Panasonic KX-TG2360JXS User manual

©2004 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG2360JXS
KX-TGA236JXS
Digital Cordless Answering System
Silver Version
(for Asia, Middle Near East and Other Areas)
Telephone Equipment
ORDER NO. KM40402342C3

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to recognize that Pb Free solder is used 5
2 FOR SERVICE TECHNICIANS 7
3 CAUTION 7
4 BATTERY 8
4.1. Standard Battery Life 8
4.2. Battery Replacement 9
5 LOCATION OF CONTROLS 10
5.1. Base unit 10
5.2. Handset 11
6 DISPLAY 12
6.1. Base Unit Display 12
6.2. Troubleshooting (Handset LCD) 13
7 SETTINGS 14
7.1. Connections 14
7.2. Connecting an Optional Headset 14
7.3. Function Menu Table 15
7.4. Date and Time 16
7.5. Dialing Mode 17
7.6. Line Mode 17
7.7. Voice Enhancer Technology 18
7.8. Ringer Tone 19
7.9. Direct Commands 20
8 OPERATION 21
8.1. Answering System 21
8.2. For Call Waiting Service Users 25
8.3. Using the PAUSE Key 25
8.4. Dial Lock 26
8.5. FLASH Button 27
8.6. Remote Operation from a Touch Tone Phone 28
8.7. Phone Book 31
9 TROUBLESHOOTING 36
10 DISASSEMBLY INSTRUCTIONS 40
10.1. Base Unit 40
10.2. Handset 41
11 ASSEMBLY INSTRUCTIONS 42
11.1. Fix the LCD to P.C. Board (Handset) 42
12 TROUBLESHOOTING GUIDE 43
12.1. Check Power 44
12.2. Error Message Table 44
12.3. Check Record 45
12.4. Check Playback 46
12.5. Check Sp-phone Transmission 46
12.6. Check Sp-phone Reception 47
12.7. Check Battery Charge 47
12.8. Check Link 48
12.9. Check the RF Part 49
12.10. Check Handset Transmission 53
12.11. Check Handset Reception 53
12.12. Check Caller ID 53
13 TEST MODE 54
13.1. Test Mode Flow Chart for Base Unit 54
13.2. Test Mode Flow Chart for Handset 57
13.3. X801 (Base Unit), X201 (Handset) Check 61
13.4. Adjustment Battery Low Detector Voltage (Handset) 61
13.5. Base Unit Reference Drawing 62
13.6. Handset Reference Drawing 64
13.7. FREQUENCY TABLE 65
13.8. How to Clear User Setting 66
14 DESCRIPTION 67
14.1. Frequency 67
14.2. FHSS (Frequency Hopping Spread Spectrum) 67
14.3. Signal Flowchart in the Whole System 69
15 EXPLANATION OF LINK DATA COMMUNICATION 70
15.1. Calling 70
15.2. To Terminate Communication 70
15.3. Ringing 70
16 BLOCK DIAGRAM (Base Unit) 71
17 CIRCUIT OPERATION (Base Unit) 72
17.1. DSP (Digital Speech/Signal Processing: IC501) 72
17.2. Flash Memory (IC701) 73
Note:
Because CONTENTS 2 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page Page
2
KX-TG2360JXS / KX-TGA236JXS

17.3. Power Supply Circuit 73
17.4. Reset Circuit 75
17.5. Locator/Intercom Mode 76
17.6. Telephone Line Interface 76
17.7. Auto Disconnect Circuit 77
17.8. Parallel Connection Detect Circuit 78
17.9. Calling Line Identification (Caller ID) 79
18 BLOCK DIAGRAM (Handset) 80
19 CIRCUIT OPERATION (Handset) 81
19.1. Construction 81
19.2. Power Supply Circuit 82
19.3. Charge Circuit 83
19.4. Ringer and Handset SP-Phone 83
19.5. Sending Signal 84
19.6. Reception Signal 84
20 SIGNAL ROUTE 85
21 CPU DATA (Base Unit) 86
21.1. IC501 86
22 CPU DATA (Handset) 87
22.1. IC201 87
23 EXPLANATION OF IC TERMINALS (RF Unit) 88
23.1. IC901 88
24 HOW TO REPLACE A FLAT PACKAGE IC 89
24.1. Preparation 89
24.2. Procedure 89
24.3. Removing Solder from Between Pins 89
25 CABINET AND ELECTRICAL PARTS (Base Unit) 90
26 CABINET AND ELECTRICAL PARTS (Handset) 91
27 ACCESSORIES AND PACKING MATERIALS 92
28 TERMINAL GUIDE OF THE IC S, TRANSISTORS AND DIODES
93
28.1. Base Unit 93
28.2. Handset 93
29 REPLACEMENT PARTS LIST 94
29.1. Base Unit 94
29.2. Handset 96
29.3. Accessories and Packing Materials 98
30 FOR SCHEMATIC DIAGRAM 99
30.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 99
30.2. Handset (SCHEMATIC DIAGRAM (Handset)) 99
31 SCHEMATIC DIAGRAM (Base Unit) 100
32 SCHEMATIC DIAGRAM (Handset) 102
33 SCHEMATIC DIAGRAM (RF PART) 104
34 CIRCUIT BOARD (Base Unit) 105
34.1. Component View 105
34.2. Flow Solder Side View 106
35 CIRCUIT BOARD (Handset) 107
35.1. Component View 107
35.2. Flow Solder Side View 108
3
KX-TG2360JXS / KX-TGA236JXS

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG2360JXS / KX-TGA236JXS

1.2. How to recognize that Pb Free solder is used
1.2.1. Base Unit PCB
IC201
IC501
IC300
IC701
IC901
IC601
PbF
Marked
(Component View)
IC301
PbF
LCD700
Marked
(Flow Solder Side View)
Note:
The location of the “PbF” mark is subject to change without notice.
5
KX-TG2360JXS / KX-TGA236JXS

1.2.2. Handset PCB
IC901 IC204
IC201
IC202
IC203
PbF
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
6
KX-TG2360JXS / KX-TGA236JXS

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover the plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on the worktable.
4.Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacture’s Instructions.
7
KX-TG2360JXS / KX-TGA236JXS

4 BATTERY
4.1. Standard Battery Life
4.1.1. Battery Charge
4.1.2. Battery Strength
4.1.3. Recharge
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
8
KX-TG2360JXS / KX-TGA236JXS

4.1.4. Battery Information
4.2. Battery Replacement
9
KX-TG2360JXS / KX-TGA236JXS

5 LOCATION OF CONTROLS
5.1. Base unit
10
KX-TG2360JXS / KX-TGA236JXS