Panasonic EB-X400 User manual

R
by Toko ([email protected])
2004 Panasonic Mobile Communications Co., Ltd.
All rights reserved. Unauthorized copying and
distribution is a violation of law.
Personal Cellular Telephone
This service information is designed for experienced repair technicians only and is not designed for use by the general public.
It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a
product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to
service or repair the product or products dealt with in this service information by anyone else could result in serious injury or
death.
WARNING
900 MHz 1800 MHz
Tx Frequency Range 880 - 915 MHz 1710 -1785 MHz
Rx Frequency Range 925 - 960 MHz 1805 -1880 MHz
Tx / Rx separation 45 MHz 95 MHz
RF Channel Bandwidth 200 kHz
Number of RF channels 174 374
Speech coding Full rate / Half rate / Enhanced Full rate
Operating temperature -10
° C to +55 °C
Type Class 4 Handheld Class 1 Handheld
RF Output Power 2 W maximum 1 W maximum
Modulation GMSK (BT = 0.3)
WAP / GPRS WAP 2.0 / GPRS Class 8
Connection 8 ch / TDMA
Voice digitizing 13 kbps RPE-LTP / 13 kps ACLEP / 5.6 kps CELP / VSLEP
Transmission speed 270.833 kbps
Signal Reception Direct conversion
Antenna Impedance 50 Ω
(External Connector)
Antenna VSWR < 2.1 : 1
Dimensions Height : 84 mm
(Excluding antenna) Width : 47.4 mm
Depth : 17.5 mm
Volume 65 cc
Weight 85
g
Main Display LCD : 128 x 128 pixels, 65,536 colours
Illumination 10 LEDs for Keypad Backlighting (White)
4 LEDs for LCD Backlighting (White)
3 LEDs for Sub LCD (Blue, Green, Orange)
Keys 16-key Keypad, Navigation key, 1 shutter key
SIM 3 V Plug-in type only
External DC Supply 5.8 V
Voltage
Battery 3.7 V nominal, 600mAh, Li-Ion
Standby Time 210 hrs
Talk Time 4.5 hrs
Talk and standby time will be dependent on network conditions, SIM card, backlight usage and network
condition.
EB-X400

ii
COMPANY LIABILITY
Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment.
However, Panasonic Mobile Communications Co., Ltd. accepts no responsibility for inaccuracies which may occur and reserves
the right to make changes to the specification or design without prior notice. The information contained in this manual and all
rights in any design disclosed therein, are and remain the exclusive property of Panasonic Mobile Communications Co., Ltd.
Other patents applying to material contained in this publication:
CP8 PATENTS
Comments or correspondence concerning this manual should be addressed to:
Panasonic Mobile Communications Co., Ltd.
600, Saedo-cho, Tsuzuki-ku, Yokohama, 224-8539, Japan
CONTENTS
1. INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1. Purpose of the Manual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2. Structure of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.3. Servicing Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
2. GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.3. Handportable Main Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
3. OPERATING INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2. Controls and Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3. Liquid Crystal Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.4. Text Entry (Edit) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.5. Menu Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
4. TECHNICAL SPECIFICATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1. Tx Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.1. Frequency Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.2. Modulation Phase Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.3. Output RF Spectrum due to Modulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.4. Outout RF Spectrum due to Switching Transients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.5. Spurious Emissions at Antenna Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.1.6. Residual Peak Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2. Rx Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-2
4.2.1. Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
5. TECHNICAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1. RF Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.1. RF Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1.2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.2. Baseband Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.2.1. Baseband Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.2.2. Summary of Device/Circuit changes to achieve new features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.2.3. E-Gold + V3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.3.4. CPU Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
5.3.5. Main LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
5.3.6. IrDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
5.3.7. Polytone IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

iii
5.2.8. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
5.2.9. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
5.2.10. UI Related Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21
5.2.11. Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23
5.2.12. Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5.2.13. External Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
6. DISASSEMBY / REASSEMBY INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1. General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1.1. Call Bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.2. Disassemby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
6.2.1. Lower Case Assembly and Main PCB Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
6.2.2. Upper Case Assembly and Display Module Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.2.3. Removal of Hinge Unit and Spigot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.2.4. Antenna Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.3. Reassemby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
6.3.1. Hinge reassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
7. REPAIR PROCEDURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.2. Lead Free (PbF) solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.3. External Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
7.3.1. General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
8. SOFTWARE DOWNLOAD & ADJUSTMENT PROCEDURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.1. FlashTool update and operation guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.1.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.2. FlashTool update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
8.3. Software upgrade procedure - FlashTool operation by using SPK file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.3.1. 8.4.1. Select SPK file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.3.2. COM port set-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
8.3.3. Start download . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5
8.4. RF Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
8.4.1. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
8.4.2. P-test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
8.4.3. Battery AD / Temperature AD Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
8.4.4. Battery Voltage AD Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
8.4.5. Battery Temperature AD Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-11
8.4.6. Tansmit Power Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-12
8.4.7. Rxlev Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-17
8.4.8. Data Overwrite Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-19
8.4.9. Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-21

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9. REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
9.1. Case and Cover Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
9.2. Main PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3
9.3. Upper Face PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
9.4. Hinge PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
9.5. SIM PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
10. BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.1. Baseband . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
10.2. RF Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
11. CIRCUIT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1
11.1. Circuit Diagram of Main PCB (Baseband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1
11.2. Circuit Diagram of Main PCB (RF Band) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-2
11.3. Circuit Diagram of Upper Face PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-3
11.4. Circuit Diagram of Hinge PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-4
11.5. Circuit Diagram of SIM PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-5
12. LAYOUT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1
12.1. Layout Diagram of Main PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-1
12.2. Layout Diagram of Upper Face PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2
12.3. Layout Diagram of Hinge PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-3
12.4. Layout Diagram of SIM PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-4

– 1-1 –
1. INTRODUCTION
WARNING
The equipment described in this manual contains polarised capacitors utilising liquid electrolyte. These devices are entirely safe provided
that neither a short-circuit nor reverse polarity connection is made across the capacitor terminals. FAILURE TO OBSERVE THIS WARNING
COULD RESULT IN DAMAGE TO THE EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM
ELECTRIC SHOCK OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES WHEN
HANDLING THESE DEVICES.
Caution
The equipment described in this manual contains electrostatic devices (ESDs). Damage can occur to these devices if the handling
procedures described in Section 4 are not adhered to.
Caution
This equipment may contain an internal battery in addition to the external battery packs. These batteries are recyclable and should be
disposed of in accordance with local legislation. They must not be incinerated, or disposed of as ordinary rubbish.
1.1. Purpose of the Manual
This Service manual contains the information and procedures required for installing, operating and servicing the Panasonic
GSM Personal Cellular Mobile Telephone system operating on GSM Digital Cellular Networks.
1.2. Structure of the Manual
1.3. Servicing Responsibilities
The manual is structured to provide service engineering personnel with the following information and procedures:
1. General and technical information - provides a basic understanding of the equipment, kits and options, together with
detailed information for each of the major component parts.
2. Installation and operating information - provides instructions for unpacking, installing and operating the equipment.
3. Servicing information - provides complete instructions for the testing, disassembly, and reassembly of the product.
Step-by-step troubleshooting information is given to enable the isolation and identification of a malfunction, and thus
determine what corrective action should be taken. The test information enable verification of the integrity of the
equipment after any remedial action has been carried out.
4. Illustrated parts list - provided to enable the identification of all cosmetic and some electrical components, for the
ordering of replacement parts.
The procedures described in this manual must performed by qualified service engineering personnel, at an authorized
service center.
The service engineering personnel are responsible for fault diagnosis and repair of all equipment described in this manual.

– 2-1 –
2. GENERAL DESCRIPTION
2.1. General
This section provides a general description and kit composition details for the GSM Handportable Telephone system and
optional kits.
2.2. Features
The Panasonic Telephone Model EB-X400 is a high performance, small, light, handset for business and domestic use.
The following features are provided:
1. Triple Rate, which includes Full Rate, Half rate and Enhanced Full Rate (EFR) speech, codec.
2. Dual Band, E-GSM 900 and GSM 1800 operation.
3. Tegic T9 Text Entry.
4. Voice Ringer.
5. Desktop Hand free function comprising integral echo cancellation and noise suppression.
6. Wireless Application Protocol (WAP) Browser.
7. Backup Battery.
8. Downloadable polyphonic melody ring tones.
9. Clock, Calculator and Currency Converter.
2.3. Handportable Main Kit
Figure 2.1: Handportable Main Unit Kit Contents
Item Description
1 Main Unit
2 Battery Standard
3 Battery Cover
4Travel Charger
1
2
34

– 3-1 –
3. OPERATING INSTRUCTIONS
3.1. General
This section provides a brief guide to the operation and facilities available on the telephone handset.
Refer to the Operating Instructions supplied with the telephone for full operational information.
3.2. Controls and Indicators
Right Soft key
Personal Handsfree Connector
Earpiece
Navigation Key
Selection/scroll/move/Alert mute/Keyguard
Main Display
One Push Auto Open button
Press to open the handset
Left soft key
Asterisk key
Charging Connector
Camera lens
Self-Portrait mirror
Use to frame self-portrait camera shots
Multi Function key
Camera/Shutter/Alert mute
Send key
To answer a call or to make an outgoing call
1 key/Vodafone mail key
Press and hold to call Vodafone mail
Microphone
Infrared Port
Illumination Light/
Charging Indicator
Lights red during charging
Pause key/Quite key
International Dialling Prefix key
Power/End key
Press and hold to switch the phone on/off
Figure 3.1: Location of Controls and Indicators

– 3-2 –
3.4. Text Entry (Edit)
Alphanumeric characters to enter details into the Phonebook, to create text, email, message, etc.
Key Text Mode
T9 (T9 , T9 or T9)
(Input language : English) Multi tap (Input mode indicator : Abc, ABC or abc) Numeric
(Input mode indicator : 0-9)
Alternatives . @ / – _ + 0 0/ (Hold)+
. , ? 1 ! " - : ; @ / * ( ) # + _ = [ ] { } ' ¡ ¿ & % \ ^ ~ | < > ¢ £ $ ¥
¤ § Space / (Hold) Character list
1
A B C 2 (a b c 2) A B C 2 Γ Á Ä Å Æ Ç (a b c 2 α β γ á ä å æ à) 2
D E F 3 (d e f 3) D E F 3 ∆ É(d e f 3 δ ε ζ é è) 3
G H I 4 (g h i 4) G H I 4 Θ(g h i 4 η θ ι ì í) 4
J K L 5 (j k l 5) J K L 5 Λ(j k l 5 κ λ µ)5
M N O 6 (m n o 6) M N O 6 ΞÑ Ö Φ(m n o 6 ν ξ ó o ñ ö ø ò) 6
P Q R S 7 (p q r s 7) P Q R S 7 Π Σ (p q r s 7 φ ρ ς σ ß ) 7
T U V 8 (t u v 8) T U V 8 ΦÜ (t y v 8 τ υ π ú u ü ù) 8
W X Y Z 9 (w x y z 9) W X Y Z 9 Ψ Ω (w x y z 9 χ ψ ω)9
Shift / (Hold) Input mode Shift / (Hold) Input mode change
* / (Hold) Input mode change
Space / (Hold) Line feed
Delete text / (Hold) Delete all characters
Space * # / (Hold) Line Feed # / (Hold) Line Feed
NOTE : Displayed characters of T9 vary depending on the selected Input language.
®
®
3.3. Liquid Crystal Display
The telephone handset has a graphical chip on glass display. The following icons are available:
Figure 3.2: Liquid Crystal Display
. , ? ! ' @ : ; / 1 *
/ (Hold) Character list
If Input mode is changed, Shift mode is initialised.
Auto capital change
Auto capital affects Abc and T9 .
If Input mode is changed to Abc or T9 , the first character is input as upper case and subsequent letters as lower case. (Input
mode indicator changes to abc or T9.) If these characters [. (Period) or ! or ?] are input, the next character is input as upper case.
(Input mode indicator changes to Abc or T9 .)
Shift mode
Shift mode change
The Shift mode changes by pressing (within 1 sec) .
Multi-tap Tegic
Abc -> ABC -> abc T9 -> T9 -> T9
Main menu screen

– 3-3 –
3.5. Features Menu Structure
Games
Games
Download
Settings
Applications
(SIM Tool Kit)
Alarm
Sound recorder
Calculator
Infrared
Messages
Create new
Inbox
Archive
Voicemail
(Chat)
Cell Broadcast
Settings
Memory status
Camera
My Media
Pictures
Sounds
Shortcuts
Text templates
Memory status
Settings
Profiles
Sound
Vibration Alert
Display
Language
Data connections
GSM network
Calls
Security
Time and date
Any key answer
Keyguard
Calendar
Contacts
Contacts list
Add contact
Call log
Speed Dial list
View groups
Advanced
(Service numbers)
Browser
PANASONIC BOX

– 4-1 –
4. TECHNICAL SPECIFICATIONS
4.1. Tx Characteristics
All data is applicable to E-GSM 900 and GSM 1800 except where stated.
4.1.1. Frequency Error
±0.1 ppm max., relative to base station frequency.
4.1.2 Modulation Phase Error
RMS: Equal to or less than 5 °
Peak: Equal to or less than 20 °
4.1.3. Output RF Spectrum due to Modulation
Offset from Centre Frequency (kHz) Maximum Level Relative to Carrier (dB)
Offset from Centre Frequency (kHz) Maximum Level (dBm)
±100 +0.5
±200 –30
±250 –33
±400 –60
±600 to 1800 –60
4.1.4. Output RF Spectrum due to Switching Transients
E-GSM 900 GSM 1800
±400 –19 –22
±600 –21 –24
±1200 –21 –24
±1800 –24 –27
Measurement conditions for output RF spectrum measurements:
Frequency Span 0 Hz
Measurement Bandwidth: 30 kHz
Video Bandwidth: 30 kHz (modulation)
100 kHz (switching)
Average (Modulation) over 200 burst
Peak Hold (Switching) over 10 burst

– 4-2 –
4.1.5. Spurious Emissions at Antenna Connector
4.1.6. Residual Peak Power
Equal to or less than 70 dBc (BW = 300 kHz)
4.2. Rx Characteristics
4.2.1. Sensitivity
■E-GSM 900 Full Rate Speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is
appropriate) is specified in the following table, according to the propagation conditions.
The reference sensitivity level is < –104 dBm.
NOTE : 1 < α< 1.6. The value of a can be different for each channel condition but must remain the same for FER and class
1b RBER measurements for the same channel condition.
Limits (dBm)
Frequency Range Frequency
offset Filter Bandwidth Approx Video B/W E-GSM 900 GSM1800
100 kHz to 50 MHz – 10 kHz 30 kHz –36 –36
50 MHz to 500 MHz – 100 kHz 300 kHz –36 –36
500 MHz to 1 GHz 0 to 1 MHz 100 kHz 300 kHz –36 –36
1 GHz to 12.75 GHz 0 to 10 MHz 100 kHz 300 kHz –30 –30 (1.0 - 1.710 GHz)
Excl. relevant TX band > 10 MHz 300 kHz 1 MHz –30
E-GSM : 880 MHz to 915 MHz > 30 MHz 3 MHz 3 MHz –30 –36 (1.710 - 1.785 GHz)
DCS : 1710 MHz to 1785 MHz (off trom edge of
-and the Rx bands relevant Tx band) –30 (1.785 - 12.75 GHz)
925 MHz - 960 MHz
1805 MHz - 1880 MHz
Relevant TX band: 1.8 to 6.0 MHz 30 kHz 100 kHz –36 –36
E-GSM : 880 MHz to 915 MHz > 6.0 MHz 100 kHz 300 kHz –36 –36
DCS : 1710 MHz to 1785 MHz
Channels Propagation conditions
TU high Propagation conditions RA Propagation conditions HT Static Conditions
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
TCH/FS FER 6.742*
α 8,900 0.122* α 164,000
class Ib (RBER) 0.42/
α 1,000,000 0.41/ α 20,000,000
class II (RBER) 8.333 120,000 7.5 24,000 9.333 60,000 2.439 8,200

– 4-3 –
■E-GSM 900 Half Rate Speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is
appropriate) is specified in the following table, according to the propagation conditions.
■GSM 1800 Full Rate Speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is
appropriate) is specified in the following table, according to the propagation conditions.
The reference sensitivity level is < –103 dBm.
NOTE: 1 < α< 1.6. The value of a can be different for each channel condition but must remain the same for FER and class
1b RBER measurements for the same channel condition.
■GSM 1800 Half Rate Speech
The reference sensitivity performance in terms of frame erasure, bit error, or residual bit error rates (whichever is
appropriate) is specified in the following table, according to the propagation conditions.
Channels Propagation conditions
TU high Propagation conditions RA Propagation conditions HT Static Conditions
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
TCH/FS FER 4.478* α 13,400 0.122* α 164,000
class Ib (RBER) 0.32/
α 1,500,000 0.41/ α 20,000,000
class II (RBER) 8.333 600,000 7.5 24,000 9.333 30,000 2.439 8,200
Channels Propagation conditions
TU high Propagation conditions RA Propagation conditions HT
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
TCH/FS (FER) 4.706 12,750
TCH/FS class Ib (BFI = 0) 0.426 141,000
TCH/FS class II (BFI = 0) 7.725 25,500 8.735 20,000 7.600 20,000
TCH/FS (UFR) 6.383 9,400
TCH/FS class Ib ((BFI or UFI) = 0) 0.291 206,000
Channels Propagation conditions
TU high Propagation conditions RA Propagation conditions HT
Minimum
No of
samples
Minimum
No of
samples
Minimum
No of
samples
Test Limit
error rate
%
Test Limit
error rate
%
Test Limit
error rate
%
TCH/FS (FER) 4.598 13,050
TCH/FS class Ib (BFI = 0) 0.404 148,500
TCH/FS class II (BFI = 0) 7.725 25,500 8.500 20,000 7.600 20,000
TCH/FS (UFR) 6.250 9,600
TCH/FS class Ib ((BFI or UFI) = 0) 0.269 227,000

– 4-4 –
■Blocking:
Measurement Conditions:
Wanted carrier is 3 dB above reference sensitivity.
Interferer is CW.
Spurious response exceptions:
Six exceptions are permitted IN band 915 - 980 MHz.
24 exceptions are permitted OUTSIDE band 915 - 980 MHz.
■Intermodulation Characteristics
Small MS level in dB µ Vemf( )
Frequency E-GSM 900 GSM 1800
FR
± 600 kHz to FR ± 800 kHz
FR ± 800 kHz to FR ± 1,6 MHz
FR ± 1,6 MHz to FR ± 3 MHz
915 MHz to FR - 3 MHz
FR ± 3 MHz to FR 980 MHz
FR ± 600 KHz to FR ± 800 KHz
1785 MHz to FR - 3 MHz
835 MHz to < 915 MHz
> 980 MHz to 1000 MHz
100 KHz to < 835 MHz
> 1000 MHz to 12.75 GHz
100 KHz to 1705 MHz
> 1705 MHz to < 1785 MHz
> 1920 MHz to 1980 MHz
> 1980 MHz to 12.75 GHz
70
70
80
90
90
–
–
113
113
90
90
_
_
_
_
70
70
80
–
–
87
87
–
–
–
–
113
101
101
90
Interferer Level ( f1& f2) dBm Interferer Frequencies ( f1&f2 )
49 Wanted frequency= 2f1 - f2,
and [ f1 - f2] = 800 kHz

– 5-1 –
5.1. RF Overview
5.1.1. RF Block Diagram
5.1.2. Functional Description
The dual-band receiver comprises mainly an RF transceiver IC and and Front-End module.
The transceiver (U101) contains a direct conversion receiver with DC offset calibration circuitry and the following circuit blocks:
8EGSM900 and DCS1800 internal LNAs.
8EGSM900 and DCS1800 down-conversion mixers/demodulators.
8Channel filtering and base-band signal variable gain amplifiers with programmable gain control function.
The Antenna Switch Module S101 is a dual-band antenna switch module. Two external SAW filters EL201 and FL202 for
EGSM900 and DCS1800 are used to improve the isolation between 900MHz and 1800MHz.
The impedance of these two filters' output is 150 Ωbalanced.
EGSM900/DCS1800
The input receiving signals into the LNAs coming from the SAWs provide out-band reflection.
However, the receiver is a direct conversion type, there is no need to concern about the image frequency blocking problem.
Figure 5.1. RF Block Diagram
5. TECHNICAL DESCRIPTION
U301
TCXO module
MAA****A
26 MHz
I/IB
Q/QB
13M_BB
PALEVEL
AFC
EGSM900
925 - 960 MHz
EGSM900
880 - 915 MHz
DCS1800
1710 - 1785 MHz
U103
PA Module
RF3140
DCS1800
1805 - 1880 MHz
S101
Antenna Switch module
FL102
Tx SAW EGSM
EFCH897MMTE7
FL202
Rx SAW Filter EGSM
B7820
FL201
Rx SAW Filter DCS
B7821
U101
Transceiver IC
DC offset Compensation
1/4
+
+
U102
Tx Limiter IC
PMB2256V V1.1
TXON
CLK/DA/EN
BAND_SEL
RF Synth
PLLON
3420 - 3980 MHz
VC1
VC2
TXON_PA
AM_TRIG
TEMP
π /2
1/4
π /2
1/2
π /2
1/2
π /2

– 5-2 –
■Transmitter Description
The main block for the dual-band transmitter is also the Transceiver IC U101 RF chipset.
The Transceiver IC U101's modulator is a direct-conversion architecture, so there are no Tx IF frequencies.
The Transceiver IC U101 contains the following Tx blocks:
8Dual-band (EGSM900/DCS1800) IQ modulators with outputs at final frequencies, and integrated IQ uplink low pass filters.
8Open collector outputs to the rest of the Tx chains.
The open collector outputs of transceiver U101 are fed via internal H3 filter before application to the dual band inputs of Limiter
U102. The function of U102 is to reduce the AM ripple from the I, Q modulators.
The 900 MHz output signal from the Tx Limiter U102 must pass through a Tx SAW filter FL102 before entering into the PA
Module U103 in order to ensure Tx noise in Rx-band satisfy GSM specifications. For 1800 MHz, the 11.10 specifications are
not very severe, so no SAW filtering is needed here. The signals are then attenuated through two attenuators to meet the drive
levels of the PA Module U103. Power control is managed through the control line PALEVEL.
Harmonics in the PA output signal are attenuated by low-pass filters inside the Front-End Module.
■Synthesiser Description
A synthesiser is provided in transceiver IC U101. The internal VCO operates from 3.42 GHz to 3.98 GHz, thus it is equivalent to
2 and 4 times of the DCS and EGSM frequencies. The registers, counters and phase detectors for this synthesiser are included
in the transceiver IC U101.
To meet GPRS lock-up timing requirement, provides a switched frac-N and integer-N counter. It also provides switched
bandwidth loop filter.
The TCXO module U301 generates 26 MHz in order to provide the reference clock to the transceiver IC and base-band portion.
Baseband circuits provide an automatic frequency control (AFC) voltage to compensate for frequency drift caused by
temperature variations.
Moreover, there is a thermistor
RT101 which is used for the temperature compensation of PA and the reported RSSI.
■DC Power Supplies
The PA runs directly from the battery and consumes no current when not transmitting. Two regulated 2.8 V lines
(RF2V8, VCC_VCXO) are provided for the rest of the RF circuitry from the
U2006 .
■Antenna
Fixed helical typed antenna is utilised for EB-X400. Its length is 16 mm and located at the top of the lower unit.
It covers 900 MHz and 1800 MHz.

– 5-3 –
5.2. Baseband Overview
5.2.1. Baseband Block Diagram
5.2.2. Summary of device/circuit changes to achieve the new features
The EB-X400 Baseband is based around a GSM chipset developed by Infineon chip set. The Infineon chipset consists of 2 chips,
one is a signal processing chip with DSP and CPU included the analogue baseband (e.g. RF, Audio, SIM), and the other is
U2006 (E-Power) which manages power supply and charge control.
Figure 5.2. Baseband Block Diagram
■Baseband Chipset U2001 (E-Gold + V3 / E-Power V1.83)
The EB-X400 baseband is based around a GSM chipset developed by Infineon. Thee chipset comprises two ICs as follows:
E-Gold + V3 (U2001) Signal processing IC with DSP and CPU and analogue baseband (e.g. RF, Audio, SIM).
E-Power (U2006) power management and charge control IC.
■Memory
The ROM/RAM capacity of the EB-X400 external memory U2008 is 64-Mbit Flash + 64-Mbit Flash + 32-Mbit mobile SRAM.
A 3-chip stacked MCP (Multi-Chip Package) is used. The 2-Mb E-Gold + V3 internal SRAM is required together with the
external SRAM U2008.
uCapacitor
MCU
C166S OAK78 DSP
Clock
Generation
Power
Management
MMCI
Multicore
Debug
Support
GPT1/GPT2
Watchdog
CAPCOM
SSCRTCOsc.
ASC
0ASC 1
DSP
Timer1
I2
SDSP Serial
Comm.Interface/
DAI
Cipher Unit
P ROM
P RAM
Y RAM
X RAM
X ROM
Viterbi
HW
Accelerator
Switch matrix
Battery & Temp
Measurement
TAP Controller
JTAG
Boundary Scan
MUX
DAC
ADC
ADC
ADC
DAC
DAC
GMSK
Modulator
Baseband
Filter/
Cordic-
Processor
Voiceband
filters
RX and TX
RF Output
Power Control
AFC
Unit
RF Control
GSM
System Timer
Bus
Interface
Unit
LPS
A
GPRS Unit
SIM card
Interface
Keypad
Interface
External
Bus & Port
Controller I2C SRAM
256k x 8 PRAM
1k x 16 Shared Memory
ID Register
CHG
Charge Control I2C bus Interface Control SDBB
(Step-down)
LANA LINT
LSIM
LRTC
Reference
I2C Bus
VSSPW VANA VINT V3V VRTC
VSIM
LRF1
LRF2
LRF3
VRF2 VRF3VRF1
U2006 (E-Power)
128Mbit Flash
(64M+64M)
+
32Mbit pSRAM
A[23:0]
D[15:0]
Key Pad
KP[9:0]
Melody Gen. IC
MIC Circuit
REC Circuit
PHF Circuit
PHF
RF Control Block
RF Block
SIM
Battery
DC
Jack
Charge
Circuit
VIB
VBAT
KEY LED Circuit
U2001 (E-GOLD+ V3)
U2008
Memory
ASC1
U3001
Companion
IC
Colour LCD
128x128
TFT 65K colour
Camera
Module
VGA CMOS
D[7:0]
A[2:1]
D[7:0] D[7:0]
IrDA
Step up
DC/DC
VLED
VCHG
VLOG
Upper Unit
I2C Bus8080 I/F
CHG LED
Circuit
Tri-LED
Circuit
SIM Unit
DSP
Timer2

– 5-4 –
■Power Source
EB-X400 uses a 600 mAh Lithium-ion battery pack.
■Main Colour TFT LCD
A 65536 colour 128 x 128 pixels full-penetration TFT LCD module.
A HD66782 chipset is used for the LCD driver.
■Integrated Camera
As one of the most characteristic features of the EB-X400 design, an integrated digital camera is introduced.
A VGA (640 x 480 pixels) size CMOS camera module. This camera module does not have an integrated SRAM nor a JPEG
encoder.
■16 polyphonic Melody Ringer
A new Melody generator IC ; U2011 YMU759B is used for the enhanced 16 polyphonic Melody ringer function with ADPCM.
Main features of the melody generator IC are as follows ;
816 multi-sounds
8ADPCM decode function (possible to mix-play with melody data)
8FIFO (512 byte for MIDI, 256 byte for ADPCM) and sequencer installed
80.4 W speaker amplifier integrated
■IrDA
The IrDA transceiver function is added to EB-X400 to enable wireless data exchange with PCs and other handsets.
■Real Time Clock (RTC)
Time and calendar informations provided within U2001, obviating the need for an external RTC.
The RTC has following functions:
Time counter (SEC, MIN, HOUR, WEEK, DAY, MONTH, and YEAR)
Daily/Weekly Alarm control
Time constant interrupt generator
High accuracy time correction control
■Acoustic Components
Desktop handsfree (DTHF) operation is supported using a DTHF speaker located in the bottom of the handheld unit.
Ringing tones are also output from this speaker.
■Headset with remote switch
A headset with remote control is available as an accessory.
This arrows the user to receive, end or place calls without opening the clamshell of the headset.
5.2.3. U2001 E-Gold + V3 (BASEBAND CHIPSET, DIGITAL AND ANALOGUE CHIP)
The U2001 (E-Gold + V3) manufactured by Infineon contains the DSP, CPU, GSM timing functions and many peripheral
functions, this LSI contains the interface circuits to the Audio, RF, SIM and auxiliary analogue functions.
■DSP (OAK)
The DSP core is a 16-bit (data and program) high performance fixed-point DSP core and is designed for the mid to high-end
telecommunication applications, where low power and portability are still major requirements.
The core consists of a high performance central processing unit, including a full featured bit-manipulation unit, RAM and ROM
addressing units, and program control logic. The core has an improved set of DSP and general microprocessor functions to
meet the application requirements.
The DSP can be clocked at up to 78 MHz via a PLL contained within U2001 (E-Gold+ V3).

– 5-5 –
■MCU (C166S)
The C166S controller core combines advantages of both RISC and CISC processors in advanced architecture which closely
couples on-chip memory and controller peripherals to the core in a very efficient way. This micro controller works in 32 bits or
16 bits instructions and on 32,16 or 8 bit data. The C166S architecture is based on RISC.
The core uses multiple variable register banks, and single cycle context switch support. The memory space is organised
logically as a van Neumann architecture, but physically the core uses multiple high bandwidth buses and core memory to
increase performance.
■Memory interface
The U2001 E-Gold + V3 has a physical address space of 128-Mbit / 16-Mbyte. The actual amount of memory needed depends
on the features included in the product. The number of features also has an influence on the required memory access speed.
The memory data bus is 16 bit wide. The SRAM utilizes the BHEQ signal to support both 8 and 16 bits access for more
efficient use. The memory interface of the U2001 E-Gold + V3 supports 1.8 V or 2.6 V operation, allowing flexibility on the
choice of memory components. EB-X400 adopted 2.6 V operation because the operation voltage of memory is 3.0 V operation.
The memory interface voltage level is selected by connecting the VDD2.0x supplies on E-Gold + to either V_SD or to VINT.
Maximum
Access Time [ns] MCU speed Number of write state Eff. Bus speed [MHz]
GSM stack, basic features 100 13MHz 0 ws 6.5
GSM stack, advanced features 70 26MHz 1 ws 8.67
GPRS stack 70 26MHz 1 ws 8.67
Memory Mapping:
Normal Case Alternative Case
0x00000
0x60000
0x80000
0x400000
0x800000
0xC00000
0xFFFFFF
0x00000
0x60000
0x80000
0x400000
0x800000
0xC00000
0xFFFFFF
Figure 5.3. Memory Map
nCS2 Flash2
nCS0 Flash1
nCS1 pSRAM
nCS2 Flash2
nCS2 Flash2
Initialize nCS2 and Not Use
or
Not Initialize _> nCS0
nCS1 pSRAM
nCS3 Companion ICnCS3 Companion IC nCS4 Polytone ICnCS4 Polytone IC
SYSTEM Int. RAMSYSTEM Int. RAM

– 5-6 –
■Clock Interface
The U2001 (E-Gold + V3) clock generation unit is used to generate all major system clocks. There are two clock signals
connected to the clock generation unit.
832 kHz clock F32K
826 MHz clock F13/26M
The 32 kHz oscillator is used for the Real Time Clock block. As a power-saving feature the 32 kHz clock can be also used for
the MCU domain. The 32 kHz oscillator and the RTC block have its own power supply pads. It has the facility for a back-up
power source for when the main battery is discharged or remoed temporarily.
The 26 MHz clock is used as the major U2001 (E-Gold + V3) clock reference. An on chip shaper is used to maintain the
low-swing input level on F13/26M. It can be powered-up with a delay (programmable in ECO block) related to the TCXO
power-up. This can slightly reduce overall power consumption.
CLKCTRL Clock Control Register
PLLUP : PLL Power Up Bit
SWCLK : PLL Clock Switch Bit
CLKAEN : CLKANA Enable Bit
SXMEN : Coprocessor clock enable
SX52M : Coprocessor clock switch
AFCEN : AFC Enable Bit
CPUH : Enables 52 MHz operation of the CPU and serial interface
CPUPRE [2:0] : CPU Clock Prescale Factor
AFC32KEN : AFC clock enable during ECO eco sleeep mode
13/26MHz_IN : Configure the CGU for the operation with either 13 MHz or 26 MHz input
CGURST Clock Generation Uint Reset Register
DSPRST : DSP Reset Bit
SIMRST : SIM Card Interface Reset Bit
RTCRST : Real Time Clock Rest Bit
DSPSLOW : DSP slow-down control bit
The frequency of clk_pll depends on 13/26 MHZ_IN and DSPSLOW refers to the below table.
15 14 13 12 11 10 9 8
13/26 - - AFC32KEN - CPUPRE (2:0)
MHz_IN
76 5 4 3210
- CPUH AFCEN SX52M SXMEN CLKAEN SWCLK PLLUP
15 14 13 12 11 10 9 8
DSPSLOW 0 0 0 0 0 r r
DSPSLOW 13/26 MHZ_IN Frequency of Input Frequency of Frequency of Frequency of
Clock F13/26M clk_pll clk_dsp clk_master
00 26 MHz 104 MHz 104 MHz 52MHz
01 13 MHz 104 MHz 104 MHz 52MHz
10 26 MHz 156 MHz 78 MHz 52MHz
11 13 MHz 156 MHz 78 MHz 52MHz
76 5 4 3210
00 00RTCRST SIMRST DSPRST

– 5-7 –
■Interrupt and Exception Handler
An Interrupt and Exception Handler is responsible for managing all system and core exceptions.
There are four different kinds of exceptions that are executed in a similar way:
8Interrupts generated by the Interrupt Controller (ITC)
8DMA transfers issued by the Peripheral Event Controller (PEC).
8Software traps caused by the TRAP instruction
8Hardware traps issued by faults or specific system states
Normal Interrupt Processing
The CPU temporarily suspends the current program execution and branches to an Interrupt Service Routine (ISR) in order to
service an interrupt-requesting device. The current program status [Instruction Pointer (IP), Processor Status Word (PSW),
and in segmentation mode, the Code Segment Pointer (CSP)] is saved on the internal system stack.
A prioritization scheme with 16 priority levels and with 8 sub-levels (8 group levels) specifies the order of multiple
interrupt-request handling.
The maximum number of interrupt requests supported by the core architecture is 112 (configured in steps of 16).
Software and Hardware Traps
Trap functions are activated in response to special conditions that occur during the execution of instructions.
A trap can also be caused externally by the Non-Maskable Interrupt (NMI) pin. Several hardware trap functions are provided
for handling erroneous conditions and exceptions that arise during the program execution. Hardware traps always have
highest priority and cause immediate system reaction. The software trap function is invoked by the TRAP instruction, which
generates a software interrupt for a specified interrupt vector. For all types of traps, the current program status is saved in the
system stack.
Interrupt Processing via the Peripheral Event Controller
A faster alternative to normal interrupt processing is servicing an interrupt requesting device by the C166S's integrated PEC.
Triggered by an interrupt request, the PEC performs a single-word or byte data transfer between any two memory locations
through one of 16 programmable PEC service channels. During a PEC transfer, the normal program execution of the CPU is
halted. No internal program status information needs to be saved. The same prioritization scheme is used for PEC service as
for normal interrupt processing.
■General Purpose I/O
The MCU can configure the pin functionality of most of the pins after reset. Whether those pins show GPIO functionality or
one of the alternate functions ALT0 or ALT1 is defined by the PxCONF and PxALTSEL registers.
Because some of input functions appear on more than one pin, the PINSEL register must specify the respective pin. In case
of ASCx the active input needs to be set by the SxPISEL register of ASCx.
For peripherals which are not able to select or disable their input signal, the corresponding input signal must be enabled by
the INPEN register.