Telit Wireless Solutions LE940B6-NA AUTO Installation manual

LE940B6
Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15

LE940B6 Hardware User Guide
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This d cumentati n applies t the f ll wing pr ducts:
Table 1: Applicability Table
Module ame Description
LE940B6-NA AUTO N rth America regi nal variant (AT&T and T-M bile)
LE940B6-NV AUTO N rth America regi n variant (Veriz n, AT&T and T-M bile)
LE940B6-RW AUTO Rest f W rld variant (Eur pe, APAC, Latin America and m re)
LE940B6-CN AUTO China variant
N te: NV variant - t be devel ped

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SPECIFICATIO S SUBJECT TO CHA GE WITHOUT OTICE
otice
While reas nable eff rts have been made t assure the accuracy f this d cument, Telit assumes
n liability resulting fr m any inaccuracies r missi ns in this d cument, r fr m use f the
inf rmati n btained herein. The inf rmati n in this d cument has been carefully checked and is
believed t be entirely reliable. H wever, n resp nsibility is assumed f r inaccuracies r missi ns.
Telit reserves the right t make changes t any pr ducts described herein and reserves the right t
revise this d cument and t make changes fr m time t time in the c ntent here f with n
bligati n t n tify any pers n f revisi ns r changes. Telit d es n t assume any liability arising
ut f the applicati n r use f any pr duct, s ftware, r circuit described herein; neither d es it
c nvey any license under its patent rights r the rights f thers.
It is p ssible that this publicati n may c ntain references t , r inf rmati n ab ut Telit pr ducts
(machines and pr grams), pr gramming, r services that are n t ann unced in y ur c untry. Such
references r inf rmati n must n t be c nstrued t mean that Telit intends t ann unce such Telit
pr ducts, pr gramming, r services in y ur c untry.
Copyrights
This instructi n manual and the Telit pr ducts described in this instructi n manual may be, include,
r describe c pyrighted Telit material, such as c mputer pr grams st red in semic nduct r
mem ries r ther media. Laws in Italy and ther c untries preserve f r Telit and its licens rs
certain exclusive rights f r c pyrighted material, including the exclusive right t c py, repr duce in
any f rm, distribute, and make derivative w rks f the c pyrighted material. Acc rdingly, any
c pyrighted material f Telit and its licens rs c ntained herein r in the Telit pr ducts described in
this instructi n manual may n t be c pied, repr duced, distributed, merged, r m dified in any
manner with ut the express written permissi n f Telit. Furtherm re, the purchase f Telit
pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r therwise, any
license under the c pyrights, patents r patent applicati ns f Telit, as arises by perati n f law
in the sale f a pr duct.
Computer Software Copyrights
Telit and third-party s ftware (SW) pr ducts described in this instructi n manual may include
c pyrighted Telit and ther third-party c mputer pr grams st red in semic nduct r mem ries r
ther media. Laws in Italy and ther c untries preserve f r Telit and ther third-party SW certain
exclusive rights f r c pyrighted c mputer pr grams, including the exclusive right t c py r
repr duce in any f rm the c pyrighted c mputer pr gram. Acc rdingly, any c pyrighted Telit r
ther third-party SW c mputer pr grams c ntained in the Telit pr ducts described in this
instructi n manual may n t be c pied (reverse engineered) r repr duced in any manner with ut
the express written permissi n f Telit r the third-party SW supplier. Furtherm re, the purchase
f Telit pr ducts shall n t be deemed t grant either directly r by implicati n, est ppel, r
therwise, any license under the c pyrights, patents r patent applicati ns f Telit r ther third-
party SW, except f r the n rmal n n-exclusive, r yalty free license t use that arises by perati n
f law in the sale f a pr duct.

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Usage and Disclosure Restrictions
License Agreements
The s ftware described in this d cument is the pr perty f Telit and its licens rs. It is furnished by
an express license agreement nly and may be used nly in acc rdance with the terms f such an
agreement.
Copyrighted Materials
S ftware and d cumentati n are c pyrighted materials. Making unauth rized c pies is pr hibited
by law. N part f the s ftware r d cumentati n may be repr duced, transmitted, transcribed,
st red in a retrieval system, r translated int any language r c mputer language, in any f rm r
by any means, with ut pri r written permissi n f Telit.
High Risk Materials
C mp nents, units, r third-party pr ducts used in the pr duct described herein are NOT fault-
t lerant and are NOT designed, manufactured, r intended f r use as n-line c ntr l equipment in
the f ll wing hazard us envir nments requiring fail-safe c ntr ls: the perati n f nuclear
facilities, aircraft navigati n r aircraft c mmunicati n systems, air traffic c ntr l, life supp rt, r
weap ns systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed
r implied warranty f fitness f r such high risk activities.
Trademarks
TELIT and the stylized T l g are trademarks and/ r registered trademarks f Telit C mmunicati ns
S.p.A. in the Unites States and/ r ther c untries. All ther pr duct r service names are the
pr perty f their respective wners.
C pyright © 2016 Telit C mmunicati ns S.p.A.

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Contents
1. Introduction ..................................................................................................... 12
1.1. Sc pe ................................................................................................................ 12
1.2. Audience .......................................................................................................... 12
1.3. C ntact Inf rmati n, Supp rt .......................................................................... 12
1.4. Text C nventi ns ............................................................................................. 13
1.5. Related D cuments .......................................................................................... 14
1.6. Abbreviati ns ................................................................................................... 14
1.7. D cument Organizati n ................................................................................... 15
2. General Product Description ............................................................................ 17
2.1. Overview .......................................................................................................... 17
2.2. Applicati ns ..................................................................................................... 17
2.3. General Functi nality and Main Features ....................................................... 18
2.4. Envir nmental Requirements .......................................................................... 19
2.4.1. Temperature Range .............................................................................. 19
2.4.2. R HS C mpliance.................................................................................. 19
2.5. Operating Frequency Bands............................................................................. 20
2.5.1. RF Bands per Regi nal Variant ............................................................. 20
2.5.2. Reference Table f RF Bands Characteristics ....................................... 21
2.6. Sensitivity ......................................................................................................... 24
2.7. LE940B6 Mechanical Specificati ns ................................................................. 25
2.7.1. Dimensi ns ........................................................................................... 25
2.7.2. Weight .................................................................................................. 25
3. LE940B6 Module Connections .......................................................................... 26
3.1. Pin- ut .............................................................................................................. 26
3.2. LE940B6 Signals That Must Be C nnected ...................................................... 36
3.3. LGA Pads Lay ut ............................................................................................... 38
4. Electrical Specifications .................................................................................... 39
4.1. Abs lute Maximum Ratings – N t Operati nal ............................................... 39

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4.2. Rec mmended Operating C nditi ns ............................................................. 39
4.3. L gic Level Specificati ns ................................................................................. 40
4.3.1. 1.8V Standard GPIOs ............................................................................ 40
4.3.2. 1.8V I2C Pads ........................................................................................ 41
4.3.3. 1.2V EMIC Pads ..................................................................................... 41
4.3.4. 1.8V/2.9V SIM Pads .............................................................................. 42
4.3.5. USB........................................................................................................ 42
4.3.6. 2.5V/3.3V EMAC Interface f r RMII and RGMII ................................... 43
5. Hardware Commands ....................................................................................... 44
5.1. Turning n the LE940B6 M dule ..................................................................... 44
5.2. Initializati n and Activati n State .................................................................... 44
5.3. Turning ff the LE940B6 M dule ..................................................................... 48
5.3.1. Shutd wn by S ftware C mmand ....................................................... 48
5.3.2. Hardware Shutd wn ............................................................................. 50
5.3.3. Unc nditi nal Hardware Reset (RESET_N)........................................... 51
5.3.4. Unc nditi nal Hardware Shutd wn ..................................................... 52
6. Power Supply ................................................................................................... 54
6.1. P wer Supply Requirements............................................................................ 54
6.2. General Design Rules ....................................................................................... 57
6.2.1. Electrical Design Guidelines .................................................................. 57
6.2.1.1. + 5V Input S urce P wer Supply – Design Guidelines ......... 57
6.2.1.2. + 12V Input S urce P wer Supply – Design Guidelines ....... 58
6.2.1.3. Battery S urce P wer Supply – Design Guidelines .............. 60
6.2.2. Thermal Design Guidelines ................................................................... 61
6.2.3. P wer Supply PCB Lay ut Guidelines ................................................... 61
7. Antenna(s) ....................................................................................................... 63
7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ................................. 63
7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................... 63
7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installati n Guidelines ................. 65
7.4. Sec ndary Antenna Requirements .................................................................. 65

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7.5. PCB Guidelines in case f FCC certificati n ..................................................... 65
7.5.1. Transmissi n line design....................................................................... 65
7.5.2. Transmissi n line measurements ......................................................... 66
8. Hardware Interfaces......................................................................................... 69
8.1. USB P rt ........................................................................................................... 70
8.2. Serial P rts ....................................................................................................... 71
8.2.1. M dem Serial P rt 1 ............................................................................. 72
8.2.2. M dem Serial P rt 2 ............................................................................. 73
8.2.3. M dem Serial P rt 3 ............................................................................. 73
8.2.4. RS232 Level Translati n ........................................................................ 74
8.3. Peripheral P rts ............................................................................................... 76
8.3.1. SPI – Serial Peripheral Interface ........................................................... 76
8.3.2. I2C - Inter-integrated Circuit ................................................................ 77
8.4. Ethernet Interface ............................................................................................ 77
8.5. Audi Interface ................................................................................................ 78
8.5.1. Anal g Audi ........................................................................................ 78
8.5.2. Digital Audi ......................................................................................... 79
8.6. General Purp se I/O ........................................................................................ 79
8.6.1. Using a GPIO Pad as Input .................................................................... 80
8.6.2. Using a GPIO Pad as Output ................................................................. 80
9. Miscellaneous Functions .................................................................................. 82
9.1. Indicati n f Netw rk Service Availability ....................................................... 82
9.2. RTC – Real Time Cl ck ...................................................................................... 83
9.3. VAUX P wer Output ........................................................................................ 83
9.4. ADC C nverter ................................................................................................. 83
9.4.1. Descripti n............................................................................................ 83
9.4.2. Using the ADC C nverter ...................................................................... 83
9.5. Using the Temperature M nit r Functi n ...................................................... 84
9.6. Fuel Gauge (TBD) ............................................................................................. 84
9.7. eFuse ................................................................................................................ 84

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10. Mounting the Module on your Board ............................................................... 85
10.1. General ............................................................................................................. 85
10.2. Finishing & Dimensi ns .................................................................................... 85
10.3. Rec mmended F tprint f r the Applicati n ................................................. 86
10.4. Stencil ............................................................................................................... 87
10.5. PCB Pad Design ................................................................................................ 87
10.6. Rec mmendati ns f r PCB Pad Dimensi ns (mm) .......................................... 88
10.7. S lder Paste ..................................................................................................... 89
10.7.1. S lder Refl w ........................................................................................ 89
11. Application Guide ............................................................................................ 91
11.1. Debug f the LE940B6 M dule in Pr ducti n ................................................. 91
11.2. Bypass Capacit r n P wer Supplies ............................................................... 92
11.3. SIM Interface .................................................................................................... 93
11.3.1. SIM Schematic Example ........................................................................ 93
11.4. EMC Rec mmendati ns ................................................................................... 94
11.5. D wnl ad and Debug P rt ............................................................................... 94
11.6. Antenna Detecti n ........................................................................................... 95
12. Packing System ................................................................................................ 96
12.1. Tray Drawing .................................................................................................... 98
12.2. M isture Sensitivity ......................................................................................... 98
13. Conformity Assessment Issues ......................................................................... 99
13.1. FCC/IC Regulat ry N tices ............................................................................... 99
14. Safety Recommendations ................................................................................ 101
15. Document History ........................................................................................... 102

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List of Tables
Table 1: Applicability Table ................................................................................................................. 2
Table 2: Related D cuments ............................................................................................................ 14
Table 3: D cument Structure ........................................................................................................... 15
Table 4: RF Bands per Regi nal Variant ............................................................................................ 20
Table 5: RF Bands Characteristics ..................................................................................................... 21
Table 6: LE940B6 Pin- ut .................................................................................................................. 26
Table 7: Mandat ry Signals .............................................................................................................. 36
Table 8: Abs lute Maximum Ratings – N t Operati nal .................................................................. 39
Table 9: Rec mmended Operating C nditi ns ................................................................................ 39
Table 10: Abs lute Maximum Ratings – N t Functi nal .................................................................. 40
Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 40
Table 12: Operating Range – 1.8V I2C Pads ..................................................................................... 41
Table 13: Operating Range – 1.2V EMIC Pads .................................................................................. 41
Table 14: Operating Range – 1.8V SIM Pads .................................................................................... 42
Table 15: Operating Range – 2.9V SIM Pads .................................................................................... 42
Table 16: Operating Range – USB_D+, USB_D- Pads ........................................................................ 42
Table 17: Abs lute Maximum Ratings – 3.3V EMAC Interface......................................................... 43
Table 18: Operating Range – 2.5V EMAC Interface .......................................................................... 43
Table 19: Operating Range – 3.3V EMAC Interface .......................................................................... 43
Table 20: P wer Supply Requirements ............................................................................................ 54
Table 21: LE940B6 Current C nsumpti n ........................................................................................ 54
Table 22: Primary Antenna Requirements ...................................................................................... 63
Table 23: Antenna Line n PCB Requirements ................................................................................. 64
Table 24: LE940B6 Hardware Interfaces .......................................................................................... 69
Table 25: USB Interface Signals ........................................................................................................ 70
Table 26: M dem Serial P rt 1 Signals ............................................................................................. 72
Table 27: M dem Serial P rt 2 Signals ............................................................................................. 73
Table 28: M dem Serial P rt 3 Signals ............................................................................................. 73
Table 29: SPI Signals ......................................................................................................................... 76
Table 30: Ethernet Interface ............................................................................................................. 77
Table 31: Anal g Audi Signals ......................................................................................................... 78
Table 32: Digital Audi Interface (DVI) Signals ................................................................................. 79
Table 33: GPIOs ................................................................................................................................ 79
Table 34: Netw rk Service Availability Indicati n ............................................................................ 82
Table 35: Operating Range – VAUX P wer Supply ........................................................................... 83
Table 36: ADC Parameters ................................................................................................................ 83
Table 37: Rec mmendati ns f r PCB Pad Surfaces ......................................................................... 88
Table 38: S lder Pr file Characteristics ............................................................................................ 90
Table 39: SIM Interface – C1 Range .................................................................................................. 93

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Table 40: EMC Rec mmendati ns ................................................................................................... 94
Table 41: Tray Packing ...................................................................................................................... 96
Table 42: Packing Quantities ............................................................................................................ 96
Table 43: D cument Revisi n Hist ry ............................................................................................ 102

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List of Figures
Figure 1: LE940B6 High-level Functi nality ...................................................................................... 18
Figure 2: LGA Pads Lay ut LE940B6 334 Pads T p View .................................................................. 38
Figure 3: P wer- n Circuit ................................................................................................................ 44
Figure 4: LE940B6 Initializati n and Activati n ................................................................................ 45
Figure 5: P wer-up Fl w Chart ......................................................................................................... 46
Figure 6: AT C mmand Managing Fl w Chart .................................................................................. 47
Figure 7: Shutd wn by S ftware C mmand ..................................................................................... 49
Figure 8: Hardware Shutd wn .......................................................................................................... 50
Figure 9: Circuit f r Unc nditi nal Hardware Reset ........................................................................ 51
Figure 10: Circuit f r Unc nditi nal Hardware Shutd wn ............................................................... 52
Figure 11: Turn Off Pr cedure .......................................................................................................... 53
Figure 12: Example f Linear Regulat r with 5V Input ..................................................................... 58
Figure 13: Example f Switching Regulat r with 12V Input – Part 1 ................................................ 59
Figure 14: Example f Switching Regulat r with 12V Input – Part 2 ................................................ 59
Figure 15: ESD Pr tecti n f r USB2.0 ............................................................................................... 71
Figure 16: RS232 Level Adapti n Circuitry Example ......................................................................... 75
Figure 17: RS232 Serial P rt Lines C nnecti n Lay ut ..................................................................... 75
Figure 18: SPI Signal C nnectivity ..................................................................................................... 76
Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 81
Figure 20: Status LED circuit example .............................................................................................. 82
Figure 21: Fuel Gauge C nnectivity Example ................................................................................... 84
Figure 22: Applicati n M dule T p View ......................................................................................... 86
Figure 23: PCB Pad Design ................................................................................................................ 87
Figure 24: PCB Pad Dimensi ns ........................................................................................................ 88
Figure 25: Inhibit Area f r Micr -via ................................................................................................ 88
Figure 26: S lder Refl w Pr file ....................................................................................................... 89
Figure 27: SIM Schematics ................................................................................................................ 93
Figure 28: Tray Packing ..................................................................................................................... 97
Figure 29: Tray Drawing .................................................................................................................... 98

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1. Introduction
1.1. Scope
This d cument intr duces the Telit LE940B6 m dule and presents p ssible and rec mmended
hardware s luti ns f r devel ping a pr duct based n the LE940B6 m dule. All the features and
s luti ns detailed in this d cument are applicable t all LE940B6 variants, where “LE940B6”
refers t the variants listed in the applicability table.
If a specific feature is applicable t a specific pr duct nly, it will be clearly marked.
OTE:
LE940B6 refers t all m dules listed in the Applicability Table.
This d cument takes int acc unt all the basic functi ns f a wireless m dule; suggests a valid
hardware s luti n f r each functi n, and p ints ut inc rrect s luti ns and c mm n err rs t be
av ided.
Obvi usly, this d cument cann t embrace every hardware s luti n r every pr duct that can be
designed. Obvi usly, av iding invalid s luti ns must be c nsidered mandat ry. Where the
suggested hardware c nfigurati ns need n t be c nsidered mandat ry, the inf rmati n given
sh uld be used as a guide and a starting p int f r pr perly devel ping y ur pr duct with the Telit
LE940B6 m dule.
OTE:
The integrati n f the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE940B6 cellular m dule within a
user applicati n must be d ne acc rding t the design rules described in this manual.
1.2. Audience
This d cument is intended f r Telit cust mers, especially system integrat rs, ab ut t implement
their applicati ns using the Telit LE940B6 m dule.
1.3. Contact Information, Support
F r general c ntact, technical supp rt, t rep rt d cumentati n err rs and t rder manuals,
c ntact Telit’s Technical Supp rt Center (TTSC) at:
•[email protected] m
•TS-NORTHAMERICA@telit.c m
•TS-LATINAMERICA@telit.c m
•[email protected] m

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Alternatively, use:
http://www.telit.c m/en/pr ducts/technical-supp rt-center/c ntact.php
F r detailed inf rmati n ab ut where y u can buy the Telit m dules r f r rec mmendati ns n
access ries and c mp nents, visit:
http://www.telit.c m
T register f r pr duct news and ann uncements r f r pr duct questi ns c ntact Telit’s
Technical Supp rt Center (TTSC).
Our aim is t make this guide as helpful as p ssible. Keep us inf rmed f y ur c mments and
suggesti ns f r impr vements.
Telit appreciates feedback fr m the users ab ut the inf rmati n pr vided.
1.4. Text Conventions
The f ll wing c nventi ns are used t emphasize specific types f inf rmati n:
Danger:
This information MUST be followed or catastrophic equipment failure or bodily injury may
occur.
Caution or arning:
Alerts the user to important points about integrating the module. If these points are not
followed, the module and end user equipment may fail or malfunction.
OTE:
Tip r Inf rmati n – Pr vides advice and suggesti ns that may be useful when integrating the
m dule.
All dates are in ISO 8601 f rmat, that is, YYYY-MM-DD.

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1.5. Related Documents
Table 2: Related Documents
Document Title Document umber
Ref 1: LE940B6 AT C mmand Reference Guide 80514ST10767A
Ref 2: LE940B6 SW User Guide 1VV0301296
Ref 3: Telit EVK2 User Guide 1vv0300704
Ref 4: SIM Integrati n Design Guide 80000NT10001A
1.6. Abbreviations
Table 3: Table of Abbreviations
Term Definition
ADC Anal g-t -digital c nverter
AE Applicati n-enabled
DAC Digital-t -anal g c nverter
FDD Frequency divisi n duplex
GLONASS Gl bal rbiting navigati n satellite system
GNSS Gl bal navigati n satellite system
GPIO General-purp se input/ utput
GPRS General packet radi services
GPS Gl bal p siti ning system
GSM Gl bal system f r m bile c mmunicati ns
I2C Inter-integrated circuit
LTE L ng term ev luti n
SD Secure digital

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Term Definition
RGMII Reduced Gigabit media-independent interface
SIM Subscriber identity m dule
SOC System- n-Chip
SMX SmartMX
SPI Serial peripheral interface
UART Universal asynchr n us receiver transmitter
UMTS Universal m bile telec mmunicati ns system
USB Universal serial bus
WCI Wireless C existence Interface
WCDMA Wideband c de divisi n multiple access
1.7. Document Organization
This d cument c ntains the f ll wing chapters:
Table 3: Document Structure
Chapter# Chapter Title Description
1 Intr ducti n Pr vides the sc pe f this d cument, target
audience, c ntact and supp rt inf rmati n, and text
c nventi ns
2 General Pr duct Descripti n An verview f the pr duct features
3 LE940B6 M dule
C nnecti ns
Pin ut c nfigurati n and lay ut
4 Electrical Specificati ns Specifies electrical values f l gic levels f r this
m dule
5 Hardware C mmands Instructs h w t c ntr l the m dule via hardware
6 P wer Supply Supply lines and current c nsumpti n

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Chapter# Chapter Title Description
7 Antenna(s) Describes the antenna c nnecti ns and related
aspects f b ard lay ut design, which are m st
critical f r the verall pr duct design
8 Hardware Interfaces Specifies the peripheral and audi interfaces
9 Miscellane us Functi ns
10 M unting the M dule n
y ur B ard
11 Applicati n Guide
12 Packing System
13 C nf rmity Assessment
Issues
14 Safety Rec mmendati ns
15 D cument Hist ry

LE940B6 Hardware User Guide
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2. General Product Description
2.1. Overview
LE940B6 is Telit’s platf rm f r aut m tive telematics n-b ard units (OBU's) f r applicati ns,
such as aut m tive telematics and eCall, based n the f ll wing techn l gies:
•4G cellular f r v ice and data c mmunicati n
•GNSS ( pti nal) - GPS, GLONASS, BeiD u, Galile , QZSS, f r p siti ning service
•Embedded security
•Designed f r aut m tive markets
1
quality needs
In its m st basic use case, LE940B6 can be applied as a wireless c mmunicati n fr nt-end f r
telematics pr ducts, ffering GNSS and m bile c mmunicati n features t an external h st CPU
thr ugh its rich interfaces.
LE940B6 can further supp rt cust mer s ftware applicati ns and security features. LE940B6 is
based n a Y ct Linux system running n an applicati n pr cess r. Thanks t a dedicated
applicati n pr cess r and embedded security res urces, pr duct devel pers and manufacturers
can create pr ducts that guarantee fraud preventi n and tamper evidence with ut extra eff rt
f r additi nal security precauti ns.
LE940B6 can be self-sufficient and serve as a fully integrated s luti n f r applicati ns, such as
l cati n-based cellular telematics, navigati n, r ad pricing and eCall. In such a case, the cust mer
w uld simply c mplement the m dule with a p wer supply, speaker amplifier, micr ph ne,
antennas, and an HMI (if applicable).
LE940B6 is ffered with different regi nal variants acc rding t the list in Table 1: Applicability
Table.
2.2. Applications
LE940B6 can be used f r telematics applicati ns where tamper-resistance, c nfidentiality,
integrity, and authenticity f end-user inf rmati n are required, f r example:
•Emergency call
•Telematics services
•R ad pricing
•Pay-as-y u-drive insurance
•St len vehicles tracking
•Internet c nnectivity
1
In acc rdance with Telit’s R bustness Validati n, using AEC-Q100-defined qualificati n tests

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2.3. General Functionality and Main Features
The LE940B6 family f aut m tive cellular m dules features an LTE and multi-RAT m dem
t gether with a p werful n-chip applicati n pr cess r and a rich set f interfaces.
The maj r functi ns and features are listed bel w:
•Multi-RAT with LTE carrier aggregati n (Rel. 10, Cat. 6)
•Flash + DDR large en ugh t all w the space f r cust mer’s wn s ftware applicati ns
•Advanced security features
•FOTA ( pti nal)
•Several regi n variants with ptimal ch ice f RF bands in each f r w rldwide c verage f
c untries and MNOs
•Well-designed f rm fact r (40x40mm), acc mm dating the multiple RF bands in each regi n
variant
•Digital audi and anal g audi c dec
•A GNSS functi n is n t included within the m dule, but can be supp rted with the pr per
interface while m unted n the cust mer b ard
•The entire m dule is designed by Telit f r satisfying the envir nment and quality
requirements f the aut m tive market
Figure 1 sh ws the high-level functi nality f the LE940B6 m dule.
Figure 1: LE940B6 High-level Functionality

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2.4. Environmental Requirements
2.4.1. Temperature Range
Operating
temperature range
-20 ~ +55°C.
This range is defined by 3GPP (the gl bal standard f r wireless
m bile c mmunicati n). Telit guarantees its m dules t c mply with
all the 3GPP requirements and t have full functi nality f the
m dule with in this range.
-40 ~ +85°C.
Telit guarantees full functi nality within this range as well. H wever,
there may p ssibly be s me perf rmance deviati ns in this
extended range relative t 3GPP requirements, which means that
s me RF parameters may deviate fr m the 3GPP specificati n in the
rder f a few dB. F r example: receiver sensitivity r maximum
utput p wer may be slightly degraded.
Even s , all the functi nalities, such as call c nnecti n, SMS, USB
c mmunicati n, UART activati n etc., will be maintained, and the
effect f such degradati ns will n t lead t malfuncti n.
–40°C ~ +95°C.
eCall must be functi nal (until the m dule is br ken)
St rage and n n-
perating
temperature range
–40°C ~ +95°C
2.4.2. RoHS Compliance
As a part f the Telit c rp rate p licy f envir nmental pr tecti n, the LE940B6 c mplies with the
R HS (Restricti n f Hazard us Substances) directive f the Eur pean Uni n (EU directive
2011/65/EU).

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2.5. Operating Frequency Bands
The perating frequencies in WCDMA and LTE m des c nf rm t the 3GPP specificati ns.
2.5.1. RF Bands per Regional Variant
Table 4 summarizes all regi n variants within the LE940B6 family, sh wing the supp rted band
sets in each variant and the supp rted band pairs f r 2x carrier aggregati n.
Table 4: RF Bands per Regional Variant
Band 41M f r China: 2,555 - 2,655 MHz
Region
Variant
LTE FDD LTE TDD HSPA+ TD-
SCDMA
2G
LE940B6-NA
2, 4, 5, 7, 12, 29(DL) - 2, 4, 5 - 2, 5
LTE Carrier Aggregati n 2+5, 2+12, 2+29, 4+4, 4+5, 4+12, 4+29
LE940B6-NV
2, 4, 5, 7, 12, 13, 29(DL) - 2, 4, 5 - 2, 5
LTE Carrier Aggregati n 2+5, 2+12, 2+13, 2+29, 4+4, 4+5, 4+12, 4+13, 4+29,
LE940B6-RW
1, 2, 3, 4, 5, 7, 8, 19, 20,
21, 26, 28, 32(DL)
- 1, 2, 3, 4, 5, 8, 19 - 2, 3, 5, 8
LTE Carrier Aggregati n 1+5, 1+8, 1+19, 1+21, 1+26, 3+3, 3+5, 3+7, 3+19, 3+20,
3+26, 3+28, 4+4, 7+20, 7+28, 19+21, 20+32
LE940B6-CN
1, 3, 5, 8, 26 38, 39, 40, 41M 1, 3, 5, 8 34, 39 3, 8
LTE Carrier Aggregati n 1+26, 3+3, 3+5, 3+26, 39+41, 40+40, 41+41