button
0～4.2V
Open
4.
SYSRSTB
I
System reset signal
DVDD18
Open
5.
GND
G
Ground
GND
6.
GPIO47
I/O
General input/output PIN
DVDD18
Open
7.
URXD1
DI
UART1 RX
DVDD18
Open
8.
UTXD1
DO
UART1 TX
DVDD18
Open
9.
GPIO50
I/O
General input/output PIN
DVDD18
Open
10.
GND
G
Ground
GND
11.
NC
NC
12.
USB_DM
DIO
USB port differential data line
Open
13.
USB_DP
DIO
Open
14.
GND
G
Ground
GND
15.
VIO18
P
1.8V output voltage
1.8V
Open
16.
LPRDB
I/O
USB download key (Reserve)
DVDD18
Open
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L306 Hardware Design
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17.
USIM_DATA
I/O
USIM data
DVDD18
Open
18.
USIM_RESET
O
USIM reset
DVDD18
Open
19.
USIM_CLK
O
USIM clock
DVDD18
Open
20.
USIM_VCC
P
USIM output voltage
1.8/3.0V
Open
21.
NC
NC
22.
NC
NC
23.
NC
NC
24.
NC
NC
25.
NC
NC
26.
NC
NC
27.
GPIO39
I/O
General input/output PIN
DVDD18
Open
28.
NC
NC
29.
GPIO30
I/O
General input/output PIN
DVDD18
Open
30.
NC
NC
31.
NC
NC
32.
NC
NC
33.
NC
NC
34.
NC
NC
35.
NC
NC
36.
NC
NC
37.
GND
G
Ground
GND
38.
VBAT
P
Power supply
3.3～4.2V
VBAT
39.
VBAT
VBAT
40.
GND
G
Ground
GND
41.
GND
G
Ground
GND
42.
NC
NC
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L306 Hardware Design
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43.
GND
G
Ground
GND
44.
NC
NC
45.
GPIO17
I/O
General input/output PIN. It can be
used as LED control
DVDD18
Open
46.
NC
NC
47.
NC
NC
48.
GPIO53
I/O
General input/output PIN
DVDD18
Open
49.
STATUS/GPI
O51
O
Output PIN as operating status
indicating of module
DVDD18
Open
50.
WAKE UP
/GPIO0
I/O
Host to set the module into sleep or
wake up the module from sleep
DVDD18
Open
51.
NETLIGHT/G
PIO54
O
Output PIN as LED control for network
status
DVDD18
Open
52.
GPIO46
I/O
General input/output PIN
DVDD18
Open
53.
GPIO52
I/O
General input/output PIN
DVDD18
Open
54.
GPIO28
I/O
General input/output PIN
DVDD18
Open
55.
GPIO44
I/O
General input/output PIN. It can be
used as IIC clock
DVDD18
Open
56.
GPIO49
I/O
General input/output PIN. It can be
used as IIC data
DVDD18
Open
57.
GND
G
Ground
GND
58.
GND
G
Ground
GND
59.
ANT1
ANT
Pin number
L306E/A
L306G
Open
Pin59
Main_ANT
NC
Pin82
MIMO_ANT
Main_A
NT
60.
GND
G
Ground
GND
61.
GND
G
Ground
GND
62.
VBAT
P
Power supply
3.3～4.2V
VBAT
63.
VBAT
VBAT
64.
GND
G
Ground
GND
65.
GND
G
Ground
GND
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L306 Hardware Design
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66.
UART0_RTS
DI
UART0 ready to receive
DVDD18
Open
67.
UART0_CTS
DO
UART0 clear to send
DVDD18
Open
68.
UART0_RX
DI
UART0 receive data input
DVDD18
Open
69.
UART0_RING
DO
UART0 ring indicator
DVDD18
Open
70.
UART0_DCD
DO
UART0 data carrier detect
DVDD18
Open
71.
UART0_TX
DO
UART0 transmit output
DVDD18
Open
72.
UART0_DTR
DI
UART0 Data terminal ready
DVDD18
Open
73.
PCM_DOUT
I/O
PCM I/F data out
DVDD18
Open
74.
PCM_DIN
I/O
PCM I/F data in
DVDD18
Open
75.
PCM_SYNC
I/O
PCM interface sync
DVDD18
Open
76.
PCM_CLK
I/O
PCM interface clock
DVDD18
Open
77.
GND
G
Ground
GND
78.
GND
G
Ground
GND
79.
NC
NC
80.
GND
G
Ground
GND
81.
GND
G
Ground
GND
82.
ANT2
ANT
Pin number
L306E/A
L306G
Open
Pin59
Main_ANT
NC
Pin82
MIMO_ANT
Main_A
NT
83.
GND
G
Ground
GND
84.
GND
G
Ground
GND
85.
GND
G
Ground
GND
86.
GND
G
Ground
GND
87.
GND
G
Ground
GND
88.
GND
G
Ground
GND
89.
GND
G
Ground
GND
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L306 Hardware Design
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90.
GND
G
Ground
GND
91.
GND
G
Ground
GND
92.
GND
G
Ground
GND
93.
GND
G
Ground
GND
94.
GND
G
Ground
GND
(1) Suggested status when not in use.
Table 2-3 Pin type description
P:POWER
G:GROUND
I:INPUT
DI:DIGITAL INPUT
O:OUTPUT
DO:DIGITAL OUTPUT
ANT:ANTENNA
DIO:DIGITAL INPUT OUTPUT
NC:NOT CONNECT
2.3 Package Information
2.3.1 Dimensions
The L306 mechanical dimensions are described as following figure (Top view, Back view, Side view).
Notes：Module provides all IO ports need to be out of floating in the boot process. If the IO is
pulled up by the external voltage before booting, it may cause the module to not start normally.
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L306 Hardware Design
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Figure 2-2 Mechanical Dimensions
2.3.2 Product labeling
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L306 Hardware Design
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Figure 2-3 Label of L306
Table 2-4 Description of label
Item
Description
A
Logo of company
B
PID number
C
Environment-friendly use period
D
QR code---include IMEI number
E
IMEI number
F
SN number
G
CE
H
Pin1 mark
I
Module name
J
Module configuration，* stands for E, A or G（refer to table 2-1 and table 2-2）
K
WEEE
L
QR code---include SN number
M
CCC
N
RoHS
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L306 Hardware Design
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2.3.3 Module size
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L306 Hardware Design
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Figure 2-4 Module Size (back view)
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L306 Hardware Design
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2.3.4 Recommend Pad
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L306 Hardware Design
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Figure 2-5 Recommend pad(front view)
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