Pace TF-350 User manual
PACE
Pace,
Inc.
TF-350
——
OPERATION
MANUAL
一
一
INTRODUCTION
Thank
you
for
your
purchasing
the
TF-350
SMD
rework
station.
As
you
are
aware,
the
technical
innovation
enabled
the
LSI
highly
densified
and
minimized
in
its
shape,
and
the
latest
technology
is
now
needed
for
the
handling
of
the
LSI.
Meanwhile,
the
surface
mount
works
also
are
required
to
keep
the
high
reliability
because
0.65mm
of
the
ar
pitch
is
further
minimized
to
0.5
mm,
and
recently
the
fine
pitch
of
0.3
mm
has
been
developed
in
the
industry.
The
TF-350
is
a
highly
reliable
SMD
rewok
system
with
hot
air
Style
that
is
applied
for
the
removal
and
the
soldering
of
many
shapes
of
QFP/SOP/PLCC/BGA/PGA
and
etc.
When
the
solder
face
of
the
SMD
is
melted
in
a
brief
time
by
the
hot
air
blowing
from
the
nozzle
that
circles
right
over
the
solder
face,
the
SMD
can
be
removed
quickly
by
the
vacuum
tweezers.
Also,
it
can
be
utilized
for
the
soldering
too.
When
it
is
overheated
due
to
the
stop
of
air
flow,
the
thermal
protector
will
be
activated
to
put
off
the
heater,
so
that
the
safety
guard
can
be
double
cheched
and
enhanced.
It
will
be
automatically
restored
when
the
ambient
temperature
is
lowered
to
60°C
MAIN
FUNCTION
1.
The
circle
range
of
the
nozzle
can
be
adjusted
to
any
dimension
up
to
50
mm
in
X
axis(right
&
left)
and
Y
axis(back
&
forth).So
it
can
be
utilized
for
any
size
of
SMD
up
to
50mm.
.
One(1)
mode
can
be
selected
from
the
four(4)
of
STANDARD,
LOW,
PGA/BGA,
SLOW
to
acconmodate
to
each
of
the
application.
The
heater
temperature
is
variable.
In
the
repeated
works,
it
is
convenient
that
the
timer
can
be
set
at
will
for
the
nozzle
to
come
up
automatically
at
the
pre-set
time.
.
The
operation
can
be
stopped
any
time
by
pushing
the
button
of
STOP.
The
nozzle
will
come
up
by
pushing
the
button
of
STOP
and
the
heater
will
be
automatically
put
off.
But
the
air
flow
will
continue
for
approx.
20
seconds
to
cool
down
the
nozzle
then
the
air
pump
will
stop.
The
vacuum
tweezers
is
equipped
to
quickly
remove
the
SMD
at
the
solder
melting.
The
PCB
can
be
handled
up
to
420
mm
in
length
and
no
limitation
in
width.
圖
COMPOSITION
№
pp
n
No
PCB
holder(targe)
PCB
holder(small)
Filter(It
is
housed
inside)
Composition
of
Main
body
and
Accessories
@Main
body
@Vacuum
Tweezers
@Suction
cup
for
Vacuum
tweezers(3
pcs.)
@Filter
for
Vacuum
tweezers(5
pcs.)
©Base
Plate
430
mm
X
300
mm
PCB
Holder
2
pcs.
of
small
size
2
pcs.
of
large
size
@Base
Plate
Stand
@PCB
Support
Pin
一
1
一
ㆍ
»
PLEASE
REMOVE
A
TRANSPORT
SCREW
PRIOR
TO
CONNECTING
THE
POWER
CORD.
A
butterfly
screw
is
fitted
to
protect
the
nozzie
against
vibration
in
the
transport.
Please
remove
it
prior
to
connecting
the
power
cord.
Be
sure
to
fit
it
in
again
at
re-packing
when
it
is
transported.
Set
X
and
Y
mode
to
O
and
tum
left
Knob
Z to
the
maximum,
then
push
the
Start
button
to
get
Nozzle
in
the
8
lowest
position
and
switch
off
the
power.
MINSTALLATION
COMMISSIONING
1.
Place
the
TF-350
on
a
level
surface
2.
Before
connecting
Power
cord,
please
confirm
that
Transport
Screw
is
removed.
Transport
Screw
with
butterfly
shape
is
fitted
to
fasten
the
arm
inside
the
front
panel.Nozzle
is
supported
by
the
arm.
3.
Connect
Power
cord
and
Vacuum
tweezers
Power
source
voltage:
AC
120
V
+10
%
or
AC
220
V
+10
%
Power
cord:
CEE
standard
UL
standard
Plug
S122
E35611
Connector
S477
E35797
Cord
S52
E35611
4.
confirm
each
of
the
basic
operation
as
stated
below.
1)
At
Power
Switch
"on",
Main
body
will
be
in
waiting
situation.
Set
Mode
Knob
in
STANDARD
and
push
Start
button
to
lower
Nozzle.
Then
confirm
whether
or
not
Nozzle
can
be
raised
and
lowered
by
Knob
Z.
Also
confirm
the
convertion
of
dimension
X(right
4
left)
and
Y(back
&
forth)
by
Knod
X
and
Knob
У.
Confirm
that
Heater
goes
on
when
Start
button
is
pushed
again.
Also
confirm
whether
or
not
the
brightness
of
Heater
can
be
changed
by
Temperature
Knob.
2)After
pushing
Stop
button,
set
Mode
Knob
in
LOW.
And
push
Start
button
twice.
Then
confirm
whether
or
not
the
air
flow
is
less
than
the
Mode
of
STANDARD.
3)After
pushing
Stop
button,
set
Mode
Knob
in
PGA/BGA.
And
push
Start
button
twice.
The
function
of
Knob
X
and
Knob
Y
in
Mode
PGA/BGA
will
be
different
from
the
Mode
of
STANDARD/LOW/SLOW.
Confirm
the
convertion
of
dimension
X(inside
circuitjand
Y(outside
circuit)by
Knob
X
and
Knob
Y
as
illustrated
below.
4)After
pushing
Stop
button,
set
Mode
Knob
in
SLOW.
And
push
Start
button
twice.
Confirm
that
the
air
flow
in
the
Mode
of
SLOW
is
less
than
the
Mode
of
STANDARD.
also
confirm
that
the
Nozzle
moving
speed
is
much
slower
(approx
1//10)
than
the
mode
of
STANDARD.
5)Heater
is
fitted
for
use
of
the
original
voltage.
When
it
is
used
in
different
voltage,
the
original
Heater
shall
be
replaced
to
meet
the
right
voltage.
LENGTH
OF
INSIDE
CIRCUIT
Adjustable
by
Knob
X
LENGTH
OF
OUTSIDE
CIRCUIT
Adjustable
by
Knob
Y
MCONTROL
PANEL
START
BUTTON
a
MODE
KNOB
|
|
[AO
BGA
STOP
BUTTON
ù
^
MODE
START/HEATon
|
一
ЕМРЕВАТОВЕ
КМОВ
一
KNOB-Z
AXIS]
Y
SES
TIMER
KNOB
一
一
in
x
Ap
KNOB-X
AXIS
t
WIDTH
O
INSIDE
QFP/PLCC
mm
PGA/BGA
|}
QI
[NOZZLE
一
一
一
一
00000
MPRESTART
1.
Turn
on
the
power
switch
2.
Tum
right(clockwise)
Knob
Z
to
the
maximum
to
raise
the
nozzle
to
the
highest
position.
3.
Set
Timer
Knob
at
max.
of
5
min.
4.
Set
Temperature
Knob
in
"high"
position
5.
Set
Mode
Knob
in
STANDARD
6.
Place
a
PCB
on
the
PCB
holders
and
adjust
Base
Plate
so
that
the
removing
QFP
can
be
positioned
right
under
Nozzle.
MTEST-RUN
(POSITION
SETTING)
7.
Push
START
button
one
time
to
lower
Nozzle
8.
Turn
left(counterclockwise)
Knob
Z
to
lower
Nozzle
so
that
Nozzle
point
can
be
1
mm
above
the
surface
of
QFP.
9.
Decide
the
width
X
and
length
Y
by
Knob
X
and
Knob
Y
so
that
Nozzle
can
circle
right
over
the
solder
face
of
QEP.
10.
Check
6,
8
and
9
above
again
if
needed
to
get
the
right
position
setting.
MSTART-REMOVAL
WORKS
11.
Push
START
button
once more
to
switch
on the
heater.
And
the
air
flow
will
start
melting
the
solder
face.
12.
The
vacuum
tweezers
will
be
usable
while
the
air
blow
is
on.
13.
You
can see
the
solder
glitter
and
start
melting.
14.
At
the
solder
melted,
place
a
finger
on the
hole
of
the
tweezers
and
let
the
tweezers
suck
the
surface
of
QFP.
15.Be
sure
to
push
STOP
button.
Nozzle
will
be
raised
up
and
Heater
will
be
off.
In
20
seconds,
the
air
pump
will
be
automatically
stopped
with
Nozzle
cooled
down.
16.When
you
want
to
heat
Nozzle
again,
push
START
button
agein.
ー3
ーー
MREMOVAL
METHOD
IN
“STANDARD”
MODE
MODE
:
CHOICE
SLOW-LOW-STANDARD-PGA/BGA
|
INDEX
OF
SETTING
POSITION
OF
NOZZLE
POINT
(X-Y-Z)
Adjust
a
distance
by
a
“re
Nozzie
will
be
raised
in
highest
position
when
Knob
Z
is
turned
right
to
the
maximum
Imm
(7
Ú
JAF
(QFP)
|
X's
width
Y's
length
YA
.
mae
73
Figure1
(PLCC)
X
EA
STEP
4
When
the
setting
time
of
Timer
is
due,
Nozzle
will
be
automatically
raised
up.
When
Timer
is
not
in
use,
Nozzle
will
be
raised
up by
pushing
button
of
2!
STEP
3
TEST
RUN
(POSITON SETTING)
In
order
to
circle
over
the
circumference
of
QFP,
Nozzle
point
can
be
set
by
placing
a
PCB
with
slight
movement
of
Base
Plate
2
and
by
deciding
X's
width
(right
&
left)
and
SMD
ol
Ys
length
(back
&
forth)that
is
shown
in
Figure1
(QFP)
中
START]
+
When
the
button
of
[lis
pushed
once
more,
the
hot
air
will
start
blowing.
STEP1
STEP
2
_
This
removal
method
is
When
the
button
of
ilustrated
in
"STANDARD"
E
(green
color)
is
Mode
pushed
one
time,
Turn
right
Timer
Knob
Nozzle
will
be
to
the
maximum
when
lowered.
Adjust
up
Φ
Timer
is
not
in
use.
&
down
by
Knob
Z.
STEP
5
When
the
solder
starts
melting,
please
suck
and
remove
QFP
by the
<
tweezers
after
placing
a
finger
on
the
hole.
STEP
6
In
approx.
20
seconds,
the
pump
will
be
automatically
stopped
with
Nozzle cooled
down.
Tweezers
MMODE
SELECTION
8
APPLICATION
MODE
|
AIRFLOW
|
NOZZLE
MOVE
APPLICATION
INDEX
OF
HEATER
SETTING
FAST
REMOVAL
FOR
QFP/PLCC/SOP/
STANDARD)
12
L/MIN.
|
A
SOP
3
7
2 8
FAST
REMOVAL
FOR
FOER
QFP/PLCC/SOP
TEMP
LOW
6
L/MIN.
+
RECOMMENDABLE
FOR
DENSE
PCB
WITH
THE
SMALL
COMPONENTS.
#
AT
THE
POSITION
OF
‘HIGH’,
MOST
PROPER
TEMPERATURE
FAST
REMOVAL
8
IS
AVAILABLE
FOR
REMOVAL.
PGA
SOLDERING
FOR
HOWEVER,
YOU
CAN
LOWER
PGA/BGA
THE
TEMPERATURE
AT
WILL
BGA
12
L/MIN.
Г]
/8G
IF
NECESSARY.
ー
*
AT
SOLDERING,
IT
IS
ADVISABLE
TO
ACTIVATE
AT
CALIBRATION
OF
3705
SLOW SOLDERING
*1/10
OF
FAST
SLOW
6
L/MIN.
ση
|
A
Lol
MREMOVAL
OF
BGA/PGA
BGA/PGA
Outside
circuit
One(1)
cycle
composes
of
five(5)
circuits
with
starting
at
©
and
ending
at
©.
The
cycle
will
be
repeated.
BGA/PGA
REMOVAL
METHOD
OF
PGA
IN
"PGA/BGA"
MODE
STEP
1
—
Set
Mode
Knob
in
“PGA/BGA”.
Nozzle
This
illustration
shows
that
Nozzle
is
circled
over
the
pins
of
PGA
by
5
Metal
frame
(Option)
CJ
(Option)
STEP
2
-
Seeing
the
solder
melting,
push
down
the
reverse
side
of
PCB
evenly
by the
metal
tweezers
or
others
so that
the
pins
points
are
on the
level
of
the
reverse
face
of
PCB.
STEP
3
—
When
the
pins
points
were
down
to
the
level
of
the
reverse
face
of
PCB,
please
pull
it
down
evenly
by the
jig.
STEP
4
-
The
PGA
will
be
removed.
Metal
frame
and
Jig
are
optional
parts.
REMOVAL
OF
SMPGA
(WITH
HEAT
SINK)
IN
“STANDARD”
MODE
SMPGA
FLOW
OF
HOT
AIR
'
‘
|
METAL
FRAME(OPTION)
SMPGA
|
REMOVAL
OF
SMPGA
WITH
A
ROUND
SHAPED
HEAT
SINK
|
1.
Set
Mode
Knob
in
"STANDARD"
2.
Place
a
square
Metal
frame
with
the
side
dimension
of
50
mm
around
SMPGA.
3.
The
tip
of
Nozzle
is
to
be
below
the
top
of
Heat
sink
as
illustrated
above.
Push
Start
button
and
tentatively
set
the
tip
end
of
Nozzle
in
a
position
so that the
rotation
of
“X”
and
“Y”
can
be
larger
than
the
diameter
of
Heat
sink.
And
place
PCB
on
the
PCB
holders
not
to
hit
the
tip
end
of
Nozzle.
4.
Adjust
the
width
of
"X”
and
“Y”
so that the
tip
end
of
Nozzle
can
rotate
between
the
circumference
of
SMPGA
and
Metal
frame
as
illustrated
above.
5.
After
the
position
setting,
push
Start
button
again.
6.
With
the
hot
air
flowing
into
the
pins
from
the
clearance
of
the
bottom
face
of
SMPGA
and
PCB,
the
solder
will
start
melting.
REFLOW
METHOD
OF
QFP
IN
“SLOW”
MODE
STEP
1
Remove
a
SMD
in
“STANDARD”
or
“SLOW”
mode
STEP
4
Put
a
new SMD
on
the
pattern
and
position
it
accurately.
“SLOW”
7
|
STEP
6
Solder
it
in
mode
of
“SLOW”.
U0000000109000
CHE
00000000000000
HER
STEP
2
STEP
3
Completely
remove
the
solder
Place
cream
by
a
dispenser
or
remained
on
the
face
of
pattern
others.
by
SC-7000
to
clean
the
face.
STEP
5
Fix
the
two
points
tentatively
by
a
solder
iron
as
illustrated
above.
(Use
a
finger
to
push
the
SMD
lightly
so
that
it
can
not
float)
REMARKS
2
circuits
in
mode
of
At
Step
2,
if
the
solder
remained
on
the
pattern
is
com-
paratively
new
and
usable,
it
is
advisable
to
re-use
the
remained
solder
and
to
flatten
it
by
a
solder
iron.
In
this
case,
place
a
little
of
flux
on
the
pattern,
then
accurately
position
a
new
SMD
on
the
pattern
while
the
flux
is
wet
(before
the
flux
is
dried).
The
flux
will
be
hardened
when
it
is
dried.
When
re-using
the
remained
solder,
please
do
Step
5&
6
after
Step
2.
|
KEY
ADVICE
ON
OPERATION
|
-
.
When
Nozzle
happens
to
contact
the
SMD,
it
is
likely
to
come
up
and
to
be
in
the
waiting
situation.
In
this
case,
please push
Start
button
again
for
Nozzle
to
come
|
down.
N
When
removing
the
small
BGA
&
OFP
less
than
15mm,
it
is
advisable
to
set
the
nozzle
to
the
maximum
height.
©
.
The
vacuum
tweezers
is
designed
to
be
used
like
a
pen.
Please
hold
it
like
a
pen
for
more
easier
usage.
A
When
the
solder
is
oxidized,
more
attention
should
be
paid
because
the
solder
melting
is
hard
to
identify.
a
.
There
will
be
quite
a
difference
in
the
time
required
for
removal
in
the
first
operation
(The
heater
is
cool
at
start)
and
in
the
second
after
(The
heater
is
already
warm).
Please
pay
attention
to
that.
の
When
PCB
is
bent
or
warped
due
to
the
large
size,
please
put the
PCB
support
pin
underneath
the
SMD.
When
it
is
bent
upward,
please
adjust
the
height
of
Nozzle
by
Knob
Z
not
to
hit
the
bent
PCB.
Remove
the
SMD
by
the
metal
twizzers
when
it
is
bonded.
oN
When
the
small
components
like
1005
are
mounted
around
the
removing
SMD,
please
use
Mode
“LOW”.
However,
if
you
find
that
the
heating
volume
of
Mode
“LOW”
is
in
shortage,
please
use
Mode
“STANDARD”
after
seperating
the
nearby
parts
by
putting
the
metal
frame
or
the
masking
tape.
©
When
the
PCB
holders
are
unusable
because
of
connectors
on
PCB,
please
use
the
PCB
support
pin.
10.Since
the
ceramic
board
is
weak
for
heating
impact,
it
is
better
to
put the
board
on
an
Aluminum
plate
of
1mm
thick.
11.In
the
reworking
of
PBGA
(Plastic
BGA),
it
is
advisable
to
activate
the
Temperature
Knob
at
calibration
of
3
to
4.
12.For
the
removal
of
the
large
sized
SMD
more
than
30mm,
an
option
of
the
metal
frame
will
be
more
useful.
13.For
the
removal
of
PGA
&
DIP,
more
efficient
works
will
be
done
when
the
molded
side
is
preheated
at
120°C.
14
if
the
connecter
is
made
with
heat-plasticity,
it
is
not
easy
to
remove
it
without
melting
or
damaging
it.
However
TF-350
can
do
it
well
while
it
is
impossible
with
other
equipment.
15.In
handling
the
flexible
PCB
or
the
film
board,
please
put
it
on
another
board
where
there
is
no
mounted
parts.
Then,
proceed
the
works
on
it.
16.Do
not
rely
on
the
timer
so
much.
It
sometimes
will
cause
failure
in
continuous
works.
17.The
removal
time
varies
according
to
the
conditions.
i.e.:
continuous
or
intermittent
works,
the
size
of
SMD
and
the
sorts
of
board.
Please
pay
attention
to
the
timer
setting.
18.The
small
PCB
is
apt
to
move
itself.
It
will
be
easy
to
do
the
works
when
you
put
a
weight
on
the
small
PCB.
19.Do
not
turn
Mode
Knob
in
the
operation.
If
the
Mode
is
changed
in
the
operation,
it
is
possible
that
Nozzle
makes
a
false
movement
because
the
last
Mode
program
is
memorized
in
the
computer.
When
you
wish
to
change
Mode,
be
sure
to
push
Stop
button
to
return
to
the
starting
position
then
select
a
Mode
you
want.
MSPECIFICATIONS
STYLE
HOT
AIR
STYLE.
BLOWING
NOZZLE
:
350W
¢
4mm
AIRFLOW
RATE
(LOW
+»
SLOW)
6
LITER/MIN.
(STD.
PGA/BGA)
12
LITER/MIN.
AIR
PUMP
+
VACUUM
PUMP
|
BUILT-IN
NOZZLE
TRACE
RANGE
|
(X
+
Y)
0—50mm
(Z)
26mm
TEMPERATURE
CONTROL
|
ADJUSTABLE
BY
KNOB
ON
PANEL
TIMER
CONTROL
ADJUSTABLE
BY
KNOB
ON
PANEL
:
MAX.
5
MIN.
SIZE
OF
BOARD
TO
PROCESS
|
(LENGTH
Y)
420mm
(WIDTH
X)
NO
LIMIT
MODE
(4
MODES)
STD
*
LOW
«
SLOW
*
PGA/BGA
POWER,/ELECTRICITY
|
АС
100,120,220V
//360W
DIMENSIONS
W
300mm
H
310mm
D
450mm
WEIGHT
9
KGS
MREPLACEMENT
PARTS
FOR
MAINTENANCE
TF
350
spare
parts
PART
NUMBER
6010-0118-P1
1360-0272-P1
1338-0101-P1
1338-0102-P1
4008-0034-P1
6020-0139-P1
1309-0055-P1
1334-0029-P1
1334-0030-P1
1285-0039-P1
1121-0827
DESCRIPTION
TF
350
Heater
Assy
120V
TF
350
Metal
Frame,
11
pcs.
Air
Pump
for
100-120V
Suction
Pump
for
100-120V
Power
Supply
PCB
for
100-120V
PCB
Main
for
100-120V
Filter
(10
pcs/set)
Air
Motor
for
Blowing
100-240V
Air
Motor
for
Suction
100-240V
PCB
Control
for
100-120V
Micro
Vacuum-Nozzle
MIBLOCK
DIAGRAM
HEATER
SWITCHING
POWER
SUPPLY
ὃν
Ум
108-1207
Sa
220-240
da
MAINTENANCE
The
TF-350
is
basically
designed
for
the
maintenance
free.
However,
the
replacement
of
major
parts
will
be
needed
when
the
emergency
accident
or
trouble
happened.
And
the
consumable
parts
will
have
to
be
changed
from
time
to
time
when
required.
Please
follow
the
instructon
stated
below
when
the
parts
replacement
is
needed.
A:INSTRUCTION
TO
REPLACE
MAJOR
PARTS
(DREMOVAL
OF
COVER
PLATE
1.
Switch
off
the
power.
2.Pull
out
the
small
cover
for
Knob
Z.
3.Come
off
the
vis
in
the
knob.
4.Come
off
all
of
14
pcs
of
screw
for
fitting
the
cover
plate.
5.When
removing
the
top
cover
of
front
panel,
slightly
open
outward
the
under
side
then
pull
it
upward.
@REPLACEMENT
OF
HEATER(NOZZLE)
Disconnect
the
AC
cord
Remove
the top
cover
of
the
front
panel
Pull
the
connector
out
of
heater
lead
wire
Loosen
the
bolt
which
fastens
the
tube
and
the
heater.
Take
the
heater
out
of
the
tube.
Insert
the
new
heater
in
the
tube.
fasten
the
bolt
fixing
the
tube
and
the
heater
so
that
the
clearance
between
Nozzle
tip
and
the
PCB
surface
can
be
2-3
mm
as
illustrated
below.
REMARKS
The
new
thermal
protector
will
be
supplied
with
the
new
heater.
NO
AG
o
o
2—3mm
PCB
@REPLACEMENT
OF
AIR
MOTOR(PUMP)
Disconnect
the
AC
cord.
Remove
Cover
plate
to
access
Air
motors(Pumps)
A) Air
motor(M1)
for
pressure
side
1.
Pull
2
pcs
of
Motor
lead
wire
(red
color)
out
of
Connectors
on
PCB(PCB/#
SD-2000M)
of
pressure
side
2.
Pull
2
pcs
of
Air
tube
out
of
Motor
3.
Disconnect
Earth
wire
out
of
Motor
by
loosenning
the
vis.
4.
Come
off
4
pes
of
Screw
of
Pump
base
5.
Pull
off
Insulator.
6.
Replace
the
old
motor
with
a
new
one.
B)
Air
motor
(M2)for
suction
side
1.
Pull
2
pcs
of
Motor
lead wire
(red
color)
out
of
Connectors
on
PCB(PCB/#
SD-2000M)
of
suction
side
2.
Pull
1
pc
of
Air
tube
out
of
Motor
3.
to
6.
Same
as
A)
@REPLACEMENT
OF
MAIN
PCB(PCB/#
SD-2000A
MAIN)
Disconnect
the
AC
cord
Remove
Cover
plate
to
access
Main
PCB
1.
Pull
off
all
of
Connectors
2.
Pull
off
the
fitting
materials(white
color)
of
Main
PCB
3.
Pull
out
Main
PCB
to
replace
with
a
new
one.
一
13
一
B:INSTRUCTION
TO
REPLACE
CONSUMABLES
(DCHANGE
OF
FILTER
Suction
filter
is
housed
inside
Base
frame.
After
coming
off
Hose
joint
by
Wrench,
take
the
old
filter
outside
to
replace
with
the
new
one.
@CHANGE
OF
LAMP
Lamp
is
a
push-off
type.
To
take
it
off,
push
it
upward
and
tum
it
clockwise.
(CHANGE
OF
PAD
FOR
VACUUM
TWEEZERS
It
is
a
rubber-make,
When
injured
or
collapsed,
it
should
be
replaced
with
a
new
one.
MITROUBLE
SHOOTING
The
trouble
shooting
illustrated
below
is
an
index
so
that
you can quickly
identify
the
cause
of
trouble
and
restore
the
equipment
to
normal
operation.
If
the
trouble
would
not
be
settled,
please
contact
Service
Div.
of
DEN-ON
or
the
service
agent
for
further
technical
information
on
the
repairs.
|
START
|
|
Check
if
initialized
Check
PULSE
MOTOR
X(CN5),
Y(CN4)
SENSOR(CN4)
OR
MICRO
SW(CN2)
|
Check
if
PUMP
MOTOR(M1
&
M2)
is
worked
by
START
SWITCH
(SW1)
Check
if
Nozzle
is
YES
repeated
up
and
down
Check
if
Nozzle
remains
up
after
pushing
START
button
È
Check
of
PCB
Check
SW
BOARD(CN1),
1C3,
SW1,
SW2
|
|
Malfunction
of
UP LIMIT
SW.
|
Malfunction
of
DOWN
LIMIT
SW.
|
|
一
14
一
The
TF-350
is
manufacturerd
and
sold
for
the
purpose
of
use
in
factory,
laboratory
and
industrial
business.
It
is
designed
for
the
solder
to
melt
efficiently
with
hot
air.
Since
the
nozzle
gets high
in
temperature,
you
must
not
touch
it
before
its
cooling
down.
And
since
the
removed
SMD
is
still
high
in
temperature,
you
must
not
touch
it
for
certain
time
after
the
removal.
The
TF-350
will
not
stop
for
approx.
20
seconds
while
the
nozzle
is
cooled
down
by
the
air
pump
even
if
the
stop
button
is
pushed.
In
the
meantime
you
must
not
turn
off
the
power
switch.
Otherwise,
it
will
cause
accident
due
to
overheating.
®
9893
Brewers
Cout
Sherboume
House,
Laurel,
MD
20723
Sherboume
Drive
S.A.
Tilbrook,
Milton
Keynes,
U
Pacs,
inc,
Tel:
(301490
9860
MK7
8HX
www.paceusa.com
1
888 535
PACE
(7223)
United
Kingdom
Fax:
(301)498
3252
Tel:
(44)
1908
277666
Fax:
(44)
1908
277777
Vi
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