NT-MDT Solver Next User manual
Read me First!
Observe safety measures for operation with devices containing sources of laser radiation.
Do not stare into the beam. A label warning about the presence of laser radiation is
attached to the laser sources (Fig. 1).
Fig. 1
Before you start working with the instrument, get acquainted with the basic safety
measures and the operation conditions for the instrument!
If you are a beginner in scanning probe microscopy, we recommend you to familiarize with
basic SPM techniques. “Fundamentals of Scanning Probe Microscopy” by V.L. Mironov
gives a good introduction to the subject. This book is available free of charge at
https://www.ntmdt-si.com/customer-support/manuals/textbook.
Feedback
Should you have any questions, which are not explained in the manuals, please contact the
give you comprehensive answers. Alternatively, you can contact our staff on-line using
the ask-on-line service (http://online.ntmdt-si.com/online).
User’s documentation set
The following manuals are included into the user’s documentation set:
-Instruction Manual – is the guidance on preparation of the instrument and other
equipment for operation on various techniques of Scanning Probe Microscopy. The
contents of the user’s documentation set may differ depending on the delivery set of the
instrument.
-SPM Software Reference Manual – is the description of the control program
interface functions, all commands and functions of the menu and, also a description of
the Image Analysis module and the Macro Language “Nova PowerScript”.
-Control Electronics. Reference Manual – is the guide to SPM controller,
Thermocontroller and Signal Access module.
Some equipment, which is described in the manuals, may not be included into your
delivery set. Read the specification of your contract for more information.
The manuals are updated regularly. Their latest versions can be found in the site of the
company (http://www.ntmdt-si.com/support).
Table of Contents
Solver Next Scanning Probe Microscope.
Instruction Manual
Table of Contents
1.OVERVIEW.............................................................................................................................................. 5
1.1.SPECIFIC FEATURES .......................................................................................................................... 5
1.2.DESIGN ............................................................................................................................................. 6
1.3.POSITIONING THE BUILT-IN MEASURING HEADS .............................................................................. 8
1.4.TECHNICAL SPECIFICATION .............................................................................................................. 9
2.BASIC SAFETY MEASURES .............................................................................................................. 11
3.OPERATING CONDITIONS ............................................................................................................... 13
4.REGULATIONS ON PACKAGING, STORAGE AND TRANSPORTATION............................... 15
5.SETUP AND INSTALLATION ............................................................................................................ 16
5.1.CONNECTING THE ELECTROMECHANICAL UNITS............................................................................ 16
5.2.INSTALLING SOFTWARE .................................................................................................................. 17
5.3.POWERING SEQUENCE .................................................................................................................... 24
5.4.CALIBRATING THE STEPPER MOTORS ............................................................................................. 25
6.PREPARING FOR MEASUREMENTS .............................................................................................. 29
6.1.TURNING ON INSTRUMENT ............................................................................................................. 29
6.2.MOUNTING THE SAMPLE................................................................................................................. 30
6.3.SELECTING OPERATING MODE OF SCANNER (SCANSCALER™ SYSTEM).................................... 33
6.4.INSTALLING THE PROBE.................................................................................................................. 34
6.4.1.Installing the AFM Probe.................................................................................................... 34
6.4.2.Installing the STM Tip......................................................................................................... 37
6.5.SELECTING THE MEASURING HEAD (HEADHIPEX™ SYSTEM) .................................................... 40
6.6.SCREENING WITH THE PROTECTIVE SHIELD (ISOSHIELD SYSTEM™) ....................................... 41
6.7.ADJUSTING THE CANTILEVER DEFLECTION DETECTION SYSTEM ................................................... 41
6.7.1.Adjusting the Cantilever Deflection Detection System in Automatic Mode
(EXPERTFBA™ System) .................................................................................................... 42
6.7.2.Adjusting the Cantilever Deflection Detection System in Manual Mode ............................ 43
6.8.INITIAL APPROACH ......................................................................................................................... 51
6.9.SELECTING THE SCAN AREA (PINPOINT™ SYSTEM).................................................................... 52
7.PERFORMING MEASUREMENTS.................................................................................................... 55
7.1.CONTACT AFM .............................................................................................................................. 55
7.1.1.Constant Force Mode.......................................................................................................... 55
7.1.1.1.Adjusting the Controller Configuration .................................................................................56
7.1.1.2.Adjusting Initial Level of the DFL Signal .............................................................................56
7.1.1.3.Approaching the Sample to the Probe ...................................................................................58
7.1.1.4.Adjusting Working Level of the Feedback Gain ...................................................................60
7.1.1.5.Adjusting Scanning Parameters.............................................................................................62
7.1.1.6.Scanning ................................................................................................................................66
7.1.1.7.Saving Measurement Data.....................................................................................................70
7.1.1.8.Completing Measurements ....................................................................................................70
7.1.2.Lateral Force Microscopy................................................................................................... 71
7.1.2.1.Brief Description ...................................................................................................................71
7.1.2.2.Procedural Sequence..............................................................................................................72
7.1.2.3.Scanning ................................................................................................................................72
7.1.3.Spreading Resistance Imaging ............................................................................................ 73
7.1.3.1.Brief Description ...................................................................................................................73
7.1.3.2.Procedural Sequence..............................................................................................................74
7.1.3.3.Adjusting Scanning Parameters.............................................................................................74
7.1.3.4.Scanning ................................................................................................................................75
Solver NEXT SPM. Instruction Manual
7.1.4.Contact Error Mode............................................................................................................ 76
7.1.4.1.Brief Description of the Mode...............................................................................................76
7.1.4.2.Preparation for Measurements...............................................................................................77
7.1.4.3.Scanning................................................................................................................................ 77
7.1.5.Piezoresponse Force Microscopy ....................................................................................... 78
7.1.5.1.Brief Description of the Mode...............................................................................................78
7.1.5.2.Preparation for Measurements...............................................................................................80
7.1.5.3.Adjusting Scanning Parameters.............................................................................................81
7.1.5.4.Scanning................................................................................................................................ 82
7.2.SEMICONTACT AFM....................................................................................................................... 84
7.2.1.Semicontact Mode ............................................................................................................... 84
7.2.1.1.Adjusting the Controller Configuration.................................................................................85
7.2.1.2.Adjusting Piezodrive Parameters ..........................................................................................85
7.2.1.3.Approaching the Sample to the Probe ...................................................................................89
7.2.1.4.Adjusting Working Level of the Feedback Gain...................................................................91
7.2.1.5.Adjusting Scanning Parameters.............................................................................................92
7.2.1.6.Scanning................................................................................................................................ 97
7.2.1.7.Saving Measurement Data .................................................................................................. 100
7.2.1.8.Completing Measurements..................................................................................................101
7.2.2.Semicontact Error Mode................................................................................................... 101
7.2.2.1.Brief Description of the Mode.............................................................................................101
7.2.2.2.Preparation for Measurements.............................................................................................102
7.2.2.3.Scanning.............................................................................................................................. 102
7.2.3.Phase Imaging Mode ........................................................................................................ 103
7.2.3.1.Brief Description of the Mode.............................................................................................103
7.2.3.2.Preparation for Measurements.............................................................................................104
7.2.3.3.Scanning.............................................................................................................................. 104
7.2.3.4.Modes of Improving Image Quality ....................................................................................105
7.3.MANY-PASS AFM TECHNIQUES ................................................................................................... 106
7.3.1.Magnetic Force Microscopy ............................................................................................. 106
7.3.1.1.Brief Description.................................................................................................................106
7.3.1.2.Procedural Sequence ........................................................................................................... 107
7.3.1.3.Adjusting Scanning Parameters...........................................................................................108
7.3.1.4.Scanning.............................................................................................................................. 109
7.3.2.Kelvin Probe Microscopy.................................................................................................. 110
7.3.2.1.Brief Description.................................................................................................................110
7.3.2.2.Procedural Sequence ........................................................................................................... 112
7.3.2.3.Adjusting Scanning Parameters...........................................................................................113
7.3.2.4.Testing SKM Operation Mode ............................................................................................ 113
7.3.2.5.Scanning.............................................................................................................................. 116
7.3.3.Electric Force Microscopy................................................................................................ 118
7.3.3.1.Brief Description of the Technique .....................................................................................118
7.3.3.2.Preparation for Measurements.............................................................................................120
7.3.3.3.Adjusting Scanning Parameters...........................................................................................121
7.3.3.4.Scanning.............................................................................................................................. 122
7.4.SCANNING TUNNELING MICROSCOPY........................................................................................... 125
7.4.1.Constant Current Mode .................................................................................................... 125
7.4.1.1.Adjusting the Controller Configuration...............................................................................126
7.4.1.2.Approaching the Sample to the Probe .................................................................................126
7.4.1.3.Adjusting Working Level of the Feedback Gain.................................................................131
7.4.1.4.Adjusting Scanning Parameters...........................................................................................132
7.4.1.5.Scanning.............................................................................................................................. 137
7.4.1.6.Saving Measurement Data .................................................................................................. 140
7.4.1.7.Completing Measurements..................................................................................................140
7.5.AFM SPECTROSCOPIES................................................................................................................. 141
7.5.1.Force-distance Spectroscopy ............................................................................................ 141
7.5.1.1.Selecting the Function to be Measured................................................................................142
7.5.1.2.Selecting Points for Spectroscopy ....................................................................................... 144
7.5.1.3.Starting the Measurements .................................................................................................. 147
7.5.1.4.Viewing Spectroscopy Data ................................................................................................147
7.5.1.5.Calculating Adhesion Force ................................................................................................150
7.5.1.6.Saving Measurement Data .................................................................................................. 152
7.5.2.Amplitude Spectroscopy Mag(Z)....................................................................................... 152
7.5.2.1.Configuring and Making Measurements .............................................................................152
7.5.2.2.Calibration of Cantilever Oscillations Amplitude ...............................................................154
7.5.3.Current Spectroscopy I(V) ................................................................................................ 156
Table of Contents
7.5.3.1.Configuring and Making Measurements .............................................................................156
7.6.STM SPECTROSCOPIES ................................................................................................................. 159
7.6.1.Current Imaging Tunneling Spectroscopy I(V) ................................................................. 159
7.6.2.I(Z) Spectroscopy .............................................................................................................. 161
8.LITHOGRAPHY.................................................................................................................................. 163
8.1.OVERVIEW.................................................................................................................................... 163
8.1.1.Vector Lithography ........................................................................................................... 163
8.1.1.1.Simple vector lithography ...................................................................................................164
8.1.1.2.Gradient lithography............................................................................................................164
8.1.1.3.Pulse lithography .................................................................................................................165
8.1.1.4.Pulse-gradient lithography...................................................................................................166
8.1.2.Raster lithography............................................................................................................. 167
8.2.FORCE LITHOGRAPHY ................................................................................................................... 168
8.2.1.Preparation for Operation ................................................................................................ 169
8.2.1.1.Estimation of the Probe Pressure on the Sample .................................................................169
8.2.1.2.Preliminary Scanning and Selecting Lithography Region ...................................................172
8.2.2.Vector Lithography ........................................................................................................... 173
8.2.2.1.Selecting Lithography Mode ...............................................................................................174
8.2.2.2.Creating the Lithography Template.....................................................................................176
8.2.2.3.Adjusting Vector Lithography Parameters ..........................................................................178
8.2.2.4.Performing Lithography ......................................................................................................181
8.2.3.Raster Lithography............................................................................................................ 183
8.2.3.1.Selecting the lithography method ........................................................................................183
8.2.3.2.Loading Template................................................................................................................185
8.2.3.3.Adjusting Lithography Parameters ......................................................................................186
8.2.3.4.Performing Lithography ......................................................................................................187
8.3.ELECTRICAL LITHOGRAPHY.......................................................................................................... 188
8.3.1.Vector Lithography ........................................................................................................... 189
8.3.1.1.Preliminary Scanning and Selecting Lithography Region ...................................................189
8.3.1.2.Selecting the lithography method ........................................................................................191
8.3.1.3.Creating Lithography Template...........................................................................................193
8.3.1.4.Adjusting Lithography Parameters ......................................................................................194
8.3.1.5.Performing Lithography ......................................................................................................198
8.3.2.Raster lithography............................................................................................................. 200
8.3.2.1.Preliminary Scanning and Selecting Lithography Region ...................................................201
8.3.2.2.Selecting the lithography method ........................................................................................202
8.3.2.3.Loading Template................................................................................................................203
8.3.2.4.Adjusting Lithography Parameters ......................................................................................204
8.3.2.5.Performing Lithography ......................................................................................................205
Solver NEXT SPM. Instruction Manual
Chapter 1. Overview
5
1. Overview
Solver NEXT is a multifunctional Scanning Probe Microscope of general purpose. It is a
state-of-the-art instrument with highly automated operations. Its digital controller enables a
wide range of SPM techniques. Automatic adjustment of cantilever deflections detection
provides ease-of-operation even for an unexperienced user.
Scanning Probe Microscope is capable to perform measurements with the following
techniques depending on working environment:
In air and in liquid
Atomic Force Microscopy (AFM) (contact; semicontact; non-contact); Lateral Force
Imaging; Phase Imaging Mode; Force Modulation Mode; Adhesion Force Imaging; AFM
Lithography (Force).
In air only
Scanning Tunneling Microscopy (STM); Magnetic Force Microscopy (MFM); Electric
Force Microscopy (EFM); Scanning Capacitance Microscopy (SCM); Kelvin Probe
Microscopy; Spreading Resistance Imaging; Nanosclerometry; AFM Lithography
(Current), STM Lithography.
1.1. Specific Features
The key distinction of the Solver NEXT SPM from its analogues is availability of two
built-in measuring heads (AFM and STM) that are automatically adjusted to their working
position.
Besides, the design of the instrument provides insertion of auxiliary measuring heads.
Currently, the kit of available auxiliary heads includes those for liquid and
nanosclerometric measurements.
The sample can be heated up to 130 °C with the use of the mountable heating stage.
The instrument is equipped with an optical viewing system of high resolution that provides
motorized focusing and zooming. Selection of the scan area is motorized as well.
Solver NEXT SPM. Instruction Manual
6
1.2. Design
General view of the Solver NEXT SPM is shown in Fig. 1-1.
Fig. 1-1. General view of the Solver NEXT SPM
Solver NEXT SPM consists of the following main units:
●Solver NEXT measuring unit;
●SPM controller;
●Computer.
Besides, the delivery set of the Solver NEXT SPM can be optionally extended with:
●Measuring head for liquid environment;
●Liquid cell;
●Measuring head of the nanoindenter;
●Heating stage;
●Vibration isolation system.
Fig. 1-2 shows a schematic diagram of the Solver NEXT measuring unit.
Chapter 1. Overview
7
Fig. 1-2. Schematic diagram of the Solver NEXT
The sample to study is fixed on a metal substrate that is mounted on the sample holder. The
sample holder is fastened to the upper end of the piezo scanner that operates in the
“scanning-by-sample” mode.
The positioning system allows moving the sample in the XY plane to select the
investigation area as well as displacing the sample vertically to approach it to the probe.
The built-in optical viewing system serves for selecting the scan area on the sample
surface. The optical microscope of this system is equipped with a positioning system that
provides selection of the scan area on the sample surface.
The Solver NEXT measuring unit is equipped with two measuring heads, for atomic-force
microscopy (AFM) and for scanning tunneling microscopy (STM). Availability of two
built-in measuring heads enables quick exchange of the experimental technique and does
not need special training of the operator.
Auxiliary measuring heads (for liquid environment and for nanoindenting) extend range of
the instrument capabilities. With those heads, measurements in liquids as well as hardness
measurements or modification of the sample surface are available.
Sample
Video camera
Optical microscope
Sample positioning system
Optical microscope
positioning system
Laser Photodiode
STM measuring
hea
d
AFM measuring
head
Solver NE
X
8
1.3.
P
The built-
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b
asic stati
o
●
Inoper
a
●
Worki
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When a h
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The worki
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Re-positio
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Designati
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T SPM. Inst
r
P
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e
ad is not in
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ng positio
n
g
the probe
.
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ing of th
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n
el (see Fig
o
n of the he
a
– moves t
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– moves
t
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– moves
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e
– moves
bo
1
r
uction Man
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n
ing the
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heads are
ons (see Fi
g
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head
F
ig. 1-3. Sta
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e
v
olved in t
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n
is used i
n
.
With the
h
e
measuri
n
. 1-4) of th
e
Fig. 1-4
a
ds positio
n
h
e protectiv
e
t
he STM
h
e
position;
t
he AFM
h
e
position;
o
th heads t
o
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Built-i
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located in
s
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. 1-3):
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ead being
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. Measurem
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ing button
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shield up
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ide the SP
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ogram.
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nt heads c
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is followi
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and down;
working
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working
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rative pos
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e
M
body. Th
e
A
F
M
m
easuring h
e
k
ing position
stays in its
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ements as
i
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through
t
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g:
p
osition an
d
p
osition a
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tions.
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o
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d
the AF
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in one of t
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its
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Chapter 1. Overview
9
1.4. Technical Specification
Measuring system
Built-in measuring heads AFM, STM
Mountable measuring heads liquid, nanosclerometric
System for detecting the cantilever
deflection
automated alignment
Laser wavelength of cantilever
deflection system
850 nm
Sample
Size up to ø20×10 mm
Positioning range, in XY plane 5×5 mm
Positioning method automated with the use of optical image
Minimum positioning step 0.3
μ
m
Sample weight up to 40 g
Heating capabilities
(heating stage)
up to 150 °C
Scanning system
Scanning mode by sample
Scan area 100×100×10
μ
m (±10 %)
3×3×2.6 μm (±10 %)
(in the high resolution mode)
Relative error of distance
measurement:
XY plane
Z direction
less 1 % (less 0.1 % with the use of the feedback
sensors)
less 5 %
Non-linearity, in XY plane (with the
use of feedback sensors)
less 0.1 %
RMS noise in 1 ÷ 200 Hz frequency
range, XY plane
less 0.02 nm (XY 100
μ
m)
less 0.001 nm (XY 3 μm)
RMS noise in 10 ÷ 1000 Hz frequency
range, Z direction:
with the use of the feedback sensors
in the high resolution mode
less 0.04 nm
less 0.02 nm
Solver NEXT SPM. Instruction Manual
10
Optical viewing system
Positioning range, 5×5 mm
Positioning step 0.3
μ
m
Resolution 2
μ
m
Field of view 3.4 ÷ 0.53
μ
m
Dimensions and weight
Overall dimensions 320
×
215
×
470 mm
Weight 30 kg
Power characteristic
Voltage 110/220 V
Power consumption less 400 W
Chapter 2. Basic Safety Measures
11
2. Basic Safety Measures
General Safety Measures
●Ground the instrument before operation!
●Do not disassemble any part of the device. Disassembling of the product is permitted
only to persons certified by NT-MDT.
●Do not connect additional devices to the instrument without prior advice from an
authorized person from NT-MDT.
●This instrument contains precision electro-mechanical parts. Therefore protect it from
mechanical shocks.
●Protect the instrument against the influence of extreme temperature, the direct impact
of sun radiation, and moisture.
●For transport, provide proper packaging for the instrument so as to avoid its damage.
Electronics
●To reduce possible influence of power line disturbances on the measurements, we
recommend supplying the instrument units with a surge filter.
●Before operation, set the power switch of the SPM controller to the position
corresponding to value of the local electrical power line (this is only done with the
controller being off!).
●Switch the SPM controller off before connecting/disconnecting its cable connectors.
Disconnecting or connecting the cable connectors during operations may cause damage
to the electronic circuit and disable the instrument. A warning label is attached to the
SPM controller of the instrument (Fig. 2-1).
Fig. 2-1
Solver NEXT SPM. Instruction Manual
12
Laser
●Observe safety measures for operation with devices containing sources of laser
radiation. Do not stare into the beam. A label warning about the presence of laser
radiation is attached to the rearing panel of the measuring unit.
Fig. 2-2
Scanner
●Do not apply to the scanner forces bigger than it is necessary for installation of a probe
or a substrate with a sample. Avoid impacts on the scanner and its lateral displacement.
Remember that thickness of the scanner walls makes only 0.5 mm.
Other manuals for Solver Next
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