MSC CXB-6S User manual

Heat sink mounting instructions
COM ExpressTM Basic Module
CXB-6S, CXB-6SI, C6B-7S
Rev.1.2 2014-09-04

MSC CXB-6S, CXB-6SI, C6B-7S Rev. 1.2 Heat sink mounting instructions
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Preface
Copyright Notice
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Copying of this document, and giving it to others and the use or communication of the contents
thereof, is forbidden without express authority. Offenders are liable to the payment of damages.
All rights are reserved in the event of the grant of a patent or the registration of a utility model or
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Important Information
This documentation is intended for qualified audience only. The product described herein is not
an end user product. It was developed and manufactured for further processing by trained
personnel.
Disclaimer
Although this document has been generated with the utmost care no warranty or liability for
correctness or suitability for any particular purpose is implied. The information in this document
is provided “as is” and is subject to change without notice.
EMC Rules
This unit has to be installed in a shielded housing. If not installed in a properly shielded
enclosure, and used in accordance with the instruction manual, this product may cause radio
interference in which case the user may be required to take adequate measures at his or her
owns expense.
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If the information provided there does not solve your problem, please contact our Technical
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MSC CXB-6S, CXB-6SI, C6B-7S Rev. 1.2 Heat sink mounting instructions
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1 Introduction
This document is designed to give the customer a better understanding of important considerations, when
using MSC heat sinks on the MSC CXB-6S module. Below you will find important guidelines that must be
followed to ensure that the heat sink is properly mounted.
1.1 General Information
Modern computers use very dense chip architectures that create a lot of heat in a relatively small area. To
make sure that the parts are used within their specifications, it is necessary to provide a method to
conduct the thermal energy away from the sensitive semiconductor dies. For this purpose MSC offers
different cooling solutions, a heat spreader and a heat sink.
2 Mounting Instructions
Photo 1 shows the heat sink from top and bottom side as delivered in a blister packaging.
The two frames show the thermal contact locations of the heat sink. According to the amount of heat that
has to be transferred, different materials have to be chosen to achieve optimal thermal contact. The grey
pads consist of a phase change material that melts the first time it is heated. Due to the mechanical
pressure between die and heat sink, the residual material is pressed out of the gap; thus leaving behind
only a very thin film with a very good thermal performance. Since these pads are printed on the
aluminium, they are very soft and sensitive to scratches. If you happen to damage the surface of the
pad, use a clean knife or something similar and try to form it so that the die surfaces are
completely covered.
The blue pad under the smaller ALU block is designed not only to conduct the heat but also to
compensate for mechanical tolerances between chipset and heat sink.
Photo 1: Heat sink top and bottom side

MSC CXB-6S, CXB-6SI, C6B-7S Rev. 1.2 Heat sink mounting instructions
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Step 1: Insert the memory module into the top memory socket. Make sure it is inserted correctly!
Step 2: Place the printed circuit board onto the heat sink and fix it by tightening the five screws in the
sequence 1 to 5 as marked below.
Step 3: Insert the memory module into the bottom memory socket if necessary.

MSC CXB-6S, CXB-6SI, C6B-7S Rev. 1.2 Heat sink mounting instructions
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Step 4: THE MOST IMPORTANT STEP –Carefully remove the two orange-coloured transportation locks
and at the same time holding the heat sink, so that it does not suddenly hit the CPU die, due to the spring
tension. If the heat sink is released suddenly, it could cause damage to the sensitive ceramic die.
As long as the transportation locks are not removed, there is a gap between CPU die and cooling element
–the CPU cannot then be cooled!
The transportation locks have to be inserted again whenever the CPU module is removed from the
baseboard. This is necessary in order to prevent the printed circuit board from flexing due to the spring
tension.
Step 5: Mount the MSC CXB-6S module on the baseboard and fix it securely with five screws as shown
below. Please note, that these screws are not provided in the delivery, because there exist different
mechanical implementation options like stacking height of COM Express receptacles on the customers
carrier board.
Step 6: If applicable, mount the fan kit and connect it to the appropriate connector. The fan has to blow
downwards onto the module, in order to ensure sufficient air flow, to keep the module cool.
NOTE:
The grey heat conducting pads are phase change material and intended for one-time mounting only. If
you need to remove the heat sink for service purposes and want to reuse it, the wax-like material must be
spread over the full die surface before re-mounting the heat sink (see above, paragraph 2).