Panasonic KX-TC1035BXW User manual

ORDER NO. KM40012753C3
Telephone Equipment
KX-TC1035BXW
Cordless Phone
White Version
(for Asia, Middle Near East and other areas)
12005-05-13
Service Manual

SPECIFICATIONS
1
22005-05-13

1. STANDARD BATTERYLIFE
Ifyour Panasonicbatteryisfullycharged;
Whileinuse (TALK) Uptoabout6hours
Whilenotinuse (Stand-by) Uptoabout30 days
- Batterylife may varydepending on usageconditionsand ambienttemperature.
- Cleanthehandset and thebase unitchargecontacts withasoft, drycloth.
Cleaniftheunitissubject togrease, dust or high humidity. Otherwise the
batterymay notchargepropery.
- Ifthebatteryisfullycharged, you do nothave toplace thehandset on thebase
unituntil theRECHARGE indicator flashes. Thiswill maximizethebatterylife.
- Thebatterycannotbeovercharged.
2. LOCATIONOFCONTROLS
32005-05-13

42005-05-13

3. CONNECTION
1. Connect as shown.
52005-05-13

-USE ONLY WITHPanasonicACADAPTORPQLV1BXZ.
-TheAC adaptor must remainconnectedat all times. (Itisnormal for the
adaptor tofeel warmduring use.)
-Whenmorethanoneunitisused, theunits may interferewitheachother.
To preventor reduce interference, please leave amplespace betweenthe
base units.
62005-05-13

3.1. Adding Another Phone
Thisunitwill notfunction during apowerfailue. To connect astandard
telephoneon thesameline, use aT-adaptor.
4. DISASSEMBLYINSTRUCUTIONS
72005-05-13

R
ef. No. Procedure ShowninFig
-.
Toremove -. Remove -.
1 1 1 LowerCabinet Screws(3×14)....................... (A)×5
21, 2 2 MainPrintedCircuitBoard Screws(3×14)....................... (B) ×1
31, 2, 3 3 ChargeTerminal Screws(3×10)....................... (C) ×2
4 4 4 RearCabinet Remove thebatterycompartment co
ver
54, 5 5 Screws(2.6×14).....................(E)×2
64-6 6MainPrintedCircuitBoard Screws(2.6×14)......................(F)×1
82005-05-13

5. HOWTO REPLACE FLATPACKAGEIC
5.1. Preparation
- SOLDER
SparkleSolder115A-1, 115B-1or AlmitSolderKR-19,KR-19RMA
- Soldering iron
Recommendedpowerconsumption will bebetween30 Wto40 W.
TemperatureofCopperRod 662 ±50°F(350 ±10°C)
(Anexpertmay handlebetween60 Wto40 Wiron, butbeginnermightdamage
foil byoverheating.)
- Flux
HI115 Specificgravity 0.863
(Original fluxwill bereplaceddaily.)
5.2. Procedure
1. TemporaryfixFLATPACKAGE ICbysoldering on twomarked2pins.
*Most importantmatterisaccurate setting ofICtothecorresponding soldering
foil.
2. Applyfluxfor all pinsofFLATPACKAGE IC.
92005-05-13

3. Solderemploying specifiedsoldertodirection ofarrow, as sliding the
soldering iron.
5.3. Modification Procedure ofBridge
1. Re-solderslightlyon bridgedportion.
2. Remove remainedsolderalong pinsemploying soldering iron as shownin
10 2005-05-13

belowfigure.
6. CPU DATA(BASE UNIT)
6.1. IC201
11 2005-05-13

12 2005-05-13

7. CPUDATA(HANDSET)
7.1. IC901
13 2005-05-13

14 2005-05-13

8. EXPLANATIONOFICTERMINALS
8.1. Base Unit:IC801
15 2005-05-13

16 2005-05-13

17 2005-05-13

8.2. HANDSET:IC101
18 2005-05-13

19 2005-05-13

20 2005-05-13