Panasonic KX-MB771GR User manual

© 2007 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
ORDER NO.KMF0711127CE
Multi-Function Printer
KX-MB771GR
(for Greece)

2
KX-MB771GR
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precaution -------------------------------------------------3
1.1. FOR SERVICE TECHNICIANS ------------------------3
1.2. AC CAUTION -----------------------------------------------3
1.3. PERSONAL SAFETY PRECAUTIONS --------------4
1.4. SERVICE PRECAUTIONS ------------------------------4
2Warning--------------------------------------------------------------5
2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free) -----5
2.2. Discarding of P. C. Board --------------------------------6
2.3. INSULATION RESISTANCE TEST--------------------6
2.4. BATTERY CAUTION --------------------------------------6
2.5. LASER BEAM AND FUSER UNIT SECTION ------6
3 Specifications ------------------------------------------------------7
4 General/Introduction---------------------------------------------7
4.1. OPTIONAL ACCESSORIES ----------------------------7
4.2. TRANSLATION LISTS ------------------------------------8
4.3. ERROR MESSAGE ---------------------------------------9
5Features------------------------------------------------------------ 11
5.1. General Features----------------------------------------- 11
5.2. HARDWARE REQUIREMENTS FOR MULTI-
FUNCTION SOFTWARE------------------------------- 11
6 Technical Descriptions---------------------------------------- 12
6.1. CONNECTION DIAGRAM----------------------------- 12
6.2. GENERAL BLOCK DIAGRAM------------------------ 13
6.3. MAIN BOARD SECTION------------------------------- 15
6.4. NCU SECTION ------------------------------------------- 27
6.5. ITS (Integrated telephone System) and
MONITOR SECTION------------------------------------ 28
6.6. CIS CONTROL SECTION ----------------------------- 29
6.7. MOTOR DRIVE SECTION----------------------------- 30
6.8. TIMING CHART AND WAVE FORM OF
SCANNER MOTORS ----------------------------------- 34
6.9. FAN MOTOR SECTION -------------------------------- 37
6.10. SOLENOID DRIVER SECTION ---------------------- 39
6.11. LSU (Laser Scanning Unit) SECTION -------------- 40
6.12. SENSORS AND SWITCHES SECTION ----------- 42
6.13. OPERATION BOARD SECTION--------------------- 50
6.14. LCD SECTION-------------------------------------------- 51
6.15. HVPS (High Voltage Power Supply)
SECTION--------------------------------------------------- 52
6.16. HEAT LAMP CONTROL CIRCUIT------------------- 54
6.17. Main Board Section-------------------------------------- 59
6.18. POWER SUPPLY BOARD SECTION -------------- 62
6.19. Mechanical Operation----------------------------------- 63
7 Location of Controls and Components------------------ 65
7.1. OVERVIEW------------------------------------------------ 65
7.2. CONTROL PANEL--------------------------------------- 66
8 Installation Instructions--------------------------------------- 67
8.1. INSTALLATION ------------------------------------------- 67
8.2. CONNECTIONS------------------------------------------ 78
9 Operation Instructions ---------------------------------------- 79
9.1. YOUR LOGO --------------------------------------------- 79
10 Test Mode---------------------------------------------------------- 81
10.1. TEST FUNCTIONS -------------------------------------- 81
11 Service Mode ----------------------------------------------------- 85
11.1. PROGRAMMING AND LISTS ------------------------ 85
11.2. USER MODE (The list below is an example of
the SYSTEM SETUP LIST the unit prints out.)--- 89
11.3. SERVICE MODE SETTINGS (Example of a
printed out list)-------------------------------------------- 90
11.4. HISTORY -------------------------------------------------- 91
12 Troubleshooting Guide --------------------------------------- 94
12.1. USER RECOVERABLE ERRORS ------------------ 94
12.2. REMOTE PROGRAMMING -------------------------- 96
12.3. TROUBLESHOOTING DETAILS -------------------101
12.4. DOCUMENT JAMS (AUTO DOCUMENT
FEEDER) -------------------------------------------------176
12.5. RECORDING PAPER JAM --------------------------178
13 Service Fixture & Tools--------------------------------------186
14 Disassembly and Assembly Instructions ------------- 187
14.1. ADF SECTION ------------------------------------------188
14.2. REMOVE ADF SECTION (1)------------------------189
14.3. REMOVE ADF SECTION ---------------------------190
14.4. REMOVE TOP COVER SECTION-----------------191
14.5. REMOVE SCANNER GLASS SECTION--------- 192
14.6. REMOVE OPERATION PANEL SECTION ------193
14.7. LEFT SIDE SECTION ---------------------------------194
14.8. REMOVE MAIN BOARD -----------------------------194
14.9. REMOVE GEAR CHASSIS SECTION------------ 195
14.10. REMOVE PAPER FEED ROLLER ----------------- 196
14.11. RIGHT SIDE SECTION -------------------------------196
14.12. REMOVE RIGHT SIDE COVER SECTION------197
14.13. LOWER SIDE CABINET SECTION ---------------198
14.14. REMOVE RIGHT CASSETTE GUIDE ------------199
14.15. REMOVE PICK UP BOARD -------------------------199
14.16. REMOVE HIGH VOLTAGE POWER BOARD---200
14.17. REMOVE PICK UP ROLLER UNIT---------------- 201
14.18. REMOVE LOW VOLTAGE POWER BOARD ---202
14.19. REMOVE FUSER UNIT-------------------------------203
14.20. Installation Position of The Lead--------------------204
15 Maintenace-------------------------------------------------------210
15.1. MAINTENANCE ITEMS AND COMPONENT
LOCATIONS ---------------------------------------------210
15.2. MAINTENANCE-----------------------------------------212
15.3. PRINTING OPERATION PRINCIPLE -------------217
15.4. TERMINAL GUIDE OF THE ICs
TRANSISTORS AND DIODES----------------------222
15.5. HOW TO REPLACE THE FLAT PACKAGE IC -224
15.6. MAIN BOARD SECTION -----------------------------226
15.7. TEST CHART--------------------------------------------228
16 Schematic Diagram -------------------------------------------230
16.1. For Schematic Diagram-------------------------------230
16.2. MAIN BOARD-------------------------------------------232
16.3. OPERATION BOARD ---------------------------------242
16.4. SENSOR BOARD --------------------------------------243
17 Printed Circuit Board-----------------------------------------245
17.1. MAIN BOARD -------------------------------------------245
17.2. OPERATION BOARD ---------------------------------247
17.3. SENSOR BOARD --------------------------------------249
18 Exploded View and Replacement Parts List---------- 252
18.1. CABINET, MECHANICAL AND ELECTRICAL
PARTS LOCATION-------------------------------------252
18.2. REPLACEMENT PARTS LIST ----------------------265

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KX-MB771GR
1 Safety Precaution
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1. FOR SERVICE TECHNICIANS
•Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic part's boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch the IC or LSI pins with bare fingers.
1.2. AC CAUTION
For safety, before closing the lower cabinet, please make sure of the following precautions.
1. The earth lead is fixed with the screw.
2. The AC connector is connected properly.

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KX-MB771GR
1.3. PERSONAL SAFETY PRECAUTIONS
1.3.1. MOVING SECTIONS OF THE UNIT
Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated
by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit
is operating.
1.3.2. LIVE ELECTRICAL SECTIONS
All the electrical sections of the unit supplied with AC power by the AC power cord are live.
Never disassemble the unit for service with the AC power supply plugged in.
CAUTION:
AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disas-
sembling for service.
1.4. SERVICE PRECAUTIONS
1.4.1. PRECAUTIONS TO PREVENT DAMAGE FROM STATIC ELECTRICITY
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, etc.

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KX-MB771GR
2Warning
2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• PbF solder has a melting point that is 50°~ 70°F, ( 3 0 °~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700°± 20°F, (370°± 10°C). In case of using high temperature soldering iron, please be careful not to
heat too long.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 6 0 0°C).
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and
be sure that any remaining is melted prior to applying the Pb solder.
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1. SUGGESTED PBF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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KX-MB771GR
2.2. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
2.3. INSULATION RESISTANCE TEST
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part
(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.
2.4. BATTERY CAUTION
CAUTION
Danger of explosion if the battery is replaced incorrectly. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose used batteries according to the manufacturer’s instructions.
The lithium battery is a critical component (type No.CR2354). Please observe for the proper polarity and exact location when
replacing it and the soldering the replacement litium battery in.
2.5. LASER BEAM AND FUSER UNIT SECTION
• The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
• The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.

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KX-MB771GR
3 Specifications
* Transmission speed depends upon the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
** Transmission speed is based upon the ITU-T No. 1 Test Chart. (Refer to ITU-T No.1 TEST CHART (P.228).) If the capability of
the other party's machine is inferior to your unit, the transmission time may be longer.
Note:
• Design and specifications are subject to change without notice.
• The pictures and illustrations in these instructions may vary slightly from the actual product.
4 General/Introduction
4.1. OPTIONAL ACCESSORIES
Applicable Lines: Public Switched Telephone Network
Document Size: Max. 216 mm in with, Max. 600 mm in length
Effective Scanning Width: 208 mm
Effective Printing Width: A4: 202 mm
Letter/ Legal: 208 mm
Transmission Time*: Approx. 4 s/page (ECM-MMR Memory transmission)**
Scanning Density: Scanning resolution:
Up to 600 ×1200 dpi (Optical)
Up to 9600 ×9600 dpi (Interpolated)
Copy resolution:
Up to 600 ×600 dpi (Scanner Glass)
Up to 600 x 300 dpi (Auto document feeder)
FAX resolution:
Horizontal:
8 pels/mm
Vertical:
3.85 lines/mm STANDARD
7.7 lines/mm FINE/PHOTO
15.4 lines/mm SUPER FINE
Photo resolution: 64-level
Scanner Type: Color Contact Image Sensor
Printer Type: Laser printer
Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR)
Modem Speed: 33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 / 12,000 /
9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback
Operating Environment: 10°C—32.5°C, 20—70% RH (Relative Humidity)
Dimensions (H×W×D): Approx. height 305mm x width 420 mm x depth 445 mm
Mass (Weight): Approx. 13kg
Power Consumption: Standby: Approx. 6.5 W
Preheat: Approx. 65 W
Copy: Approx. 320 W
Maximum: Approx. 950 W (When the fuser lamp turns on)
Power Supply: 220 - 240 V AC, 50 Hz
Memory Capacity (for operation and
storing memory):
32 MB
Fax Memory Capacity: 2 MB in total
Approx. 170 pages of memory reception
Approx. 150 pages of memory transmission
(Based on the ITU-T No. 1 Test Chart in standard resolution.)
Laser diode properties: Laser output: Max. 5 mW
Wave length: 760 nm—810 nm
Emission duration: Continuous
Print Speed: 18 ppm (page per minute)
Printing Resolution: 600 ×600 dpi
Model No. Description Specifications
KX-FAT92X Replacement toner cartridge 1 toner cartridge
KX-FAD93X Replacement drum unit 1 drum unit

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KX-MB771GR
4.2. TRANSLATION LISTS
4.2.1. HELP FUNCTION

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KX-MB771GR
4.3. ERROR MESSAGE
4.3.1. DISPLAY

10
KX-MB771GR
4.3.2. REPORT
4.3.3. OTHERS

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KX-MB771GR
5 Features
5.1. General Features
General
• Help function
Display:
1. FEATURE LIST
2. DIRECTORY
3. FAX RECEIVING
4. CALLER ID
• LCD (Liquid Crystal Display) readout
Plain Paper Facsimile Machine
Output tray (approx. 100+50 sheets)
Output tray (approx. 150 sheets)
Letter/A4/Legal
G3 compatible
Automatic document feeder (Up to 20 sheets)
Quick scan
Resolution: Standard/Fine/Super fine/Photo (64 level).
STANDARD: For printed or typewritten originals with normal-
sized characters.
FINE: For originals with small printing.
SUPER FINE: For originals with very small printing.
PHOTO: For originals containing photographs, shaded draw-
ing, etc.
Broadcast
250-sheet paper capacity (60 g/m2~ 75 g/m2)
Distinctive ring detection.
Large Memory... Performed by DRAM
Approx. 150 pages of memory transmission
Approx. 170 pages of memory reception
Enhanced Copier Function
Multi-copy function (up to 99 copies)
Enlargement and reduction
64-Level halftone
5.2. HARDWARE REQUIREMENTS FOR MULTI-FUNCTION SOFTWARE
To use Multi-Function Station on your computer, the following are required:
Operating System:
Windows 98 / Windows Me / Windows 2000 / Windows XP / Windows VistaTM operating system
CPU:
Windows 98: Pentium® 90 MHz or faster
Windows Me: Pentium 150 MHz or faster
Windows 2000: Pentium 166 MHz or faster
Windows XP: Pentium 300 MHz or faster
Windows Vista: Recent Processor (x86) 800 MHz or higher processor
RAM:
Windows 98: 24 MB (32 MB or more recommended)
Windows Me: 32 MB (64 MB or more recommended)
Windows 2000: 64 MB or more
Windows XP: 128 MB or more
Windows Vista: 512 MB or more
Other Hardware:
CD-ROM drive
Hard disk drive with at least 150 MB of available space
USB interface
WARNING:
• To assure continued emission limit compliance, use only shielded USB cable
Note:
• Be sure to use a Hi-Speed USB 2.0 certified cable if your computer is equipped with the Hi-Speed USB 2.0 interface.
• USB cable is not supplied. Please purchase a shielded Type-A male/Type-B male USB cable.

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KX-MB771GR
6 Technical Descriptions
6.1. CONNECTION DIAGRAM

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KX-MB771GR
6.2. GENERAL BLOCK DIAGRAM
MAIN UNIT
SOC (IC300)
This custom IC is used for general MFP operations.
ROM (IC402)
This 8MB FLASH ROM contains all of the program instructions on the unit operations.
And support the backup of user setting and FAX receive data.
SYNCHRONOUS DYNAMIC RAM (IC400)
This 256Mbit SDRAM is used for CPU work and receiving memory and page memory.
POWER SUPPLY
DC-DC converters generate 3.3V and 1.2V for system power.
Regurator generates 5V for peripheral devices.
TEL/FAX I/F
Composed of ITS circuit and NCU circuit.
3 ICs called SDAA(Silicon Direct Access Arrangement) control Telephone line, Speaker, and Handset.
READ SECTION
CIS Unit to read transmitted documents.
CIS Unit is connected to FLATBED transit Unit.
Scan data is converted by AFE(IC503).
MOTOR
This model has 1 DC motor and 2 stepping motors.
IC300 drives the DC motor for printing.
IC502 and IC700 drive the stepping motor for Auto Document Feeder motor and CIS carriage.
LSU
Forms the images on the OPC DRUM by rotating polygon motor and reflecting the laser beam against polygon.
SENSORS
Composed of 2 switches and 5 sensors.
POWER SUPPLY BOARD
Supplies +24V and +7V to the Main unit and controls the Heat Lamp.
HIGH VOLTAGE POWER SUPPLY BOARD
Supplies bias need for the printing operation: bias of the DRUM, Developing and Transcription.
FIXING UNIT
Composed heat lamp, thermistor and thermostats.
1) CPU ARM9 operating at 250MHz.
2) SDRAM Controller Controls SDRAM Memory.
3) USB Controller with PHY Apply to USB2.0 HS
4) Scanner I/F Controls the CIS and AFE, and process the scan images.
5) LSU I/F Controls the polygon motor and outputs the VIDEO signal to LSU.
6) MOTOR I/F Controls the DC motor and Stepping Motor.
7) FAN I/F Controls FAN MOTOR and detect the rotation of FAN MOTOR.
8) OPERATION PANEL I/F Serial interface with Operation Panel.
9) SENSOR I/F Detects the sensor signal.
10) I/O PORT I/O Port Interface.
11) A/D, D/A converter Sends beep tones, etc.
Convert the analog signal to the digital signal.
12) RTC Real time clock.
13) MODEM Performs the modulation and the demodulation for FAX communication.
14) Analog Front End I/F Controls the DAA device for TEL/FAX function.

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KX-MB771GR
Main Board
DAA block
(TNV)
SoC
(sirius
Lite)
Polygon motor
(LSU) USB
FLASH
(32/64Mbit)
SDRAM
(256Mbit
)
TEL
EXT
TEL
Speaker
Operation Panel Board
Ope
G/A
AFE
2Line
LCD
Motor
Driver
(FB)
Flat Bed
Flat Bed
Thermistor
(Room)
Motor
Driver
(ADF)
Hand Set
Hook SW
LAN
Phy
Varistor
Carriage motor
Color CIS
FB Transit
Not used
CN701 CN700
CN509
CN750CN300
CN100
CN101
CN200
CN510
CN500
CN501
CN502
CN504
CN505
CN511
CN508
CN507
CN514
CN506
CN58
CN57
CN56
CN61 CN62
CN60
CN59
CN2
CN1
DC motor
Resist Solenoid
Pick-up Solenoid
HVU
FAN motor (left)
Hole
IC
Pick Up SensorToner Sensor
CN64
CN67 CN66
CN65
CN51
CN63
CN53 CN52
CN50
FAN motor (right)
Thermostat
Heater lamp
SWPS
CN101
AC inlet
Thermistor
(Heater)
Thermostat
AC cord set
DC-DC
CONVERTER
ADF motor
IC400
IC402
IC300 IC100, IC101
IC50
IC503
IC502 IC700
IC1 nRP Se sor
Document Sensor
tr or
Regis e Sens ePTOP S nsor
IT SensorEX

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KX-MB771GR
6.3. MAIN BOARD SECTION
6.3.1. Data Flow
[FAX Tx]
1. An analog image data is output from CIS unit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.
2. CPU compress the data in IC400.
3. CPU transfer the data to MODEM
and output it to TEL LINE through DAA circuit.
CN59
CN510
CN61
CN500
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
FB tr ansit Board
CN300
SDRAM
I/F
USB
USB
I/F
CPU
DAA
IC100
IC101
LAN
I/F DSPJBIG
CN100
CI S unit
LSU
TEL
LINE
PC
[FAX Rx]
1. FAX data is input from TEL LINE to MODEM in IC300
through DAA circuit.
And then store it in IC400 through SDRAM I/F.
2. CPU decompress the data in IC400.
3. Print I/F retrieve the data from IC400 and output it to LSU.
CN59
CN510
CN61
CN500
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
FB tr ansit Board
CN300
SDRAM
I/F
USB
USB
I/F
CPU
DAA
IC100
IC101
LAN
I/F DSPJBIG
CN100
CI S unit
LSU
TEL
LINE
PC

16
KX-MB771GR
[PC Scan]
1. An analog image data is output from CISunit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.
2. If necessary, the data is compressed via DSP.
3. The data is output to PC through the USB I/F.
CN59
CN510
CN61
CN500
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
FB tr ansit Board
CI S unit
LSU
CN300
SDRAM
I/F
USB
USB
I/F
CPU
DAA
IC100
IC101
LAN
I/F DSPJBIG
CN100
TEL
LINE
PC
[PC print]
CN59
CN510
CN61
CN500
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
FB tr ansit Board
CN300
SDRAM
I/F
USB
USB
I/F
CPU
DAA
IC100
IC101
LAN
I/F DSPJBIG
CN100
1.The print data is output from PC through USB
and pass the USB I/F in IC300.
then the data is stored in IC400 through SDRAM I/F.
2. Print I/F retrieve the data from IC400 and output it to LSU.
CI S unit
LSU
TEL
LINE
PC

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KX-MB771GR
[Copy]
CN59
CN510
CN61
CN500
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
FB tr ansit Board
CN300
SDRAM
I/F
USB
USB
I/F
CPU
DAA
IC100
IC101
LAN
I/F DSPJBIG
CN100
1. An analog image data is output from CISunit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400
through SDRAM I/F.
2. If necessary, the data is compressed via JBIG.
3. Print I/F retrieve the data from IC400 and output it to LSU.
CI S unit
LSU
TEL
LINE
PC

18
KX-MB771GR
Description of Pin Distribution (IC300) SOC (System On Chip)
PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION
A02 LEDONB O 3.3V SCANNER INTERFACE
A03 NCCDON O 3.3V SCANNER INTERFACE
A04 AFEMCLK O 3.3V SCANNER INTERFACE
A05 NCCDCP O 3.3V NOT USED
A06 CCDCLK O 3.3V NOT USED
A07 PIO29 O 3.3V OPERATION PANEL INTERFACE
A08 PIO57 O 3.3V CARRIAGE MOTOR INTERFACE
A09 PIO53 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
A10 PIO50 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
A11 PIO46 O 3.3V FAN1 CONTROL
A12 PIO42 O 3.3V DC MOTOR INTERFACE
A13 NFRCE O 3.3V FLASH MEMORY CHIP SELECT
A14 FRMD0 I/O 3.3V FLASH MEMORY DATA BUS 0
A15 FRMD3 I/O 3.3V FLASH MEMORY DATA BUS 3
A16 FRMD7 I/O 3.3V FLASH MEMORY DATA BUS 7
A17 FRMA3 O 3.3V FLASH MEMORY ADDRESS BUS 3
A18 FRMA6 O 3.3V FLASH MEMORY ADDRESS BUS 6
A19 FRMA10 O 3.3V FLASH MEMORY ADDRESS BUS 10
A20 THRMAVDD - 3.3V POWER SUPPLY
A21 FRMA11 O 3.3V FLASH MEMORY ADDRESS BUS 11
A22 FRMA15 O 3.3V FLASH MEMORY ADDRESS BUS 15
A23 FRMA17 O 3.3V FLASH MEMORY ADDRESS BUS 17
A24 FRMA20 O 3.3V FLASH MEMORY ADDRESS BUS 20
A25 FRMA22 O 3.3V FLASH MEMORY ADDRESS BUS 22
AA01 SDMD8 I/O 3.3V SDRAM DATA BUS 8
AA02 SDMD9 I/O 3.3V SDRAM DATA BUS 9
AA03 SDMA7 O 3.3V SDRAM ADDRESS BUS 7
AA04 SDMA6 O 3.3V SDRAM ADDRESS BUS 6
AA23 VDD1.2 - 1.2V POWER SUPPLY
AA24 AFERST O 3.3V NCU INTERFACE
AA25 RING I 3.3V NCU INTERFACE
AA26 EXTINT I 3.3V NCU INTERFACE
AB01 SDMD10 I/O 3.3V SDRAM DATA BUS 10
AB02 SDMD11 I/O 3.3V SDRAM DATA BUS 11
AB03 SDMA5 O 3.3V SDRAM ADDRESS BUS 5
AB04 VDD1.2 - 1.2V POWER SUPPLY
AB23 VSS - GND GND
AB24 BTXD O 3.3V NCU INTERFACE
AB25 BRXD I 3.3V NCU INTERFACE
AB26 AFECLK O 3.3V NCU INTERFACE
AC01 SDMD12 I/O 3.3V SDRAM DATA BUS 12
AC02 SDMD13 I/O 3.3V SDRAM DATA BUS 13
AC03 SDMA4 O 3.3V SDRAM ADDRESS BUS 4
AC04 VSS - GND GND
AC05 VSS - GND GND
AC06 VDD1.2 - 1.2V POWER SUPPLY
AC07 TXD0 O 3.3V ETHERNET INTERFACE
AC08 TX_ER O 3.3V ETHERNET INTERFACE
AC09 RXD1 I 3.3V ETHERNET INTERFACE
AC10 VDD3.3 - 3.3V POWER SUPPLY
AC11 TEST I 3.3V NOT USED
AC12 USBREXT I 3.3V USB INTERFACE
AC13 VDD1.2 - 1.2V POWER SUPPLY
AC14 VDD3.3 - 3.3V POWER SUPPLY
AC15 USBXIN I 3.3V CRYSTAL(12MHz) INPUT
AC16 LSI_SCAN_ENABLE I 3.3V NOT USED
AC17 VDD1.2 - 1.2V POWER SUPPLY
AC18 NWDTRST O 3.3V WATCH DOG TIMER RESET OUTPUT
AC19 LSI_TN I 3.3V NOT USED
AC20 PSCIO2 I 3.3V INPUT PORT (FANDET1)
AC21 PSCIO6 O 3.3V NOT USED
AC22 VDD1.2 - 1.2V POWER SUPPLY
AC23 VSS - GND GND
AC24 ATXD O 3.3V NCU INTERFACE
AC25 BBITCLK I/O 3.3V NCU INTERFACE

19
KX-MB771GR
AC26 BSPCLK I/O 3.3V NCU INTERFACE
AD01 SDMD14 I/O 3.3V SDRAM DATA BUS 14
AD02 SDMD15 I/O 3.3V SDRAM DATA BUS 15
AD03 VSS - GND GND
AD04 NBATRST I 3.3V BATTERY RESET INPUT
AD05 VDD2RTC - 1.2V POWER SUPPLY
AD06 CRS I 3.3V ETHERNET INTERFACE
AD07 TXD1 O 3.3V ETHERNET INTERFACE
AD08 RX_DV I 3.3V ETHERNET INTERFACE
AD09 RXD2 I 3.3V ETHERNET INTERFACE
AD10 RX_ER I 3.3V ETHERNET INTERFACE
AD11 CLKSEL I 3.3V NOT USED
AD12 USBVSSA33_BIAS - GND GND
AD13 USBVSSA33 - GND GND
AD14 USBVDDA12_SQ - 1.2V POWER SUPPLY
AD15 USBVSSA12 - GND GND
AD16 LSI_TRSTN I 3.3V NOT USED
AD17 LSI_TDO O 3.3V NOT USED
AD18 NRST I 3.3V SYSTEM RESET INPUT
AD19 HTRCTL O 3.3V HEATER CONTROL
AD20 PSCIO3 I 3.3V INPUT PORT (POUT)
AD21 PSCIO7 O 3.3V NOT USED
AD22 PSCIO15 I 3.3V INPUT PORT (RPS)
AD23 NC - - NOT USED
AD24 VSS - GND GND
AD25 ASPCLK I/O 3.3V NCU INTERFACE
AD26 ARXD I 3.3V NCU INTERFACE
AE01 SDLDM1 O 3.3V SDRAM DQML1
AE02 VSS - GND GND
AE03 SYSPLLVSS1 - GND GND
AE04 RTCCLKOUT O 3.3V CRYSTAL(32.768KHz) OUTPUT
AE05 RTCPWRDWN I 3.3V RTC POWER DOWN
AE06 TX_CLKI I 3.3V ETHERNET INTERFACE
AE07 TXD2 O 3.3V ETHERNET INTERFACE
AE08 RX_CLKI I 3.3V ETHERNET INTERFACE
AE09 RXD3 I 3.3V ETHERNET INTERFACE
AE10 MDC O 3.3V ETHERNET INTERFACE
AE11 NC - - NOT USED
AE12 USBID O 3.3V NOT USED
AE13 USBDM I/O 3.3V USB INTERFACE
AE14 USBVSSA12_SQ - GND GND
AE15 USBVDDA12PLL - 1.2V POWER SUPPLY
AE16 USBVDDA12 - 1.2V POWER SUPPLY
AE17 LSI_TDI I 3.3V NOT USED
AE18 LSI_PROCMON O 3.3V NOT USED
AE19 LSI_IDDT I 3.3V NOT USED
AE20 PSCIO1 I 3.3V INPUT PORT (PICK)
AE21 PSCIO5 O 3.3V NOT USED
AE22 PSCIO13 I 3.3V INPUT PORT (TNR)
AE23 MDMCLKOUT O 3.3V CRYSTAL(24.576MHz) OUTPUT
AE24 MDMPLLVDD - 3.3V POWER SUPPLY
AE25 VSS - GND GND
AE26 ABITCLK I/O 3.3V NCU INTERFACE
AF02 SYSPLLVDD1 - 3.3V POWER SUPPLY
AF03 VDD3.3OSC - 3.3V POWER SUPPLY
AF04 RTCCLKIN I 3.3V CRYSTAL(32.768KHz) INPUT
AF05 COL I 3.3V ETHERNET INTERFACE
AF06 TX_EN O 3.3V ETHERNET INTERFACE
AF07 TXD3 O 3.3V ETHERNET INTERFACE
AF08 RXD0 I 3.3V ETHERNET INTERFACE
AF09 MDIO I/O 3.3V ETHERNET INTERFACE
AF10 MGTINT I 3.3V ETHERNET INTERFACE
AF11 USBVBUS O 3.3V USB INTERFACE
AF12 USBVDDA33_BIAS - 3.3V POWER SUPPLY
AF13 USBDP I/O 3.3V USB INTERFACE
AF14 USBVDDA33 - 3.3V POWER SUPPLY
AF15 USBVSSA12PLL - GND GND
PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION

20
KX-MB771GR
AF16 USBXOUT I 3.3V CRYSTAL(12MHz) OUTPUT
AF17 LSI_TMS I 3.3V NOT USED
AF18 LSI_TCK I 3.3V NOT USED
AF19 LSI_CW_TAP I 3.3V NOT USED
AF20 PSCIO0 I 3.3V INPUT PORT (REGIST)
AF21 PSCIO4 O 3.3V NOT USED
AF22 PSCIO12 I 3.3V INPUT PORT (POUT)
AF23 PSCIO14 I 3.3V INPUT PORT (DOCU)
AF24 MDMCLKIN I 3.3V CRYSTAL(24.576MHz) INPUT
AF25 MDMPLLVSS - GND GND
B01 AFEADC0 I 3.3V NOT USED
B02 VSS - GND GND
B03 LEDONG O 3.3V SCANNER INTERFACE
B04 AFERSMP O 3.3V NOT USED
B05 AFEVSMP O 3.3V SCANNER INTERFACE
B06 NCCDRS O 3.3V SCANNER INTERFACE
B07 PIO30 I/O 3.3V OPERATION PANEL INTERFACE
B08 MMPWR O 3.3V NOT USED
B09 PIO54 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
B10 PIO51 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
B11 PIO47 O 3.3V NOT USED
B12 PIO43 O 3.3V DC MOTOR INTERFACE
B13 NFROE O 3.3V FLASH MEMORY CHIP OUTPUT ENABLE
B14 FRMD1 I/O 3.3V FLASH MEMORY DATA BUS 1
B15 FRMD4 I/O 3.3V FLASH MEMORY DATA BUS 4
B16 FRMA0 O 3.3V FLASH MEMORY ADDRESS BUS 0
B17 FRMA4 O 3.3V FLASH MEMORY ADDRESS BUS 4
B18 FRMA7 O 3.3V FLASH MEMORY ADDRESS BUS 7
B19 THRMAVSS - GND GND
B20 TONE O 3.3V ANALOG(TONE) OUTPUT
B21 FRMA12 O 3.3V FLASH MEMORY ADDRESS BUS 12
B22 FRMA16 O 3.3V FLASH MEMORY ADDRESS BUS 16
B23 FRMA19 O 3.3V FLASH MEMORY ADDRESS BUS 19
B24 FRMA21 O 3.3V FLASH MEMORY ADDRESS BUS 21
B25 VSS - GND GND
B26 DOTPLLVSS - GND GND
C01 AFEADC3 I 3.3V NOT USED
C02 AFEADC1 I 3.3V NOT USED
C03 VSS - GND GND
C04 LEDONR O 3.3V SCANNER INTERFACE
C05 OEB O 3.3V NOT USED
C06 CCDSH O 3.3V SCANNER INTERFACE
C07 PIO31 O 3.3V OPERATION PANEL INTERFACE
C08 OPMPWR O 3.3V NOT USED
C09 PIO55 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
C10 PIO52 O 3.3V CARRIAGE/ADF MOTOR INTERFACE
C11 PIO49 O 3.3V OUTPUT PORT(HSSPMUTE)
C12 PIO45 O 3.3V DC MOTOR INTERFACE
C13 NFRWE O 3.3V FLASH MEMORY CHIP WRITE ENABLE
C14 FRMD2 I/O 3.3V FLASH MEMORY DATA BUS 2
C15 FRMD6 I/O 3.3V FLASH MEMORY DATA BUS 6
C16 FRMA2 O 3.3V FLASH MEMORY ADDRESS BUS 2
C17 FRMA5 O 3.3V FLASH MEMORY ADDRESS BUS 5
C18 FRMA9 O 3.3V FLASH MEMORY ADDRESS BUS 9
C19 THRMSTR0 I 3.3V ANALOG INPUT(THERMISTOR)
C20 TONEAVDD - 3.3V POWER SUPPLY
C21 FRMA14 O 3.3V FLASH MEMORY ADDRESS BUS 14
C22 FRMA18 O 3.3V FLASH MEMORY ADDRESS BUS 18
C23 FRMA23 O 3.3V FLASH MEMORY ADDRESS BUS 23
C24 VSS - GND GND
C25 DOTPLLVDD - 3.3V POWER SUPPLY
C26 DOTCLKIN I 3.3V CRYSTAL(20MHz) INPUT
D01 AFEADC5 I 3.3V SCANNER INTERFACE
D02 AFEADC4 I 3.3V SCANNER INTERFACE
D03 AFEADC2 I 3.3V NOT USED
D04 VSS - GND GND
D05 VSS - GND GND
PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION