Panasonic DMR-ES25P User manual

ORDERNO.CHM0604022CE
B24
DVDRecorder
DMR-ES25P / DMR-ES25PC
Vol. 1
Colour
(S).......................Silver Type
SPECIFICATIONS
2006 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
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Unauthorized copying and distribution isaviolation of law.
1. Safety Precaution
1.1. General guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. Leakage current coldcheck
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to the chassis,
the reading shouldbe between 1M and 5.2M .
When the exposed metal does not have areturn path to the
chassis, the reading must be .
Figure 1
1.1.2. Leakage current hot check / (See Figure 1 .)
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1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1.
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current must not exceed 1/2
milliampere. Incase ameasurement isoutside of the limits
specified, there isapossibilityof ashock hazard, and the
equipment shouldbe repaired and rechecked before itisreturned
to the customer.
1.2. Caution for fuse replacement
2. Warning
2.1. Prevention of ElectrostaticDischarge (ESD)to Electrostatic
Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostatic Sensitive (ES) Devices. Examples of typical ES
devices are integratedcircuits and some field-effect transistor-sand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
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wear acommerciallyavailabledischarging ESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as aluminum
foil, to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricitysufficient to damage
an ES device).
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2.2. Precaution of Laser Diode
2.3. Service caution based on legal restrictions
2.3.1. General description about Lead Free Solder(PbF)
The leadfree solderhas beenusedinthe mounting process of all electrical components on the
printedcircuit boards usedforthis equipment inconsidering the globallyenvironmental
conservation.
The normal solderis the alloyof tin(Sn) and lead(Pb). Onthe otherhand, the leadfree solderis
the alloymainlyconsists of tin(Sn), silver(Ag) and Copper(Cu), and the melting point of the
leadfree solderis higherapprox.30 degrees C (86°F) more thanthat of the normal solder.
Definition of PCB LeadFree Solderbeing used
The letterof “PbF” is printedeitherfoil side orcomponents side on the PCB
using the leadfree solder.
(See right figure)
Service caution forrepairwork using LeadFree Solder(PbF)
-The lead free solder has to be used when repairing the equipment
for which the lead free solder isused.
(Definition: The letter of “PbF” isprinted on the PCB using the
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lead free solder.)
-To put lead free solder, itshouldbe well molten and mixed with the
original lead free solder.
-Remove the remaining lead free solder on the PCB cleanlyfor
soldering of the new IC.
-Since the melting point of the lead free solder ishigher than that of
the normal lead solder, ittakes the longer time to meltthe lead
free solder.
-Use the soldering iron (more than 70W) equipped with the
temperature control after setting the temperature at 350±30
degrees C(662±86°F).
RecommendedLeadFree Solder(Service Parts Route.)
-The following 3types of lead free solder are availablethrough the
service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
*Ingredient: tin(Sn), 96.5%, silver(Ag) 3.0%, Copper(Cu) 0.5%, Cobalt (Co) / Germanium(Ge)
0.1 to0.3%
3. Service Navigation
3.1. Service Information
4. Specifications
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5. Feature
5.1. HDAVI Control (HDMI Link)
Linkedoperations byHDAVI Control (HDMI Link)
5.1.1. What isHDMI
HDMI is abbreviation of [High-Definition Multimedia Interface], and is digital interface standard
fornext generation TV corresponding tofollows.
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1. Non-compressing high qualitydigital image
2. Digital transmission of multi channel digital audio.
3. Twowaycommunication of control signal of control
straightening between equipments
PinName
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Pinlayout of plug of HDMI cable seenfromoutside.
5.1.2. Link functions withEquipmentsCorresponding Table
Functions
(1) Automatic Input switch
(2) Link of Power
Incase setting of [FUNCTIONS] [Setup] [TV Screen] [Functions of HDMI] [Control
withHDMI] are on, all above equipments Link functions are effective.
5.1.3. Outline of EquipmentsLinked functions
(1) Automatic Input switch
At starting of playback/ GUI displaybyDIGA, it turns on powerof VIErA, and it displays picture
of DIGA ontoscreenof VIErA.
Starting of playback:
It includes automatic playback of DVD-Videoand soon. And it includes picture of screensaver
too.
GUI display:
FUNCTIONS, DIRECTNAVIGATOR, TV PROGRAM, PROG/CHECK, TimerRecording, G-code,
Initial setting, Playback setting, Playlist, SD/DVD guide, Warning messages that usercanselect
and soon.
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