Panasonic A35US User manual

ACCTF14E-3
2015.09 industrial.panasonic.com/ac/e/
A35US
Narrow-pitch Connectors onnector
Operation manual

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
industrial.panasonic.com/ac/e/ ©Panasonic Corporation 2015
A
CCTF14E-3 201509
-1-
Contents
01.Introduction ............................................................................................. 2
02.Precautions for product design ............................................................... 3
03.Precautions for mounting and reflow soldering ..................................... 15
04.Precautions for mating and unmating ................................................... 25
Points which particularly need to be confirmed before designing products
are bold and underlined.

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
industrial.panasonic.com/ac/e/ ©Panasonic Corporation 2015
A
CCTF14E-3 201509
-2-
01. Introduction
Our Advanced series A35US consists of ultra-small connectors with a terminal pitch of
0.35 mm, a stacking height of 0.6mm, and a shorthand width of 2.2 mm. This connector
is designed for board-to-FPC connections that require a more space-saving connector
than our A35S Series.
For this purpose, the size and thickness of the molded part has been further reduced.
Select the types best suited to the conditions of use. Read this document before
designing a product and starting production.
A35US A35S
Space-
saving
Excellent
Width:
2.2mm
Very good
Width:
2.5mm
Low
profaile
Excellent
Mated height
0.6mm
Very good
Mated height
0.8mm
Wiring
underneath
Good
Exposed metal
part on the
rear face
Exposed
metal part
Good
Exposed metal
part on the
rear face
Exposed
metal part
Contact
reliability Excellent Excellent
Drop
resistance Very good
Bellows-type
contact
With a thin plastic part Very good
Bellows-type
contact
With a thin plastic part
Mountability Excellent
Header needs
special nozzle
Very good
Header needs
special nozzle
Clicking
feedback Excellent Excellent
2.2mm 2.5mm
0.6mm 0.8mm
Header
pickup
apace:
0.8mm-
wide
b
ottom
Header
pickup
apace:
0.7mm-
wide
b
ottom

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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02. Precautions for product design
02-1. Considerations in mechanical design
1) Position of the connector on a board
Rigid boards tend to warp in a direction perpendicular to the rolling direction
during the production process. Poor soldering may occur depending on the
warping direction. Make sure to place the connector in a direction which reduces
warpage.
2) Position of the connector in the mounting process
Design multi-pin connector layouts that do not require a swinging movement
during pickup and mounting.
In many cases, deviation of the connector mounting position is caused by the
inertia of the swinging movement of the mounter. A layout that does not require
swinging is thus required.
●Example of a connector layout requiring a swinging movement in the mounting process
This space causes poor
soldering.
Pickup and mounting positions
Connector
Tends to warp in the
manufacturing (lateral) direction.
Embossed tape
Motherboard
No rotation inertia
Poor soldering can be reduced by
designing a mounting pattern to place
the connector in a lateral direction.
×
Connector
Rotary inertia is applied

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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3) Prevention of problems during use
(1)The connectors have a simple locking structure, but make sure to consider
preventive measures against the detachment of mated connectors during
practical use.
- Make sure to eliminate any gaps between the casing and board.
- We recommend that the holding force is set greater than the insertion force of
the connector.
- Select an appropriate cushioning material with a suitable shape and dimensions,
and hold down the connector at the center. (If the holding position is off the
center, it may cause detachment of mated connectors.)
(2)If the board is insufficiently fixed as in the following drawing, the inertial
load applied to the connector may damage it. Pay attention to the following
points.
Cushioning material
Casing
Sub-
b
oar
d
(
flexible board
)
Connector
Reinforcing plate
Motherboar
d
When an impact such as dropping as shown in the
drawing is applied:
(1) If both boards are not sufficiently fixed,
the connector will be damaged due to the
impact applied to the connector.
(2) In particular, if there is no gap between
the casing and sub-board (A<B), the sub-
board side will hit the casing wall first.
This impact may damage the connector.
<Preventive measures>
Securely fix both the motherboard and sub-board.
(1) Fixing motherboard
(Prevents inertial movement by drop impact
by fixing the side with a greater mass.)
(2) Hold down the sub-board to prevent it from
moving using a rubber cushioning material,
etc.
(3) It is safer if board gaps are set to AB so as
to prevent shearing damage on deviation of
the board by impact.
× A<B
○ AB
Sub-
b
oar
d
(
FPC
)
Connector
Casing
Motherboar
d
(
not fixed
)
Connector
Casing
Motherboar
d
(
not fixed
)
Holdin
g
cushion
Sub-
b
oard
(
FPC
)
<Preventive measures>

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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(3)To facilitate the mating of connectors, we recommend that you pay attention
to the following points when designing the motherboard.
- Provide a reference mark.
- Design a layout that allows easy-checking of the connector mating condition.
Examples of reference mark
Flexible board
Reinforcing plate
Motherboard
Provide a reference
mark:
-Silk printing
-Pattern (co
pp
er foil)

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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02-2. Precautions for board design
1) Circuit design
(1)When designing the terminal foot pattern, check the latest specifications and
examine the recommended foot pattern and dimensions of the metal mask opening.
The current recommendations are indicated on pages 13 and 14.
(2)This connector is provided with soldering metals for preventing solder from
peeling off the terminal.
Make sure to design a foot pattern for the holding metal.
(3)Pay attention to the following points when providing a through hole by
extending the foot pattern.
If a through-hole is created simply by extending the foot pattern by the same
width, solder is absorbed into the through-hole during the reflow process, which
may cause defective or poor soldering of the terminals.
①Thin and extend the tip of the foot
pattern before creating a through-hole.
②Prevent solder from reaching the land
by using a coverlay or resist.
Soldering terminal
Soldering terminal
Socket Header
In general, 1/3 the
terminal pattern
width.
NG
Good
Good

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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(4)Pay attention to the following point as a pattern
peeling preventive measure when removing the
connector.
- Make the foot pattern length longer than the
coverlay opening.
In general, at least 0.3 mm.
(5)Foot pattern dimensions indicated in the drawings are
intended to achieve the minimum area on the premise
that the reflow-soldering process is used. For manual
soldering or for ensuring solder reworkability, make
a longer pattern at the terminal tip.
(6)When it is needed to provide pattern wiring and through-hole underneath the
socket, it is possible to use it by designing the pattern as shown below in case
insulation underneath the socket is not assured.
- Secure space for applying the soldering
iron tip.
Terminal looseness and unwanted
solder creep are preventable by
applying the soldering iron tip here.
Example of through hole
The area where there is a possibility
that the contacts touch.

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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(7)Resist between pins
When it is needed to provide resist between the pins, there is a way to adopt the
overresist method as below.
（If the resist is out of alignment, the pattern width 0.20mm would not change.)
Copper foil
Overresis
t
Resis
t

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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A
CCTF14E-3 201509
-9-
2) FPC board design
(1)Positions of connectors on the FPC
The FPC board is made by laminating a polyimide layer, copper foil, and adhesive
layers. Since each material has slightly different heat-shrinkable properties,
warpage may occur typically due the reflow heat in the following cases. This may
cause poor soldering. Make sure to arrange the board in a direction that minimizes
warpage.
■Example of the Assist carrier (ShinEtsu Polymer)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-
p
revention
p
ur
p
oses.
Since the FPC is soft, it is
difficult to kee
p
i
t
flat.
●Typical transfer jigs for the board
mounting process
- Magic resin (Daisho Denshi)
- Keiju board (Mitsubishi Resin)
- Assist carrier (ShinEtsu Polymer)
To keep the FPC board flat during
mounting, we recommend the use of a
“Sticky transfer jig” for the wiring board
mounting process.
Workpiece
(FPC board, etc.)
Elastomer
(
Weak adhesive la
y
er
)
Elastomer
(
Stron
g
adhesive la
y
er
)
Substrate
Workpiece (FPC, etc.)
Assist carrier
La
y
out pin STEP 1:
Provisional fixing of workpiece
STEP 2:
Mountin
g
com
p
lete
STEP 3:
Removal of
work
p
iece
Removal pin

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
industrial.panasonic.com/ac/e/ ©Panasonic Corporation 2015
A
CCTF14E-3 201509
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(2)FPC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the coverlay, etc. so as to prevent the
occurrence of poor soldering.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer. Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, design the board so as to remove the
coverlay under the connector.
(3)This connector is often used for connecting the motherboard and FPC board. In
this case, if the FPC board is too short, a load that causes deviation will be applied
to the connector.
Make sure to create a design that provides some allowance in the FPC board.
Connector
terminal
Solder
Molded part of the connector
Coverlay (polyimide)
Adhesive (epoxy adhesive recommended)
Adhesive (epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Reinforcing plate + Adhesive
(epoxy adhesive recommended)
NG: Too long
Fixed
Connecto
r
NG: Too short
Positional deviation
Motherboard
Part where FPC board
is fixed

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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3) Reinforcing plate design
We recommend the use of a reinforcing plate with appropriate thickness and
rigidity to prevent solder peeling and pattern peeling when unmating the
connector, and to guard against board warpage during the reflow process.
(1)We recommend the use of a glass-reinforced epoxy resin sheet, since it is
rigid.
(2)When a polyimide resin plate is used to avoid the generation of fabric
particles:
- Select a thick sheet whenever possible.
(In general, 0.2 mm or thicker sheet is used.)
- High-rigidity epoxy adhesive is recommended for attaching the reinforcing
plate to a flexible board.
- As a measure to ensure rigidity, attach two thin reinforcing plates using epoxy
adhesive. This achieves greater rigidity than a single reinforcing plate of the
same thickness.
(3)Warpage of the reinforcing plate during the reflow process or poor soldering
may occur depending on the direction the reinforcing plate on material was
cut. Accordingly, make sure to indicate the direction of the material.
(Rolled sheets generate warpage depending on material direction, so
therefore, make sure to warpage reduction into consideration.)
(4)For using an ultra-thin reinforcing plate for slimming a product, one way is
to use metals such as stainless steel for the reinforcing plate.
(5)To avoid generating stress on the soldering portion of the connector when
removing the connector or bending an FPC board, design a reinforcing plate
about 0.5 to 1.0 mm longer from the foot pattern tip.
(6)Foot pattern design
The following measure is effective for improving
the strengthening effect when the reinforcing
plate is thin.
- Make the foot pattern length longer than the
coverlay opening.
In general, it is designed to be about 0.3 mm.
However, when the reinforcing plate is thin,
it is recommended to secure at least twice the normal length.
If the connector
will be unmated,
set this to
0.5-1.0 mm.
0.5-1.0 mm
When a thin and soft reinforcing plate is used, the reinforcing plate
may warp if this dimension is too large, which results in reducing
the reinforcing effect.
Reinforcing plate

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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4) Metal Mask Design
Since this connector is designed with an ultra low-profile, pay attention to the
following precautions for reflow soldering.
(1)In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Make sure to
adjust the amount of solder applied after checking the finish quality in a test run.
(2)Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, make sure to apply an appropriate amount of solder.
(3)Do not apply an excessive amount of solder,otherwise, solder or flux may creep
near the contact section and reduce contact reliability or cause interference during
mating. Pay careful attention.
(4)It is recommended that solder with a grain diameter of 40 μm or smaller is used so
as to print a constant amount of solder.

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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Recommended specifications for PC-board and metal mask opening area
When designing please verify with the product specification sheets
Applicable product:A35US narrow-pitch connector socket （Mated height：0.6mm）
Recommended PC-board pattern (Mount-pad layout)
Recommended metal mask pattern
When the metal mask thickness is 100 m
(Terminal section opening area: 70%)
(Metal section opening area: 46%)
Insulation area

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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Recommended specifications for PC-board and metal mask opening area
Applicable product:A35US narrow-pitch connector header （Mated height：0.6mm）
Recommended PC-board pattern (Mount-pad layout)
Recommended metal mask pattern
When the metal mask thickness is 100 m
(Terminal section opening area: 70%)
(Metal section opening area: 77%)
Insulation area

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
industrial.panasonic.com/ac/e/ ©Panasonic Corporation 2015
A
CCTF14E-3 201509
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03. Precautions for mounting and reflow soldering
03-1. Mounting
When mounting, a multifunctional mounter is recommended
If using a high-speed mounter, controle the suction force by using a multifunctional
head
03-2. Points to consider when selecting a pickup nozzle
for mounting
Select a pickup nozzle with a suction area that demonstrates a theoretical lifting force
at least 10 times greater than the connector weight. .
Theoretical lifting force (g)
= Vacuum pressure (mmHG) /760 ×1.033×Nozzle area (cm
2
)
Example of machine vacuum pressure setting: 480–520 mmHg
1) Picking up the socket
(1)The suction area on the socket is 0.6 mm in
the shorter direction.
(2)Dimension of the socket
Socket
Terminal coplanarity
(Unit；mm)
(Post and soldering terminal)
(Cross section view)
(Suction area)
Mated height: 0.6m
m

Operation manual for Narrow-pitch connectors A35US
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CCTF14E-3 201509
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●Examples of suction nozzle shape
●Connector weight (socket)
Number of pins 10 20 30 40 50 60
Weight 0.008 0.011 0.014 0.017 0.020 0.023
①Elongated hole ②Circular hole
Available for less than 50
pins and except for the case
of connector turning around
when mounted.
（Unit；g）
Mated height：0.6mm

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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2) Picking up the header
(1)The suction area on the header is 0.8 mm in the shorter direction.
If it is difficult to reliably insert the nozzle to the connector bottom face of 0.8
mm widthwise, the header can be picked up by converting the entire top face of
the connector as shown below.
(2)Dimension of the socket
Header
(Suction area)
Terminal coplanarity
(Unit；mm)
(Post and soldering terminal)
(Cross section view)
Mated height: 0.6m
m

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
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CCTF14E-3 201509
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●Examples of suction nozzle shape
Pins A B C D
10 3.0 1.8 1.0 0.6
20 4.5 1.8 2.5 0.6
30 6.5 1.8 4.5 0.6
40 8.0 1.8 6.0 0.6
50 10.0 1.8 8.0 0.6
60 11.5 1.8 9.5 0.6
●Connector weight (header)
Number of pins 10 20 30 40 50 60
Weight 0.003 0.004 0.006 0.007 0.009 0.010
①Elongated hole ②Circular hole
Available for less than 50
pins and except for the case
of connector turning around
when mounted.
(Unit；mm)
*It is available to suck the connector’s whole top surface.
（Unit；g）
Mated height：0.6mm

Operation manual for Narrow-pitch connectors A35US
Panasonic Corporation
industrial.panasonic.com/ac/e/ ©Panasonic Corporation 2015
A
CCTF14E-3 201509
- 19 -
03-3. Precautions for reflow soldering
(1)Measure the temperature profile at the mounted connector position, and make sure
that it conforms to the recommended profile.
(2)When the molded part of connector melts or becomes deformed during the reflow
process, the heating temperature may be too high, or the connector may be
affected by a nearby electronic component with high heat capacity.
(3)When the soldering finish is abnormal, check the next points.
If solder creeps to or near the contact section, then excessive solder may have
been applied or the wicking phenomenon may have occurred. Check the amount
of solder applied, the position, and the temperature profile at the mounted
connector position.
In particular, be careful not to apply excessive solder when the N2 reflow furnace
is used.
(4)Extending the screen pattern outward and providing a solder application position
on the outer side can help secure a large front fillet.
(5)In the reflow process of FPC boards, pay attention to the following points to
reduce temperature variations among connector terminals.
- Ensure that the FPC board and the base attach firmly to each other when the base
on which the FPC board is placed is made of metal (e.g., Al).
- When a metal reinforcing plate is used, further firmly attach the base and
reinforcing plate (e.g., by using heat-resistant double-sided tape).