Nokia RH-18 Series User manual

Customer Care Solutions
RH-18/36/38 Series Transceivers
Issue 1 10/03 Nokia Corporation
Engine module

RH-18/36/38 Company confidential
Engine module CCS Technical Documentation
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Table of Contents
Page No
Electronics of Nokia 1100.............................................................................................. 8
Environmental Specifications .....................................................................................8
Baseband HW Introduction ........................................................................................8
Technical Summary .....................................................................................................8
Modes of Operation ...................................................................................................10
No supply ................................................................................................................ 10
Power_off................................................................................................................ 10
Acting Dead............................................................................................................. 11
Active...................................................................................................................... 11
Sleep mode.............................................................................................................. 12
Charging.................................................................................................................. 12
DC Characteristics .....................................................................................................13
Supply Voltage Ranges........................................................................................... 13
Regulators’ Voltage Ranges.................................................................................... 14
Interconnection Diagram ...........................................................................................15
External Signals and Connections .............................................................................15
System connector (X102)........................................................................................ 15
Battery connector .................................................................................................... 16
Baseband – RF interface ......................................................................................... 17
Internal Signals and Connections ..............................................................................17
Audio....................................................................................................................... 17
Baseband board clocks............................................................................................ 18
Functional Description................................................................................................. 19
Audio External ...........................................................................................................19
Audio Internal ......................................................................................................... 19
Earpiece................................................................................................................... 19
Microphone ............................................................................................................. 20
Buzzer...................................................................................................................... 21
Flashlight................................................................................................................. 21
Batteries .....................................................................................................................22
Keyboard...................................................................................................................... 23
Display & Keyboard Backlight............................................................................... 24
Keyboard light......................................................................................................... 24
Display .......................................................................................................................24
Memory Module ........................................................................................................25
SIM Interface .............................................................................................................25
Vibra........................................................................................................................ 25
Test Interfaces ............................................................................................................26
Connections to Baseband ...........................................................................................26
FBUS Interface........................................................................................................ 26
MBUS Interface ...................................................................................................... 26
General description of the RF circuits ......................................................................... 27
Receiver signal path ...................................................................................................27
Transmitter signal path ..............................................................................................28
PLL ............................................................................................................................28
Power Supply .............................................................................................................30

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Abbreviations
Abbr. Description
ACI Accessory Control Interface
ADC Analog Digital Connector
ARM Advanced RISC Machines
ASIC Application Specific Integrated Circuit
ATR Answer To Reset
BB Baseband
BL-5C Battery type.
BSI Battery Size Indicator
Cbus Control bus (internal phone interface between UPP-UEM)
CCS Customer Care Service
CPH Copenhagen, Denmark
CTI Cover Type Indicator
CTSI Clock Timing Sleep and Interrupt
Dbus DSP controlled bus (Internal phone interface between UPP-UEM)
DC Direct Current
DCT4.0 Digital Core Technology, generation 4.0
DSP Digital Signal Processor
DUT Device under test
EAD External Accessory Detection
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
Fbus Fast Bus, asynchronous message bus connected to DSP (communications bus)
FCI Functional cover interface
FPC Flexible printed circuit
FR Full Rate
GENIO General Purpose Input/Output
GSM Global System Mobile
HW Hardware
IF Interface

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IHF Integrated Hands Free
IMEI International Mobile Equipment Identity
Jannette DCT3.x accessory program
LCD Liquid Crystal Display
LDO Low Drop Out
LED Light Emitting Diode
Li-Ion Lithium Ion battery
Lion Battery program
LN Lotus Notes
LPRF Low Power Radio Frequency
Lynx Battery type, Lion program, Salo – Finland
MALT Medium And Loud Transducer
Maxwell GSM phone program
Mbus Asynchronous message bus connected to MCU (phone control interface). Slow
message bus for control data.
MCU Micro Controller Unit
NO_SUPPLY UEM state where UEM has no supply what so ever
NRT Nokia Ringing Tones
NTC Negative temperature Coefficient, temperature sensitive resistor used as a tem-
perature sensor.
PA Power Amplifier (RF)
PDA Personal Digital Assistant
PDM Pulse Density Modulation
PDRAM Program/Data RAM
Phoenix SW tool of DCT4.x
Pippi Hdb12, Phone program (3510)
PLL Phase locked loop
PnPHF Plug and Play Handsfree
PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators
PWB Printed Wired Board
PWR_OFF UEM state where phone is off
PWRONX Signal from power on key.
R&D Research and development

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RESET UEM state where regulators are enabled
RTC UEM internal Real Time Clock
SARAM Single Access RAM
SIM Subscriber Identification Module
SLEEP UEM power saving state controlled by UPP
SPR Standard Product Requirements
SRAM Static RAM
STI Serial Trace Interface
SW Software
TBSF Through the Board Side Firing
TDB To Be Defined
TI Texas Instruments
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VBAT Main battery voltage
VCHAR Charger input voltage
VCHARDET Charger detection threshold level
VMSTR+,
VMSTR Master Reset threshold level

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Electronics of Nokia 1100
Environmental Specifications
Baseband HW Introduction
This document specifies the baseband module for the Nokia 1100. The baseband module
includes the baseband engine chipset, the UI components and the acoustical parts for
the transceiver.
Nokia 1100 is a hand-portable dualband 900/1800MHz or 850/1900MHz phone, featur-
ing the DCT4 generation baseband (UEM/UPP) and RF (MJOELNER) circuitry.
Technical Summary
The baseband module contains 2 main ASICs named the UEM and UPP. The baseband
module furthermore contains a Flash IC of 16Mbit. The baseband is based on the DCT4
Table 1: Environmental specifications
Parameter Ambient temperature Remarks
Normal operation -25 °C … +55 °C Specifications fulfilled
Reduced performance -40 °C ..-25 °C
and +55 °C … +85 °C
No operation and/or stor-
age < -40 °C or > +85 °C No storage or operation. An attempt to operate may damage the phone permanently
Humidity Relative humidity
5...95%. The module is not protected against water. Con- densed or splashed water might cause malfunction.
Any submerge of the phone will cause permanent
damage. Long-term high humidity, with condensa-
tion, will cause permanent damage because of cor-
rosion.

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engine program.
Figure 1: Baseband block diagram
The UEM supplies both the baseband module as well as the RF module with a series of
voltage regulators. Both the RF and Baseband modules are supplied with regulated volt-
ages of 2.78 V and 1.8V. UEM includes 6 linear LDO (low drop-out) regulators for base-
band and 7 regulators for RF. The UEM is furthermore supplying the baseband SIM
interface with a programmable voltage of either 1.8 V or 3.0 V. The core of the UPP is
supplied with a programmable voltage of 1.0 V, 1.3 V, 1.5 V or 1.8 V.
UPP operates from a 26MHz clock, coming from the RF ASIC MJOELNER, the 26 MHz
clock is internally divided by two, to the nominal system clock of 13MHz. DSP and MCU
contain phase locked loop (PLL) clock multipliers, which can multiply the system.
The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator.
The 32768 Hz clock is fed to the UPP as a sleep clock.
The communication between the UEM and the UPP is done via the bi-directional serial
busses CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1
MHz set by SW. The DBUS is controlled by the DSP and operates at a speed of 13 MHz.
Both processors are located in the UPP.
RFBUS
UEM
UPP
FLASH
Battery
CBUS/
DBUS
BB
Supplies
RF Supplies
UI
DCT4 Janette connector
RF RX/TX
PA Supply
MBus/FBus
External Audio
Charger connection
Mjoelner
26MHz
SLEEPCLK
32kHz
Baseband
MEMADDA
M
VIBRA
EAR
MIC
DLIGHT
speaker
Buzzer
SIM
Flashlight

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The UEM ASIC mainly handles the interface between the baseband and the RF section.
UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans-
mit signal paths and also A/D and D/A conversions of received and transmitted audio sig-
nals to and from the user interface. The UEM supplies the analog signals to RF section
according to the UPP DSP digital control.
RF ASIC MJOELNER is controlled through UPP RFBUS serial interface. There are also sep-
arate signals for PDM coded audio. Digital speech processing is handled by the DSP
inside UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from the
baseband supply 1.8V and the analog parts are running from the analog supply 2.78V,
also VBAT is directly used by some blocks.
The baseband supports both internal and external microphone inputs and speaker out-
puts. Input and output signal source selection and gain control is done by the UEM
according to control messages from the UPP.
The transceiver module is implemented on 6 layer selective OSP/Gold coated PWB.
Modes of Operation
baseband has six different operating modes (in normal mode):
•No_Supply
•Power_off
•Acting_Dead
•Active
•Sleep
•Charging
Additionally two modes exist for product verification: 'testmode' and 'local mode'.
No supply
In No_Supply mode, the phone has no supply voltage. This mode is due to disconnection
of main battery or low battery voltage level.
Phone is exiting from No_Supply mode when sufficient battery voltage level is detected.
Battery voltage can rise either by connecting a new battery with VBAT > Vmstr+ or by
connecting charger and charging the battery above Vmstr+.
Power_off
In this state the phone is powered off, but supplied. VRTC regulator is active (enabled)
having supply voltage from main battery. Note, the RTC status in PWR_OFF mode
depends on whether RTC was enabled or not when entering PWR_OFF. From Power_off

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mode UEM enters RESET mode (after 20ms delay), if any of following statements is true
(logical OR –function):
– Power_on button detected (PWROFFX)
– charger connection detected (VCHARDET)
– RTC_ALARM detected
The Phone enters POWER_OFF mode from all the other modes except NO_SUPPLY if
internal watchdog elapses.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a
state called”Acting Dead”, in this mode no RF parts are powered. To the user, the phone
acts as if it was switched off. A battery-charging alert is given and/or a battery charging
indication on the display is shown to acknowledge the user that the battery is being
charged.
Active In the active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. There are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.
In active mode the RF regulators are controlled by SW writing into UEM’s registers
wanted settings: VR1A/B must be kept disabled. VR2 can be enabled or forced into low
quiescent current mode. VR3 is always enabled in active mode. VR4 -VR7 can be enabled,
disabled or forced into low quiescent current mode.
Table 2: Regulator controls
Regulator NOTE
VFLASH1 Enabled; Low Iq mode during sleep
VFLASH2 Disabled
VANA Enabled; Disabled in sleep mode
VIO Enabled; Low Iq mode during sleep
VCORE Enabled; Low Iq mode during sleep
VSIM Controlled by register writing.
VR1A Enabled; Disabled in sleep mode
VR1B Disabled
VR2 Controlled by register writing; Enabled in sleep mode
VR3 Enabled; Disabled in sleep mode

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Sleep mode
Sleep mode is entered when both MCU and DSP are in stand-by mode. Sleep is controlled
by both processors. When SLEEPX low signal is detected UEM enters SLEEP mode. VCORE,
VIO and VFLASH1 regulators are put into low quiescent current mode. All RF regulators,
except VR2, are disabled in SLEEP. When SLEEPX=1 is detected UEM enters ACTIVE mode
and all functions are activated.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEM or
by some external interrupt, generated by a charger connection, key press, headset con-
nection etc.
In sleep mode the main oscillator (26MHz) is shut down and the 32 kHz sleep clock oscil-
lator is used as reference clock for the baseband.
Charging
Charging can be performed in parallel with any other operating mode. A BSI resistor
inside the battery pack indicates the battery type/size. The resistor value corresponds to
a specific battery capacity and technology.
The battery voltage, temperature, size and current are measured by the UEM controlled
by the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEM controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEM switch off when the battery voltage has reached VBATLim (programmable
charging cut-off limits 3.6V / 5.0V / 5.25V). Charging current is monitored by measuring
the voltage drop across a 220 mOhm resistor.
VR4 Enabled; Disabled in sleep mode
VR5 Enabled; Disabled in sleep mode
VR6 Enabled; Disabled in sleep mode
VR7 Enabled; Disabled in sleep mode
IPA1-2 Disabled
Table 2: Regulator controls

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DC Characteristics
Supply Voltage Ranges Table 3: Absolute Maximum Ratings
Following voltages are the normal and extreme voltages for the battery:
Table 4: Battery voltage range
1According to the GSM specifications, a GSM-device must work correctly if it is powered
by his nominal voltage +/-15%. The UEM hardware shut down is from 3.10V and below.
The Energy Managment of the phone is shutting down the phone at 3.20V in order to
perform a correct shutdown of the phone. Above 3.20V + tolerances, at 3.21V, the phone
is still fullfilling all the GSM requirements. The Nominal voltage is therefore set at 3.80V.
During fast charging of an empty battery voltages between 4.20 and 4.60 might appear
for a short while.
Signal Rating
Battery Voltage 0... 4.39V (VBAT)
Charger Input Voltage -0.3... 9.2VRMS (16,9 Vpeak)
Signal Min. Nom Max Note
VBAT 3.21V 3.80V 4.39V 1
Vcoff+ 3.0V 3.1 3.2 HW off to on
Vcoff- 2.7V 2.8V 2.9V HW on to off
Vmstr+ 2.0V 2.1V 2.2V UEM off to on
Vmstr- 1.8V 1.9V 2.0V UEM on to off
Sw shutdown - 3.1V - In Call
Sw shutdown - 3.2V - In Idle

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Regulators’ Voltage Ranges
Table 5: BB regulators
Table 6: RF regulators
Signal Min. Nom Max
VANA 2.70V 2.78V 2.86V
VFLASH1 2.70V 2.78V 2.86V
VFLASH2 2.70V 2.78V 2.86V
VSIM 1.745V
2.91V 1.8V 3.0V 1.855V 3.09V
VIO 1.72V 1.8V 1.88V
VCORE 1.000V
1.140V
1.235V
1.425V
1.710V
1.053V
1.2V
1.3V
1.5V
1.8V
1.106V
1.260V
1.365V
1.575V
1.890V
Signal Min. Nom Max
VR1A 4.6V 4.75V 4.9V
VR1B 4.6V 4.75V 4.9V
VR2 Vout_on
Vout_sleep
2.70V
2.61V 2.78V 2.86V 2.95V
VR3 2.70V 2.78V 2.86V
VR4 2.70V 2.78V 2.86V
VR5 2.70V 2.78V 2.86V
VR6 2.70V 2.78V 2.86V
VR7 2.70V 2.78V 2.86V

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Interconnection Diagram
Figure 2: Power distribution diagram
External Signals and Connections
System connector (X102)
Table 7: DC connector
Pin Signal Min. Nom Max Condition Note
2VCHAR-11.1V
peak 16.9 Vpeak
7.9 VRMS
1.0 Apeak
Standard
charger
(ACP-7)
Charger positive
input
7.0
VRMS
8.4 VRMS 9.2 VRMS
850 mA Fast
charger
1CHGND-0 - Chargerground
System Connector
Battery CHACON
RF Regulators
Baseband
Regulators
6
VR2-7
VR1A
VR1B
VIO
VSIM
VCORE
VANA
VFLASH1
RTC
PA Supply
FM
Radio
SIM
UPP
LCD
FLASH
SRAM
Baseband UEM
VBAT
VR4
Accessory
Regulator
Vout
LED
Driver
VLED+
VBAT

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Table 8: External microphone
Table 9: External speaker, differential output XEARP (HF) & XEARN (HFCM)
Table 10: Headset detection
Battery connector
Battery temperature is estimated by measurement in Transceiver PWB with a separate
NTC resistor. Thus the Battery Interface has only 3 contacts.
Table 11: Battery connector
Signal Min. Nom Max Condition Note
MIC2P (Differential input P) - - 100mVpp G=20dB 1,22kΩto MIC1B (AC con-
dition)
MIC2N (Differential input N) - - 100mVpp G=20dB 1kΩto GND
MICB2 (Microphone Bias) 2.0 V 2.1 V 2.25 V DC Unloaded
External loading of MICB2 - - 600uA DC
Signal Min. Nom Max Units Note
Output voltage swing*
* seen from transducer side 2.0 - - Vpp Differential output, with 60 dB sig- nal to total distortion ratio
Common voltage level for
HF output (HF & HFCM) VCMHF 0.75 0.8 0.85 V
Load Resistance (HF to HFCM)154 194 234 W 2×22Ω(±5%) + 150Ω(±25%)
Load Capacitance (HF to HFCM) - - 10 NF Load to GND
Signal Min. Nom Max Condition Note
HookInt 0V - 2.86V (Vflash1) Headsetbutton callcontrol, connected
to UEM AD-converter
HeadInt 0V - 2.86V (V flash1) Accessory detection, connected to
UEM AD-converter
Name Description Test usage
VBAT Battery voltage terminal. Battery calibration.
GND Battery ground terminal.
BSI Battery size identification. Flash and local mode forcing.

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Baseband – RF interface
The interface between the baseband and the RF can be divided into three categories:
- The digital interface from the UPP to the RF ASIC (Mjoelner). The serial digital interface
is used to control the operation of the different blocks in the RF ASICs.
- The analogue interface between UEM and the RF. The analogue interface consists of RX
and TX converter signals. The power amplifier control signal TXC and the AFC signal
comes as well from the UEM.
- Reference clock interface between Mjoelner and UPP which supplies the 26Mhz system
clock for the UPP.
Internal Signals and Connections
The tables below describe internal signals. The signal names can be found on the sche-
matic for the PWB.
Audio
Table 12: Internal microphone
Table 13: Internal speaker (Differential output EARP & EARN)
Signal Min. Nom Max Condition Note
MIC1P (Differential input P) - 5mV - G=0dB 1kΩto MIC1B
(RC filtered by 220R/4.7uF)
MIC1N (Differential input N) - 5mV - G=0dB 1kΩto GND
MICB1 (Microphone Bias) 2.0 V 2.1 V 2.25 V DC
External loading of MICB1 - - 600uA DC
Signal Min. Nom Max Units Note
Output voltage swing 4.0 - - Vpp Differential output
Load Resistance (EARP to EARN)26 32 - W
Load Capacitance (EARP to EARN) - - 50 NF

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Baseband board clocks
Table 14: Board Clocks
Signal name From To Min. Typ. Max. Unit Notes
RFCLK MJOELNER UPP - 26 - MHz Active when
SLEEPX is high
SLEEPCLK UEM UPP - 32.768 - KHz Active when
VBAT is sup-
plied
RFCONVCLK UPP UEM 13 - MHz Active when RF
converters are
active
RFBUSCLK UPP MJOELNER - 13 13 MHz Only active
when bus-ena-
ble is active
DBUSCLK UPP (DSP) UEM - 13 13 MHz Only active
when bus-ena-
ble is active
CBUSCLK UPP (MCU) UEM - 1 1.2 MHz Only active
when bus-ena-
ble is active
LCDCAMCLK UPP
(Write)
(Read)
LCD 0.3 3.25
0.650
4 MHz Only active
when bus-ena-
ble is active

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Functional Description
Audio External
Nokia 1100 is designed to support fully differential external audio accessory connection.
A headset and PnPHF can be directly connected to system connector.
Figure 3: Headset Interface
Headset accessory uses 4-wire fully differential audio connection.
Audio Internal
Earpiece
The earpiece selected is a 13-mm dynamic earpiece with a nominal impedance of 32 Ω(.
The earpiece is placed within the mechanic parts, e.g. C-cover and Light guide. The holes
of the A-cover and the choice of dust shield are made in a way to have the best trans-
mission of the sound, without having much impact on the sound waves and sound qual-
ities.
The acoustic design involves a sandwich of five parts: Earmat, A-cover, C-cover, light-
guide- and D-cover.
On top of the lightguide there will be a metal frame (C-cover) that protects the earpiece.
The C-cover includes 5 acoustical holes and a double-sided gasket for sealing in the area
over the earpiece.
The front cover consists of two parts, an A-cover and an earmat with six acoustical holes,
2 direct front holes, and 4 leak holes.
1k0
Hookint
Headint Headint
EAD
MICB2
MIC2P
MIC2N 33N
HFCM
HF
Bottom
Connector
UEM
2.1V
2.7V
33N
1k0
/MBUS
MicGnd
1.8V
0.3V
0.8V
3...25k
Mic_bias
0.8V
Not all components are shown

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Two dust shields will be used: one in the gap between earmat and A-cover and one on
the C-cover.
The earpiece circuit includes only a few components:
two 10 ohm in order to have a stable output
an EMC filter
Figure 4: Earpiece interface
Microphone
An omni directional microphone is used. The microphone is placed in the system connec-
tor sealed in its rubber gasket. The sound port is provided in the system connector.
Figure 5: Bottom connector including the microphone
The microphone connection comprises a differential bias circuit, driven directly from the
MICB1 bias output with external RC-filters.
EARN
EARP EARP
EARN
UEM
10
ohm
10
ohm
Placed near UEM
Placed in top of
PWB, near
earpiece