Panasonic KX-TG2323AGB User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG2323AGB
KX-TGA231AGB
2.4GHz Digital Cordless Answering
System
Black Version
(for Argentina)
Telephone Equipment
ORDER NO. KM40501578CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FOR SERVICE TECHNICIANS 6
3 CAUTION 6
4 BATTERY 7
4.1. Battery Charge 7
4.2. Battery Recharge 7
4.3. Battery Information 7
4.4. Battery Replacement 8
5 LOCATION OF CONTROLS 9
5.1. Base Unit 9
5.2. Handset 10
6 DISPLAY 11
6.1. Base Unit Display 11
7 SETTINGS 12
7.1. Connections 12
7.2. Connecting an Optional Headset 13
7.3. Time and Day 13
7.4. Dialing Mode 14
7.5. Voice Enhancer Technology 14
7.6. Ringer Tone 14
8 OPERATION 15
8.1. Answering System 15
8.2. For Call Waiting Service Users 17
8.3. FLASH Button 18
8.4. Remote Operation from a Touch Tone Phone 18
9 TROUBLESHOOTING 22
10 DISASSEMBLY INSTRUCTIONS 25
10.1. Base Unit 25
10.2. Handset 26
11 TROUBLESHOOTING GUIDE 27
11.1. Check Power 28
11.2. Error Message Table 28
11.3. Check Record 29
11.4. Check Playback 30
11.5. Check Battery Charge 30
11.6. Check Link 31
11.7. Check the RF Part 32
11.8. Check Handset Transmission 36
11.9. Check Handset Reception 36
12 TEST MODE 37
12.1. Test Mode Flow Chart for Base Unit 37
12.2. Test Mode Flow Chart for Handset 40
12.3. X801 (Base Unit), X201 (Handset) Check 44
12.4. Adjust Battery Low Detector Voltage (Handset) 44
12.5. Base Unit Reference Drawing 45
12.6. Handset Reference Drawing 47
12.7. Frequency Table 48
12.8. How to Clear User Setting 49
13 DESCRIPTION 50
13.1. Frequency 50
13.2. FHSS (Frequency Hopping Spread Spectrum) 50
13.3. Signal Flowchart in the Whole System 52
14 EXPLANATION OF LINK DATA COMMUNICATION 53
14.1. Calling 53
14.2. To Terminate Communication 53
14.3. Ringing 53
15 BLOCK DIAGRAM (Base Unit) 54
16 CIRCUIT OPERATION (Base Unit) 55
16.1. DSP (Digital Speech/Signal Processing: IC501) 55
16.2. Flash Memory (IC701) 56
16.3. Power Supply Circuit 56
16.4. Reset Circuit 58
16.5. Locator Mode 59
16.6. Telephone Line Interface 59
16.7. Auto Disconnect Circuit 60
16.8. Parallel Connection Detect Circuit 61
17 BLOCK DIAGRAM (Handset) 62
18 CIRCUIT OPERATION (Handset) 63
18.1. Construction 63
18.2. Power Supply Circuit 64
18.3. Charge Circuit 65
18.4. Ringer and Handset SP-Phone 65
Note:
Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page Page
2
KX-TG2323AGB / KX-TGA231AGB

18.5. Sending Signal 66
18.6. Reception Signal 66
19 SIGNAL ROUTE 67
20 CPU DATA (Base Unit) 68
20.1. IC501 68
21 CPU DATA (Handset) 69
21.1. IC201 69
22 EXPLANATION OF IC TERMINALS (RF Unit) 70
22.1. IC901 70
23 HOW TO REPLACE A FLAT PACKAGE IC 71
23.1. Preparation 71
23.2. Procedure 71
23.3. Removing Solder from Between Pins 71
24 CABINET AND ELECTRICAL PARTS (Base Unit) 72
25 CABINET AND ELECTRICAL PARTS (Handset) 73
26 ACCESSORIES AND PACKING MATERIALS 74
27 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
75
27.1. Base Unit 75
27.2. Handset 75
28 REPLACEMENT PARTS LIST 76
28.1. Base Unit 76
28.2. Handset 78
28.3. Accessories and Packing Materials 80
29 FOR SCHEMATIC DIAGRAM 81
29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 81
29.2. Handset (SCHEMATIC DIAGRAM (Handset)) 81
30 SCHEMATIC DIAGRAM (Base Unit) 82
30.1. Main 82
30.2. Operation 84
31 SCHEMATIC DIAGRAM (Handset) 86
32 SCHEMATIC DIAGRAM (RF PART) 88
33 CIRCUIT BOARD (BASE UNIT) 89
33.1. Main 89
33.2. Operation 91
34 CIRCUIT BOARD (HANDSET) 93
34.1. Component View 93
34.2. Flow Solder Side View 94
3
KX-TG2323AGB / KX-TGA231AGB

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
4
KX-TG2323AGB / KX-TGA231AGB

1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC901
IC201
IC202
Marked
PbF
(Component View)
Note:
The location of the “PbF”mark is subject to change without notice.
5
KX-TG2323AGB / KX-TGA231AGB

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on worktable.
4.Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
6
KX-TG2323AGB / KX-TGA231AGB

4 BATTERY
4.1. Battery Charge
4.2. Battery Recharge
4.3. Battery Information
7
KX-TG2323AGB / KX-TGA231AGB

4.4. Battery Replacement
8
KX-TG2323AGB / KX-TGA231AGB

5 LOCATION OF CONTROLS
5.1. Base Unit
9
KX-TG2323AGB / KX-TGA231AGB

5.2. Handset
10
KX-TG2323AGB / KX-TGA231AGB

6 DISPLAY
6.1. Base Unit Display
11
KX-TG2323AGB / KX-TGA231AGB

7 SETTINGS
7.1. Connections
12
KX-TG2323AGB / KX-TGA231AGB

7.2. Connecting an Optional Headset
7.3. Time and Day
13
KX-TG2323AGB / KX-TGA231AGB

7.4. Dialing Mode
7.5. Voice Enhancer Technology
7.6. Ringer Tone
14
KX-TG2323AGB / KX-TGA231AGB

8 OPERATION
8.1. Answering System
8.1.1. Greeting Message
15
KX-TG2323AGB / KX-TGA231AGB

16
KX-TG2323AGB / KX-TGA231AGB

8.1.2. Erasing Messages
8.2. For Call Waiting Service Users
17
KX-TG2323AGB / KX-TGA231AGB

8.3. FLASH Button
8.4. Remote Operation from a Touch Tone Phone
18
KX-TG2323AGB / KX-TGA231AGB

8.4.1. Summary of Remote Operation
8.4.2. Remote Code
19
KX-TG2323AGB / KX-TGA231AGB

8.4.3. Help Menu Function
8.4.4. Direct Commands
8.4.5. To Turn on the Answering System
8.4.6. Skipping the Greeting
20
KX-TG2323AGB / KX-TGA231AGB