ON Semiconductor NCP6324GEVB User manual

©Semiconductor Components Industries, LLC, 2014
May, 2014 −Rev. 0
1Publication Order Number:
EVBUM2243/D
NCP6324GEVB
NCP6324B/C Evaluation
Board User's Manual
3 MHz, 2 A, High Efficiency, Low Ripple,
Adjustable Output Voltage, Synchronous
Buck Converter
Overview
This document is a manual file for a demo board of the
NCP6324B/C, which includes demo board schematics, bill
of materials, PCB layout, jumper setup, and test procedure.
About NCP6324B/C
The NCP6324B/C, a family of synchronous buck
converters, which is optimized to supply different sub
systems of portable applications powered by one cell Li-ion
or three cell Alkaline/NiCd/NiMH batteries. The devices are
able to deliver up to 2 A on an external adjustable voltage
range from 0.6 V to 3.3 V. Operation with 3 MHz switching
frequency allows employing small size inductor and
capacitors. Input supply voltage feed-forward control is
employed to deal with wide input voltage range.
Synchronous rectification and automatic PWM/PFM power
save mode offer improved system efficiency. The
NCP6324B is in a space saving, low profile
2.0 ×2.0 ×0.75 mm WDFN−8 package.
Features
•2.5 V to 5.5 V Input Voltage Range
•External Adjustable Voltage
•Up to 2 A Output Current
•3 MHz Switching Frequency
•Synchronous Rectification
•Automatic Power Save or External Mode Selection
•Enable Input
•Power Good Output
•Soft Start
•Over Current Protection
•Active Discharge When Disabled. Hi−Z Version
Available upon Request
•Thermal Shutdown Protection
•WDFN−8, 2 ×2 mm, 0.5 mm Pitch Package
•Maximum 0.8 mm Height for Super Thin Applications
Typical Applications
•Cellular Phones, Smart Phones, and PDAs
•Portable Media Players
•Digital Still Cameras
•Wireless and DSL Modems
•USB Powered Devices
•Point of Load
•Game and Entertainment System
1uH
Vo = 0.6V to Vin
Cout
10uF
PGND
FB
PVIN
EN
SW
AGND
AVIN
MODE/
PG
Cin
10uF
Rpg
1M
Vin = 2.5V to 5.5V
Power Good
Enable
R1
R2
Cfb
NCP6324B 1uH
Vo = 0.6V to Vin
Cout
10uF
PGND
FB
PVIN
EN
SW
AGND
AVIN
MODE/
PG
Cin
10uF
Vin = 2.5V to 5.5V
Mode
Enable
R1
R2
Cfb
NCP6324C
(a) Power Good Output (NCP6324B) (b) External Mode Selection
(NCP6324C Available upon Request)
Figure 1. Typical Application Circuits
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Table 1. PIN DESCRIPTION
Pin Name Type Description
1 PGND Power
Ground
Power Ground for power, analog blocks. Must be connected to the system ground.
2 SW Power
Output
Switch Power pin connects power transistors to one end of the inductor.
3 AGND Analog
Ground
Analog Ground analog and digital blocks. Must be connected to the system ground.
4 FB Analog
Input
Feedback Voltage from the buck converter output. This is the input to the error amplifier. For fixed
output devices, this pin is directly connected to the output capacitor; For external adjustable output
devices, this pin is connected to the resistor divider network between the output and AGND.
5 EN Digital
Input
Enable of the IC. High level at this pin enables the device. Low level at this pin disables the device.
6 PG Digital
Output
PG pin is for NCP6324B with Power Good option. It is open drain output. Low level at this pin
indicates the device is not in power good, while high impedance at this pin indicates the device is
in power good.
7 AVIN Analog
Input
Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or
larger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as
close as possible to this input.
8 PVIN Power
Input
Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacitor
must bypass this input to the ground. This capacitor should be placed as close a possible to this
input.
9PAD Exposed
Pad
Exposed Pad. Must be soldered to system ground to achieve power dissipation performances.
This pin is internally unconnected
Table 2. MAXIMUM RATINGS
Rating Symbol
Value
Unit
Min Max
Input Supply Voltage to GND VPVIN, VAVIN −0.3 7.0 V
Switch Node to GND VSW −0.3 7.0 V
EN, PG to GND VEN, VPG −0.3 7.0 V
FB to GND VFB −0.3 7.0 V
Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM −2,000 V
Machine Model (MM) ESD Rating are (Note 1) ESD MM −200 V
Latch up Current: (Note 2)
All pins, except digital pins
Digital pins
ILU −100
−10
100
10
mA
Operating Junction Temperature Range TJ−40 125 °C
Operating Ambient Temperature Range TA−40 85 °C
Storage Temperature Range TSTG −55 150 °C
Thermal Resistance Junction-to-Top Case (Note 4) RqJC 12 °C/W
Thermal Resistance Junction-to-Board (Note 4) RqJB 30 °C/W
Thermal Resistance Junction-to-Ambient (Note 4) RqJA 62 °C/W
Power Dissipation (Note 5) PD1.6 W
Moisture Sensitivity Level (Note 6) MSL 1 −
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115.
2. Latch up Current per JEDEC standard: JESD78 class II.
3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.
4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50 mm NCP6324EVB
board. It is a multilayer board with 1 once internal power and ground planes and 2−once copper traces on top and bottom of the board. If
the copper trances of top and bottom are 1 once too, RqJC = 11°C/W, RqJB = 30°C/W, and RqJA = 72°C/W.
5. .The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.
6. .Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

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Electrical Characteristics
For electrical characteristics, please refer to
NCP6324B/C datasheet available on website:
http://www.onsemi.com.
Schematic of Demo Board
A schematic of NCP6324B/C evaluation board is shown
in Figure 2, which is for a typical application with 1.8 V
output voltage. It is flexible to configure the board for both
PG devices (NCP6324B) and Mode devices (NCP6324C).
Please refer to Jumper Configuration for details.
1.0uH
Co1
10uF PGND
FB
PVIN
EN
SW
AGND
AVIN
MODE/
PG
Cin1
10uF
Ren
1M
R1
R2
Cfb
LCin2
100uF
Rpg
1M
220k
110k
15pF
IC1
NCP6324B/C
1
2
3
4
8
7
6
5
Vo+
Vo−
Co2
DNP
Co3
DNP
Rfb
20
J3
EN
Vin+
Vin−
Vo+
Vo_sen
Vin_sen
Mode
PG
Figure 2. Schematic of NCP6324B/C Evaluation Board
Table 3. BILL OF MATERIALS OF EVALUATION BOARD
Item
Part
Reference Description Package Part Number Manufacturer Qty
1 IC1 3 MHz, 2 A, Synchronous Buck
Converter
WDFN−8
2.0 ×2.0 ×
0.75 mm
NCP63xyB/C ON Semiconductor 1
2 Cin1 MLCC Cap 10 V, 10 mF, X5R,
±20%
0805 GRM21BR61A106KE19 muRata 1
3 Cin2 MLCC Cap 6.3 V, 100 mF, X5R,
±20%
1210 GRM32ER60J107ME20 muRata 1
4 Co1 MLCC Cap 6.3 V, 10 mF, X5R,
±20%
0603 GRM188R60J106ME47 muRata 1
5 L Power Choke 1.0 mH, ±30%,
2450 mA, 30 mW
4.0 ×3.5 ×
1.65 mm
LQH44PN1R0NP0 muRata 1
6Ren, Rpg Thick Film Chip Resistors, 1 MW,
±5%, 0.1 W
0603 ERJ3GEYJ105V Panasonic 2
7 R1 Thick Film Chip Resistors,
220 kW, ±1%, 0.1 W
0603 ERA3AEB224V Panasonic 1
8 R2 Thick Film Chip Resistors,
110 kW, ±1%, 0.1 W
0603 ERA3AEB114V Panasonic 1
9 Cfb MLCC, 15 pF, 50 V, 0603 0603 ECJ1VC1H150J Panasonic 1
10 Rfb Thick Film Chip Resistors, 20 W,
±1%, 0.1 W
0603 ERA3AEB200V Panasonic 1

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PCB Layout of Demo Board
A 80 ×50 mm PCB is designed for NCP6324B/C
evaluation board. It is a 4-layer board with 1-once internal
ground planes (middle1 layer and middle2 layer) and 2-once
copper traces on top layer and bottom layer of the board.
Figure 3 shows layout information of the board.
(a) TopOver Layer (b) Top Layer
(c) Middle 1 Layer (d) Middle 2 Layer
(e) Bottom Layer
Figure 3. PCB Layout of NCP6324B/C Evaluation Board

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Connections and Jumper Setup
There are two main configurations of the demo board for
two different devices, which are NCP6324B (PG device)
and NCP6324C (Mode device). External connections and
jumper setup for both configurations are shown in Figure 4.
The default configuration of NCP6324B/C evaluation board
is for NCP6324B devices.
2.5V ~ 5.5V
Supply
1.8V
Output
Short Rfb in
Normal Operation
(Default)
Open and Inject AC
Signal (for AC Test)
Enable by Connecting EN
to Vin (Default)
Disable by Connecting EN
to GND
Open (Default)
Pull PG to Vin (Default) Pull PG to Vo
To Multi−Meter for Vin Measurement To Multi−Meter for Vo Measurement
(a)NCP6324B (Default)
2.5V ~ 5.5V
Supply
1.8V
Output
Short Rfb in
Normal Operation
(Default)
Open and Inject AC
Signal (for AC Test)
Enable by Connecting EN
to Vin (Default)
Disable by Connecting EN
to GND
Open (Default)
FPWM Mode AUTO Mode (Default)
To Multi−Meter for Vin Measurement To Multi−Meter for Vo Measurement
(b)NCP6324C
Figure 4. Connections and Jumper Setup of NCP6324B/C Evaluation Board

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Test Procedure of Evaluation Board
1. Prepare equipments as below list.
a. DC power supply
b. Electronic load
c. Multimeters
d. Oscilloscope
2. Check jumper setup to make sure it is a right default
configuration for the device under test.
3. Set the power supply to 3.6 V with a current limit
higher than 1 A, and then disable the output of the
power supply.
4. Connect the power supply to the evaluation board’s
connectors Vin+ and Vin−.
5. Disable output of the electronic load and connect it
to the evaluation board’s connectors Vo+ and Vo−.
6. Enable the output of the power supply and check the
1.8 V output voltage of the evaluation board.
7. Set the electronic load to 10 mA and enable its
output. Typical input supply current is about 6 mA.
8. Monitor the output voltage and SW node signal
using an oscilloscope. The converter should operate
in DCM with similar waveforms as shown in
Figure 5(a).
9. Increase the electronic load to 1.0 A. Typical input
supply current is about 565 mA.
10. Monitor the output voltage and SW node signal
using the oscilloscope. The converter should operate
in CCM with similar waveforms as shown in
Figure 5(b). The switching frequency is about
3 MHz.
11. After the test is done, make sure to disable the output
of power supply before remove power connectors to
protect the device from damage caused by possible
high voltage spike in input.
(a) Io = 10 mA (b) Io = 1000 mA
Figure 5. Typical Operation Waveforms of NCP6324B/C Evaluation Board

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