Panasonic KX-FP207FX-S User manual

© 2006 Panasonic Communications Co., Ltd.
All rights reserved. Unauthorized copying and distri-
bution is a violation of law.
ORDER NO. KMF0609044CE
Compact Plain Paper Fax (with Digital Answering System)
KX-FP207FX-S
KX-FP218FX-S
(for Eastern Europe)

2
KX-FP207FX-S/FP218FX-S
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precaution -------------------------------------------------3
1.1. For Service Technicians ----------------------------------3
1.2. AC Caution---------------------------------------------------3
1.3. Personal Safety Precautions ----------------------------4
1.4. Service Precautions ---------------------------------------5
2Warning--------------------------------------------------------------6
2.1. About Lead Free Solder (PbF: Pb free) --------------6
2.2. Insulation Resistance Test -------------------------------7
2.3. Battery Caution ---------------------------------------------7
2.4. Disposal Cautions------------------------------------------7
3 Specifications ------------------------------------------------------8
4 General/Introduction ---------------------------------------------9
4.1. Optional Accessories--------------------------------------9
5Features--------------------------------------------------------------9
6 Technical Descriptions---------------------------------------- 10
6.1. Connection Diagram------------------------------------- 10
6.2. General Block Diagram--------------------------------- 11
6.3. Control Section ------------------------------------------- 13
6.4. Facsimile Section ---------------------------------------- 22
6.5. Sensors and Switches ---------------------------------- 29
6.6. Modem Section ------------------------------------------- 33
6.7. NCU Section----------------------------------------------- 40
6.8. ITS (Integrated telephone System) and
Monitor Section ------------------------------------------- 43
6.9. Operation Board Section ------------------------------- 45
6.10. LCD Section ----------------------------------------------- 46
6.11. Power Supply Board Section-------------------------- 47
7 Location of Controls and Components------------------ 50
7.1. Overview --------------------------------------------------- 50
7.2. Control Panel---------------------------------------------- 50
8 Installation Instructions--------------------------------------- 51
8.1. Installation Space ---------------------------------------- 51
8.2. Connections ----------------------------------------------- 52
8.3. Installing the Ink Film------------------------------------ 53
8.4. Installing the Paper Tray ------------------------------- 54
8.5. Paper Support--------------------------------------------- 55
8.6. Installing the Recording Paper------------------------ 55
9 Operation Instructions ---------------------------------------- 56
9.1. Setting Your Logo ---------------------------------------- 56
10 Test Mode---------------------------------------------------------- 58
10.1. DTMF Signal Tone Transmit Selection ------------- 59
10.2. Button Code Table --------------------------------------- 60
10.3. Print Test Pattern----------------------------------------- 61
11 Service Mode ----------------------------------------------------- 62
11.1. Programing and Lists------------------------------------ 62
11.2. The Example of the Printed List ---------------------- 67
12 Troubleshooting Guide---------------------------------------- 72
12.1. Troubleshooting Summary----------------------------- 72
12.2. Error Messages-Display -------------------------------- 73
12.3. Error Messages-Report--------------------------------- 75
12.4. Remote Programming----------------------------------- 97
12.5. Troubleshooting Details ------------------------------ 100
13 Service Fixture & Tools ------------------------------------- 136
14 Disassembly and Assembly Instructions------------- 137
14.1. General Section ---------------------------------------- 137
14.2. Disassembly Flowchart ------------------------------- 138
14.3. Disassembly Procedure ------------------------------ 140
15 Maintenace ------------------------------------------------------ 163
15.1. Maintenance Items and Component Locations - 163
15.2. Gear Section --------------------------------------------- 165
15.3. Jams ------------------------------------------------------- 172
15.4. Cleaning---------------------------------------------------174
16 Miscellaneous --------------------------------------------------176
16.1. Terminal Guide of the ICs Transistors and
Diodes -----------------------------------------------------176
16.2. How to Replace the Flat Package IC --------------178
16.3. Test Chart-------------------------------------------------180
17 Schematic Diagram -------------------------------------------183
17.1. Digital Board (PCB1) (KX-FP207FX) --------------183
17.2. Digital Board (PCB1) (KX-FP218FX) --------------187
17.3. Analog Board (PCB2) (KX-FP207FX) ------------191
17.4. Analog board (PCB2) (KX-FP218FX) -------------193
17.5. Operation Board (PCB3) (KX-FP207FX) ---------195
17.6. Operation Board (PCB3) (KX-FP218FX) ---------196
17.7. Power Supply Board (PCB4) ------------------------197
17.8. Interface Board (PCB5) -------------------------------198
17.9. Sensor Board (PCB6) ---------------------------------199
17.10. Film End SensorBoard (PCB7)--------------------- 199
17.11. Motor Position Sensor Board (PCB8) -------------199
17.12. Hook Switch Board (PCB9) --------------------------200
18 Printed Circuit Board----------------------------------------- 202
18.1. Digital Board (PCB1)-----------------------------------202
18.2. Analog Board (PCB2) ---------------------------------204
18.3. Operation Board (PCB3)------------------------------ 206
18.4. Power Supply Board (PCB4) ------------------------208
18.5. Interface Board (PCB5) -------------------------------209
18.6. Sensor Board (PCB6) ---------------------------------209
18.7. Film End Sensor Board (PCB7)---------------------209
18.8. Motor Position Sensor Board (PCB8) ------------- 209
18.9. Hook Switch Board (PCB9) --------------------------210
19 Appendix Information of Schematic Diagram -------210
20 Exploded View and Replacement Parts List---------- 211
20.1. Cabinet, Mechanical and Electrical Parts
Location --------------------------------------------------- 211
20.2. Replacement Parts List ------------------------------- 221

3
KX-FP207FX-S/FP218FX-S
1 Safety Precaution
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic part's boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch the IC or LSI pins with bare fingers.
1.2. AC Caution
For safety, before closing the lower cabinet, please make sure of the following precautions.
1. The earth lead is fixed with the screw.
2. The AC lead is connected properly to power supply board.
3. Wrap the earth lead around the core 5 times.
4. Wrap the AC lead around the core 5 times.

4
KX-FP207FX-S/FP218FX-S
1.3. Personal Safety Precautions
1.3.1. Moving Sections of the Unit
Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are
rotated by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially
when the unit is operating.
1.3.2. Live Electrical Sections
All the electrical sections of the unit supplied with AC power by the AC power cord are live.
Never disassemble the unit for service with the AC power supply plugged in.
CAUTION:
AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disas-
sembling for service.

5
KX-FP207FX-S/FP218FX-S
1.4. Service Precautions
1.4.1. Precautions to Prevent Damage from static Electricity
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, etc.

6
KX-FP207FX-S/FP218FX-S
2Warning
2.1. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°~ 70°F, (3 0 °~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700°± 20°F, ( 3 7 0 °± 10°C).
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder
splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 6 0 0 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

7
KX-FP207FX-S/FP218FX-S
2.2. Insulation Resistance Test
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part
(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.
2.3. Battery Caution
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the man-
ufacturer. Dispose of used batteries according to the manufacturer’s instruction.
CAUTION:
The lithium battery is a critical component (type No. CR2032). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
2.4. Disposal Cautions
2.4.1. Information on Disposal for Users of Waste Electrical & Electronic Equipment (pri-
vate households)
This symbol on the products and/or accompanying documents means that used electrical and electronic products should not be
mixed with general household waste.
For proper treatment, recovery and recycling, please take these products to designated collection points, where they will be
accepted on a free of charge basis. Alternatively, in some countries you may be able to return your products to your local retailer
upon the purchase of an equivalent new product.
Disposing of this product correctly will help to save valuable resources and prevent any potential negative effects on human health
and the environment which could otherwise arise from inappropriate waste handling. Please contact your local authority for further
details of your nearest designated collection point.Penalties may be applicable for incorrect disposal of this waste, in accordance
with national legislation.
For business users in the European Union
If you wish to discard electrical and electronic equipment, please contact your dealer or supplier for further information.
Information on Disposal in other Countries outside the European Union
This symbol is only valid in the European Union.
If you wish to discard this product, please contact your local authorities or dealer and ask for the correct method of disposal.

8
KX-FP207FX-S/FP218FX-S
3 Specifications
Any details given in these instructions are subject to change without notice.
*1Transmission speed depends on the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
*2Transmission speed is based on the ITU-T No. 1 Test Chart with original mode. If the capability of the other party’s machine is
inferior to your unit, the transmission time may be longer. (Refer to ITU-T No.1 Test chart (P.180).)
*3If an error occurs during fax reception, such as a paper jam or if the recording paper runs out, the fax and subsequent faxes will
be retained in memory.
*4Recording time may be reduced by the calling party’s background noise.
Applicable Lines: Public Switched Telephone Network
Document Size: Max. 216 mm in width, Max. 600 mm in length
Effective Scanning Width: 208 mm
Recording Paper Size: A4: 210 mm ×297 mm
Effective Printing Width: A4: 202 mm
Recording Paper Weight: 64 g/m2to 80 g/m2
Transmission Speed*1(KX-FP207): Approx. 12 s/page (ECM-MMR)*2
Transmission Speed*1(KX-FP218): Approx. 8 s/page (ECM-MMR)*2
Scanning Density: Horizontal: 8 pels/mm
Vertical:
3.85 lines/mm (standard resolution)
7.7 lines/mm (fine/photo resolution)
15.4 lines/mm (super fine resolution)
Photo Resolution: 64 levels
Scanner Type: Contact Image Sensor
Printer Type: Thermal Transfer on Plain Paper
Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR)
Modem Speed (KX-FP207): 9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback
Modem Speed (KX-FP218): 14,400 / 12,000 / 9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback
Operating Environment: 5—35°C, 20—80 % RH (Relative Humidity)
Dimensions: Approx. height 106 mm ×width 356 mm ×depth 200 mm
Mass (Weight): Approx. 2.7 kg
Power Consumption: Standby: Approx. 1.5 W
Transmission: Approx. 15 W
Reception: Approx. 40 W (When receiving a 20% black document)
Copy: Approx. 40 W (When copying a 20% black document)
Maximum: Approx. 135 W (When copying a 100% black document)
Power Supply: 220 - 240 V AC, 50 / 60 Hz
Fax Memory Capacity*3:Transmission: Approx. 25 pages
Reception: Approx. 28 pages
(Based on the ITU-T No. 1 Test Chart in standard resolution, without using the Error
Correction Mode.)
Voice Memory Capacity*4
(KX-FP218):
Approx. 18 minutes of recording time including greeting messages

9
KX-FP207FX-S/FP218FX-S
4 General/Introduction
4.1. Optional Accessories
*1 To ensure the unit operates properly, we recommend using the Panasonic replacement film.
The ink film is not reusable. Do not rewind and use the ink film again.
5 Features
General
• LCD (Liquid Crystal Display) readout
Plain Paper Facsimile Machine
• 12 second transmission speed (KX-FP207)*
• 8 second transmission speed (KX-FP218)**
•A4,G3compatible
• Automatic document feeder (up to 10 sheets)
• Quick scan
• Resolution: Standard/Fine/Super fine/Photo (64 level)
• Broadcast
• 20-sheet recording paper capacity
• Automatic fax/phone switching
* The 12 second speed is based upon the ITU-T No. 1 Test
Chart on the condition that memory transmission is performed.
** The 8 second speed is based upon the ITU-T No. 1 Test
Chart on the condition that memory transmission is performed.
Large Memory... Performed by DRAM
Approx. 28 pages of memory reception
Approx. 25 pages of memory transmission
Integrated Telephone System
• On-hook dialling
• Voice muting
• Redialling function
• 50-station telephone directory with Phonebook
• Caller ID service
This unit is compatible with the Caller ID service offered by
your local telephone company. To use this unit’s Caller ID
features, you must subscribe to Caller ID service.
Important:
- This unit is designed in accordance with the ETS (Euro-
pean Telecommunication Standard) and only supports
the basic CLIP (Calling Line Identification Presentation)
features.
- This unit will only display the caller’s telephone number
and name.
- This unit will not support future additional telephone ser-
vices.
- Depending on the service of the local telephone com-
pany, the date/time of the call or the caller’s name may
not be displayed.
Make sure the following ring count is set to 2 or more rings
beforehand.
- For KX-FP207: FAX ring count (feature #06 on P.98) and
TEL/FAX ring count (feature #78 on P.98)
- For KX-FP218: TAM ring count (feature #06 on P.98)
FAX ring count (feature #06 on P.98) and TEL/FAX ring
count (feature #78 on P.98)
• SP-Phone, TAM (KX-FP218)
Enhanced Copier Function
• Multi-copy function (up to 20 copies)
• Enlargement and reduction
•Collate
• 64-Level halftone
Model No. Description Specification
KX-FA52E Replacement Film*1 30 m ×2 rolls
(Each roll will print about 90 A4-sized pages)

10
KX-FP207FX-S/FP218FX-S
6 Technical Descriptions
6.1. Connection Diagram

11
KX-FP207FX-S/FP218FX-S
6.2. General Block Diagram
The following is an outline of each device IC on the digital board. (Refer to General Block Diagram (P.12).).
1. ASIC (IC501)
Composed mainly of an address decoder and a modem control.
Controls the general FAX operations.
Controls the operation panel I/F.
Controls the thermal head I/F and CIS I/F.
Performs the image processing.
CPU and Real time clock
Provides the reset pulse for each of the major ICs.
2. Flash ROM (IC506)
Contains all of the program instructions on the unit operations.
This memory is used mainly for the parameter working in the storage area.
3. Dynamic RAM (IC503)
This memory is used mainly for the parameter working in the storage area.
4. MODEM (IC505)
Performs the modulation and the demodulation for FAX communication.
5. Read Section
CIS image sensor to read transmitted documents.
6. Motor Driver (IC401)
Drives the transmission motor and the reception motor.
7. Thermal Head
Contains heat-emitting elements for dot matrix image printing.
8. Analogue Board
Composed of ITS circuit and NCU circuit.
9. Sensor Section
Composed of a cover open and film end switch, a document set switch, a document top switch, a paper top sensor and a
motor position switch.
10. Power Supply Board Switching Section
Supplies +6V and +24V to the unit.
11. Flash Memory (IC507) (KX-FP218 Only)
This memory is used for voice prompt and TAM.

12
KX-FP207FX-S/FP218FX-S
6.2.1. General Block Diagram

13
KX-FP207FX-S/FP218FX-S
6.3. Control Section
6.3.1. Block Diagram
KX-FP207/218FX-S : CONTROL SECTION BLOCK DIAGRA M
IC501
ASIC
ADR[15:13]
RBA[5:0]
ADR[12:0]
DB[7:0]
XRD
XWR
XROMCS XOPRBE
XMDMCS
IC506
FLASH IC505
MODEM
A[17:0]
D[7:0]
XRD XCS
A[4:0]
D[7:0]
XRD XWR XCS
XWDERR IN
OUT
GND
KSTART,KLATCH KSCLK,KTXD KRXD
TO CIS
F1,FTG
VIDEO
OP-RESET
XRESETI
XORESET
XRESET
XBACKEN
IC504
RESET-IC
+3.3V/BATT +2.5V/BATT
BATT
+ -
24MHz
32.768KHz
TX
RX
TO Analog Board
A[12:0]
RBA[5:0]
A[4:0]
+5V
XRAS
XCAS
A[9:0]
D[7:0]
XRD XWR XRAS XCAS
IC503
DRAM
A[7:4]
RBA[5:0]
+3.3V
CN501
THLAT,THC,THDAT STB1,STB2
Q501,502,504 HEADON
RXE
TM REED,PTOP,COVER OPEN RXE,RM0~3 FILM_CHECK,MOTOR_POS
CN502,503
CN505
CN504
CN507
CISLEDON
32.256MHz
+3.3V
VDET
Q503 +3.3V+2.5V Q505
+2.5V/BATT +3.3V/BATT
XWR
+5V
MIC IN
IC510
SP-AMP
IC509
AND
er
ation
ne
l
A[17:0]
D[7:0]
XRD XCS XWR
IC507
FLASH
A[12:0]
RBA[5:0]
XRESCS2
(KX-FP218)

14
KX-FP207FX-S/FP218FX-S
6.3.2. Memory Map

15
KX-FP207FX-S/FP218FX-S
6.3.3. ASIC (IC501)
This custom IC is used for the general FAX operations.
1. CPU:
This model uses a Z80 equivalent to the CPU operating
at 12 MHz. Most of the peripheral functions are performed
by custom-designed LSIs. Therefore, the CPU only works
for processing the results.
2. RTC:
Real Time Clock
3. DECODER:
Decodes the address.
4. ROM/RAM I/F:
Controls the SELECT signal of ROM or RAM and the
bank switching.
5. CIS I/F:
Controls the document reading.
6. IMAGE DATA RAM:
This memory is programmed into the ASIC and uses 8
KB for the image processing. (See Fig. A.*)
7. THERMAL HEAD I/F:
Transmits the recorded data to the thermal head.
8. MOTOR I/F:
Controls the transmission motor which feeds the docu-
ment.
Controls the receiving motor which feeds the recording
paper.
9. OPERATION PANEL I/F:
Serial interface with Operation Panel.
10. I/O PORT:
I/O Port Interface.
11. ANALOGUE UNIT:
Electronic volume for the monitor.
Sends beep tones, etc.
Fig. A
Note:
This memory is incorporated into the ASIC (IC501) and used for the image processing.
Fig. A shows the memory map of the Image Data RAM.

16
KX-FP207FX-S/FP218FX-S
Descriptions of Pin Distribution (IC501)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE
DESCRIPTION
1 VSSA GND POWER SOURCE (ANALOG GND)
2 VDDA 3.3 3.3V POWER SOURCE (ANALOG +3.3V)
3 AIN1 A 3.3V CIS IMAGE SIGNAL INPUT (SIG)
4 AIN2 A 3.3V THERMISTOR TEMPERATURE WATCH INPUT
5 AIN3 A 3.3V LINE VOLTAGE DETECTION SIGNAL INPUT (DCIN)
6 AMON A 3.3V ANALOG SIGNAL MONITOR TERMINAL
7 VSS GND POWER SOURCE (GND)
8 X32OUT O 3.3V/BATT RTC (32.768KHz) CONNECTION
9 X32IN I 3.3V/BATT RTC (32.768KHz) CONNECTION
10 VDD (3.3V / B) ----- POWER SOURCE (+3.3V/LITHIUM BATTERY)
11 XBACEN I 3.3V/BATT BACKUP ENABLE
12 XRAMCS O 3.3V/BATT NOT USED
13 VDD (3.3V / B) ----- POWER SOURCE(+3.3V / LITHIUM BATTERY)
14 VDD (2.5V/B) ----- POWER SOURCE (+2.5V / LITHIUM BATTERY)
15 FTG O 3.3V SH SIGNAL OUTPUT FOR CIS (SI)
16 F1 O 3.3V 01 SIGNAL OUTPUT FOR CIS (CLK)
17 F2/OP O 3.3V OUTPUT PORT (THON)
18 FR/OP O 3.3V OUTPUT PORT (MDMRST)
19 CPC I 3.3V INPUT PORT (CPC)
20 RVN I 3.3V INPUT PORT (REED)
21 IRDATXD/IOP O 3.3V OUTPUT PORT (CISLED)
22 IRDARXD/IOP80 I 3.3V INPUT PORT (PTOP)
23 TXD/IOP I 3.3V INPUT PORT (FILMEND)
24 RXD/IOP O 3.3V OUTPUT PORT (HS-ALC)
25 XRTS/IOP I 3.3V INPUT PORT (HOOK)
26 XCTS/IOP O 3.3V OUTPUT PORT (SPMUTE)
27 VDD (2.5V) ----- POWER SOURCE (+2.5V)
28 TONE1 A 3.3V TONE OUTPUT
29 TONE2 A 3.3V TONE OUTPUT
30 VOLUREF A 3.3V ANALOG REF VOLTAGE
31 VOLUOUT A 3.3V VOLUME OUTPUT
32 VOLUIN A 3.3V VOLUME INPUT
33 XNMI I 3.3V HIGH FIXED
34 FMEMDO/IOP O 3.3V OUTPUT PORT (CIS ON)
35 VDD (3.3V) ----- POWER SOURCE (+3.3V)
36 VSS GND POWER SOURCE (GND)
37 VSS GND POWER SOURCE (GND)
38 VDD (3.3V) ----- POWER SOURCE (+3.3V)
39 MIDAT/IOP O 3.3V PORT (DATA)
40 MICLK/IOP O 3.3V PORT (DR)
41 MILAT/IOP O 3.3V PORT (CD)
42 20KOSC/IOP I/O 3.3V PORT (TONEIEN)
43 XWAIT I 3.3V INPUT PORT (MPOS)
44 HSTRD/IOP O 3.3V OUTPUT (DCLK)
45 HSTWR/IOP O 3.3V OUTPUT PORT (XHSTWR)
46 XOPRBE O 3.3V MFCS
47 ADR15 O 3.3V CPU ADDRESS BUS 15 (NOT USED)
48 ADR14 O 3.3V CPU ADDRESS BUS 14 (NOT USED)
49 ADR13 O 3.3V CPU ADDRESS BUS 13 (NOT USED)
50 VDD (2.5V) ----- POWER SOURCE (+2.5V)
51 XOUT O 3.3V SYSTEM CLOCK (24MHz)
52 XIN I 3.3V SYSTEM CLOCK (24MHz)
53 VSS GND POWER SOURCE (GND)
54 VDD (3.3V) ----- POWER SOURCE (+3.3V)
55 XTEST O 3.3V 24MHz CLOCK
56 TEST1 I 3.3V HIGH FIXED

17
KX-FP207FX-S/FP218FX-S
57 TEST2 I 3.3V HIGH FIXED
58 TEST3 I 3.3V HIGH FIXED
59 TEST4 I 3.3V HIGH FIXED
60 XMDMINT I 3.3V MODEM INTERRUPT
61 XMDMCS O 3.3V MODEM CHIP SELECT
62 XRAS/IOP O 3.3V DRAM (IC503) ROW ADDRESS STROBE
63 XCAS1/IOP O 3.3V DRAM (IC503) CULUM ADDRESS STROBE
64 XCAS2/IOP I 3.3V INPUT PORT (COVER)
65 XRESCS2 O 3.3V FLASH CHIP SELECT (XRESCS2)
66 DB3 I/O 3.3V CPU DATA BUS 3
67 DB2 I/O 3.3V CPU DATA BUS 2
68 DB4 I/O 3.3V CPU DATA BUS 4
69 DB1 I/O 3.3V CPU DATA BUS 1
70 DB5 I/O 3.3V CPU DATA BUS 5
71 VDD (3.3V) ----- POWER SOURCE (+3.3V)
72 VSS GND POWER SOURCE (GND)
73 VSS GND POWER SOURCE (GND)
74 VDD (3.3V) ----- POWER SOURCE (+3.3V)
75 DB0 I/O 3.3V CPU DATA BUS 0
76 DB6 I/O 3.3V CPU DATA BUS 6
77 DB7 I/O 3.3V CPU DATA BUS 7
78 XROMCS O 3.3V ROM (IC502) CHIP SELECT
79 RD O 3.3V CPU RD
80 WR O 3.3V CPU WR
81 ADR0 O 3.3V CPU ADDRESS BUS 0
82 ADR1 O 3.3V CPU ADDRESS BUS 1
83 ADR2 O 3.3V CPU ADDRESS BUS 2
84 ADR3 O 3.3V CPU ADDRESS BUS 3
85 ADR4 O 3.3V CPU ADDRESS BUS 4
86 ADR5 O 3.3V CPU ADDRESS BUS 5
87 VSS GND POWER SOURCE (GND)
88 VDD (2.5V) ----- POWER SOURCE (+2.5V)
89 ADR6 O 3.3V CPU ADDRESS BUS 6
90 ADR7 O 3.3V CPU ADDRESS BUS 7
91 ADR8 O 3.3V CPU ADDRESS BUS 8
92 ADR9 O 3.3V CPU ADDRESS 9
93 ADR10 O 3.3V CPU ADDRESS 10
94 ADR11 O 3.3V CPU ADDRESS 11
95 ADR12 O 3.3V CPU ADDRESS 12
96 RBA0 O 3.3V ROM/RAM BANK ADDRESS 0
97 RBA1 O 3.3V ROM/RAM BANK ADDRESS 1
98 RBA2 O 3.3V ROM/RAM BANK ADDRESS 2
99 RBA3 O 3.3V ROM/RAM BANK ADDRESS 3
100 RBA4 O 3.3V ROM/RAM BANK ADDRESS 4
101 RBA5 O 3.3V ROM/RAM BANK ADDRESS 5
102 RBA6/IOP96 O 3.3V A19
103 STB1 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
104 STB2 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
105 STB3 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
106 XRESET I 3.3V RESET INPUT
107 VDD (3.3V) ----- POWER SOURCE (+3.3V)
108 VSS GND POWER SOURCE (GND)
109 VSS GND POWER SOURCE (GND)
110 VDD (3.3V) ----- POWER SOURCE (+3.3V)
111 XORESET O 3.3V NOT USED
112 VDD(5V) ----- POWER SOURCE (+5V)
113 VSS GND POWER SOURCE (GND)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE
DESCRIPTION

18
KX-FP207FX-S/FP218FX-S
6.3.4. Flash Memory (IC506)
This 512KB ROM (FLASH MEMORY) carries a common area of 32KB and bank areas which each have 8KB (BK4~BK63). The
addresses from 0000H to 7FFFH are for the common area and from 8000H to 9FFFH are for the bank areas.
6.3.5. Dynamic RAM (IC503)
The DRAM serves as CPU and receives memory.
The address is F200H~F3FFH (DRAM access window 1) and F600H~F7FFH (DRAM access window 2).
114 XRESETI I 3.3V RESET INPUT
115 WDERR O 3.3V WATCHED ERROR OUTPUT SIGNAL
116 THDAT O 3.3V RECORDED IMAGE OUTPUT (XTHDAT)
117 THCLK O 3.3V CLOCK OUTPUT FOR DATA TRANSFER (XTHCLK)
118 THLAT O 3.3V PULSE OUTPUT FOR DATA LATCH (XTHLAT)
119 STBNP I 3.3V INPUT PORT (TEST)
120 RM0/IOP O 3.3V OUTPUT PORT (OPRESET)
121 RM1/IOP I/O 3.3V (TEL RXEN)
122 RM2/IOP I/O 3.3V (HS RXEN)
123 RM3/IOP I/O 3.3V MDMTXEN
124 RXE/IOP I 3.3V INPUT PORT (BELL)
125 TMO O 3.3V MOTOR A PHASE
126 VDD (2.5V) ----- POWER SOURCE (+2.5V)
127 VSS GND POWER SOURCE (GND)
128 TM1/IOP O 3.3V MOTOR B PHASE
129 TM2/IOP O 3.3V MOTOR /A PHASE
130 TM3/IOP O 3.3V MOTOR /B PHASE
131 TXE/IOP O 3.3V MOTOR ENABLE SIGNAL
132 KSTART O 3.3V OPERATION PANEL CONTROL
133 KLATCH O 3.3V OPERATION PANEL CONTROL
134 KSCLK O 3.3V OPERATION PANEL CONTROL
135 KTXD O 3.3V OPERATION PANEL CONTROL
136 KRXD I 3.3V OPERATION PANEL CONTROL
137 FMEMCLK/IOP O 3.3V OUTPUT PORT (BREAK)
138 FMEMDI/IOP O 3.3V OUTPUT PORT (DR)
139 ADSEL1 O 3.3V CHANNEL SELECT SIGNAL FOR AIN2
140 VDDA (2.5V) 2.5V POWER SOURCE (ANALOG +2.5V)
141 VREFB A 3.3V A/D CONVERTER'S ZERO STANDARD VOLTAGE
OUTPUT
142 VCL A 3.3V ANALOG PART STANDARD VOLTAGE SIGNAL
143 VREFT A 3.3V A/D CONVERTER'S FULL SCALE VOLTAGE OUTPUT
144 VSSA GND POWER SOURCE (ANALOG GND)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE
DESCRIPTION

19
KX-FP207FX-S/FP218FX-S
6.3.6. Reset Circuit (Watch dog timer)
The output signal (reset) from pin 4 of the voltage detect IC (IC504) is input to the ASIC (IC501) 114 pin.
1. During a momentary power interruption, a positive reset pulse of 50~70 msec is generated and the system is reset com-
pletely.
2. The watch dog timer, built-in the ASIC (IC501), is initialized by the CPU about every 1.5 ms.
When a watch dog error occurs, pin 115 of the ASIC (IC501) becomes low level.
The terminal of the 'WDERR' signal is connected to the reset line, so the 'WDERR' signal works as the reset signal.

20
KX-FP207FX-S/FP218FX-S
6.3.7. RTC Backup Circuit
1. Function
This unit has a lithium battery (BAT501) which works for Real Time Clock IC (RTC: inside IC501).
The RTC continues to work, backed up by a lithium battery even when the power switch is OFF.
The user parameters for autodial numbers, the system setup data and others are in the FLASH MEMORY (IC506).
2. RTC Inside (IC501) Backup Circuit Operation
When the power switch is turned ON, power is supplied through Q505 to the RTC (inside IC501). At this time, the voltage at
pin 14 of the IC501 is +2.5V. When the power switch is turned OFF, the BAT501 supplies power to RTC through D501 and
Q505. The voltage at pin 14 of IC501 is about +2.2V. When the power switch is OFF and the voltage of +3.3V decreases, pin
14 of RTC (IC501) becomes roughly the same voltage as the battery voltage. RTC goes into the backup mode, in which the
power consumption is lower.