Telit Wireless Solutions LE940B6-NA AUTO Installation manual

LE940B6
Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15

LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
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This d cumentati n applies t the f ll wing pr ducts:
Table 1: Applicability Table
Module ame Description
LE940B6-NA AUTO N rth America regi nal variant (AT&T and T-M bile)
LE940B6-NV AUTO N rth America regi n variant (Veriz n, AT&T and T-M bile)
LE940B6-RW AUTO Rest f W rld variant (Eur pe, APAC, Latin America and m re)
LE940B6-CN AUTO China variant
N te: NV variant - t be devel ped

LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
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SPECIFICATIO S SUBJECT TO CHA GE WITHOUT OTICE
otice
While reas nable eff rts have been made t assure the accuracy f this d cument, Telit assumes
n liability resulting fr m any inaccuracies r missi ns in this d cument, r fr m use f the
inf rmati n btained herein. The inf rmati n in this d cument has been carefully checked and is
believed t be entirely reliable. H wever, n resp nsibility is assumed f r inaccuracies r missi ns.
Telit reserves the right t make changes t any pr ducts described herein and reserves the right t
revise this d cument and t make changes fr m time t time in the c ntent here f with n
bligati n t n tify any pers n f revisi ns r changes. Telit d es n t assume any liability arising
ut f the applicati n r use f any pr duct, s ftware, r circuit described herein; neither d es it
c nvey any license under its patent rights r the rights f thers.
It is p ssible that this publicati n may c ntain references t , r inf rmati n ab ut Telit pr ducts
(machines and pr grams), pr gramming, r services that are n t ann unced in y ur c untry. Such
references r inf rmati n must n t be c nstrued t mean that Telit intends t ann unce such Telit
pr ducts, pr gramming, r services in y ur c untry.
Copyrights
This instructi n manual and the Telit pr ducts described in this instructi n manual may be, include,
r describe c pyrighted Telit material, such as c mputer pr grams st red in semic nduct r
mem ries r ther media. Laws in Italy and ther c untries preserve f r Telit and its licens rs
certain exclusive rights f r c pyrighted material, including the exclusive right t c py, repr duce in
any f rm, distribute, and make derivative w rks f the c pyrighted material. Acc rdingly, any
c pyrighted material f Telit and its licens rs c ntained herein r in the Telit pr ducts described in
this instructi n manual may n t be c pied, repr duced, distributed, merged, r m dified in any
manner with ut the express written permissi n f Telit. Furtherm re, the purchase f Telit
pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r therwise, any
license under the c pyrights, patents r patent applicati ns f Telit, as arises by perati n f law
in the sale f a pr duct.
Computer Software Copyrights
Telit and third-party s ftware (SW) pr ducts described in this instructi n manual may include
c pyrighted Telit and ther third-party c mputer pr grams st red in semic nduct r mem ries r
ther media. Laws in Italy and ther c untries preserve f r Telit and ther third-party SW certain
exclusive rights f r c pyrighted c mputer pr grams, including the exclusive right t c py r
repr duce in any f rm the c pyrighted c mputer pr gram. Acc rdingly, any c pyrighted Telit r
ther third-party SW c mputer pr grams c ntained in the Telit pr ducts described in this
instructi n manual may n t be c pied (reverse engineered) r repr duced in any manner with ut
the express written permissi n f Telit r the third-party SW supplier. Furtherm re, the purchase
f Telit pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r
therwise, any license under the c pyrights, patents r patent applicati ns f Telit r ther third-
party SW, except f r the n rmal n n-exclusive, r yalty free license t use that arises by perati n
f law in the sale f a pr duct.

LE940B6 Hardware User Guide
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Usage and Disclosure Restrictions
License Agreements
The s ftware described in this d cument is the pr perty f Telit and its licens rs. It is furnished by
an express license agreement nly and may be used nly in acc rdance with the terms f such an
agreement.
Copyrighted Materials
S ftware and d cumentati n are c pyrighted materials. Making unauth rized c pies is pr hibited
by law. N part f the s ftware r d cumentati n may be repr duced, transmitted, transcribed,
st red in a retrieval system, r translated int any language r c mputer language, in any f rm r
by any means, with ut pri r written permissi n f Telit.
High Risk Materials
C mp nents, units, r third-party pr ducts used in the pr duct described herein are NOT fault-
t lerant and are NOT designed, manufactured, r intended f r use as n-line c ntr l equipment in
the f ll wing hazard us envir nments requiring fail-safe c ntr ls: the perati n f nuclear
facilities, aircraft navigati n r aircraft c mmunicati n systems, air traffic c ntr l, life supp rt, r
weap ns systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed
r implied warranty f fitness f r such high risk activities.
Trademarks
TELIT and the stylized T l g are trademarks and/ r registered trademarks f Telit C mmunicati ns
S.p.A. in the Unites States and/ r ther c untries. All ther pr duct r service names are the
pr perty f their respective wners.
C pyright © 2016 Telit C mmunicati ns S.p.A.

LE940B6 Hardware User Guide
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Contents
1. Introduction ..................................................................................................... 12
1.1. Sc pe ................................................................................................................ 12
1.2. Audience .......................................................................................................... 12
1.3. C ntact Inf rmati n, Supp rt .......................................................................... 12
1.4. Text C nventi ns ............................................................................................. 13
1.5. Related D cuments .......................................................................................... 14
1.6. Abbreviati ns ................................................................................................... 14
1.7. D cument Organizati n ................................................................................... 15
2. General Product Description ............................................................................ 17
2.1. Overview .......................................................................................................... 17
2.2. Applicati ns ..................................................................................................... 17
2.3. General Functi nality and Main Features ....................................................... 18
2.4. Envir nmental Requirements .......................................................................... 19
2.4.1. Temperature Range .............................................................................. 19
2.4.2. R HS C mpliance.................................................................................. 19
2.5. Operating Frequency Bands............................................................................. 20
2.5.1. RF Bands per Regi nal Variant ............................................................. 20
2.5.2. Reference Table f RF Bands Characteristics ....................................... 21
2.6. Sensitivity ......................................................................................................... 24
2.7. LE940B6 Mechanical Specificati ns ................................................................. 25
2.7.1. Dimensi ns ........................................................................................... 25
2.7.2. Weight .................................................................................................. 25
3. LE940B6 Module Connections .......................................................................... 26
3.1. Pin- ut .............................................................................................................. 26
3.2. LE940B6 Signals That Must Be C nnected ...................................................... 36
3.3. LGA Pads Lay ut ............................................................................................... 38
4. Electrical Specifications .................................................................................... 39
4.1. Abs lute Maximum Ratings – N t Operati nal ............................................... 39

LE940B6 Hardware User Guide
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4.2. Rec mmended Operating C nditi ns ............................................................. 39
4.3. L gic Level Specificati ns ................................................................................. 40
4.3.1. 1.8V Standard GPIOs ............................................................................ 40
4.3.2. 1.8V I2C Pads ........................................................................................ 41
4.3.3. 1.2V EMIC Pads ..................................................................................... 41
4.3.4. 1.8V/2.9V SIM Pads .............................................................................. 42
4.3.5. USB........................................................................................................ 42
4.3.6. 2.5V/3.3V EMAC Interface f r RMII and RGMII ................................... 43
5. Hardware Commands ....................................................................................... 44
5.1. Turning n the LE940B6 M dule ..................................................................... 44
5.2. Initializati n and Activati n State .................................................................... 44
5.3. Turning ff the LE940B6 M dule ..................................................................... 48
5.3.1. Shutd wn by S ftware C mmand ....................................................... 48
5.3.2. Hardware Shutd wn ............................................................................. 50
5.3.3. Unc nditi nal Hardware Reset (RESET_N)........................................... 51
5.3.4. Unc nditi nal Hardware Shutd wn ..................................................... 52
6. Power Supply ................................................................................................... 54
6.1. P wer Supply Requirements............................................................................ 54
6.2. General Design Rules ....................................................................................... 57
6.2.1. Electrical Design Guidelines .................................................................. 57
6.2.1.1. + 5V Input S urce P wer Supply – Design Guidelines ......... 57
6.2.1.2. + 12V Input S urce P wer Supply – Design Guidelines ....... 58
6.2.1.3. Battery S urce P wer Supply – Design Guidelines .............. 60
6.2.2. Thermal Design Guidelines ................................................................... 61
6.2.3. P wer Supply PCB Lay ut Guidelines ................................................... 61
7. Antenna(s) ....................................................................................................... 63
7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ................................. 63
7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................... 63
7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installati n Guidelines ................. 65
7.4. Sec ndary Antenna Requirements .................................................................. 65

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7.5. PCB Guidelines in case f FCC certificati n ..................................................... 65
7.5.1. Transmissi n line design....................................................................... 65
7.5.2. Transmissi n line measurements ......................................................... 66
8. Hardware Interfaces......................................................................................... 69
8.1. USB P rt ........................................................................................................... 70
8.2. Serial P rts ....................................................................................................... 71
8.2.1. M dem Serial P rt 1 ............................................................................. 72
8.2.2. M dem Serial P rt 2 ............................................................................. 73
8.2.3. M dem Serial P rt 3 ............................................................................. 73
8.2.4. RS232 Level Translati n ........................................................................ 74
8.3. Peripheral P rts ............................................................................................... 76
8.3.1. SPI – Serial Peripheral Interface ........................................................... 76
8.3.2. I2C - Inter-integrated Circuit ................................................................ 77
8.4. Ethernet Interface ............................................................................................ 77
8.5. Audi Interface ................................................................................................ 78
8.5.1. Anal g Audi ........................................................................................ 78
8.5.2. Digital Audi ......................................................................................... 79
8.6. General Purp se I/O ........................................................................................ 79
8.6.1. Using a GPIO Pad as Input .................................................................... 80
8.6.2. Using a GPIO Pad as Output ................................................................. 80
9. Miscellaneous Functions .................................................................................. 82
9.1. Indicati n f Netw rk Service Availability ....................................................... 82
9.2. RTC – Real Time Cl ck ...................................................................................... 83
9.3. VAUX P wer Output ........................................................................................ 83
9.4. ADC C nverter ................................................................................................. 83
9.4.1. Descripti n............................................................................................ 83
9.4.2. Using the ADC C nverter ...................................................................... 83
9.5. Using the Temperature M nit r Functi n ...................................................... 84
9.6. Fuel Gauge (TBD) ............................................................................................. 84
9.7. eFuse ................................................................................................................ 84

LE940B6 Hardware User Guide
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10. Mounting the Module on your Board ............................................................... 85
10.1. General ............................................................................................................. 85
10.2. Finishing & Dimensi ns .................................................................................... 85
10.3. Rec mmended F tprint f r the Applicati n ................................................. 86
10.4. Stencil ............................................................................................................... 87
10.5. PCB Pad Design ................................................................................................ 87
10.6. Rec mmendati ns f r PCB Pad Dimensi ns (mm) .......................................... 88
10.7. S lder Paste ..................................................................................................... 89
10.7.1. S lder Refl w ........................................................................................ 89
11. Application Guide ............................................................................................ 91
11.1. Debug f the LE940B6 M dule in Pr ducti n ................................................. 91
11.2. Bypass Capacit r n P wer Supplies ............................................................... 92
11.3. SIM Interface .................................................................................................... 93
11.3.1. SIM Schematic Example ........................................................................ 93
11.4. EMC Rec mmendati ns ................................................................................... 94
11.5. D wnl ad and Debug P rt ............................................................................... 94
11.6. Antenna Detecti n ........................................................................................... 95
12. Packing System ................................................................................................ 96
12.1. Tray Drawing .................................................................................................... 98
12.2. M isture Sensitivity ......................................................................................... 98
13. Conformity Assessment Issues ......................................................................... 99
13.1. FCC/IC Regulat ry N tices ............................................................................... 99
14. Safety Recommendations ................................................................................ 101
15. Document History ........................................................................................... 102

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List of Tables
Table 1: Applicability Table ................................................................................................................. 2
Table 2: Related D cuments ............................................................................................................ 14
Table 3: D cument Structure ........................................................................................................... 15
Table 4: RF Bands per Regi nal Variant ............................................................................................ 20
Table 5: RF Bands Characteristics ..................................................................................................... 21
Table 6: LE940B6 Pin- ut .................................................................................................................. 26
Table 7: Mandat ry Signals .............................................................................................................. 36
Table 8: Abs lute Maximum Ratings – N t Operati nal .................................................................. 39
Table 9: Rec mmended Operating C nditi ns ................................................................................ 39
Table 10: Abs lute Maximum Ratings – N t Functi nal .................................................................. 40
Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 40
Table 12: Operating Range – 1.8V I2C Pads ..................................................................................... 41
Table 13: Operating Range – 1.2V EMIC Pads .................................................................................. 41
Table 14: Operating Range – 1.8V SIM Pads .................................................................................... 42
Table 15: Operating Range – 2.9V SIM Pads .................................................................................... 42
Table 16: Operating Range – USB_D+, USB_D- Pads ........................................................................ 42
Table 17: Abs lute Maximum Ratings – 3.3V EMAC Interface......................................................... 43
Table 18: Operating Range – 2.5V EMAC Interface .......................................................................... 43
Table 19: Operating Range – 3.3V EMAC Interface .......................................................................... 43
Table 20: P wer Supply Requirements ............................................................................................ 54
Table 21: LE940B6 Current C nsumpti n ........................................................................................ 54
Table 22: Primary Antenna Requirements ...................................................................................... 63
Table 23: Antenna Line n PCB Requirements ................................................................................. 64
Table 24: LE940B6 Hardware Interfaces .......................................................................................... 69
Table 25: USB Interface Signals ........................................................................................................ 70
Table 26: M dem Serial P rt 1 Signals ............................................................................................. 72
Table 27: M dem Serial P rt 2 Signals ............................................................................................. 73
Table 28: M dem Serial P rt 3 Signals ............................................................................................. 73
Table 29: SPI Signals ......................................................................................................................... 76
Table 30: Ethernet Interface ............................................................................................................. 77
Table 31: Anal g Audi Signals ......................................................................................................... 78
Table 32: Digital Audi Interface (DVI) Signals ................................................................................. 79
Table 33: GPIOs ................................................................................................................................ 79
Table 34: Netw rk Service Availability Indicati n ............................................................................ 82
Table 35: Operating Range – VAUX P wer Supply ........................................................................... 83
Table 36: ADC Parameters ................................................................................................................ 83
Table 37: Rec mmendati ns f r PCB Pad Surfaces ......................................................................... 88
Table 38: S lder Pr file Characteristics ............................................................................................ 90
Table 39: SIM Interface – C1 Range .................................................................................................. 93

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Table 40: EMC Rec mmendati ns ................................................................................................... 94
Table 41: Tray Packing ...................................................................................................................... 96
Table 42: Packing Quantities ............................................................................................................ 96
Table 43: D cument Revisi n Hist ry ............................................................................................ 102