National Instruments cRIO-FRC User manual

Cleaning Your cRIO-FRC and Installing Protective Gaskets
This document describes how to clean the cRIO-FRC if it has been internally contaminated by metallic
debris such as wire fragments, flakes, or dust. You must be ery careful disassembling the cRIO-FRC.
When you remo e the printed circuit board (PCB) from the enclosure, it is ulnerable to electrostatic
discharge (ESD) and physical damage. Failure to follow the directions in this document may result in
damage to your cRIO-FRC and oid the warranty.
If you are uncomfortable with disassembling and cleaning your controller, you can provide a minimal
level of protection by installing the external Module Connector Gasket. To do that, skip to the
Installing the Module Connector Gasket section of this document.
Table of Contents
•Preparation
•Disassembling the cRIO-FRC
•Cleaning the cRIO-FRC
•Installing the I/O Gasket
•Reassembling the cRIO
•Installing the Module Connector Gasket

Preparation
Before getting started, make sure you ha e the following tools and an appropriate work en ironment.
Required Tools:
•#1 Philips Head Screwdri er (Caution: If you use a different-sized screwdri er, you can easily
destroy the cross recesses in the screw heads, making the screws nearly impossible to tighten or
remo e. Do not use a power screwdri er.)
On the left is a #1 screwdri er. On the right is a different-sized screwdri er.
•Compressed air
•Protecti e Gasket Kit
•Small, soft, clean paintbrush with non-conducti e bristles
•Small Ziploc® bag or other sealable container for holding loose parts such as screws
•ESD grounding wrist straps and an ESD mat, properly installed and grounded
NOTE: You should use an ESD mat whene er you handle electronics. Howe er, if a mat is not
a ailable, you can discharge static electricity from your body by touching the bare metal of a
grounded computer or other electrical equipment before touching the cRIO-FRC.

cRIO-FRC, Gasket Kit, ESD wristband, compressed air, #1 screwdri er, and clean paintbrush
Preparation:
•Clean your work area. You should disassemble the cRIO-FRC in a location free of dust and
metallic debris.
•Properly ground yourself and the cRIO-FRC to pre ent any electrostatic discharge (ESD) by using
an ESD wristband and mat.
•Take off all rings, bracelets, and dangling necklaces to reduce the risk of ESD
Disassembling the cRIO-FRC
C UTION
When handling the cRIO-FRC circuit board, ne er hold it by the components or connectors. Make sure to
hold the board only by the edges. Do not touch the integrated circuits. Before starting, make sure you
ha e read the abo e sections listing the tools and preparation required.
1. Remo e all external components from the cRIO. This includes any I/O modules, dust co ers,
power cable and connector, and any Ethernet or serial cables.

cRIO-FRC with all external components remo ed
2. Place the cRIO-FRC face down on the ESD mat. Using the #1 Philips screwdri er, remo e the
eight screws that secure the back plate to the chassis (Note: Take care to apply moderate
downward force and work slowly to reduce the risk of damaging the cross recesses in the screw
heads). Place the screws in a safe place like a Ziploc® bag or other sealable container.
Remo ing the screws
3. Keeping the cRIO-FRC facing downward, use one hand to gently press on the serial connector to
raise the back plate and PCB board and use your other hand to lift off and set aside the back
plate.

Remo ing the back plate
4. Using the same method as in the pre ious step, raise the PCB by lifting the serial port from
under the chassis with one hand, and carefully remo e the PCB with the other hand. Place the
PCB on the ESD mat with the connectors facing up, and set the chassis aside.
Remo ing the PCB

Cleaning the cRIO-FRC
C UTION
Use only compressed air to clean the cRIO-FRC. Do not clean the cRIO-FRC casing or PCB with any
cleaners or sol ents.
C UTION
When using compressed air, do not hold the can upside down or in a manner that causes liquid
propellant to spray onto the cRIO-FRC casing or PCB.
1. Hold the chassis away from your work surface and use compressed air to dislodge and remo e
debris from all sides of the chassis. Note that holding the chassis away from the work surface
remo es the risk of blowing debris from the chassis to the PCB.
Remo ing debris from the chassis with compressed air
2. Check to see if there are any foreign objects on or in the chassis that were not dislodged by the
compressed air. If so, use a small, soft, clean, dry paintbrush to remo e the debris.

Using a paintbrush to remo e foreign objects from the chassis
3. Repeat steps 1 and 2 to clean the PCB and back plate. Be careful not to force debris under the
components.

Installing the I/O and thernet Gaskets
Before reassembling the cRIO-FRC, you can install two gaskets to help pre ent future contamination.
NOTE
The gaskets reduce the risk of contamination but do not completely eliminate it. You should still keep
the cRIO-FRC away from conducti e debris such as metal sha ings and grinding debris.
C UTION
The gaskets are made of a thin, flexible material that can tear if they are repositioned after application.
Make sure each gasket is properly aligned before applying pressure to set the adhesi e.
1. Place the chassis face down on the ESD mat.
2. Remo e one of the gaskets from the packaging and peel away the paper backing to re eal the
adhesi e. Take care to minimize adhesi e contact with foreign objects such as fingers or dust.
3. Lightly place the gasket in the chassis adhesi e side down making sure it is aligned correctly
according to the following diagram.

4. Repeat steps 2 and 3 for the other gasket.
5. Before firmly seating the gaskets, flip the chassis o er and confirm that the gasket openings and
chassis openings are centered.
6. Using your finger, firmly press each gasket into place. Work slowly and take care not to tear the
gasket material.

Reassembling the cRIO-FRC
1. Place the chassis face down on the ESD mat.
2. Position one end of the PCB board o er the corresponding hole in the casing, and gently ease it
back into place inside the chassis.
3. Replace the back plate on top of the PCB. You may need to apply slight pressure after ha ing
installed the protecti e gasket to push the connectors through the gasket openings. DO NOT
USE EXCESSIVE FORCE ON THE PCB. If you feel resistance, remo e the PCB and check the
alignment.
4. Use the #1 Phillips head screwdri er to secure the back plate to the chassis using the eight
screws. Be careful not to o er-tighten or strip the screws. The maximum recommended
installation torque is 4.9 in-lb.

Installing the Module Connector Gasket
1. Place the chassis face up on the ESD Pad.
2. Partially remo e the backing from the Module Connector Gasket to re eal the adhesi e. Take
care to minimize adhesi e contact with foreign objects such as fingers or dust.
3. Lightly place the Module Connector Gasket in the chassis module ca ity adhesi e side down, and
gently press the gasket o er the first connector.
4. Working from the first connector, gently peel away enough of the backing to press the gasket
down o er each connector, taking care not to stretch the gasket too much.

5. When the gasket is in place around all connectors, go back o er it and firmly press it into place
with a soft, blunt tool.

6. Reinstall your I/O Modules and dust caps.
C UTION
Use only light pressure to place the dust caps o er the empty connectors. Using excessi e force
can damage the gasket and the connectors. Note that the dust caps will not be as deeply
recessed with the gasket installed. If you find that the dust caps do not remain seated when
subjected to ibration, you can lea e them off.
Lightly Pressing Dust C
ap
Dust Cap
in Place
Module Slot
IO Module
1
NI 9201
2
NI 9201
3
Empty
4
NI 9403
5
Empty
6
NI 9403
7
Empty
8
NI 9472
7. Reattach power, Ethernet, and serial cables, and test for functionality.
Congratulations! You have successfully cleaned your cRIO controller and applied gaskets to help
prevent future contamination. Please remember to keep the cRIO-FRC and other robot
electronics isolated from metallic debris at all times. There are many ways to do this, including:
-Using an enclosed electronics box
-Using a wet-dry ac to collect metal sha ings during robot chassis work
-Routinely cleaning the floor to pre ent debris from being kicked up into the robot’s electronics