Application Note [Page 2]
Design Considerations of EMW3239
Content
User Manual of EMW3239 ................................................................................................................................................1
Version Record....................................................................................................................................................................1
1. Introduction.................................................................................................................................................................4
2. Considerations in Hardware Design .........................................................................................................................6
MECHANICAL SIZE............................................................................................................................................62.1
REFERENCE PACKAGE DESIGN..........................................................................................................................62.2
DC POWER DESIGN ..........................................................................................................................................72.3
PIN FUNCTION ..................................................................................................................................................72.4
RF DESIGN .......................................................................................................................................................92.5
2.5.1 On-board PCB Antenna Design...........................................................................................................9
2.5.2 External Antenna............................................................................................................................... 10
ESD DESIGN................................................................................................................................................... 112.6
3. Downloading Firmware and Storage Test Method ................................................................................................12
PREPARATIONS................................................................................................................................................123.1
SWITCH SET UP IN DOWNLOADING MODE.......................................................................................................123.2
SYSTEM CONNECTION ....................................................................................................................................133.3
SERIAL PORT SELECTION ................................................................................................................................133.4
J-FLASH..........................................................................................................................................................133.5
J-FLASH SET UP..............................................................................................................................................143.6
TESTING.......................................................................................................................................................... 153.7
3.7.1 Environment Set Up .......................................................................................................................... 15
IMPORTANT STATEMENT ................................................................................................................................. 163.8
4. SMT ........................................................................................................................................................................... 17
STENCILS........................................................................................................................................................ 174.1
TEMPERATURE CURVE OF SECONDARY REFLOW.............................................................................................174.2
5. Mass Production Test and Product Update ............................................................................................................18
MODULE TEST ................................................................................................................................................185.1
5.1.1 Half Secondary Development of Firmware.......................................................................................18
5.1.2 Complete Secondary Development of Firmware ..............................................................................18
PRODUCT UPDATE ..........................................................................................................................................185.2
6. Technical Support.....................................................................................................................................................19
7. FCC Statement..........................................................................................................................................................20
Figure Content
Figure 1.1 Top View of EMW3239-P.................................................................................................................. 4
Figure 1.2 Top View of EMW3239-E.................................................................................................................. 4
Figure 2.1 Top View of Mechanical Size............................................................................................................. 6
Figure 2.2 Side View of Mechanical Size............................................................................................................ 6
